CN110225690A - A kind of compact(ing) machine controller of good heat dissipation - Google Patents
A kind of compact(ing) machine controller of good heat dissipation Download PDFInfo
- Publication number
- CN110225690A CN110225690A CN201910347860.5A CN201910347860A CN110225690A CN 110225690 A CN110225690 A CN 110225690A CN 201910347860 A CN201910347860 A CN 201910347860A CN 110225690 A CN110225690 A CN 110225690A
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- fixed
- heat
- upper housing
- heat dissipation
- machine controller
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses the compact(ing) machine controllers of good heat dissipation, are related to electric machine controller technical field.The present invention includes upper housing, lower case, control mainboard and radiating subassembly, upper housing and lower case inner wall offer vacuum chamber, one inner wall of upper housing is fixed with a miniature exhaust fan, and radiating subassembly includes radiation shell and lid, and one surface of lid is fixedly connected with one surface of radiation shell.The present invention can carry out refrigeration processing to water by semiconductor chilling plate, water circulation is able to carry out by micro pump, diversion cavity, serpentine channel, water-cooled process is able to carry out by layer of silica gel, lid, the first heat-conducting plate and the second heat-conducting plate, water circulation is capable of forming by micro pump, water inlet pipe, heat-dissipating pipe and outlet pipe, air circulation is capable of forming by miniature exhaust fan, heat-dissipating pipe, air-out chamber and return air chamber, it is able to carry out air-cooled processing, solves the problems, such as that existing electric machine controller heat dissipation effect is bad.
Description
Technical field
The invention belongs to electric machine controller technical fields, more particularly to the compact(ing) machine controller of good heat dissipation.
Background technique
Electric machine controller be controlled by active motor according to the direction of setting, speed, angle, the response time into
The integrated circuit of row work, electric machine controller use high power intelligent module, excellent cooling heat radiation system, reliable power supply control
System processed, closed loop sampling feedback control system optimization composition, with the spy that fast response time, control are stable and non-maintaining
Point.
Traditional electric machine controller is all sealed using complete shell in order to guarantee waterproof performance, and will appear scattered
The bad situation of thermal effect, at the same be not available it is extraneous it is air-cooled radiate, and use liquid cooled module it will cause occupied spaces
Excessive situation is not easy to the installation of compact(ing) machine controller.
Summary of the invention
The purpose of the present invention is to provide the compact(ing) machine controllers of good heat dissipation, can be to water by semiconductor chilling plate
Refrigeration processing is carried out, water circulation is able to carry out by micro pump, diversion cavity, serpentine channel, passes through layer of silica gel, lid, first
Heat-conducting plate and the second heat-conducting plate are able to carry out water-cooled process, are capable of forming by micro pump, water inlet pipe, heat-dissipating pipe and outlet pipe
Water circulation, is capable of forming air circulation by miniature exhaust fan, heat-dissipating pipe, air-out chamber and return air chamber, is able to carry out air-cooled processing,
Solve the problems, such as that existing electric machine controller heat dissipation effect is bad.
In order to solve the above technical problems, the present invention is achieved by the following technical solutions:
The present invention is the compact(ing) machine controller of good heat dissipation, including upper housing, lower case, control mainboard and heat dissipation group
Part；
The upper housing and lower case inner wall offer vacuum chamber, and one inner wall of upper housing is fixed with a miniature exhausting
Machine；
The radiating subassembly includes radiation shell and lid, and one surface of lid is fixedly connected with one surface of radiation shell, institute
It states radiation shell one side and offers an opening, one opposed inner walls of the opening are respectively and fixedly provided with gear edge, and the gear is fixed along a surface
There is the first heat-conducting plate, one surface of the first heat-conducting plate and one inner wall of radiation shell are respectively and fixedly provided with several second heat-conducting plates, Ruo Gansuo
It states the second heat-conducting plate to be spaced apart, several second heat-conducting plates form serpentine channel, the gear edge and one inner wall shape of radiation shell
At one group of diversion cavity, one inner wall of diversion cavity is fixed with several semiconductor chilling plates；
One inner wall of radiation shell and it is located at the position of one group of gear between and is fixed with micro pump, the micro pump
Inlet and outlet pass through pipeline respectively and are connected to two diversion cavities；
The radiation shell bottom surface is fixed with several telescopic sleeves, and described telescopic sleeve one end is fixed with backing plate, the backing plate
Several springs are fixed between one surface and radiation shell bottom surface, the spring is circumferentially positioned at telescopic sleeve outer surface；
One surface of lid is fixed with a layer of silica gel, pipeline on the micro pump water outlet is fixed be communicated with one into
Water pipe, one surface of lid is fixed with heat-dissipating pipe through outlet pipe is fixed between the water inlet pipe and outlet pipe, described to dissipate
It is opposite on heat pipe and miniature exhaust fan position.
