CN108679876A - A kind of semiconductor cooling device - Google Patents
A kind of semiconductor cooling device Download PDFInfo
- Publication number
- CN108679876A CN108679876A CN201811010579.4A CN201811010579A CN108679876A CN 108679876 A CN108679876 A CN 108679876A CN 201811010579 A CN201811010579 A CN 201811010579A CN 108679876 A CN108679876 A CN 108679876A
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- CN
- China
- Prior art keywords
- wall
- magnet
- cup body
- semiconductor
- turbine wheel
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/002—Details of machines, plants or systems, using electric or magnetic effects by using magneto-caloric effects
- F25B2321/0022—Details of machines, plants or systems, using electric or magnetic effects by using magneto-caloric effects with a rotating or otherwise moving magnet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The present invention provides a kind of semiconductor cooling devices for effectivelying prevent refrigeration to fail.The semiconductor cooling device includes the cup body set gradually, electromagnetic assembly, magnet and cooling assembly, the magnet and cooling assembly are affixed, the magnet is moved with power-off towards the direction closer or far from cup body with the energization of electromagnetic assembly, and the cold end of the cooling assembly is contacted or detached with wall of cup with the movement of magnet.
Description
Technical field
The present invention relates to semiconductor refrigerating technology field, more particularly to a kind of semiconductor cooling device.
Background technology
The operation principle of semiconductor cooling device is to be based on Peltier principle, using when two different conductor A and B compositions
Circuit and when being connected with direct current, some other heat can be also released in addition to Joule heat in joint, and another connects
Heat is then absorbed at head, and this phenomenon caused by peltier effect is reversible, when changing current direction, heat release and heat absorption
Connector also change correspondingly, the heat for absorbing and releasing is directly proportional to current strength, and with the property of two kinds of conductors and hot junction
Temperature is related.
Because of the presence of above-mentioned property, semiconductor refrigerating is applied in various refrigeration occasions.Such as cold and hot cup or refrigeration cup etc..
Liner is usually positioned on the semiconductor refrigeration member of semiconductor refrigerating module, works as semiconductor refrigeration member by existing refrigeration cup
Be powered, one end that semiconductor refrigeration member is connected with liner by the heat transfer from liner to semiconductor refrigeration member the other end simultaneously
Heat dissipation.In this case, if semiconductor refrigeration member powers off, the heat of the semiconductor refrigeration member other end have again be transmitted to again it is interior
Courage is to the possibility of desuperheated liner heating, and the refrigeration work(in vain before thus causing, after power-off, liner can not be protected
Temperature.
Invention content
The technical problem to be solved by the present invention is to：A kind of semiconductor cooling device for effectivelying prevent refrigeration to fail is provided.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention is：
A kind of semiconductor cooling device, including the cup body, electromagnetic assembly, magnet and the cooling assembly that set gradually, the magnetic
Iron is affixed with cooling assembly, and the magnet is moved with power-off towards the direction closer or far from cup body with the energization of electromagnetic assembly, institute
The cold end for stating cooling assembly is contacted or is detached with wall of cup with the movement of magnet.
The beneficial effects of the present invention are：Electromagnetic assembly when refrigeration is needed to be powered, cooling assembly is contacted with wall of cup and made
It is cold, when freeze complete when electromagnetic assembly power off, the cold end of cooling assembly detaches with wall of cup, and the heat in the hot junction of cooling assembly is just not
It can pass back on cup body, ensure that the effect of cup body refrigerating thermal-insulation.
Description of the drawings
Fig. 1 is the decomposition texture schematic diagram of the semiconductor cooling device of the embodiment of the present invention one；
Fig. 2 is the longitudinal cross-section schematic diagram of the semiconductor cooling device of the embodiment of the present invention one；
Fig. 3 is the decomposition texture schematic diagram of the semiconductor cooling device of the embodiment of the present invention two；
Fig. 4 is the longitudinal cross-section schematic diagram of the semiconductor cooling device of the embodiment of the present invention two；
Fig. 5 is the air duct schematic diagram in the turbine wheel of the refrigeration module of the embodiment of the present invention two；
Label declaration：
10, cup body；11, inner wall；12, outer wall；13, insulated cavity；
20, electromagnetic assembly；21, the first protrusion；
30, magnet；
40, conduction cooling part；41, the second protrusion；
50, refrigeration module；
51, semiconductor refrigeration member；
52, radiating piece；521, air port is crossed；522, heat-dissipating pipe；
53, turbine wheel；531, air outlet；532, turbofan；533, fixed blade；
54, cool guide sheet；
55, control panel；
60, sealing device.
