CN206640868U - A kind of pcb board with high heat dispersion - Google Patents
A kind of pcb board with high heat dispersion Download PDFInfo
- Publication number
- CN206640868U CN206640868U CN201720371158.9U CN201720371158U CN206640868U CN 206640868 U CN206640868 U CN 206640868U CN 201720371158 U CN201720371158 U CN 201720371158U CN 206640868 U CN206640868 U CN 206640868U
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- CN
- China
- Prior art keywords
- heat
- copper base
- pcb board
- equidistant
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of pcb board with high heat dispersion, including plate body, the plate body includes wiring board, the top of the wiring board is equidistant to be connected with surface lines, the top of the surface lines is connected with high-power heat generating components by scolding tin, the bottom of the wiring board is connected with heat-conducting glue, the bottom of the heat-conducting glue is equidistant to offer neck, the bottom of the heat-conducting glue is provided with copper base, the top of the copper base is equidistant to be connected with heat-conducting block, the outside of the heat-conducting block and the inner side clamping of neck, the inner side of the copper base, which is run through, offers passage, both sides inside the copper base offer thermal vias.The utility model possesses the advantages of improving copper base heat dispersion on pcb board, solves the problems, such as that heat emission efficiency is relatively low and influences whether pcb board normal use.
Description
Technical field
Technical field of PCB board is the utility model is related to, specially a kind of pcb board with high heat dispersion.
Background technology
Pcb board is also known as printed circuit board (PCB), is the supplier of electronic component electrical connection, and its development is existing more than 100 years
History, it is mainly designed to layout design, the major advantage using circuit board be greatly reduce wiring and assembling difference
Mistake, improve the gentle productive labor rate of Automated water.
The heat dispersion of pcb board is all by plus aluminium base or copper base, the price phase of copper base and aluminium base at present
It is far short of what is expected, but copper base is better than aluminium in terms of the conductibility of heat, and copper base is in radiating simply by the heat on copper base
Automatically distributed so that when the temperature of pcb board is too high, the radiating effect of copper base is with regard to poor, so as to influence whether PCB
The normal use of plate.
Utility model content
The purpose of this utility model is to provide a kind of pcb board with high heat dispersion possess copper-based on raising pcb board
The advantages of plate heat dispersion, solve the problems, such as that heat emission efficiency is relatively low and influence whether pcb board normal use.
To achieve the above object, the utility model provides following technical scheme：A kind of pcb board with high heat dispersion,
Including plate body, the plate body includes wiring board, and the top of the wiring board is equidistant to be connected with surface lines, the surface lines
Top high-power heat generating components is connected with by scolding tin, the bottom of the wiring board is connected with heat-conducting glue, the heat-conducting glue
Bottom is equidistant to offer neck, and the bottom of the heat-conducting glue is provided with copper base, and the top of the copper base is equidistant to be connected with
Heat-conducting block, the outside of the heat-conducting block and the inner side clamping of neck, the inner side of the copper base, which is run through, offers passage, described
Both sides inside copper base offer thermal vias, and the madial wall of the thermal vias is provided with heat-conducting silicone grease.
Preferably, the neck is adapted with heat-conducting block.
Preferably, the thermal vias is connected with passage.
Preferably, the inner side of the copper base is equidistant offers through hole.
Preferably, the through hole is in vertical distribution with passage, and through hole is connected with passage.
Compared with prior art, the beneficial effects of the utility model are as follows：
1st, the use that the utility model passes through copper base and heat-conducting glue so that heat-conducting glue can pass the heat on wiring board
It is delivered on copper base, so as to allow copper base to be reached for the purpose that pcb board is radiated, by the use of heat-conducting block and neck, makes
The area that copper base contacts with heat-conducting glue can be increased by obtaining heat-conducting block, so as to accelerate the speed of heat conduction, improve copper
The efficiency of substrate radiating, passes through the use of thermal vias and passage so that for copper base when distributing heat, thermal vias is with leading to
Air-flow in stomata can accelerate distributing for copper base heat, so as to improve the radiating efficiency of pcb board, prevent the too high meeting of temperature
The normal use of pcb board is had influence on, passes through the use of heat-conducting silicone grease so that heat can be focused on more at thermal vias, from
And it has been easy to heat to be distributed.
Brief description of the drawings
Fig. 1 is the utility model structure diagram.
