CN107836987A - Humidity control system and cooking apparatus - Google Patents
Humidity control system and cooking apparatus Download PDFInfo
- Publication number
- CN107836987A CN107836987A CN201610839988.XA CN201610839988A CN107836987A CN 107836987 A CN107836987 A CN 107836987A CN 201610839988 A CN201610839988 A CN 201610839988A CN 107836987 A CN107836987 A CN 107836987A
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- China
- Prior art keywords
- heat
- control system
- semiconductor chilling
- side plate
- pot
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Classifications
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J27/00—Cooking-vessels
- A47J27/08—Pressure-cookers; Lids or locking devices specially adapted therefor
- A47J27/088—Pressure-cookers; Lids or locking devices specially adapted therefor adapted to high-frequency heating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
Abstract
The present invention proposes a kind of humidity control system and cooking apparatus, wherein, cooking apparatus includes pot and pot cover, and humidity control system is arranged in pot and pot cover；Humidity control system includes：Internal circulation system；Semiconductor chilling plate, the side of semiconductor chilling plate are used to carry out heat exchange with internal circulation system；External circulating system, for carrying out heat exchange with the opposite side of semiconductor chilling plate；Power supply circuit, for being powered to semiconductor chilling plate；Control system, for controlling internal circulation system, semiconductor chilling plate and the working condition of external circulating system.Humidity control system provided by the invention, the working condition of internal circulation system, semiconductor chilling plate and external circulating system is controlled by control system, to realize that being rapidly heated in cooking apparatus or the temperature in pot, pressure keep constant and fast cooling decompression, and then further improve cooking speed, and the reduction of blood pressure in high-speed of cooking apparatus, so as to Rapid opening, man-machine performance and security are improved.
Description
Technical field
The present invention relates to living electric apparatus field, in particular to a kind of humidity control system and cooking apparatus.
Background technology
In the related art, some cooking apparatus can produce HTHP in cooking process, to realize fast cooking, from
And obtain liking for consumer.But it need to quickly heat the decompression of pressure, after the cooking section in the heating process of culinary art leading portion
Journey need to quickly cool down decompression, and two demands can not be solved effectively simultaneously, constrain cooking apparatus and further lift culinary art speed
Degree, especially can not reduction of blood pressure in high-speed the problem of, it has also become industry problems.At present, the conventional decompression side of the cooking apparatus of in the market
Method has following several：Natural cooling, exhaust decompression, air-cooled acceleration and pressure decrease, water cooling acceleration and pressure decrease etc..But problems be present：From
So cooling needs to wait for time length；Exhaust decompression can not solve overflow problem；Air-cooled and water cooling decompression efficiency is low, noise is big, and ties
Structure is complicated, cost is high, fault rate is high.
The content of the invention
At least one in order to solve the above-mentioned technical problem, of the invention first purpose proposes a kind of temperature adjustment system
System.
A kind of another object of the present invention, it is also proposed that cooking apparatus.
In view of this, embodiment according to the first aspect of the invention, the present invention propose a kind of humidity control system, use
In cooking apparatus, cooking apparatus includes pot and the pot cover being arranged in pot, and humidity control system is arranged on pot and pot cover
On, humidity control system includes：Internal circulation system；Semiconductor chilling plate, the side of semiconductor chilling plate are used for and interior cyclic system
System carries out heat exchange；External circulating system, for carrying out heat exchange with the opposite side of semiconductor chilling plate；Power supply circuit, with partly leading
Body cooling piece is connected, for being powered to semiconductor chilling plate；Control system, for controlling the work shape of semiconductor chilling plate
State.
Humidity control system provided by the invention, by the way that the side of semiconductor chilling plate and internal circulation system are carried out into hot friendship
Change, opposite side and the external circulating system of semiconductor chilling plate carry out heat exchange, control system control internal circulation system, semiconductor system
Cold and the working condition of external circulating system, when being rapidly heated and temperature in pot, pressure is kept constant or quick
The cooling decompression operational phase, by control system control power supply circuit the sense of current, make internal circulation system, semiconductor chilling plate and
External circulating system is worked accordingly, to realize that being rapidly heated in cooking apparatus or the temperature in pot, pressure keep permanent
The decompression of fixed and fast cooling, and then cooking speed is further improved, and the reduction of blood pressure in high-speed of cooking apparatus, so as to
The problems such as Rapid opening, avoiding after culinary art terminates and wait as long for, and spraying, overflow outside steam in pressure reduction, ensure that and cook
The security prepared food during utensil use, improves user experience.
In addition, the humidity control system in above-described embodiment provided by the invention can also have following supplementary technology special
Sign：
In the above-mentioned technical solutions, it is preferable that internal circulation system includes water pump；Hot service pipe, above pot cover, with
Pot cover is fitted, and one end of hot service pipe is connected with water pump；Heat exchanging pipe, positioned at pot side, with semiconductor chilling plate
Side fit, the both ends of heat-exchange tube are connected with hot service pipe and water pump respectively；Wherein, water pump, hot service pipe
And heat-exchange tube forms the circulation loop of closing.