Specific implementation mode
To explain the technical content, the achieved purpose and the effect of the present invention in detail, below in conjunction with embodiment and coordinate attached
Figure is explained.
The design of most critical of the present invention is：It controls whether to attract magnet using the energization and power-off of electromagnetic assembly, to
Contact of the cooling assembly with cup body is controlled as needed and is detached.
Fig. 1-5, a kind of semiconductor cooling device are please referred to, including cup body 10, electromagnetic assembly 20, the magnet 30 set gradually
And cooling assembly, the magnet 30 and cooling assembly are affixed, and the magnet 30 is with the energization of electromagnetic assembly 20 with power-off towards close
Or the direction movement far from cup body 10, the cold end of the cooling assembly are contacted or are detached with wall of cup with the movement of magnet 30.
As can be seen from the above description, the beneficial effects of the present invention are：Need refrigeration when electromagnetic assembly be powered, cooling assembly with
Wall of cup contact is freezed, and when refrigeration is completed, electromagnetic assembly powers off, and the cold end of cooling assembly is detached with wall of cup, cooling assembly
The heat in hot junction would not pass back on cup body, ensure that the effect of cup body refrigerating thermal-insulation.
Further, the cup body 10 is the double-layer structure being made of inner wall 11 and outer wall 12, the inner wall 11 and outer wall
Insulated cavity 13 is equipped between 12, the cold end of the cooling assembly contacts or divided with the inner wall 11 of cup body 10 with the movement of magnet 30
From.
Seen from the above description, the heat insulation effect of the cup body 10 of double-layer structure is good, at the same the cold end of cooling assembly directly with
The inner wall 11 of cup body 10 contacts, and heat conduction is more direct.
Further, the cooling assembly includes conduction cooling part 40 and refrigeration module 50, and the refrigeration module 50 is equipped with half
One end of conductor cooling component 51, the conduction cooling part 40 is connected across magnet 30 with the semiconductor refrigeration member 51 of refrigeration module 50, institute
The other end for stating conduction cooling part 40 sequentially passes through the outer wall 12 of electromagnetic assembly 20 and cup body 10 and extends towards the inner wall of cup body 10 11.
Seen from the above description, setting conduction cooling part 40 can increase the length of the refrigeration end of cooling assembly.
Further, the semiconductor refrigeration member 51 and the setting of 52 integral type of radiating piece, the radiating piece 52 and turbine wheel
53 fitting settings, the radiating piece 52 was equipped with the heat-dissipating pipe 522 of air port 521 and at least two, on the radiating piece 52
It crosses air port 521, the air inlet on turbine wheel 53 and the air outlet on turbine wheel 53 531 to be sequentially communicated to form air duct, the heat dissipation
One end of pipe 522 extends towards air inlet and extends to the inside of turbine wheel 53, the air duct in the turbine wheel 53 by air inlet extremely
The circulation area of air outlet 531 gradually increases, and the magnet 30 and radiating piece 52 are affixed.
Seen from the above description, radiating piece 52 and semiconductor refrigeration member 51 are made of one formula, 51 heat of semiconductor refrigeration member
The heat at end is promptly oriented to radiating piece 52.When turbine wheel 53 works, internal turbofan 532 rotates, outside radiating piece 52
Pass through successively under the action of fan of the air in turbine wheel 53 radiating piece 52 cross air port 531, turbine wheel 53 air inlet and
It is discharged turbine wheel 53 after the air outlet 531 of turbine wheel 53.Air outside radiating piece 52 washes away scattered when passing through air port 521
Warmware 52 washes away heat-dissipating pipe 522, to complete second to complete primary heat dissipation in the air inlet on entering turbine wheel 53
Heat dissipation, the structure of radiating piece 52 farthest increase the contact area with air, and heat dissipation twice can take away more heat
Amount, and the fan of turbine wheel 53 compared with the prior art, internal air-flow will not reverse in work, can only be flowed along a direction
It is dynamic, the discharge that heat can also be much smoother.
Further, the refrigeration module 50 further includes control panel 55, and the control panel 55 is set on radiating piece 52, described
NTC temperature sensors are equipped in control panel 55, the control panel 55 is electrically connected with the driving motor of driving turbine wheel 53.
