CN113654268A - Precooling apparatus for gas treatment - Google Patents
Precooling apparatus for gas treatment Download PDFInfo
- Publication number
- CN113654268A CN113654268A CN202111059733.9A CN202111059733A CN113654268A CN 113654268 A CN113654268 A CN 113654268A CN 202111059733 A CN202111059733 A CN 202111059733A CN 113654268 A CN113654268 A CN 113654268A
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- CN
- China
- Prior art keywords
- cooling
- barrel
- air pipe
- fins
- gas treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 101
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a precooling device for gas treatment, which comprises a portal frame and a cooling structure, wherein a rotating frame is arranged between two vertical plates of the portal frame, the cooling structure is driven by a driving motor, and the gas inlet end of the cooling structure is communicated with the gas outlet of a gas pump; the cooling structure comprises a barrel, a cooling part is arranged in the barrel, gas entering the barrel is discharged after passing through the cooling part, the cooling part is abutted against and connected with the refrigerating surfaces of the semiconductor refrigerating pieces and performs heat transfer, the heating surface of the semiconductor refrigerating piece protrudes out of the outer wall of the barrel, a plurality of radiating fins are fixedly arranged on the heating surface, the radiating fins extend along the axis direction of the barrel, the radiating fins are distributed in a circumferential array around the axis of the barrel, and a plurality of radiating holes are formed in the radiating fins; its novel structure can carry out initiative refrigeration cooling, carries out quick cooling to the air in way, and effectual work efficiency that provides shortens for a long time.
Description
Technical Field
The invention relates to the field of gas precooling, in particular to a precooling device for gas treatment.
Background
Compressed air is the main raw material of an air separation device, impurities of the air are removed by a precooler and a purifier after the air is dried and compressed, the air enters a fractionating tower, the temperature of the air is obviously increased to 45-55 ℃ after the air is dried and compressed, and therefore precooling and cooling are needed for subsequent processes; however, most of the existing precooling structures are simple in structure, and the conventional heat exchangers are adopted for cooling, so that long cooling time is needed, the efficiency is low, and the efficiency is to be improved.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a precooling device for gas treatment, which has a novel structure, can perform active refrigeration and cooling, can perform rapid cooling on air in a way, effectively provides working efficiency and shortens time.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a precooling device for gas treatment, which comprises a portal frame and a cooling structure, wherein a rotating frame is arranged between two vertical plates of the portal frame, the cooling structure is driven by a driving motor, and the gas inlet end of the cooling structure is communicated with the gas outlet of a gas pump; the cooling structure comprises a barrel, a cooling part is arranged inside the barrel, gas entering the barrel is discharged after the gas enters the cooling part, the cooling part is abutted against and connected with the refrigerating surfaces of the semiconductor refrigerating pieces and performs heat transfer, the heating surface of the semiconductor refrigerating pieces protrudes out of the outer wall of the barrel, a plurality of cooling fins are fixedly arranged on the heating surface, the cooling fins extend along the axis direction of the barrel, the cooling fins are distributed in a circumferential array mode around the axis of the barrel, and a plurality of heat dissipation holes are formed in the cooling fins.
In a preferred technical scheme of the invention, two ends of the cylinder body are open, a first cylinder cover and a second cylinder cover are respectively arranged at two ends of the cylinder body, a first air pipe is communicated with the middle part of the first cylinder cover, a second air pipe is communicated with the middle part of the second cylinder cover, and the cooling structure is rotatably erected between the two vertical plates through the first air pipe and the second air pipe; rotary joints are mounted at the end parts of the first air pipe and the second air pipe, and the air outlet of the air pump is communicated with the rotary joint at the end part of the first air pipe through a pipeline.
In a preferred technical scheme of the invention, a first chain wheel is fixedly arranged on the outer wall of the first air pipe, a driving motor is arranged on a portal frame, a second chain wheel is fixedly arranged on an output shaft of the driving motor, and the first chain wheel and the second chain wheel are in transmission connection through a chain;
and the second air pipe is provided with a conductive slip ring.
