CN105193246B - A kind of cooling system and electric pressure cooking saucepan - Google Patents
A kind of cooling system and electric pressure cooking saucepan Download PDFInfo
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- CN105193246B CN105193246B CN201510681057.7A CN201510681057A CN105193246B CN 105193246 B CN105193246 B CN 105193246B CN 201510681057 A CN201510681057 A CN 201510681057A CN 105193246 B CN105193246 B CN 105193246B
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Abstract
The present invention relates to heat abstractor technical field, more particularly to a kind of cooling system and electric pressure cooking saucepan.Cooling system includes air-intake device, air exhausting device and liquid cooling circulator；The air-intake device and air exhausting device form cooling cycle wind；The liquid cooling circulator includes semiconductor chilling plate, radiator, refrigerator pipes and cooling tube；The refrigerator pipes are connected to form liquid circulation line by connecting line with cooling tube；The semiconductor chilling plate is arranged on the air inlet of air exhausting device by radiator, and the semiconductor chilling plate includes cold end and hot junction, its cold end is close to refrigerator pipes setting, its hot junction held against heat sink is set.Present invention also offers the electric pressure cooking saucepan using above-mentioned cooling system at the same time.The cooling effectiveness with the use of cooling system with higher that the present invention is cooled down by cooling cycle wind and liquid circulation, since after cooled object is cooled to room temperature, semiconductor chilling plate works on, and realizes refrigerating function there are the refrigeration of semiconductor chilling plate.
Description
Technical field
The present invention relates to heat abstractor technical field, more particularly to a kind of cooling system and electric pressure cooking saucepan.
Background technology
Electric pressure cooking saucepan because can fast cooking and in cooking process food nutrition loss be subject to people to like less.But voltage
After the culinary art work of power pot, because there is high pressure in pot, user cannot open pot cover at once, and must unplug pressure limiting valve exhausting drop
Pressure, or allow food natural cooling in pot, lid taking-up food could be opened after waiting pot inner pressure to reduce, uses and not enough facilitates
Fast.In addition, during user unplugs pressure limiting valve exhausting decompression, if culinary art is slop in pot, in pot
Slop easily by gases at high pressure from exhaust ports spray, bring danger to user, at the same can also pollute pot body outer surface and
Environment.
In view of the above-mentioned problems, having made some improvement to electric pressure cooking saucepan in the prior art, such as water cooling equipment is added,
As Chinese patent application provides a kind of electric pressure cooking saucepan quickly cooled down, including pot body and pot cover, liner is equipped with the pot body,
The pot cover includes upper cover and inner cover, and flying height, the height of the flying height are equipped between the inner cover and the upper cover
Less than 3.5mm, the inner cover and the liner form culinary art cavity, it is described in be covered with cooling chamber, the cooling chamber is communicated with
Water inlet and water outlet, wherein, the intermediate plate to float together with inner cover is additionally provided with above the inner cover, is set on the intermediate plate
There are water supply connector and water out adapter, the water supply connector and water inlet Butt sealing, the water out adapter docks close with water outlet
Envelope.
Although aforesaid way can improve the radiating efficiency of electric pressure cooking saucepan to a certain extent, although above-mentioned water-cooling system energy
It is enough that electric pressure cooking saucepan is cooled down, but its structure is more complicated, if desired for external water source and discharge pipe line, and cooling effectiveness
It is relatively low.
In view of the above-mentioned problems, we need one kind to use simple structure, and the cooling with higher cooling effectiveness
System and electric pressure cooking saucepan.
The content of the invention
It is an object of the invention to propose a kind of cooling system, the existing knot of existing radiator structure cooling structure can be solved
The problem of structure loads, radiating efficiency is low.
It is another object of the present invention to propose a kind of electric pressure cooking saucepan using above-mentioned cooling system.
For this purpose, the present invention uses following technical scheme：
A kind of cooling system, it includes air-intake device, air exhausting device and liquid cooling circulator；
The air-intake device and air exhausting device form cooling cycle wind；
The liquid cooling circulator includes semiconductor chilling plate, radiator, refrigerator pipes and cooling tube；
The refrigerator pipes are connected to form liquid circulation line by connecting line with cooling tube；
The semiconductor chilling plate is arranged on the air inlet of air exhausting device, the semiconductor chilling plate bag by radiator
Cold end and hot junction are included, its cold end is close to refrigerator pipes setting, its hot junction held against heat sink is set.