In figure：1 plate body, 2 wiring boards, 3 surface lines, 4 scolding tin, 5 high-power heat generating components, 6 heat-conducting glues, 7 necks, 8 bronze medals
Substrate, 9 heat-conducting blocks, 10 passages, 11 thermal vias, 12 heat-conducting silicone greases, 13 through holes.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Referring to Fig. 1, the utility model provides a kind of technical scheme：A kind of pcb board with high heat dispersion, including plate
Body 1, plate body 1 include wiring board 2, and the top of wiring board 2 is equidistant to be connected with surface lines 3, and the top of surface lines 3 passes through weldering
Tin 4 is connected with high-power heat generating components 5, and the bottom of wiring board 2 is connected with heat-conducting glue 6, and the bottom of heat-conducting glue 6 is equidistant to be offered
Neck 7, the bottom of heat-conducting glue 6 are provided with copper base 8, pass through the use of copper base 8 and heat-conducting glue 6 so that heat-conducting glue 6 can be by line
Heat transfer on road plate 2 is on copper base 8, so as to allow copper base 8 to be reached for the purpose that pcb board is radiated, copper base 8
Top is equidistant to be connected with heat-conducting block 9, the outside of heat-conducting block 9 and the inner side clamping of neck 7, passes through making for heat-conducting block 9 and neck 7
With so that heat-conducting block 9 can increase the area that copper base 8 contacts with heat-conducting glue 6, so as to accelerate the speed of heat conduction,
The efficiency of the radiating of copper base 8 is improved, neck 7 is adapted with heat-conducting block 9, and the inner side of copper base 8, which is run through, offers passage 10,
Both sides inside copper base 8 offer thermal vias 11, pass through the use of thermal vias 11 and passage 10 so that copper base
8 when distributing heat, and thermal vias 11 can accelerate distributing for the heat of copper base 8 with the air-flow in passage 10, so as to improve
The radiating efficiency of pcb board, prevents the too high normal use for influencing whether pcb board of temperature, thermal vias 11 and the phase of passage 10
Connection, the madial wall of thermal vias 11 are provided with heat-conducting silicone grease 12, pass through the use of heat-conducting silicone grease 12 so that heat can more collect
In at thermal vias 11, consequently facilitating heat is distributed, the inner side of copper base 8 is equidistant to offer through hole 13, through hole
13 are in vertical distribution with passage 10, and through hole 13 is connected with passage 10, pass through the use of through hole 13 so that increase sky
The logical outlet of air-flow, so as to ensure that the radiating efficiency of copper base 8.
In use, heat caused by high-power heat generating components 5 drives the heating of wiring board 2, the heat on wiring board 2 is by leading
Hot glue 6 is delivered on copper base 8, and the heat on copper base 8 is distributed automatically, and absorbing heat by heat-conducting silicone grease 12 is dissipated
Hair.
In summary, should pcb board with high heat dispersion, pass through being used cooperatively for copper base 8 and heat-conducting glue 6 so that
Heat-conducting glue 6, which is easy to transfer heat on copper base 8, to be distributed, and thermal vias 11 accelerates copper base 8 with passage 10 and dissipated
The efficiency of heat, solves the problems, such as that heat emission efficiency is relatively low and influences whether pcb board normal use.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply and deposited between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability includes, so that process, method, article or equipment including a series of elements not only will including those
Element, but also the other element including being not expressly set out, or it is this process, method, article or equipment also to include
Intrinsic key element.In the absence of more restrictions, by sentence " including one ... the key element limited, it is not excluded that
Other identical element also be present in process, method, article or equipment including the key element ".
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of pcb board with high heat dispersion, including plate body (1), it is characterised in that：The plate body (1) includes wiring board
(2), the top of the wiring board (2) is equidistant is connected with surface lines (3), passes through scolding tin at the top of the surface lines (3)
(4) high-power heat generating components (5) is connected with, the bottom of the wiring board (2) is connected with heat-conducting glue (6), the heat-conducting glue (6)
Bottom is equidistant to offer neck (7), and the bottom of the heat-conducting glue (6) is provided with copper base (8), the top of the copper base (8)
It is equidistant to be connected with heat-conducting block (9), the outside of the heat-conducting block (9) and the inner side clamping of neck (7), the copper base (8)
Inner side offers thermal vias (11), the radiating through passage (10), the internal both sides of the copper base (8) are offered
The madial wall of through hole (11) is provided with heat-conducting silicone grease (12).
A kind of 2. pcb board with high heat dispersion according to claim 1, it is characterised in that：The neck (7) is with leading
Hot block (9) is adapted.
A kind of 3. pcb board with high heat dispersion according to claim 1, it is characterised in that：The thermal vias
(11) it is connected with passage (10).
A kind of 4. pcb board with high heat dispersion according to claim 1, it is characterised in that：The copper base (8)
Inner side is equidistant to offer through hole (13).
A kind of 5. pcb board with high heat dispersion according to claim 1 or 4, it is characterised in that：It is described, it is described logical
Hole (13) is in vertical distribution with passage (10), and through hole (13) is connected with passage (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720371158.9U CN206640868U (en) | 2017-04-10 | 2017-04-10 | A kind of pcb board with high heat dispersion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720371158.9U CN206640868U (en) | 2017-04-10 | 2017-04-10 | A kind of pcb board with high heat dispersion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206640868U true CN206640868U (en) | 2017-11-14 |
Family
ID=60248000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720371158.9U Expired - Fee Related CN206640868U (en) | 2017-04-10 | 2017-04-10 | A kind of pcb board with high heat dispersion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206640868U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107830420A (en) * | 2017-11-27 | 2018-03-23 | 安徽文尧智能光电科技有限公司 | A kind of LED line light source based on aluminium base radiating |
-
2017
- 2017-04-10 CN CN201720371158.9U patent/CN206640868U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107830420A (en) * | 2017-11-27 | 2018-03-23 | 安徽文尧智能光电科技有限公司 | A kind of LED line light source based on aluminium base radiating |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171114 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |