CN206610803U - The heat abstractor of integrated circuit - Google Patents
The heat abstractor of integrated circuit Download PDFInfo
- Publication number
- CN206610803U CN206610803U CN201720161313.4U CN201720161313U CN206610803U CN 206610803 U CN206610803 U CN 206610803U CN 201720161313 U CN201720161313 U CN 201720161313U CN 206610803 U CN206610803 U CN 206610803U
- Authority
- CN
- China
- Prior art keywords
- heat abstractor
- integrated circuit
- heat
- main body
- connecting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses the heat abstractor of integrated circuit, including heat abstractor main body, the top of the heat abstractor main body is provided with connecting plate, and the connecting plate is fixedly connected with heat abstractor main body, the side of the connecting plate is provided with screwed hole, the bottom of the heat abstractor main body is provided with dividing plate, the side of the dividing plate is provided with heat radiation rack, the heat abstractor of this kind of integrated circuit, making is designed in the way of straight-through be combined, a variety of radiator structures are assembled with the shape of straight line, integrated circuit is radiated layer by layer, the mode of this making, not only contribute to improve the operating efficiency of the heat abstractor of integrated circuit, but also greatly reduce the space occupancy rate of the heat abstractor of integrated circuit, it is mounted with suction sheet, after the heat abstractor connection of integrated circuit is installed, suction sheet carries out second consolidation processing to the heat abstractor of integrated circuit, advantageously reduce the probability that the heat abstractor of integrated circuit is damaged by shake at work.
Description
Technical field
The utility model is related to the heat abstractor of heat abstractor technical field, specially integrated circuit.
Background technology
So-called heat abstractor, with microelectronic chip high speed, high density, high performance development, heat management is into micro- system
The problem of one united in encapsulating is extremely important, so the heat dissipation problem in integrated circuit is very heavy in many computer applications
Want, in high-performance calculation machine, such as server, large scale computer and super computer, the radiating efficiency of multi-chip module will
Directly affect the design and operating characteristics of computer, the heat of chip is to flow through resistance by electric current to produce, resistance heat be by
Signal is transmitted the process transmitted with power along metal wire and produced on chip, can also be passed through by individual Transistor bias currents
IC substrate is leaked to be produced with transistor level transfer process.
But existing heat abstractor, design structure is complicated, when heat abstractor radiates to integrated circuit, causes integrated
The inefficiency of circuit, and the space occupancy rate of heat abstractor is big, the service life of heat abstractor is low, and use cost is high.
So, how the heat abstractor of integrated design circuit, the problem of currently being solved as us.
Utility model content
The purpose of this utility model is the heat abstractor for providing integrated circuit, to solve what is proposed in above-mentioned background technology
Problem.
To achieve the above object, the utility model provides following technical scheme：The heat abstractor of integrated circuit, including radiating
Apparatus main body, the top of the heat abstractor main body is provided with connecting plate, and the connecting plate is fixed with heat abstractor main body and connected
Connect, the side of the connecting plate is provided with screwed hole, and the bottom of the heat abstractor main body is provided with dividing plate, the side of the dividing plate
Heat radiation rack is installed, and the heat radiation rack is fixedly connected with dividing plate, the inside of the heat radiation rack is provided with heat sink, the radiating
The bottom of plate is provided with auxiliary heat dissipation block, and the bottom of the auxiliary heat dissipation block is provided with fastener, the fastener and auxiliary heat dissipation block
Be fixedly connected, the side of the fastener is provided with resilient clip, the heat sink insertion is arranged in the heat radiation rack, and with institute
Dividing plate is stated to be fixedly connected.
Further, the top of the connecting plate is provided with suction sheet, and the suction sheet is flexibly connected with connecting plate.
Further, the side of the heat abstractor main body is provided with mounting groove and connecting hole, and the dividing plate is filled with radiating
Main body is put to be fixedly connected by screw.
Further, the bottom of the auxiliary heat dissipation block is provided with thermal insulation layer, and the auxiliary heat dissipation block leads to heat radiation rack
Peg is crossed to be fixedly connected.
Further, the inside of the heat abstractor main body is provided with radiator fan, and the radiator fan is filled with radiating
Put main body drive connection.
Compared with prior art, the beneficial effects of the utility model are：The heat abstractor of this kind of integrated circuit, with straight-through multiple
The mode of conjunction is designed making, and a variety of radiator structures are assembled with the shape of straight line, integrated circuit dissipated layer by layer
Heat, the mode of this making not only contributes to improve the operating efficiency of the heat abstractor of integrated circuit, but also greatly reduces
The space occupancy rate of the heat abstractor of integrated circuit, is mounted with suction sheet, after the heat abstractor connection of integrated circuit is installed, inhales
Tag carries out second consolidation processing to the heat abstractor of integrated circuit, advantageously reduces the heat abstractor of integrated circuit at work
The probability damaged by shake, extends the service life of the heat abstractor of integrated circuit, is mounted with dividing plate, dividing plate is in integrated circuit
Heat abstractor effectively prevent integrated circuit heat sink interior circuit loss, advantageously reduce integrated circuit dissipate
The use cost of thermal.