Further, one inner wall of upper housing is fixed with fixed ring, one surface of control mainboard and one table of fixed ring
Face offers several threaded holes, and the control mainboard is fixedly connected by threaded hole and screw with one surface of fixed ring.
Further, form gap between the fixed ring and upper housing, the heat-dissipating pipe and miniature exhaust fan with sky
Gap clearance fit.
Further, one opposed inner walls of lower case offer one group of sliding slot, and the radiation shell one is relatively fixed
There is one group of sliding block, the radiation shell is slidably matched by sliding block and sliding slot and lower case.
Further, upper housing week side and lower case week side are respectively and fixedly provided with flange trunnion, and the upper housing is logical
It crosses flange trunnion and screw is fixedly connected with lower case.
Further, one inner wall of upper housing is fixed with one group of wind deflector, and upper housing is divided into out by two wind deflectors
Wind chamber and return air chamber, the miniature exhaust fan are located at the position inside air-out chamber.
Further, one surface of upper housing offers seal groove, and one surface of lower case offers sealing ring, institute
It states opposite on seal groove and sealing ring gap cooperation and position.
Further, the lid, the first heat-conducting plate, the second heat-conducting plate, water inlet pipe, outlet pipe and heat-dissipating pipe are by copper material
Material is made, and first heat-conducting plate and the second thermally conductive plate top surface are contacted with lid bottom surface.
Further, one surface of layer of silica gel offers conduit, the conduit and water inlet pipe clearance fit.
The invention has the following advantages:
1, the present invention can carry out refrigeration processing to the water inside diversion cavity by semiconductor chilling plate, pass through Miniature water
Pump, diversion cavity, serpentine channel are able to carry out water circulation, can be incited somebody to action by layer of silica gel, lid, the first heat-conducting plate and the second heat-conducting plate
Heat in control mainboard drains into the cold water in radiation shell, is able to carry out water-cooled process, by micro pump, water inlet pipe, dissipates
Heat pipe and outlet pipe are capable of forming water circulation, are capable of forming air by miniature exhaust fan, heat-dissipating pipe, air-out chamber and return air chamber and follow
Ring is able to carry out air-cooled processing, can improve compact controller to efficient radiating treatment is carried out in controller cavity
Service life, while occupied space is smaller, facilitates the installation and dismounting of radiating subassembly.
2, the present invention is by sealing ring and seal groove with the use of the leakproofness improved between upper housing and lower case
Can, by opening up vacuum chamber in upper housing and lower case inner wall, the sealing performance of controller housing is improved, while being equipped with true
Cavity can completely cut off extraneous hot-air, avoid causing the higher situation of enclosure interior temperature since shell is thermally conductive.
Certainly, it implements any of the products of the present invention and does not necessarily require achieving all the advantages described above at the same time.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, will be described below to embodiment required
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the structural schematic diagram of the compact(ing) machine controller of good heat dissipation of the invention；
Fig. 2 is the structural schematic diagram that Fig. 1 overlooks visual angle；
Fig. 3 is the structure sectional view in Fig. 2 at A-A；
Fig. 4 is the structural schematic diagram of upper housing；
Fig. 5 is the structural schematic diagram of lower case；
Fig. 6 is the structural schematic diagram of radiating subassembly；
Fig. 7 is the structural schematic diagram of radiation shell；
In attached drawing, parts list represented by the reference numerals are as follows:
1- upper housing, 2- lower case, 3- control mainboard, 4- radiating subassembly, 101- vacuum chamber, the miniature exhaust fan of 102-,
103- fixed ring, 104- threaded hole, the gap 105-, 106- flange trunnion, 107- wind deflector, 108- air-out chamber, 109- return air chamber,
110- seal groove, 201- sliding slot, 202- sealing ring, 401- radiation shell, 402- lid, 403- opening, 404- keep off edge, 405- first
Heat-conducting plate, the second heat-conducting plate of 406-, 407- serpentine channel, 408- diversion cavity, 409- micro pump, 410- telescopic sleeve, 411-