In the technical scheme, the circulation loop of closing is formed by water pump, hot service pipe and heat exchanging pipe, and will
Hot service pipe is arranged above pot cover, is fitted with pot cover, one end is connected with water pump, and heat exchanging pipe is arranged at pot side
Face, fitted with the side of semiconductor chilling plate, both ends are connected with hot service pipe and water pump respectively.Hot service pipe and heat
Exchange the medium in pipeline is realized in the presence of water pump in circulate, when cooking apparatus is rapidly heated and makes the temperature in pot
Degree, pressure keep constant periods, and heat can by hot service pipe, the continuous circulation in the presence of water pump be fast by heat-exchange tube
Speed transfers heat to pot cover, realizes that pot cover temperature rises rapidly or maintains high temperature, so as to reach the purpose being rapidly heated；Fast
Prompt drop temperature decompression phase, hot service pipe absorb the heat in cooking apparatus, then by heat-exchange tube under the work of water pump not
Disconnected circulation will quickly discharge heat to the external world, realize pot cover rapid drop in temperature, so as to reach the purpose of fast cooling decompression.
In the above-mentioned technical solutions, it is preferable that semiconductor chilling plate includes the first side plate and with the first side plate back to setting
The second side plate；Wherein, one in the first side plate and the second side plate is cold end, another in the first side plate and the second side plate
For hot junction, the first side plate fits with heat exchanging pipe.
In the technical scheme, by the way that the first side plate will be set on semiconductor chilling plate and with the first side plate back to setting
Second side plate, and the first side plate fits with heat exchanging pipe, cooking apparatus be rapidly heated and make temperature in pot,
Pressure keeps constant periods, control system control electric current direction, the first side plate is turned into hot junction, and hot friendship is carried out to heat exchanging pipe
Changing, the second side plate turns into cold end, absorbs the progress that external heat promotes heat exchange, so as to reach the purpose being rapidly heated, or
Fast cooling decompression phase, control system control electric current direction, the first side plate is turned into cold end, heat exchanging pipe is dissipated
Heat, the second side plate turn into hot junction, and the heat for absorbing the release of the first side plate promotes the progress of radiating, so as to reach fast cooling decompression
Purpose.
In the above-mentioned technical solutions, it is preferable that external circulating system includes fin and the radiation air on the outside of fin
Fan；Wherein, the second side plate of fin and semiconductor chilling plate fits.
In the technical scheme, by setting the fin that is fitted with the second side plate of semiconductor chilling plate and positioned at dissipating
Radiator fan on the outside of backing, it is rapidly heated in cooking apparatus and temperature, pressure in pot is kept constant periods, promoted
Enter the second side plate and absorb external heat, and then improve the efficiency of heat exchange, realize more quickly heating, or in fast cooling
Decompression phase, promote the second side plate to absorb the heat of the first side plate, and then improve the efficiency of radiating, realize and more quickly drop
Temperature decompression.
In the above-mentioned technical solutions, it is preferable that control system includes central processing unit, with internal circulation system, semiconductor system
Cold and external circulating system are connected；Control panel, it is connected with central processing unit, enters the operating instructions；Pressure sensitive device, with
Central processing unit is connected, and for detecting pressure in pot, pressure information is sent to central processing unit；Temperature sensor, with
Central processing unit is connected, and for detecting pot body temperature, temperature information is sent to central processing unit；Wherein, central processing
Device receives pressure information, temperature information and operational order, after being analyzed and processed, control internal circulation system, semiconductor chilling plate
And the working condition that external circulating system is defeated.
In the technical scheme, pressure information, temperature information and operational order are received by central processing unit, analyzed
After processing, the working condition of control internal circulation system, semiconductor chilling plate and external circulating system, it is controlled to enter by different states
Row work, realizes intelligentized control method, reduces the operation difficulty of user, improves the usage experience of user.
In the above-mentioned technical solutions, it is preferable that when the operational order of reception be rapidly heated or make temperature in pot or
When pressure keeps constant, it is hot junction that central processing unit, which controls the first side plate of semiconductor chilling plate, and the second side plate is cold end so that
The hot junction sustained release amount of heat of semiconductor chilling plate is simultaneously transferred to internal circulation system so that the temperature of pot cover and pot is rapid
Rise or maintain high temperature.
In the technical scheme, the information received by control panel is the temperature or pressure that are rapidly heated or make in pot
Constant instruction is kept, it is hot junction that central processing unit, which controls the first side plate of semiconductor chilling plate, and the second side plate is cold end so that
The hot junction sustained release amount of heat of semiconductor chilling plate is simultaneously transferred to internal circulation system so that the temperature of pot cover and pot is rapid
Rise or maintain high temperature, and then further improve cooking speed.
In the above-mentioned technical solutions, it is preferable that when the operational order of reception depressurizes for fast cooling, central processing unit control
First side plate of semiconductor chilling plate processed is cold end, and the second side plate is hot junction so that the cold end constant absorption of semiconductor chilling plate
The amount of heat of internal circulation system, and continue thermal cycle with external circulating system so that pot cover and the rapid drop in temperature of pot.