Brief description of the drawings
Fig. 1 is overall structure diagram of the present utility model；
Fig. 2 is radiator fan overall structure diagram of the present utility model；
In figure：1- screwed holes；2- suction sheets；3- connecting plates；4- connecting holes；5- mounting grooves；6- heat abstractor main bodys；7- every
Plate；8- screws；9- heat radiation racks；10- heat sinks；11- pegs；12- auxiliary heat dissipation blocks；13- resilient clips；14- fasteners；15- every
Thermosphere；16- radiator fans.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Fig. 1-2 is referred to, the utility model provides a kind of technical scheme：The heat abstractor of integrated circuit, including radiating dress
Main body 6 is put, the top of the heat abstractor main body 6 is provided with connecting plate 3, and the connecting plate 3 is fixed with heat abstractor main body 6
Connection, the side of the connecting plate 3 is provided with screwed hole 1, and the bottom of the heat abstractor main body 6 is provided with dividing plate 7, the dividing plate
7 side is provided with heat radiation rack 9, and the heat radiation rack 9 is fixedly connected with dividing plate 7, and the inside of the heat radiation rack 9 is provided with radiating
Plate 10, the bottom of the heat sink 10 is provided with auxiliary heat dissipation block 12, and the bottom of the auxiliary heat dissipation block 12 is provided with fastener 14,
The fastener 14 is fixedly connected with auxiliary heat dissipation block 12, and the side of the fastener 14 is provided with resilient clip 13, the heat sink
10 insertions are arranged in the heat radiation rack 9, and are fixedly connected with the dividing plate 7, the fastener 14 can integrated circuit radiating
When device is installed, effectively consolidation process is carried out for the heat abstractor of integrated circuit.
Further, the top of the connecting plate 3 is provided with suction sheet 2, and the suction sheet 2 connects with the activity of connecting plate 3
Connect, facilitate the activity of suction sheet 2, be conducive to the heat abstractor of integrated circuit to be installed.
Further, the side of the heat abstractor main body 6 is provided with mounting groove 5 and connecting hole 4, and the dividing plate 7 is with dissipating
Thermal main body 6 is fixedly connected by screw 8, strengthens dividing plate 7, effectively isolates heat abstractor main body 6 with heat radiation rack 5.
Further, the bottom of the auxiliary heat dissipation block 12 is provided with thermal insulation layer 15, and the auxiliary heat dissipation block 12 is with dissipating
Hot frame 9 is fixedly connected by peg 11, makes auxiliary heat dissipation block 12 more firm, is conducive to extending the use longevity of auxiliary heat dissipation block 12
Life.
Further, the inside of the heat abstractor main body 6 is provided with radiator fan 16, and the radiator fan 16 is with dissipating
Thermal main body 6 is connected, and facilitates the activity of radiator fan 16, makes the heat dispersion of radiator fan 16 more perfect.
Operation principle：First, by the connecting plate 3 on the top of heat abstractor main body 6 by the heat abstractor and collection of integrated circuit
Installation is attached into circuit, then by heat abstractor progress consolidation process of the suction sheet 2 for integrated circuit, by integrated circuit
The fastener 14 of heat abstractor bottom is attached with cooling integrated place, is reinforced by resilient clip 13, integrated circuit
Heat abstractor used, in use, when integrated circuit produces a large amount of heat energy, by connecting plate 3 by integrated circuit
Internal heat energy is exported, and is transferred to inside heat abstractor main body 6, and radiator fan 16 starts high-speed rotation, is integrated circuit, is dissipated
In heat treatment, the thermal energy conduction of the absorbed inside of heat abstractor main body 6 to heat radiation rack 9, radiating treatment is carried out by heat sink 10, aided in
Radiating block 12 carries out residuals temperatures all to distribute.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out in the case where not departing from principle of the present utility model and spirit a variety of changes, repaiies
Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of heat abstractor of integrated circuit, including heat abstractor main body (6), it is characterised in that：The heat abstractor main body
(6) top is provided with connecting plate (3), and the connecting plate (3) is fixedly connected with heat abstractor main body (6), the connecting plate
(3) side is provided with screwed hole (1), and the bottom of the heat abstractor main body (6) is provided with dividing plate (7), the side of the dividing plate (7)
Face is provided with heat radiation rack (9), and the heat radiation rack (9) is fixedly connected with dividing plate (7), and the inside of the heat radiation rack (9) is provided with
Heat sink (10), the bottom of the heat sink (10) is provided with auxiliary heat dissipation block (12), the bottom of the auxiliary heat dissipation block (12)
Fastener (14) is installed, the fastener (14) is fixedly connected with auxiliary heat dissipation block (12), and the side of the fastener (14) is provided with
Resilient clip (13), heat sink (10) insertion is arranged in the heat radiation rack (9), and is fixedly connected with the dividing plate (7).
2. the heat abstractor of integrated circuit according to claim 1, it is characterised in that：The top peace of the connecting plate (3)
Equipped with suction sheet (2), and the suction sheet (2) is flexibly connected with connecting plate (3).
3. the heat abstractor of integrated circuit according to claim 1, it is characterised in that：The heat abstractor main body (6)
Side is provided with mounting groove (5) and connecting hole (4), and the dividing plate (7) connects with heat abstractor main body (6) by the way that screw (8) is fixed
Connect.
4. the heat abstractor of integrated circuit according to claim 1, it is characterised in that：The bottom of the auxiliary heat dissipation block (12)
End is provided with thermal insulation layer (15), and the auxiliary heat dissipation block (12) is fixedly connected with heat radiation rack (9) by peg (11).
5. the heat abstractor of integrated circuit according to claim 1, it is characterised in that：The heat abstractor main body (6)
Inside is provided with radiator fan (16), and the radiator fan (16) is connected with heat abstractor main body (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720161313.4U CN206610803U (en) | 2017-02-22 | 2017-02-22 | The heat abstractor of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720161313.4U CN206610803U (en) | 2017-02-22 | 2017-02-22 | The heat abstractor of integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206610803U true CN206610803U (en) | 2017-11-03 |
Family
ID=60168259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720161313.4U Expired - Fee Related CN206610803U (en) | 2017-02-22 | 2017-02-22 | The heat abstractor of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206610803U (en) |
-
2017
- 2017-02-22 CN CN201720161313.4U patent/CN206610803U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171103 Termination date: 20210222 |