As a kind of preferred solution of above-mentioned cooling system, temperature difference electricity generation device is further included, and the quantity of air exhausting device is
At least two；
The temperature difference electricity generation device includes thermoelectric generation film and power generation sheet heat radiator；
The side of the power generation sheet heat radiator is bonded setting with the cold end of thermoelectric generation film, and the other end is arranged on air exhausting device
Upper end；
The thermoelectric generation film is electrically connected with semiconductor chilling plate, and is powered for semiconductor chilling plate.
As a kind of preferred solution of above-mentioned cooling system, the air exhausting device includes exhaust outlet and is arranged at exhaust outlet
Air ejector fan, and the semiconductor chilling plate is arranged on the air inlet of air ejector fan by radiator；
The air-intake device includes air inlet and is arranged on the air inlet fan of air inlet.
As a kind of preferred solution of above-mentioned cooling system, the air inlet of the air-intake device and the exhaust outlet of air exhausting device
It is arranged at intervals, and grid is both provided with the air inlet of air-intake device and the exhaust outlet of air exhausting device.
As a kind of preferred solution of above-mentioned cooling system, the refrigerator pipes and cooling tube are coiled structure.
As a kind of preferred solution of above-mentioned cooling system, the refrigerator pipes and cooling tube are copper pipe or aluminum pipe.
As a kind of preferred solution of above-mentioned cooling system, set on the connecting line between the refrigerator pipes and cooling tube
There is liquid circulation pump.
As a kind of preferred solution of above-mentioned cooling system, heat conduction is provided between the semiconductor chilling plate and radiator
Medium.
As a kind of preferred solution of above-mentioned cooling system, control device, the control device and semiconductor system are further included
Cold electrical connection, to control the working status of semiconductor chilling plate.
A kind of electric pressure cooking saucepan, including shell, outer pot, interior pot, heater and cooling system as described above；
The cooling tube is arranged between outer pot and interior pot, the cooling for interior pot；
The air inlet of the air-intake device, the exhaust outlet of air exhausting device are opened on enclosure bottom, and refrigerator pipes with it is outer
There are spacing between pot.
Beneficial effects of the present invention are：The present invention is provided cold by the refrigeration of semiconductor chilling plate for liquid circulation line
Amount, can form cooling cycle wind between air-intake device and air exhausting device, the cooperation that cooling cycle wind and liquid circulation cool down makes
There is the cooling effectiveness of higher with cooling system, since the refrigeration there are semiconductor chilling plate is cooled to room temperature in cooled object
Afterwards, semiconductor chilling plate works on, and realizes refrigerating function.
Brief description of the drawings
Fig. 1 is the structure diagram for the cooling system that the specific embodiment of the invention provides；
Fig. 2 is the decomposing state schematic diagram for the refrigeration system that the specific embodiment of the invention provides；
Fig. 3 is the internal structure schematic diagram for the electric pressure cooking saucepan that the specific embodiment of the invention provides；
Fig. 4 is the structure diagram that the fluid circulation system that the specific embodiment of the invention provides coordinates with outer pot；
Fig. 5 is the structure diagram that the cooling tube that the specific embodiment of the invention provides coordinates with outer pot, interior pot；
Fig. 6 is the structure diagram for the bottom case that the specific embodiment of the invention provides.
Wherein：
1：Semiconductor chilling plate；2：Radiator；3：Refrigerator pipes；4：Cooling tube；5：Connecting line；6：Exhaust outlet；7：Air draft
Fan；8：Air inlet；9：Air inlet fan；10：Liquid circulation pump；11：Shell；12：Outer pot；13：Interior pot；14：Heater；15：
Bottom case；
101：Cold end；102：Hot junction.
Embodiment
Further illustrate technical scheme below with reference to the accompanying drawings and specific embodiments.
