CN211293857U - Auxiliary heat dissipation structure of machine case - Google Patents
Auxiliary heat dissipation structure of machine case Download PDFInfo
- Publication number
- CN211293857U CN211293857U CN201921525258.8U CN201921525258U CN211293857U CN 211293857 U CN211293857 U CN 211293857U CN 201921525258 U CN201921525258 U CN 201921525258U CN 211293857 U CN211293857 U CN 211293857U
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- Prior art keywords
- heat
- heat dissipation
- radiator
- dissipation structure
- auxiliary
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 28
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 208000021760 high fever Diseases 0.000 claims abstract description 11
- 229910052742 iron Inorganic materials 0.000 claims abstract description 8
- 230000005855 radiation Effects 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 238000006467 substitution reaction Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat radiation structure is assisted to quick-witted case, including mainboard and high fever device, high fever device sets up the bottom at the mainboard, and the another side of high fever device is provided with the radiator, and the another side setting of radiator is in iron sheet machine bottom of the case portion. The utility model provides a heat radiation structure is assisted to quick-witted case transmits the heat to iron sheet chassis bottom portion through radiator and heat-conducting layer, takes away the heat through chassis exterior, has realized the heat dissipation of the high fever device of mainboard back.
Description
Technical Field
The utility model belongs to the technical field of server machine case heat dissipation, concretely relates to heat radiation structure is assisted to machine case.
Background
In the design of the server, generally, high-heat devices are placed on the front side of the board card, heat is taken away by utilizing air flow, some devices need to be additionally provided with a radiator for radiating heat, and the devices placed on the back side cannot radiate heat. With the development of computer technology, the design density of the board card of the server is higher and higher, the cost of the high-heat devices is high when the high-heat devices are placed on the front side, the design often meets the bottleneck because the previous requirements cannot be met, and the design needs to modify the scheme or increase the size of the board card, so that great trouble is brought to the design.
This is a deficiency of the prior art, and therefore, it is very necessary to provide an auxiliary heat dissipation structure for a chassis, aiming at the above-mentioned disadvantages in the prior art.
Disclosure of Invention
All put at the integrated circuit board openly to the above-mentioned server design high-heat device of prior art, the cost is more and more high, the defect that can't satisfy the requirement, the utility model provides a heat radiation structure is assisted to the machine case to solve above-mentioned technical problem.
The utility model provides a heat radiation structure is assisted to quick-witted case, including mainboard and high fever device, high fever device sets up the bottom at the mainboard, and the another side of high fever device is provided with the radiator, and the another side setting of radiator is in iron sheet machine bottom of the case portion.
Further, the high-heat device is packaged by BGA, the high-heat device comprises a pin surface and a resin surface, and the resin surface of the high-heat device is arranged on the radiator. The utility model discloses be not limited to the BGA encapsulation, the high heat ware that the BGA encapsulation was, the heat dissipation demand is bigger.
Furthermore, the radiator is made of aluminum and comprises a device mounting surface and a comb-shaped radiating surface, the high-heat device is arranged on the device mounting surface of the radiator, and the comb-shaped radiating surface of the radiator is arranged at the bottom of the iron-sheet case. The utility model discloses be not limited to this kind of radiator, the radiator heat radiating area who has the pectination cooling surface is big.
Further, a heat conducting layer is arranged between the high heat device and the heat radiator. The heat conducting layer accelerates heat dissipation between the high heat device and the radiator, and simultaneously carries out buffer protection on the high heat device.
Further, the heat conducting layer adopts heat conducting paste. The heat conducting efficiency of the heat conducting paste is high, and heat dissipation is accelerated.
Furthermore, the heat conduction layer adopts heat conduction paste with the heat conduction coefficient of 2.0W/m.
Further, the heat conducting layer adopts heat conducting glue. The heat-conducting glue has lower cost than the heat-conducting paste.
The utility model has the advantages that,
the utility model provides a heat radiation structure is assisted to quick-witted case transmits the heat to iron sheet chassis bottom portion through radiator and heat-conducting layer, takes away the heat through chassis exterior, has realized the heat dissipation of the high fever device of mainboard back.
Furthermore, the utility model relates to a principle is reliable, and simple structure can use multiple server power, has very extensive application prospect.
Therefore, compared with the prior art, the utility model has the substantive characteristics and the progress, and the beneficial effects of the implementation are also obvious.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention;
among them, 1-high heat devices; 2, a main board; 3-a radiator; 4-the bottom of the iron sheet case; 5-thermally conductive layer.