Seen from the above description, when the temperature of NTC temperature sensor senses to radiating piece 52 is higher than preset temperature, control
Plate 55 can control turbofan 532 and rev up, to which the heat of radiating piece quickly be discharged to reduce conductor refrigeration
The temperature of part cold end；When NTC temperature sensor senses have reached preset temperature to radiating piece 52, control panel 55 can control
Turbofan 532 in turbine wheel 53 reduces or keeps rotating speed, can be intelligently according to the temperature of radiating piece 52 by control panel 55
Degree reaches constant temperature to control turbofan 532, that is, keeps ultralow temperature, and semiconductor refrigerating equipment compared with the prior art is only
The performance that opposite room temperature reduces certain temperature can be reached, be improved in the performance that this programme is visited at low temperature.
Further, the electromagnetic assembly 20 and magnet 30 are respectively cyclic structure；The conduction cooling part 40 and electromagnetic assembly
20 and magnet 30 be coaxially disposed respectively, the outer wall 12 of the cup body 10 is equipped with the first protrusion 21, and first protrusion 21 is towards leading
Cold part 40 extends, and the side wall of the conduction cooling part 40 is equipped with the second protrusion 41 being equipped with the first protrusion 21, and described second
Protrusion 41 is located between the first protrusion 21 and the inner wall 11 of cup body 10.
Seen from the above description, after electromagnetic assembly 20 powers off, the first protrusion 21 can be prevented with 41 cooperation of the second protrusion
Conduction cooling part 40 slides.
Further, further include sealing device 60, the sealing device 60 is sheathed in the second protrusion 41 and is located at second
Between the outer wall 12 and the outer wall 12 of cup body 10 of protrusion 41.
Seen from the above description, by be arranged sealing device 60 can enhance heat insulation and preservation effect, prevent heat loss or
Extraneous air enters insulated cavity 13.
Further, it is equipped with inert gas in the insulated cavity 13 and inert gas is full of insulated cavity 13.
Seen from the above description, insulated cavity 13 is evacuated first, then is filled with inert gas thereto, it is so heat-insulated
The heat insulation effect of cavity 13 is more preferable.
Fig. 1-2 is please referred to, the embodiment of the present invention one is：
A kind of semiconductor cooling device, including cup body 10, electromagnetic assembly 20, magnet 30, conduction cooling part 40,50 and of refrigeration module
Sealing device 60, the cup body 10, electromagnetic assembly 20, magnet 30 and refrigeration module 40 are set gradually；
The cup body 10 is the double-layer structure being made of inner wall 11 and outer wall 12, is equipped between the inner wall 11 and outer wall 12
Insulated cavity 13,13 inside of the insulated cavity are full of inert gas；
The electromagnetic assembly 20 and magnet 30 are respectively cyclic structure；
The refrigeration module 50 is equipped with semiconductor refrigeration member 51, and one end of the conduction cooling part 40 passes through magnet 30 and refrigeration
The semiconductor refrigeration member 51 of module 50 is connected, and the other end of the conduction cooling part 40 sequentially passes through the outer of electromagnetic assembly 20 and cup body 10
Wall 12 simultaneously extends towards the inner wall of cup body 10 11；
The electromagnetic assembly 20 and magnet 30 are respectively cyclic structure；The conduction cooling part 40 and electromagnetic assembly 20 and magnet 30
It being coaxially disposed respectively, the outer wall 12 of the cup body 10 is equipped with the first protrusion 21, and first protrusion 21 extends towards conduction cooling part 40,
The side wall of the conduction cooling part 40 is equipped with the second protrusion 41 for being equipped with the first protrusion 21, and second protrusion 41 is located at the
Between one protrusion 21 and the inner wall 11 of cup body 10；
The sealing device 60 is sheathed in the second protrusion 41 and positioned at the outer of the outer wall 12 of the second protrusion 41 and cup body 10
Between wall 12；
The magnet 30 and refrigeration module 50 are affixed, the magnet 30 with the energization of electromagnetic assembly 20 with power-off towards close or
Direction movement far from cup body 10, the other end of the conduction cooling part 40 are contacted or are detached with inner wall 11 with the movement of magnet 30.
Refrigeration module 50 in the present embodiment is the semiconductor refrigerating module of routine in the prior art.