In the technical scheme, it is the instruction that fast cooling depressurizes to receive operational order by control panel, and control is partly led
First side plate of body cooling piece is cold end, and the second side plate is hot junction so that is circulated in the cold end constant absorption of semiconductor chilling plate
The amount of heat of system, and continue thermal cycle with external circulating system so that pot cover and the rapid drop in temperature of pot, realize culinary art
The pot nside reduction of blood pressure in high-speed of utensil, so as to Rapid opening, avoid after culinary art terminates and wait as long for, and avoid drop
Sprayed during pressure outside steam and overflow problem, improve man-machine performance and security.
In any of the above-described technical scheme, it is preferable that liquid heat-conducting medium is packaged with circulation loop.
In the technical scheme, by liquid heat-conducting medium water pump under in being circulated in circulation loop, improve
The efficiency of heat transfer, reduces energy consumption.
In the above-mentioned technical solutions, it is preferable that scribble heat-conducting medium on the binding face of the first side plate and heat exchanging pipe；The
Heat-conducting medium is scribbled on the binding face of two side plates and fin；Heat conduction Jie is also coated with the binding face of hot service pipe and pot cover
Matter.
In the technical scheme, pass through the heat-conducting medium applied on the binding face of the first side plate and heat exchanging pipe, the second side
The heat-conducting medium applied on the binding face of plate and fin, the heat-conducting medium applied on the binding face of hot service pipe and pot cover, improve
The efficiency of heat transfer, reduces energy consumption.
In the above-mentioned technical solutions, it is preferable that heat-conducting plate, be arranged between heat exchanging pipe and the first side plate.
In the technical scheme, by the way that heat-conducting plate is arranged between heat exchanging pipe and the first side plate, hot biography is added
The area passed, improves the efficiency of heat transfer, and the first side plate is uniformly transmitted heat to heat exchanging pipe, and to heat
Pipeline is exchanged to play a protective role with the first side plate.
In the above-mentioned technical solutions, it is preferable that the binding face of heat-conducting plate and the first side plate scribbles heat-conducting medium.
In the technical scheme, by the heat-conducting medium of the binding face of hot plate and the first side plate painting, heat transfer is improved
Efficiency, reduce energy consumption.
In the above-mentioned technical solutions, it is preferable that heat-conducting plate is connected with heat-exchange tube by way of welding；Pot cover and thermal technology
Make pipeline to connect by way of welding.
In the technical scheme, heat-conducting plate and heat-exchange tube, pot cover are carried out with hot service pipe by way of welding
Connection, makes the connection of heat-conducting plate and heat-exchange tube, pot cover and hot service pipe more firm, more stable, avoids heat-conducting plate and heat
Exchange pipe, pot cover come off with hot service pipe, extend service life.
According to another object of the present invention, it is also proposed that a kind of cooking apparatus, including the temperature described in any of the above-described
Regulating system.
The cooking apparatus that another object of the present invention provides, because including the temperature adjustment described in any of the above-described technical scheme
System, therefore whole beneficial effects with the humidity control system.
In the above-mentioned technical solutions, it is preferable that cooking apparatus is electric pressure cooking saucepan.
In the technical scheme, cooking apparatus is electric pressure cooking saucepan, and humidity control system is set in the inside of electric pressure cooking saucepan, should
System includes semiconductor chilling plate, internal circulation system, external circulating system and corresponding electronic control system.Wherein semiconductor system
Cold be powered after side be hot junction, opposite side is cold end, and can make its cold end, hot junction position pair when changing its sense of current
Adjust.Closed circulation pipeline is set on the inside of semiconductor chilling plate, heat transfer medium is encapsulated in pipeline, outside sets fin and radiation air
Fan.When product needs quick heat temperature raising or makes to maintain certain temperature or pressure in pot, can control in semiconductor chilling plate
Side plate is hot junction, outer panel is cold end, so can continue the hot junction of control semiconductor chilling plate by the thermal cycle of both sides
Amount of heat is discharged, and heat can be transferred to pot cover, pot cover temperature is increased rapidly or maintain high temperature, it is quick so as to realize
The purpose of heating.When product needs fast cooling to depressurize, then semiconductor chilling plate interior plate can be controlled as cold end, outer panel
For hot junction, similarly, by the heat exchange and thermal cycle of medial and lateral, pot cover rapid drop in temperature can be made, so as to realize fast prompt drop
The purpose of temperature decompression.
The additional aspect and advantage of the present invention will become obvious in following description section, or the practice by the present invention
Recognize.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment
Substantially and it is readily appreciated that, wherein：
Fig. 1 shows the structural representation of cooking apparatus in one embodiment of the present of invention；
Fig. 2 shows the humidity control system structural representation in cooking apparatus shown in Fig. 1；
Fig. 3 shows the internal circulation system structural representation in humidity control system shown in Fig. 2；
Fig. 4 shows the structural representation of the semiconductor chilling plate in humidity control system shown in Fig. 2；
Fig. 5 shows control system composition schematic diagram in one embodiment of the invention humidity control system；
Fig. 6 shows that one embodiment of the invention humidity control system is rapidly heated and makes temperature, the pressure in pot
Keep the operation principle schematic diagram of constant periods；
Fig. 7 shows that one embodiment of the invention humidity control system carries out the operation principle in fast cooling decompression operation stage
Schematic diagram.