Detailed Description
In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
Example 1:
as shown in fig. 1, the utility model provides an auxiliary heat dissipation structure for a chassis, which comprises a main board 2 and a high heat device 1, wherein the high heat device 1 is arranged at the bottom layer of the main board 2, a heat radiator 3 is arranged at the other side of the high heat device 1, and the other side of the heat radiator 3 is arranged at the bottom 4 of an iron sheet chassis;
the heat radiator 3 is made of aluminum and comprises a device mounting surface and a comb-shaped heat dissipation surface, the high-heat device 1 is arranged on the device mounting surface of the heat radiator 3, and the comb-shaped heat dissipation surface of the heat radiator 3 is arranged at the bottom 4 of the iron-sheet case; the heat dissipation area of the heat radiator with the comb-shaped heat dissipation surface is large;
a heat conduction layer 5 is arranged between the high heat device 1 and the device mounting surface of the radiator 3; the heat conduction layer 5 adopts heat conduction paste with the heat conduction coefficient of 2.0W/m; the heat conducting efficiency of the heat conducting paste is high, and heat dissipation is accelerated.
Example 2:
as shown in fig. 1, the utility model provides an auxiliary heat dissipation structure for a chassis, which comprises a main board 2 and a high heat device 1, wherein the high heat device 1 is arranged at the bottom layer of the main board 2, a heat radiator 3 is arranged at the other side of the high heat device 1, and the other side of the heat radiator 3 is arranged at the bottom 4 of an iron sheet chassis;
the high-heat device 2 is packaged by BGA, the high-heat device 2 comprises a pin surface and a resin surface, and the resin surface of the high-heat device 1 is arranged on the radiator;
the heat radiator 3 is made of aluminum and comprises a device mounting surface and a comb-shaped heat dissipation surface, the high-heat device 1 is arranged on the device mounting surface of the heat radiator 3, and the comb-shaped heat dissipation surface of the heat radiator 3 is arranged at the bottom 4 of the iron-sheet case; the heat dissipation area of the heat radiator with the comb-shaped heat dissipation surface is large;
a heat conduction layer 5 is arranged between the high heat device 1 and the device mounting surface of the radiator 3; the heat conduction layer 5 is made of heat conduction glue; the heat-conducting glue has lower cost than the heat-conducting paste.
Although the present invention has been described in detail by referring to the drawings in conjunction with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and substance of the present invention, and these modifications or substitutions are intended to be within the scope of the present invention/any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (7)
1. The utility model provides a machine case auxiliary heat radiation structure which characterized in that, includes mainboard (2) and high fever device (1), and high fever device (1) sets up in the bottom of mainboard (2), and the another side of high fever device (1) is provided with radiator (3), and the another side setting of radiator (3) is in iron sheet machine bottom of the case portion (4).
2. The auxiliary heat dissipation structure of chassis according to claim 1, wherein the high heat device (1) is encapsulated by BGA, the high heat device (1) includes a pin surface and a resin surface, and the resin surface of the high heat device (1) is disposed on the heat sink.
3. The auxiliary heat dissipation structure of the chassis according to claim 1, wherein the heat sink (3) is made of aluminum and includes a device mounting surface and a comb-shaped heat dissipation surface, the high-heat device (1) is disposed on the device mounting surface of the heat sink (3), and the comb-shaped heat dissipation surface of the heat sink (3) is disposed on the bottom (4) of the iron-sheet chassis.
4. The auxiliary heat dissipation structure of the chassis according to claim 1, wherein a heat conducting layer (5) is disposed between the high heat device (1) and the heat sink (3).
5. The auxiliary heat dissipation structure of chassis according to claim 4, wherein the heat conduction layer (5) is made of heat conductive paste.
6. The auxiliary heat dissipation structure of chassis according to claim 5, wherein the heat conduction layer (5) is made of heat conductive paste with a heat conductivity of 2.0W/m.
7. The auxiliary heat dissipation structure of the chassis according to claim 4, wherein the heat conduction layer (5) is made of heat conduction glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921525258.8U CN211293857U (en) | 2019-09-09 | 2019-09-09 | Auxiliary heat dissipation structure of machine case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921525258.8U CN211293857U (en) | 2019-09-09 | 2019-09-09 | Auxiliary heat dissipation structure of machine case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211293857U true CN211293857U (en) | 2020-08-18 |
Family
ID=72021760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921525258.8U Active CN211293857U (en) | 2019-09-09 | 2019-09-09 | Auxiliary heat dissipation structure of machine case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211293857U (en) |
-
2019
- 2019-09-09 CN CN201921525258.8U patent/CN211293857U/en active Active
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