In a preferred technical scheme of the invention, the cooling part comprises support rods, the inner walls of the two ends of the cylinder body are provided with brackets, the two ends of each support rod are fixed in the middle of the brackets, and the cooling part is overhead through the two brackets; the outer wall of the supporting rod is fixedly provided with a plurality of heat-conducting fins, the heat-conducting fins extend along the length direction of the supporting rod, and the plurality of heat-conducting fins are distributed in a circumferential array around the axis of the supporting rod; the end part of each heat conducting sheet far away from the supporting rod is propped against the refrigerating surface of the semiconductor refrigerating sheet to carry out heat transfer.
In a preferred technical scheme of the invention, a plurality of grid plates are fixedly arranged between any two adjacent heat conducting fins, the grid plates are distributed in a linear array along the axis of the supporting rod, and the grid plates are matched with the areas between the two adjacent heat conducting fins in shape and abut against the refrigerating surfaces of the semiconductor refrigerating fins.
In a preferred embodiment of the present invention, the heat sink, the heat conducting fin, and the grid plate are made of copper metal or aluminum metal or copper alloy or aluminum alloy.
In a preferred technical scheme of the invention, at least two fans are installed on the bottom surface of the frame beam of the portal frame, and the fans blow towards the cooling structure.
The invention has the beneficial effects that:
the precooling device for gas treatment provided by the invention is novel in structure, the cooling structure comprises a cylinder body, a cooling piece is arranged in the cylinder body, the cooling piece is in abutting contact with a refrigerating surface of a semiconductor refrigerating sheet and performs heat transfer, gas in the cylinder body is discharged after passing through the cooling piece, active refrigeration and cooling are realized, and air in the passage is rapidly cooled; the heating surface of the semiconductor refrigerating sheet is positioned on the outer side of the cylinder body, and the plurality of radiating fins are arranged, so that heat generated by the semiconductor refrigerating sheet can be quickly diffused, the refrigerating effect of the semiconductor refrigerating sheet is maintained, and the temperature of gas in an internal path is reduced; in addition, the driving motor drives the whole cooling structure to rotate, so that on one hand, supplied air flow can be stirred when passing through the cooling piece, better contact cooling is carried out, and the precooling effect is improved; on the other hand, the cooling fin can be driven to rotate, the cooling fin is provided with the heat dissipation holes, under the rotating condition, external airflow is actively promoted to penetrate through the heat dissipation holes, the heat dissipation of the heating surface of the semiconductor refrigeration piece is further accelerated, the normal refrigeration work of the refrigeration surface is maintained, the design and the matching of the whole structure can effectively provide the working efficiency, and the pre-cooling time is shortened.
Drawings
Fig. 1 is a schematic structural diagram of a pre-cooling apparatus for gas treatment according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of a cooling structure provided in an embodiment of the present invention;
fig. 3 is a schematic side view of a cooling structure provided in an embodiment of the invention.
In the figure:
100. a gantry; 200. a cooling structure; 210. a barrel; 220. a cooling member; 221. a support bar; 222. a heat conductive sheet; 223. a grid plate; 230. a semiconductor refrigeration sheet; 240. a heat sink; 241. heat dissipation holes; 250. a first cartridge cover; 251. a first air pipe; 260. a second cartridge cover; 261. a second air pipe; 262. a conductive slip ring; 270. a rotary joint; 280. a support; 300. a drive structure; 400. an air pump; 500. a fan.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
As shown in fig. 1 to fig. 3, the embodiment of the present invention discloses a pre-cooling device for gas treatment, which includes a gantry 100, a cooling structure 200 rotatably mounted between two vertical plates of the gantry 100, wherein the cooling structure 200 is driven by a driving motor 300, and an air inlet end of the cooling structure 200 is communicated with an air outlet of an air pump 400; the air pump is used for pressurizing the air flow, so that the conveying force is enhanced; the cooling structure 200 includes a cylinder 210, a cooling member 220 is installed inside the cylinder 210, the gas entering the cylinder 210 is discharged after passing through the cooling member 220, the cooling member 220 abuts against and is connected with the cooling surfaces of the semiconductor cooling plates 230 and performs heat transfer, the heating surfaces of the semiconductor cooling plates 230 protrude out of the outer wall of the cylinder 210 through active cooling, a plurality of cooling fins 240 are fixedly arranged on the heating surfaces, the cooling fins 240 extend along the axial direction of the cylinder 210, the plurality of cooling fins 240 are distributed in a circumferential array around the axial direction of the cylinder 210, and a plurality of heat dissipation holes 241 are arranged on the cooling fins 240.