Wherein, corresponding relations of the Fig. 1 into Fig. 7 between reference and component names is：
1 cooking apparatus, 10 humidity control systems, 12 internal circulation systems, 122 hot platform flow channels, 124 heat exchanging pipes, 126
Water pump, 128 heat-conducting plates, 14 semiconductor chilling plates, 140 first side plates, 142 second side plates, 16 external circulating systems, 160 radiation airs
Fan, 162 fin, 18 control systems, 180 central processing units, 182 control panels, 184 pressure sensitive devices, 186 TEMPs
Device, 3 pot covers, 5 pots.
Embodiment
It is below in conjunction with the accompanying drawings and specific real in order to be more clearly understood that the above objects, features and advantages of the present invention
Mode is applied the present invention is further described in detail.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still, the present invention may be used also
To be different from other modes described here using other to implement, therefore, the present invention is not limited to following public specific real
Apply the limitation of example.
Described referring to Fig. 1 to Fig. 7 according to a kind of embodiment humidity control system 10 proposed by the present invention and cooking pot
Tool 1.
As shown in Fig. 2 the present invention proposes a kind of humidity control system 10, for cooking apparatus 1, cooking apparatus 1 includes
Pot and the pot cover being arranged in pot, humidity control system 10 are arranged in pot and pot cover, and humidity control system 10 includes：
Internal circulation system 12；Semiconductor chilling plate 14, side and the internal circulation system 12 of semiconductor chilling plate 14 carry out heat exchange；Follow outside
Loop system 16, heat exchange is carried out with the opposite side of semiconductor chilling plate 14；Power supply circuit, it is connected with semiconductor chilling plate 14,
For being powered to semiconductor chilling plate 14；Control system 18, control the working condition of semiconductor chilling plate 14.
Certainly, in the present invention, internal circulation system 12, external circulating system 16 can also be controlled using control system 18
Working condition.
In above-described embodiment, semiconductor chilling plate is arranged on by what internal circulation system 12, external circulating system 16 were bonded respectively
14 both sides, heat exchange is carried out with the cool and heat ends of interior semiconductor chilling plate 14 respectively, however, in order to realize the purpose of heat exchange,
Its fit structure is not limited only to the mode of close fit described above, and the present invention, which also contains other, can realize heat exchange
Mode.
Humidity control system 10 provided by the invention, by the way that the side of semiconductor chilling plate 14 and internal circulation system 12 are entered
Row heat exchange, opposite side and the external circulating system 16 of semiconductor chilling plate 14 carry out heat exchange, and control system 18 controls interior circulation
The working condition of system 12, semiconductor chilling plate 14 and external circulating system 16, when be rapidly heated and make temperature in pot,
Pressure is kept for the constant or fast cooling decompression operation stage, and the sense of current of power supply circuit is controlled by control system 18, makes interior follow
Loop system 12, semiconductor chilling plate 14 and external circulating system 16 are worked accordingly, to realize the quick liter in cooking apparatus 1
Temperature or the temperature in pot, pressure keep constant and fast cooling decompression, and then further improve cooking speed, and
The reduction of blood pressure in high-speed of cooking apparatus 1, so as to Rapid opening, avoid after culinary art terminates and wait as long for, and in pressure reduction
Spray and overflow problem, improve man-machine performance and security outside steam.
In one embodiment of the invention, it is preferable that as shown in figure 3, internal circulation system 12 includes water pump 126；Thermal technology
Make pipeline 122, above pot cover, fitted with pot cover, one end of hot service pipe 122 is connected with water pump 126；Heat-exchange tube
Road 124, positioned at pot side, fitted with the side of semiconductor chilling plate 14, the both ends of heat-exchange tube respectively with hot instrumentation tubes
Road 122 is connected with water pump 126；Wherein, water pump 126, hot service pipe 122 and heat-exchange tube form the circulation loop of closing.
Hot service pipe 122 is not limited only to above-mentioned tubular construction, can be the machine-shaping directly on pot cover, in this way, can increase
Big area of heat transfer, so as to improve the efficiency of heat transfer.Further, the shape of hot service pipe 122 is also not limited to attached
Structure shown in figure, can be looped around on the pot cover, add the length of hot service pipe 122, and then also increase thermal technology
Make the contact area of pipeline 122 and pot cover, that is, increase the area of heat transfer, improve the operating efficiency of heat transfer.