Please refer to Fig. 3-5, the embodiment of the present invention two and embodiment one difference lies in：
The refrigeration module 50 further includes radiating piece 52, turbine wheel 53, cool guide sheet 54 and control panel 55, it is described partly cause it is cold
Part 51 is wholely set with radiating piece 52；
The radiating piece 52 includes heat dissipation platform, radiating fin and the heat-dissipating pipe 522, and heat dissipation platform is far from the turbine wheel 53
One side connect with semiconductor refrigeration member 51, heat dissipation platform close to the turbine wheel 53 another side be equipped with the radiating fin and dissipate
Heat pipe 522, heat-dissipating pipe 522 are vertically set to the central area of radiating piece 52, and radiating fin radially divides around heat-dissipating pipe 522
Cloth, constitute between the adjacent radiating fin of arbitrary two panels it is described cross air port 521, the air inlet of the turbine wheel 53 is located at cyclic annular tie
The air outlet 531 in the center of the radiating fin of structure, the turbine wheel 53 is set on the radiating fin of turbine wheel 53, the radiating piece
Cross air port 521, the air inlet on turbine wheel 53 and the air outlet on turbine wheel 53 531 on 52 are sequentially communicated to form air duct, institute
The air duct stated in turbine wheel 53 is gradually increased by the circulation area of air inlet to air outlet 531.
One end of the heat-dissipating pipe 522 is connected with heat dissipation platform, and the other end of the heat-dissipating pipe 522 passes through air inlet and extends
To the inside of turbine wheel 53.
Turbofan 532 and fixed blade 533 are equipped in the turbine wheel 53, the fixed blade 533 is cyclic annular and solid
It is scheduled in the inner bottom wall of turbine wheel 53, the turbofan 532 is with the coaxial arrangement of fixed blade 533 positioned at fixed blade 533
In inner ring, turbofan 532 sucks air from air inlet after rotating, and is conveyed towards surrounding through fixed blade 533, and air is solid
It is discharged through air outlet 531 after converging between fixed blade 533 and the inner cavity of turbine wheel 53.Wherein 532 fixed blade 533 of turbofan
The combination of one movable vane, one stator blade so that adverse current will not occur in turbine wheel 53.
The cool guide sheet 54 covers the one side of the separate radiating piece 52 of semiconductor refrigeration member 51.
The control panel 55 is set on radiating piece 52, and NTC temperature sensors, the control panel are equipped in the control panel 55
55 are electrically connected with the driving motor of turbofan 532.
When refrigeration module 50 in the present embodiment works, since radiating piece 52 and semiconductor refrigeration member 51 are made of one formula
, the heat in 51 hot junction of semiconductor refrigeration member is promptly oriented to radiating piece 52.When turbine wheel 53 works, internal turbofan
532 rotations, what fan in turbine wheel 53 of air outside radiating piece 52 under the action of passed through radiating piece 52 successively crosses air port, thoroughly
It is discharged turbine wheel 53 after the air inlet of flat wheel 53 and the air outlet 531 of turbine wheel 53.Air outside radiating piece 52 is passing through
Radiating piece 52 is washed away when crossing air port 521, to complete primary heat dissipation, washes away heat-dissipating pipe in the air inlet on entering turbine wheel 53
522, to complete the second heat dissipation, the structure of radiating piece 52 farthest increases the contact area with air, radiates twice
It can take away more heats, and the fan of turbine wheel 53 compared with the prior art, internal air-flow will not reverse in work, only meeting
It is flowed along a direction, the discharge that heat can also be much smoother.
In conclusion the present invention provides a kind of semiconductor cooling devices for effectivelying prevent refrigeration to fail.The semiconductor
Refrigerating plant electromagnetic assembly when needing refrigeration is powered, and cooling assembly is contacted with wall of cup to freeze, the electromagnetism when refrigeration is completed
Component powers off, and the cold end of cooling assembly is detached with wall of cup, and the heat in the hot junction of cooling assembly would not pass back on cup body, ensures
The effect of refrigerating thermal-insulation.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalents made by bright specification and accompanying drawing content are applied directly or indirectly in relevant technical field, include similarly
In the scope of patent protection of the present invention.
Claims (8)
1. a kind of semiconductor cooling device, which is characterized in that including cup body, electromagnetic assembly, magnet and the refrigeration train set gradually
Part, the magnet and cooling assembly are affixed, and the magnet is with the energization of electromagnetic assembly with power-off towards the side closer or far from cup body
To movement, the cold end of the cooling assembly is contacted or is detached with wall of cup with the movement of magnet.