The precooling device for gas treatment is novel in structure, the cooling structure comprises a cylinder body, a cooling piece is arranged in the cylinder body, the cooling piece is in abutting contact with the refrigerating surface of the semiconductor refrigerating sheet and performs heat transfer, gas in the cylinder body is discharged after passing through the cooling piece, active refrigeration and cooling are realized, and air in the passage is rapidly cooled; the heating surface of the semiconductor refrigerating sheet is positioned on the outer side of the cylinder body, and the plurality of radiating fins are arranged, so that heat generated by the semiconductor refrigerating sheet can be quickly diffused, the refrigerating effect of the semiconductor refrigerating sheet is maintained, and the temperature of gas in an internal path is reduced; the driving motor drives the whole cooling structure to rotate, so that on one hand, supplied air flow can be stirred when passing through the cooling piece, better contact cooling is carried out, and the precooling effect is improved; on the other hand, the cooling fin can be driven to rotate, the cooling fin is provided with the heat dissipation holes, under the rotating condition, external airflow is actively promoted to penetrate through the heat dissipation holes, the heat dissipation of the heating surface of the semiconductor refrigeration fin is further accelerated, the normal refrigeration work of the refrigeration surface is maintained, the design and the matching of the whole structure can effectively provide the working efficiency, and the pre-cooling time is shortened; in addition, the air pump is used, so that the air pressure of supplied air can be further enhanced, and the air flow can be ensured to smoothly pass through the cooling piece and be discharged; note that the gas supplied was dried gas, and moisture was not entrained.
Furthermore, the two ends of the cylinder 210 are open, and the first cylinder cover 250 and the second cylinder cover 260 are respectively mounted at the two ends, so that the cylinder can be conveniently disassembled and assembled, is convenient to produce and assemble, and is convenient to overhaul or replace the internal structure; a first air pipe 251 is communicated with the middle part of the first cylinder cover 250, a second air pipe 261 is communicated with the middle part of the second cylinder cover 260, the cooling structure 200 is rotatably erected between the two vertical plates through the first air pipe 251 and the second air pipe 261, and the first air pipe and the second air pipe movably penetrate through the vertical plates through bearings to provide a rotating support foundation; the rotary joints 270 are installed at the end portions of the first air pipe 251 and the second air pipe 261, and the air outlet of the air pump 400 is communicated with the rotary joint 270 at the end portion of the first air pipe 251 through a pipeline, so that the air supply and exhaust actions can be realized while rotating, and the actions are not interfered with each other.
Further, the cooling member 220 includes a support rod 221, brackets 280 are mounted on the inner walls of the two ends of the cylinder 210, the two ends of the support rod 221 are fixed in the middle of the brackets 280, and the cooling member 220 is overhead by the two brackets 280 so as to facilitate smooth airflow; a plurality of heat-conducting fins 222 are fixedly arranged on the outer wall of the support rod 221, the heat-conducting fins 222 extend along the length direction of the support rod 221, the plurality of heat-conducting fins 222 are distributed in a circumferential array around the axis of the support rod 221, and an airflow channel is formed between any two adjacent heat-conducting fins; the end of each heat-conducting plate 222 away from the support rod 221 abuts against the refrigerating surface of the semiconductor refrigerating plate 230 to transfer heat, and the semiconductor refrigerating plate can reduce the temperature of the heat-conducting plate, so that the temperature of the air flow in the path is reduced.