As shown in Figures 1 to 6, present embodiments provide for a kind of cooling system, which includes air-intake device, row
Wind apparatus and liquid cooling circulator, form cooling cycle wind between air-intake device and air exhausting device.Liquid cooling circulation dress
Put and connected including semiconductor chilling plate 1, radiator 2, refrigerator pipes 3 and cooling tube 4, refrigerator pipes 3 by connecting line 5 and cooling tube 4
Connect to form liquid circulation line.Semiconductor chilling plate 1 is arranged on the air inlet of air exhausting device, semiconductor system by radiator 2
Include cold end 101 and hot junction 102 for cold 1, its cold end 101 is close to refrigerator pipes 3 and is set, its 102 held against heat sink 2 of hot junction is set.
Present embodiment provides cold, semiconductor chilling plate 1 by the refrigeration of semiconductor chilling plate 1 for liquid circulation line
Its radiating efficiency can be improved by the cooperation with air exhausting device.Cooling cycle can be formed between air-intake device and air exhausting device
The cooling effectiveness with the use of cooling system with higher of wind, cooling cycle wind and liquid circulation cooling, partly leads due to existing
After cooled object is cooled to room temperature, semiconductor chilling plate 1 works on the refrigeration of body cooling piece 1, realizes refrigerating function.
Cooling system further includes temperature difference electricity generation device (not shown), and the quantity of air exhausting device is at least two, and part
The air inlet of air exhausting device is provided with semiconductor chilling plate 1, and the air inlet of part air exhausting device is provided with thermo-electric generation dress
Put.
Temperature difference electricity generation device includes thermoelectric generation film and power generation sheet heat radiator, the side for the sheet heat radiator that generates electricity and thermo-electric generation
The cold end fitting of piece is set, and the other end is arranged on the upper end of air exhausting device, and thermoelectric generation film is electrically connected with semiconductor chilling plate, and
Power for semiconductor chilling plate.Specifically, the hot junction of thermoelectric generation film is bonded with thing to be cooled, thus, it is possible to using to be cooled
The heat that thing produces carries out power generation and is used for semiconductor chilling plate 1, has saved the use of the energy.
With reference to Fig. 3, Fig. 6, air exhausting device includes exhaust outlet 6 and the air ejector fan 7 being arranged at exhaust outlet 6, and semiconductor
Cooling piece 1 is arranged on the air inlet of air ejector fan 7 by radiator 2, and air-intake device includes air inlet 8 and is arranged on air inlet
Air inlet fan 9 at 8.
The air inlet/outlet between air inlet 8 and exhaust outlet 6 interferes with each other in order to prevent, and air inlet 8 and the interval of exhaust outlet 6 are set
Put.Debris enters air-intake device and air exhausting device in order to prevent, and grid is both provided with air inlet 8 and exhaust outlet 6.
With reference to Fig. 4, in order to improve the heat exchange efficiency between refrigerator pipes 3 and semiconductor chilling plate 1, cooling tube 4 with it is to be cooled
Heat exchange efficiency between thing, refrigerator pipes 3 and cooling tube 4 are coiled structure, and material is made used by refrigerator pipes 3 and cooling tube 4
Expect for copper pipe or aluminum pipe.
In order to improve the efficiency of liquid circulation in liquid circulation line, on the connecting line between refrigerator pipes 3 and cooling tube 4
It is provided with liquid circulation pump 10.
In order to improve the heat exchange efficiency between semiconductor chilling plate 1 and radiator 2, semiconductor chilling plate 1 and radiator 2 it
Between be provided with heat-conducting medium.As preference, semiconductor chilling plate 1 is fitted on radiator 2 by heat conductive silica gel.
Cooling system further includes control device, control device and semiconductor chilling plate 1, thermoelectric generation film, air inlet fan 9,
Air ejector fan 7 is electrically connected, to control the working status of semiconductor chilling plate 1, thermoelectric generation film, air inlet fan 9, air ejector fan 7.
Above-mentioned cooling system can be used for the equipment cooling of the needs such as computer, electromagnetic oven, electric pressure cooking saucepan cooling, in this implementation
In mode, it is described in detail so that cooling system is applied on electric pressure cooking saucepan as an example, specifically as described below：With reference to Fig. 3
To Fig. 6, a kind of electric pressure cooking saucepan, including shell 11, outer pot 12, interior pot 13, heater 14, and cooling system as described above
System.Cooling tube 4 is arranged between outer pot 12 and interior pot 13, for the cooling of interior pot 13, the air inlet 8 of air-intake device, air draft dress
The exhaust outlet 6 put is opened on enclosure bottom, and there are spacing between refrigerator pipes 3 and outer pot 12.