Backing plate, 412- spring, 413- layer of silica gel, 414- water inlet pipe, 415- outlet pipe, 416- heat-dissipating pipe, 417- sliding block, 418- conduit,
419- semiconductor chilling plate.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
Please refer to shown in Fig. 1-7, the present invention be good heat dissipation compact(ing) machine controller, including upper housing 1, lower case 2,
Control mainboard 3 and radiating subassembly 4；
Upper housing 1 and 2 inner wall of lower case offer vacuum chamber 101, and 1 one inner wall of upper housing is fixed with a miniature exhaust fan
102；
Radiating subassembly 4 includes radiation shell 401 and lid 402, the fixed company in 402 1 surface of lid and 401 1 surface of radiation shell
It connects, 401 one side of radiation shell offers an opening 403, and 403 1 opposed inner walls of opening are respectively and fixedly provided with gear along 404, keep off along 404 1
Surface is fixed with the first heat-conducting plate 405, and 405 1 surface of the first heat-conducting plate and 401 1 inner wall of radiation shell are respectively and fixedly provided with several second
Heat-conducting plate 406, several second heat-conducting plates 406 are spaced apart, and several second heat-conducting plates 406 form serpentine channel 407, are kept off along 404
One group of diversion cavity 408 is formed with 401 1 inner wall of radiation shell, 408 1 inner wall of diversion cavity is fixed with several semiconductor chilling plates 419；
401 1 inner wall of radiation shell and be located at position of one group of gear between 404 be fixed with micro pump 409, micro pump
409 inlet and outlet pass through pipeline respectively and are connected to two diversion cavities 408；
401 bottom surface of radiation shell is fixed with several telescopic sleeves 410, and 410 one end of telescopic sleeve is fixed with backing plate 411, backing plate
411 1 surfaces and radiation shell are fixed with several springs 412 between 401 bottom surface, and spring 412 is circumferentially positioned at outside telescopic sleeve 410
Surface is provided upwards to radiation shell 401 after the installation of radiation shell 401 always by telescopic sleeve 410, spring 412 and backing plate 411
Elastic force, can be always ensured that layer of silica gel 413 touch 3 one surface of control mainboard；
402 1 surface of lid is fixed with a layer of silica gel 413, and the pipeline fixation on 409 water outlet of micro pump is communicated with one
Water inlet pipe 414,402 1 surface of lid are fixed with heat dissipation through outlet pipe 415 is fixed between water inlet pipe 414 and outlet pipe 415
It is opposite on pipe 416, heat-dissipating pipe 416 and miniature 102 position of exhaust fan.
Wherein as shown in Figure 3-4,1 one inner wall of upper housing is fixed with fixed ring 103,3 one surface of control mainboard and fixed ring
103 1 surfaces offer several threaded holes 104, and control mainboard 3 is solid by threaded hole 104 and screw and 103 1 surface of fixed ring
Fixed connection.
Wherein as shown in Figure 3-4, gap 105, heat-dissipating pipe 416 and miniature exhausting are formed between fixed ring 103 and upper housing 1
Machine 102 with 105 clearance fit of gap.
Wherein as shown in Fig. 3 and Fig. 5-6,2 one opposed inner walls of lower case offer one group of sliding slot 201, radiation shell 401 1
Opposite to be respectively and fixedly provided with one group of sliding block 417, radiation shell 401 is slidably matched by sliding block 417 with sliding slot 201 and lower case 2.
Wherein as shown in Figs. 1-5, the 2 weeks sides in 1 week side of upper housing and lower case are respectively and fixedly provided with flange trunnion 106, upper casing
Body 1 is fixedly connected by flange trunnion 106 and screw with lower case 2.
Wherein as shown in figure 4,1 one inner wall of upper housing is fixed with one group of wind deflector 107, two wind deflectors 107 divide upper housing 1
For air-out chamber 108 and return air chamber 109, miniature exhaust fan 102 is located at the position inside air-out chamber 108.
Wherein as in Figure 3-5,1 one surface of upper housing offers seal groove 110, and 2 one surface of lower case offers sealing
It is opposite in ring 202, seal groove 110 and 202 clearance fit of sealing ring and position.
Wherein, lid 402, the first heat-conducting plate 405, the second heat-conducting plate 406, water inlet pipe 414, outlet pipe 415 and heat-dissipating pipe
416 are made of copper product, and the first heat-conducting plate 405 and 406 top surface of the second heat-conducting plate are contacted with 402 bottom surface of lid.
Wherein as shown in fig. 6,413 1 surface of layer of silica gel offers conduit 418, conduit 418 is matched with 414 gap of water inlet pipe
It closes.