In this embodiment, the circulation loop of closing is formed by water pump 126, hot service pipe 122 and heat-exchange tube, and
Hot service pipe 122 is arranged above pot cover, fitted with pot cover, one end is connected with water pump 126, and heat exchanging pipe 124 is set
Be placed in pot side, fitted with the side of semiconductor chilling plate 14, both ends respectively with hot service pipe 122 and the phase of water pump 126
Connection.Medium in hot service pipe 122 and heat exchanging pipe 124 circulates in being realized in the presence of water pump 126, works as cooking pot
Tool 1 is rapidly heated and temperature, pressure in pot is kept constant periods, and heat can be made by heat-exchange tube by thermal technology
Constantly circulation quickly transfers heat to pot cover to pipeline 122 in the presence of water pump 126, realizes that pot cover temperature rises or tieed up rapidly
High temperature is held, so as to reach the purpose being rapidly heated, or fast cooling decompression phase, hot service pipe 122 is absorbed in cooking apparatus 1
Heat, then by heat-exchange tube in the presence of water pump 126 constantly circulation quickly heat is discharged to the external world, realize pot cover temperature
Degree is rapid to be declined, so as to reach the purpose of fast cooling decompression.
In one embodiment of the invention, it is preferable that as shown in figure 4, semiconductor chilling plate 14 includes the first side plate 140
With the second side plate 142 with the first side plate 140 back to setting；Wherein, the first side plate 140 is with one in the second side plate 142
Cold end, another in the first side plate 140 and the second side plate 142 is hot junction, and the first side plate 140 is affixed with heat exchanging pipe 124
Close.
In this embodiment, by will be set on semiconductor chilling plate 14 first side plate 140 and with the first side plate 140 back to
The second side plate 142 set, and the first side plate 140 fits with heat exchanging pipe 124, is rapidly heated in cooking apparatus 1
Constant periods are kept with temperature, the pressure made in pot, the first side plate 140 turns into hot junction, hot friendship is carried out to heat exchanging pipe 124
Changing, the second side plate 142 turns into cold end, absorbs the progress that external heat promotes heat exchange, so as to reach the purpose being rapidly heated, or
In fast cooling decompression phase, the first side plate 140 turns into cold end, heat exchanging pipe 124 is radiated, the second side plate 142 into
For hot junction, the heat for absorbing the release of the first side plate 140 promotes the progress of radiating, so as to reach the purpose of fast cooling decompression.
In one embodiment of the invention, it is preferable that as shown in Fig. 2 external circulating system 16 includes fin 162 and position
Radiator fan 160 in the outside of fin 162；Wherein, the second side plate 142 of fin 162 and semiconductor chilling plate 14 is affixed
Close.
In this embodiment, the fin 162 that is fitted by setting with the second side plate 142 of semiconductor chilling plate 14 and
Radiator fan 160 positioned at the outside of fin 162, it is rapidly heated in cooking apparatus 1 and protects temperature, pressure in pot
Constant periods are held, promote the second side plate 142 to absorb external heat, and then improve the efficiency of heat exchange, are realized more quick
Heating, or in fast cooling decompression phase, the heat of promotion the second side plate 142 the first side plate 140 of absorption, and then improve radiating
Efficiency, realize more quick cooling decompression.
In one embodiment of the invention, it is preferable that as shown in figure 5, control system 18 includes central processing unit 180,
It is connected with internal circulation system 12, semiconductor chilling plate 14 and external circulating system 16；Control panel 182, with the phase of central processing unit 180
Connection, is entered the operating instructions；Pressure sensitive device 184, it is connected with central processing unit 180, will for detecting pressure in pot
Pressure information is sent to central processing unit 180；Temperature sensor 186, it is connected with central processing unit 180, for detecting pot
Interior temperature, temperature information is sent to central processing unit 180；Wherein, central processing unit 180 receives pressure information, temperature information
And operational order, after being analyzed and processed, the work of control internal circulation system 12, semiconductor chilling plate 14 and external circulating system 16
State.
In specific embodiment, control system provided by the invention can also detect kettle temperature by intelligent temperature sensor
Carry out control system unlatching, can also be opened, manually button can also be controlled come control system by the cooking process of setting
Storing tank processed realizes control.Certainly, protection scope of the present invention is not limited to listed several control modes,
Other can realize the control purpose control system of the present invention within the protection domain of the application.
In this embodiment, pressure information, temperature information and operational order are received by central processing unit, carried out at analysis
After reason, to internal circulation system 12, semiconductor chilling plate 14 and the output control signal of external circulating system 16, it is controlled by different shapes
State is operated, and realizes intelligentized control method, reduces the operation difficulty of user, improves the usage experience of user.
In one embodiment of the invention, it is preferable that as shown in fig. 6, when the operational order received to be rapidly heated or
When making temperature or the constant pressure holding in pot, the first side plate 140 of the control semiconductor chilling plate 14 of central processing unit 180 is
Hot junction, the second side plate 142 are cold end so that the hot junction sustained release amount of heat of semiconductor chilling plate 14 is simultaneously transferred to interior circulation
System 12 so that the temperature of pot cover and pot rises rapidly or maintains high temperature.