Further specifically, the bottom of shell 11 is bottom case 15, air-intake device includes air inlet 8 and air inlet fan 9, air draft
Device includes exhaust outlet 6 and air ejector fan 7, and the quantity of air-intake device and air exhausting device can be set according to actual needs,
In the present embodiment, it is described in detail by taking an air-intake device and an air exhausting device as an example.Air inlet 8 and exhaust outlet 6
It is opened on 15 bottom surface of bottom case, air inlet fan 9 and air ejector fan 7 are arranged on corresponding position, and the air inside bottom case 15 exists
Air under the action of air-intake device and air exhausting device with the electric pressure cooking saucepan external world forms air circulation, can be right by air circulation
Interior pot 13 cools down.Semiconductor chilling plate 1 is arranged at the air inlet 8 of air ejector fan by radiator 2, semiconductor chilling plate
1 includes cold end 101 and hot junction 102, its cold end 101 is close to refrigerator pipes 3 and is set, its 102 held against heat sink 2 of hot junction is set.Refrigeration
Pipe 3, cooling tube 4, liquid circulation pump 10 form liquid circulation line by pipeline, and the liquid in circulation line is in liquid circulation pump
Under 10 driving, circulate, form liquid circulation cooling system.Cooling tube 4 is close to the setting of 12 inner wall of outer pot, and interior pot 13 is arranged
In outer pot 12, interior pot 13 is contacted with cooling tube 4 after interior pot 13 is put into outer pot 12, by liquid circulation flow internal pot 13 into
Row cooling.Liquid circulation pump 10 is arranged on the outer wall of outer pot 12, and the mouth of pipe is provided with outer pot 12, and connecting line 5 passes through pipe
Mouthful to connect cooling tube 4, refrigerator pipes 3 and liquid circulation pump 10.
The above-mentioned specific cooling procedure of electric pressure cooking saucepan is：Natural wind passes through 15 inlet air of bottom case under the driving of air inlet fan 9
Mouth 8 enters in electric pressure cooking saucepan, and the hot wind in electric pressure cooking saucepan discharges electricity under the driving of air ejector fan 7 by 15 exhaust outlet 6 of bottom case
Outside pressure cooker, make hot-air in electric pressure cooking saucepan carry out replacing flowing with cool exterior air, take away unnecessary heat, it can be achieved that pot body
Fast cooling cools down.Under the driving of liquid circulation pump 10, cooling tube 4 is flowed with the liquid circulation in refrigerator pipes 3, wherein liquid
During by cooling tube 4, the heat heating of pot 13 in the liquid absorption in cooling tube 4, when liquid passes through refrigerator pipes 3, in semiconductor
Cooled down under the refrigeration of cooling piece 1.Coordinate pot 13 in achievable by what circulated air cooling and liquid circulation cooled down
Quick cooling, meanwhile, when temperature is down to room temperature, semiconductor chilling plate 1 can continue cooling and realize refrigerating function.
Above in association with the specific embodiment technical principle that the invention has been described.These descriptions are intended merely to explain the present invention's
Principle, and limiting the scope of the invention cannot be construed in any way.Based on explanation herein, the technology of this area
Personnel would not require any inventive effort the other embodiments that can associate the present invention, these modes are fallen within
Within protection scope of the present invention.
Claims (8)
1. a kind of cooling system, it is characterised in that including air-intake device, air exhausting device and liquid cooling circulator；
The air-intake device and air exhausting device form cooling cycle wind；
The liquid cooling circulator includes semiconductor chilling plate (1), radiator (2), refrigerator pipes (3) and cooling tube (4)；
The refrigerator pipes (3) are connected to form liquid circulation line by connecting line (5) with cooling tube (4)；
The semiconductor chilling plate (1) is arranged on the air inlet of air exhausting device, the semiconductor chilling plate by radiator (2)
(1) cold end (101) and hot junction (102) are included, its cold end (101) is close to refrigerator pipes (3) setting, its hot junction (102) is close to radiate
Device (2) is set；
The air exhausting device includes exhaust outlet (6) and the air ejector fan (7) for being arranged on exhaust outlet (6) place, and the semiconductor system
Cold (1) is arranged on the air inlet of air ejector fan (7) by radiator (2)；The air-intake device includes air inlet (8) and sets
Put the air inlet fan (9) at air inlet (8) place；
Control device is further included, the control device is electrically connected with semiconductor chilling plate (1), to control semiconductor chilling plate (1)
Working status.