One concrete application of the present embodiment are as follows: in use, semiconductor chilling plate 419 can be to diversion cavity 408 inside
Water is cooled down, and is able to drive the water flowing inside diversion cavity 408 by micro pump 409, cold water can pass through serpentine channel
407 and diversion cavity 408 recycled, control mainboard 3 generate heat can be transmitted by layer of silica gel 413 and lid 402
To the first heat-conducting plate 405 and the second heat-conducting plate 406, the cold water in serpentine channel 407 can absorb the first heat-conducting plate 405 and
Heat on two heat-conducting plates 406, is able to carry out water-cooled process, micro pump 409 simultaneously can by cold water by water inlet pipe 414,
Heat-dissipating pipe 416 and outlet pipe 415 form water circulation, be outside heat-dissipating pipe 416 it is cold, miniature exhaust fan 102 can be by heat-dissipating pipe
Air-out chamber 108 is extracted and passed through to cold air around 416 out and return air chamber 109 forms air circulation, is able to carry out air-cooled processing, energy
It is enough to carrying out radiating treatment in controller cavity.
In the description of this specification, the description of reference term " one embodiment ", " example ", " specific example " etc. means
Particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one implementation of the invention
In example or example.In the present specification, schematic expression of the above terms may not refer to the same embodiment or example.
Moreover, particular features, structures, materials, or characteristics described can be in any one or more of the embodiments or examples to close
Suitable mode combines.
Present invention disclosed above preferred embodiment is only intended to help to illustrate the present invention.There is no detailed for preferred embodiment
All details are described, are not limited the invention to the specific embodiments described.Obviously, according to the content of this specification,
It can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to better explain the present invention
Principle and practical application, so that skilled artisan be enable to better understand and utilize the present invention.The present invention is only
It is limited by claims and its full scope and equivalent.
Claims (9)
1. the compact(ing) machine controller of good heat dissipation, including upper housing (1), lower case (2) and control mainboard (3), feature exists
In: it further include radiating subassembly (4)；
The upper housing (1) and lower case (2) inner wall offer vacuum chamber (101), and (1) one inner wall of upper housing is fixed with
One miniature exhaust fan (102)；
The radiating subassembly (4) includes radiation shell (401) and lid (402), (402) one surface of lid and radiation shell
(401) one surfaces are fixedly connected, and radiation shell (401) one side offers an opening (403), (403) one phases of the opening
Gear is respectively and fixedly provided with along (404) to inner wall, the gear is fixed with the first heat-conducting plate (405) along (404) one surfaces, and described first is thermally conductive
(405) one surface of plate and (401) one inner wall of radiation shell are respectively and fixedly provided with several second heat-conducting plates (406), and several described second is thermally conductive
Plate (406) is spaced apart, and several second heat-conducting plates (406) form serpentine channel (407), and the gear is along (404) and heat dissipation
(401) one inner wall of shell forms one group of diversion cavity (408), and (408) one inner wall of diversion cavity is fixed with several semiconductor chilling plates
(419)；
(401) one inner wall of radiation shell and it is located at the position of one group of gear between (404) and is fixed with micro pump (409), institute
The inlet and outlet for stating micro pump (409) pass through pipeline respectively and are connected to two diversion cavities (408)；
Radiation shell (401) bottom surface is fixed with several telescopic sleeves (410), and described telescopic sleeve (410) one end is fixed with pad
Plate (411) is fixed with several springs (412), the spring between (411) one surface of backing plate and radiation shell (401) bottom surface
(412) it is circumferentially positioned at telescopic sleeve (410) outer surface；
(402) one surface of lid is fixed with a layer of silica gel (413), and the pipeline on micro pump (409) water outlet is solid
Surely it is communicated with a water inlet pipe (414), (402) one surface of lid, which is run through, is fixed with outlet pipe (415), the water inlet pipe
(414) it is fixed between outlet pipe (415) heat-dissipating pipe (416), the heat-dissipating pipe (416) and miniature exhaust fan (102) position
It is upper opposite.
2. the compact(ing) machine controller of good heat dissipation according to claim 1, which is characterized in that the upper housing (1) one
Inner wall is fixed with fixed ring (103), and (3) one surface of control mainboard and (103) one surface of fixed ring offer several screw threads
Hole (104), the control mainboard (3) are fixedly connected by threaded hole (104) and screw with (103) one surface of fixed ring.
3. the compact(ing) machine controller of good heat dissipation according to claim 1, which is characterized in that the fixed ring (103)
Gap (105) are formed between upper housing (1), the heat-dissipating pipe (416) and miniature exhaust fan (102) are between gap (105)
Gap cooperation.