In this embodiment, the information received by control panel 182 is the temperature or pressure for being rapidly heated or making in pot
Try hard to keep and hold constant instruction, it is hot junction that central processing unit 180, which controls the first side plate 140 of semiconductor chilling plate 14, the second side plate
142 be cold end so that the hot junction sustained release amount of heat of semiconductor chilling plate 14 is simultaneously transferred to internal circulation system 12 so that pot
The temperature of lid and pot rises rapidly or maintains high temperature, and then further improves cooking speed.
In one embodiment of the invention, it is preferable that as shown in fig. 7, when the operational order received subtracts for fast cooling
During pressure, it is cold end that central processing unit 180, which controls the first side plate 140 of semiconductor chilling plate 14, and the second side plate 142 is hot junction, is made
The amount of heat of the cold end constant absorption internal circulation system 12 of semiconductor chilling plate 14 is obtained, and continues heat with external circulating system 16 and follows
Ring so that pot cover and the rapid drop in temperature of pot.
In this embodiment, it is the instruction that fast cooling depressurizes to receive operational order by control panel 182, and control is partly led
First side plate 140 of body cooling piece 14 is cold end, and the second side plate 142 is hot junction so that the cold end of semiconductor chilling plate 14 continues
The amount of heat of internal circulation system 12 is absorbed, and continues thermal cycle with external circulating system 16 so that the temperature of pot cover and pot is fast
Speed declines, and realizes the reduction of blood pressure in high-speed of cooking apparatus 1, so as to Rapid opening, avoids after culinary art terminates and wait as long for, and
Avoid in pressure reduction and to be sprayed outside steam and overflow problem, improve man-machine performance and security.
In one embodiment of the invention, it is preferable that as shown in Figure 6 and Figure 7, liquid heat conductive is packaged with circulation loop
Medium.
In this embodiment, by liquid heat-conducting medium water pump 126 under in being circulated in circulation loop, improve
The efficiency of heat transfer, reduces energy consumption.
In one embodiment of the invention, it is preferable that the first side plate 140 on the binding face of heat exchanging pipe 124 with applying
There is heat-conducting medium；Second side plate 142 on the binding face of fin 162 with scribbling heat-conducting medium；Hot service pipe 122 and pot cover
Heat-conducting medium is also coated with binding face.
In this embodiment, by the first side plate 140 and the heat-conducting medium that is applied on the binding face of heat exchanging pipe 124, the
Applied on the binding face of two side plates 142 and the heat-conducting medium applied on the binding face of fin 162, hot service pipe 122 and pot cover
Heat-conducting medium, the efficiency of heat transfer is improved, reduces energy consumption.
In one embodiment of the invention, it is preferable that as shown in figure 3, heat-conducting plate 128, is arranged on heat exchanging pipe 124
Between the first side plate 140.
In this embodiment, between by the way that heat-conducting plate 128 is arranged on into the side plate 140 of heat exchanging pipe 124 and first, increase
The area of heat transfer, improves the efficiency of heat transfer, and the first side plate 140 is uniformly transmitted heat to heat-exchange tube
Road 124, and heat exchanging pipe 124 and the first side plate 140 are played a protective role.
In a particular embodiment, the material used in heat-conducting plate 128 can be with aluminium, aluminium alloy, copper, copper alloy or other heat conduction systems
The high metal material of number.
In one embodiment of the invention, it is preferable that the binding face of the side plate 140 of heat-conducting plate 128 and first scribbles heat conduction
Medium.
In this embodiment, the heat-conducting medium applied by the binding face of hot plate and the first side plate 140, increases heat transfer
Efficiency, reduce energy consumption.
In one embodiment of the invention, it is preferable that heat-conducting plate 128 is connected with heat-exchange tube by way of welding；
Pot cover is connected with hot service pipe 122 by way of welding.
In this embodiment, by heat-conducting plate 128 and heat-exchange tube, pot cover and hot service pipe 122 by way of welding
It is attached, makes the connection of heat-conducting plate 128 and heat-exchange tube, pot cover and hot service pipe 122 more firm, it is more stable, avoid
Heat-conducting plate 128 comes off with heat-exchange tube, pot cover with hot service pipe 122, improves service life.
As shown in figure 1, embodiment according to a further aspect of the invention, it is also proposed that a kind of cooking apparatus 1, including it is any of the above-described
Humidity control system 10 described in.
The cooking apparatus 1 that another aspect of the present invention embodiment provides, because including the temperature described in any of the above-described technical scheme
Spend regulating system 10, therefore whole beneficial effects with the humidity control system 10.
In one embodiment of the invention, it is preferable that cooking apparatus 1 is electric pressure cooking saucepan.