2. cooling system according to claim 1, it is characterised in that further include temperature difference electricity generation device, and air exhausting device
Quantity is at least two, and the air inlet of part air exhausting device is provided with semiconductor chilling plate (1), part air exhausting device into
Temperature difference electricity generation device is provided with air port；
The temperature difference electricity generation device includes thermoelectric generation film and power generation sheet heat radiator；
The side of the power generation sheet heat radiator is bonded setting with the cold end of thermoelectric generation film, and the other end is arranged on the upper of air exhausting device
End；
The thermoelectric generation film is electrically connected with semiconductor chilling plate (1), and is powered for semiconductor chilling plate (1).
3. cooling system according to claim 1, it is characterised in that the air inlet (8) of the air-intake device and air draft dress
The exhaust outlet (6) put is arranged at intervals, and is both provided with the air inlet (8) of air-intake device and exhaust outlet (6) place of air exhausting device
Grid.
4. cooling system according to claim 1 or 2, it is characterised in that the refrigerator pipes (3) and cooling tube (4) are disk
Tubular structure.
5. cooling system according to claim 1 or 2, it is characterised in that the refrigerator pipes (3) and cooling tube (4) are copper
Pipe or aluminum pipe.
6. cooling system according to claim 1 or 2, it is characterised in that between the refrigerator pipes (3) and cooling tube (4)
Connecting line on be provided with liquid circulation pump (10).
7. cooling system according to claim 1 or 2, it is characterised in that the semiconductor chilling plate (1) and radiator
(2) heat-conducting medium is provided between.
8. a kind of electric pressure cooking saucepan, including shell (11), outer pot (12), interior pot (13) and heater (14), it is characterised in that also wrap
Include the cooling system as described in claim 1 to 7 any one；
The cooling tube (4) is arranged between outer pot (12) and interior pot (13), the cooling for interior pot (13)；
The air inlet (8) of the air-intake device, the exhaust outlet (6) of air exhausting device are opened on shell (11) bottom surface, and are freezed
There are spacing between pipe (3) and outer pot (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510681057.7A CN105193246B (en) | 2015-10-19 | 2015-10-19 | A kind of cooling system and electric pressure cooking saucepan |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510681057.7A CN105193246B (en) | 2015-10-19 | 2015-10-19 | A kind of cooling system and electric pressure cooking saucepan |
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| Publication Number | Publication Date |
|---|---|
| CN105193246A CN105193246A (en) | 2015-12-30 |
| CN105193246B true CN105193246B (en) | 2018-05-01 |
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ID=54941501
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510681057.7A Active CN105193246B (en) | 2015-10-19 | 2015-10-19 | A kind of cooling system and electric pressure cooking saucepan |
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| CN105476448A (en) * | 2016-02-02 | 2016-04-13 | 广东天际电器股份有限公司 | Anti-sticking method and device for electric cooker |
| CN107836987A (en) * | 2016-09-21 | 2018-03-27 | 佛山市顺德区美的电热电器制造有限公司 | Humidity control system and cooking apparatus |
| CN111671298A (en) * | 2020-06-28 | 2020-09-18 | 福清市诚冠科技有限公司 | Autoclave with cooling function |
| CN114305059B (en) * | 2020-09-30 | 2023-06-23 | 佛山市顺德区美的电热电器制造有限公司 | Cooking apparatus, control method of cooking apparatus, and computer-readable storage medium |
| CN114337375A (en) * | 2021-12-22 | 2022-04-12 | 北京化工大学 | Passive radiator, thermoelectric power generation device and thermoelectric power generation system |
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| JPH0926248A (en) * | 1995-07-11 | 1997-01-28 | Matsushita Electric Ind Co Ltd | Cold water device |
| CN101032367A (en) * | 2007-04-10 | 2007-09-12 | 广东新宝电器股份有限公司 | Slow-speed saucepan with refrigerating and fresh-keeping function and operation method |
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