4. the compact(ing) machine controller of good heat dissipation according to claim 1, which is characterized in that the lower case (2) one
Opposed inner walls offer one group of sliding slot (201), and the radiation shell (401) one is opposite to be respectively and fixedly provided with one group of sliding block (417), described
Radiation shell (401) is slidably matched by sliding block (417) with sliding slot (201) and lower case (2).
5. the compact(ing) machine controller of good heat dissipation according to claim 1, which is characterized in that upper housing (1) week
Side and all sides of lower case (2) are respectively and fixedly provided with flange trunnion (106), and the upper housing (1) passes through flange trunnion (106) and spiral shell
Silk is fixedly connected with lower case (2).
6. the compact(ing) machine controller of good heat dissipation according to claim 1, which is characterized in that the upper housing (1) one
Inner wall is fixed with one group of wind deflector (107), and upper housing (1) is divided into air-out chamber (108) and return air chamber by two wind deflectors (107)
(109), the miniature exhaust fan (102) is located at the internal position of air-out chamber (108).
7. the compact(ing) machine controller of good heat dissipation according to claim 1, which is characterized in that the upper housing (1) one
Surface offers seal groove (110), and (2) one surface of lower case offers sealing ring (202), the seal groove (110) with
It is opposite in sealing ring (202) clearance fit and position.
8. the compact(ing) machine controller of good heat dissipation according to claim 1, which is characterized in that the lid (402),
One heat-conducting plate (405), the second heat-conducting plate (406), water inlet pipe (414), outlet pipe (415) and heat-dissipating pipe (416) are by copper product
It is made, first heat-conducting plate (405) and the second heat-conducting plate (406) top surface are contacted with lid (402) bottom surface.
9. the compact(ing) machine controller of good heat dissipation according to claim 1, which is characterized in that the layer of silica gel (413)
One surface offers conduit (418), the conduit (418) and water inlet pipe (414) clearance fit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910347860.5A CN110225690B (en) | 2019-04-28 | 2019-04-28 | Compact motor controller with good heat dissipation |
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| CN201910347860.5A CN110225690B (en) | 2019-04-28 | 2019-04-28 | Compact motor controller with good heat dissipation |
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| CN110225690B CN110225690B (en) | 2020-09-25 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602914A (en) * | 2019-09-25 | 2019-12-20 | 珠海格力电器股份有限公司 | Air conditioner and controller mainboard constant temperature structure thereof |
| CN111029950A (en) * | 2020-01-10 | 2020-04-17 | 安徽明远电力设备制造有限公司 | Sealed circulative cooling switch board |
| CN113759155A (en) * | 2021-08-24 | 2021-12-07 | 安特仪表集团有限公司 | Intelligent ammeter with compact structure |
| CN117175361A (en) * | 2023-08-24 | 2023-12-05 | 徐州映钛电气集团有限公司 | Stainless steel distribution box shell with moisture resistance |
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| CN1351417A (en) * | 2000-10-31 | 2002-05-29 | 富士电机株式会社 | Electric inverter |
| CN201251749Y (en) * | 2008-06-20 | 2009-06-03 | 刘雪 | Novel refrigerating and heat-dissipating device of CPU semiconductor |
| CN106711110A (en) * | 2017-03-19 | 2017-05-24 | 北京工业大学 | Air-cooling and water-cooling hybrid radiating module for large-power series connected IGBT (Insulated Gate Bipolar Translator) |
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| CN208241583U (en) * | 2018-04-02 | 2018-12-14 | 湖北理工学院 | It is a kind of for studying the inverter of combined type Repetitive Control |
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| CN110225690B (en) | 2020-09-25 |
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Address after: 221000 Xuzhou Industrial Park, Xuzhou City, Jiangsu Province, east of Tunshidagou and west of Tunqing Road Applicant after: Jiangsu Jinpeng Group Co.,Ltd. Address before: 221000 Xuzhou Industrial Park, Xuzhou City, Jiangsu Province, east of Tunshidagou and west of Tunqing Road Applicant before: JIANGSU JINPENG VEHICLE Co.,Ltd. |
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Denomination of invention: Compact motor controller with good heat dissipation Effective date of registration: 20221018 Granted publication date: 20200925 Pledgee: Xuzhou Jiawang Sub branch of Bank of Jiangsu Co.,Ltd. Pledgor: Jiangsu Jinpeng Group Co.,Ltd. Registration number: Y2022980018797 |