In this embodiment, cooking apparatus 1 is electric pressure cooking saucepan, and humidity control system is set in the inside of electric pressure cooking saucepan, should
System includes semiconductor chilling plate, internal circulation system, external circulating system and corresponding electronic control system.Wherein semiconductor system
Cold be powered after side be hot junction, opposite side is cold end, and can make its cold end, hot junction position pair when changing its sense of current
Adjust.Closed circulation pipeline is set on the inside of semiconductor chilling plate, heat transfer medium is encapsulated in pipeline, outside sets fin and radiation air
Fan.When product needs quick heat temperature raising or makes to maintain certain temperature or pressure in pot, can control in semiconductor chilling plate
Side plate is hot junction, outer panel is cold end, so can continue the hot junction of control semiconductor chilling plate by the thermal cycle of both sides
Amount of heat is discharged, and heat can be transferred to pot cover, pot cover temperature is increased rapidly or maintain high temperature, it is quick so as to realize
The purpose of heating.When product needs fast cooling to depressurize, then semiconductor chilling plate interior plate can be controlled as cold end, outer panel
For hot junction, similarly, by the heat exchange and thermal cycle of medial and lateral, pot cover rapid drop in temperature can be made, so as to realize fast prompt drop
The purpose of temperature decompression.
Specific works mode is：
It is rapidly heated and temperature, pressure in pot is kept constant, the control electric current direction of control system 18, makes semiconductor
First side plate 140 of cooling piece 14 is hot junction, the second side plate 142 is cold end, heat exchanging pipe 124 by with the first side plate 140
Heat exchange is carried out, makes the hot-fluid of the formation high temperature of thermal medium in internal circulation system, hot-fluid flows through hot service pipe 122, with pot
Heat exchange occurs for lid 3, the temperature of pot cover 3 is raised or maintain high temperature, and external circulating system 16 accelerates the process of this heat exchange.
In the fast cooling decompression operation stage, the first side plate 140 of semiconductor chilling plate 14 is cold end, the second side plate is heat
End, heat exchanging pipe 124 make the thermal medium in internal circulation system 12 form low temperature by carrying out heat exchange with the first side plate 140
Cold flow, the hot service pipe of cold fluid passes though, with pot cover 3 occur heat exchange, make the temperature of pot cover 3 reduce, and the first side plate 140 lead to
Semiconductor chilling plate 14 is crossed by heat via the second side plate 142, the fin 162 into external circulating system 16 radiates, by following outside
Radiator fan 160 in loop system 16, accelerates this radiation processes.
Realize to be rapidly heated and depressurized with fast cooling, so as to Rapid opening, avoided after culinary art terminates for a long time
Wait, and sprayed in pressure reduction outside steam and overflow problem, improve man-machine performance and security.
Described in synthesis, humidity control system 10 provided by the invention and cooking apparatus 1, by by semiconductor chilling plate 14
One end fits with internal circulation system 12, and the other end and the external circulating system 16 of semiconductor chilling plate 14, control system 18 control
The working condition of internal circulation system 12, semiconductor chilling plate 14 and external circulating system 16, when being rapidly heated and made in pot
Temperature, pressure keep the constant or fast cooling decompression operation stage, by the control electric current direction of control system 18, make interior cyclic system
System 12, semiconductor chilling plate 14 and external circulating system 16 are worked accordingly, with realize being rapidly heated in cooking apparatus 1 or
Temperature, pressure in pot keep constant and fast cooling decompression, and then further improve cooking speed, and culinary art
The reduction of blood pressure in high-speed of utensil 1, so as to Rapid opening, avoid and avoid waiting as long for after culinary art terminates, and in pressure reduction
Spray and overflow problem, improve man-machine performance and security outside steam.
In the present invention, term " multiple " then refers to two or more, is limited unless otherwise clear and definite.Term " peace
The term such as dress ", " connected ", " connection ", " fixation " all should be interpreted broadly, for example, " connection " can be fixedly connected, can also
It is to be detachably connected, or is integrally connected；" connected " can be joined directly together, and can also be indirectly connected by intermediary.It is right
For one of ordinary skill in the art, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean to combine at least one reality that specific features, structure, material or the feature that the embodiment or example describe are contained in the present invention
Apply in example or example.In this manual, identical embodiment or reality are not necessarily referring to the schematic representation of above-mentioned term
Example.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (14)
1. a kind of humidity control system, for cooking apparatus, the cooking apparatus includes pot and is arranged in the pot
Pot cover, the humidity control system are arranged in the pot and the pot cover, it is characterised in that the humidity control system bag
Include：
Internal circulation system；
Semiconductor chilling plate, the side of the semiconductor chilling plate are used to carry out heat exchange with the internal circulation system；
External circulating system, for carrying out heat exchange with the opposite side of the semiconductor chilling plate；
Power supply circuit, it is connected with the semiconductor chilling plate, for being powered to the semiconductor chilling plate；
Control system, for controlling the working condition of the semiconductor chilling plate.
2. humidity control system according to claim 1, it is characterised in that the internal circulation system includes
Water pump；
Hot service pipe, above the pot cover, fitted with the pot cover, one end and the water of the hot service pipe
Pump connects；
Heat exchanging pipe, positioned at the pot side, fitted with the side of the semiconductor chilling plate, the heat-exchange tube
Both ends are connected with the hot service pipe and the water pump respectively；
Wherein, the water pump, the hot service pipe and the heat-exchange tube form the circulation loop of closing.