2. semiconductor cooling device according to claim 1, which is characterized in that the cup body is to be made of inner and outer wall
Double-layer structure, insulated cavity, the movement and cup of the cold end of the cooling assembly with magnet are equipped between the inner wall and outer wall
The inner wall of body contacts or separation.
3. semiconductor cooling device according to claim 2, which is characterized in that the cooling assembly includes conduction cooling part and system
Chill group, the refrigeration module are equipped with semiconductor refrigeration member, and one end of the conduction cooling part passes through the half of magnet and refrigeration module
Conductor cooling component is connected, and the other end of the conduction cooling part sequentially passes through the outer wall of electromagnetic assembly and cup body and prolongs towards the inner wall of cup body
It stretches.
4. semiconductor cooling device according to claim 3, which is characterized in that the semiconductor refrigeration member and radiating piece one
Body formula is arranged, and the radiating piece is bonded setting with turbine wheel, and the radiating piece was equipped with air port and at least two heat-dissipating pipes,
The air outlet on the air inlet and turbine wheel on air port excessively, turbine wheel on the radiating piece is sequentially communicated to form air duct, described
One end of heat-dissipating pipe extends towards air inlet and extends to the inside of turbine wheel, and the air duct in the turbine wheel is by air inlet to outlet air
The circulation area of mouth gradually increases, and the magnet and radiating piece are affixed.
5. semiconductor cooling device according to claim 4, which is characterized in that further include control panel, the control panel is set
In on radiating piece, being equipped with NTC temperature sensors in the control panel, the driving motor of the control panel and driving turbine wheel is electrically connected
It connects.
6. semiconductor cooling device according to claim 3, which is characterized in that the electromagnetic assembly and magnet are respectively ring
Shape structure；The conduction cooling part is coaxially disposed respectively with electromagnetic assembly and magnet, and the outer wall of the cup body is equipped with the first protrusion, institute
It states the first protrusion towards conduction cooling part to extend, the side wall of the conduction cooling part is equipped with the second protrusion being arranged with the first male cooperation, institute
The second protrusion is stated to be located between the first protrusion and the inner wall of cup body.
7. semiconductor cooling device according to claim 6, which is characterized in that further include sealing device, the sealing dress
It sets and is sheathed on the second protrusion above and between the outer wall and the outer wall of cup body of the second protrusion.
8. semiconductor cooling device according to claim 1, which is characterized in that be equipped with inert gas in the insulated cavity
And inert gas is full of insulated cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811010579.4A CN108679876A (en) | 2018-08-31 | 2018-08-31 | A kind of semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811010579.4A CN108679876A (en) | 2018-08-31 | 2018-08-31 | A kind of semiconductor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108679876A true CN108679876A (en) | 2018-10-19 |
Family
ID=63815625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811010579.4A Pending CN108679876A (en) | 2018-08-31 | 2018-08-31 | A kind of semiconductor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108679876A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111998571A (en) * | 2020-09-08 | 2020-11-27 | 南京理工大学 | Heat abstractor based on electro-magnet removes electricity card refrigeration device |
| CN113654268A (en) * | 2021-09-10 | 2021-11-16 | 清远市联升空气液化有限公司 | Precooling apparatus for gas treatment |
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| CN207674759U (en) * | 2017-12-27 | 2018-07-31 | 宁波方太厨具有限公司 | A kind of semiconductor cooling device |
| CN208817760U (en) * | 2018-08-31 | 2019-05-03 | 厦门帕尔帖电子科技有限公司 | A kind of semiconductor cooling device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101616566A (en) * | 2008-06-25 | 2009-12-30 | 富准精密工业(深圳)有限公司 | Heat abstractor |
| CN202382514U (en) * | 2011-12-29 | 2012-08-15 | Tcl空调器(中山)有限公司 | Minitype refrigeration cup |
| CN104687949A (en) * | 2014-09-30 | 2015-06-10 | 泉州市功夫动漫设计有限公司 | Intelligent vacuum cup |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111998571A (en) * | 2020-09-08 | 2020-11-27 | 南京理工大学 | Heat abstractor based on electro-magnet removes electricity card refrigeration device |
| CN113654268A (en) * | 2021-09-10 | 2021-11-16 | 清远市联升空气液化有限公司 | Precooling apparatus for gas treatment |
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