3. humidity control system according to claim 2, it is characterised in that
The semiconductor chilling plate includes the first side plate and the second side plate with first side plate back to setting；
Wherein, first side plate and one in second side plate are cold end, first side plate and second side plate
In another be hot junction, first side plate fits with the heat exchanging pipe.
4. humidity control system according to claim 3, it is characterised in that
The external circulating system includes fin and the radiator fan on the outside of the fin；
Wherein, second side plate of the fin and the semiconductor chilling plate fits.
5. humidity control system according to any one of claim 1 to 4, it is characterised in that
The control system includes：
Central processing unit, it is connected with the internal circulation system, the semiconductor chilling plate and external circulating system；
Control panel, it is connected with the central processing unit, enters the operating instructions；
Pressure sensitive device, it is connected with the central processing unit, for detecting pressure in the pot, by the pressure information
Send to the central processing unit；
Temperature sensor, it is connected with the central processing unit, for detecting the pot body temperature, the temperature information is sent out
Deliver to the central processing unit；
Wherein, the central processing unit receives pressure information, the temperature information and the operational order, carries out at analysis
After reason, the working condition of the internal circulation system, the semiconductor chilling plate and external circulating system is controlled.
6. humidity control system according to claim 5, it is characterised in that
When the operational order of reception is to be rapidly heated or temperature in the pot or pressure is kept constant, in described
It is hot junction that central processor, which controls the first side plate of the semiconductor chilling plate, and second side plate is cold end so that semiconductor system
The hot junction sustained release amount of heat of cold is simultaneously transferred to the internal circulation system so that the temperature of the pot cover and the pot
It is rapid to rise or maintain high temperature.
7. humidity control system according to claim 5, it is characterised in that
When the operational order of reception depressurizes for fast cooling, the central processing unit controls the semiconductor chilling plate
First side plate is cold end, and second side plate is hot junction so that interior cyclic system described in the cold end constant absorption of semiconductor chilling plate
The amount of heat of system, and continue thermal cycle with the external circulating system so that under the temperature of the pot cover and the pot is rapid
Drop.
8. the humidity control system according to any one of claim 2 to 7, it is characterised in that
Liquid heat-conducting medium is packaged with the circulation loop.
9. the humidity control system according to any one of claim 3 to 7, it is characterised in that
First side plate on the binding face of the heat exchanging pipe with scribbling heat-conducting medium；
Second side plate on the binding face of the fin with scribbling heat-conducting medium；
Also oiling heat-conducting medium on the binding face of the hot service pipe and the pot cover.
10. the humidity control system according to any one of claim 3 to 7, it is characterised in that also include：
Heat-conducting plate, it is arranged between the heat exchanging pipe and the first side plate.
11. humidity control system according to claim 10, it is characterised in that
The binding face of the heat-conducting plate and first side plate scribbles heat-conducting medium.
12. humidity control system according to claim 10, it is characterised in that
The heat-conducting plate is connected with the heat exchanging pipe by way of welding；
The pot cover is connected with the hot service pipe by way of welding.
A kind of 13. cooking apparatus, it is characterised in that including
Humidity control system as any one of claim 1 to 12.
14. cooking apparatus according to claim 13, it is characterised in that the cooking apparatus is electric pressure cooking saucepan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610839988.XA CN107836987A (en) | 2016-09-21 | 2016-09-21 | Humidity control system and cooking apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610839988.XA CN107836987A (en) | 2016-09-21 | 2016-09-21 | Humidity control system and cooking apparatus |
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| CN107836987A true CN107836987A (en) | 2018-03-27 |
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| CN201610839988.XA Pending CN107836987A (en) | 2016-09-21 | 2016-09-21 | Humidity control system and cooking apparatus |
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| CN108201334A (en) * | 2018-04-11 | 2018-06-26 | 郑保华 | A kind of energy-saving steam electric cooker |
| CN109140900A (en) * | 2018-09-29 | 2019-01-04 | 西南大学 | Portable circumscribed automatic temperature-control liner system |
| EP3641495A1 (en) * | 2018-10-18 | 2020-04-22 | BSH Hausgeräte GmbH | Cooking system |
| CN111166160A (en) * | 2019-12-27 | 2020-05-19 | 季华实验室 | Novel heating and self-cooling cooking utensil |
| CN111265118A (en) * | 2018-12-29 | 2020-06-12 | 九阳股份有限公司 | Food processing machine |
| CN111568165A (en) * | 2020-05-22 | 2020-08-25 | 海信集团有限公司 | Steaming and baking equipment and control method thereof |
| CN114305059A (en) * | 2020-09-30 | 2022-04-12 | 佛山市顺德区美的电热电器制造有限公司 | Cooking apparatus, control method of cooking apparatus, and computer-readable storage medium |
| CN114305131A (en) * | 2020-09-30 | 2022-04-12 | 佛山市顺德区美的电热电器制造有限公司 | Cooking appliance, control method of cooking appliance, and storage medium |
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