Furthermore, a plurality of grid plates 223 are fixedly arranged between any two adjacent heat conducting fins 222, the grid plates 223 are distributed in a linear array along the axis of the supporting rod 221, the shape of the area between the grid plates 223 and the two adjacent heat conducting fins 222 is matched, and the grid plates are abutted against the refrigerating surface of the semiconductor refrigerating fin 230, the grid plates are used for filling the area between the two adjacent heat conducting fins, so that the contact area between the grid plates and the airflow can be increased, on the other hand, the airflow can be better blocked and stirred when the barrel rotates, and the cooling and heat dissipation are further accelerated.
Further, the heat sink 240, the heat conductive sheet 222, and the mesh plate 223 are made of copper metal or aluminum metal or copper alloy or aluminum alloy; the heat conduction effect can be better, so that the temperature can be reduced; preferably, the heat conducting fins and the heat radiating fins are both of a thin-sheet structure, and the grid plate is also of a thin-sheet honeycomb structure.
Further, at least two fans 500 are installed on the bottom surface of the frame beam of the gantry 100, and the fans 500 blow toward the cooling structure 200, so that the heat dissipation effect of the heat sink can be further accelerated.
Further, a first chain wheel is fixedly arranged on the outer wall of the first air pipe 251, the driving motor 300 is installed on the portal frame 100, a second chain wheel is fixedly arranged on an output shaft of the driving motor 300, the first chain wheel and the second chain wheel are in transmission connection through a chain, the driving motor is matched with the cooling structure, and the cooling structure is driven to rotate through the driving motor; the second air pipe 261 is provided with a conductive slip ring 262, and the semiconductor refrigeration piece is externally connected with electricity through the conductive slip ring, so that the refrigeration effect is maintained under the condition that the normal rotation is not influenced.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. The present invention is not to be limited by the specific embodiments disclosed herein, and other embodiments that fall within the scope of the claims of the present application are intended to be within the scope of the present invention.
Claims (7)
1. A precooling apparatus for gas treatment is characterized in that:
the gantry type air pump comprises a gantry frame and a cooling structure which is rotatably erected between two vertical plates of the gantry frame, wherein the cooling structure is driven by a driving motor, and the air inlet end of the cooling structure is communicated with an air outlet of the air pump;
the cooling structure comprises a barrel, a cooling part is arranged inside the barrel, gas entering the barrel is discharged after the gas enters the cooling part, the cooling part is abutted against and connected with the refrigerating surfaces of the semiconductor refrigerating pieces and performs heat transfer, the heating surface of the semiconductor refrigerating pieces protrudes out of the outer wall of the barrel, a plurality of cooling fins are fixedly arranged on the heating surface, the cooling fins extend along the axis direction of the barrel, the cooling fins are distributed in a circumferential array mode around the axis of the barrel, and a plurality of heat dissipation holes are formed in the cooling fins.
2. A pre-cooling apparatus for gas treatment according to claim 1, characterised in that:
the two ends of the cylinder body are open, the two ends of the cylinder body are respectively provided with a first cylinder cover and a second cylinder cover, the middle part of the first cylinder cover is communicated with a first air pipe, the middle part of the second cylinder cover is communicated with a second air pipe, and the cooling structure is rotatably erected between the two vertical plates through the first air pipe and the second air pipe; rotary joints are mounted at the end parts of the first air pipe and the second air pipe, and the air outlet of the air pump is communicated with the rotary joint at the end part of the first air pipe through a pipeline.
3. A pre-cooling apparatus for gas treatment according to claim 2, characterised in that:
a first chain wheel is fixedly arranged on the outer wall of the first air pipe, a driving motor is installed on the portal frame, a second chain wheel is fixedly arranged on an output shaft of the driving motor, and the first chain wheel and the second chain wheel are in transmission connection through a chain;
and the second air pipe is provided with a conductive slip ring.
4. A pre-cooling apparatus for gas treatment according to claim 1, characterised in that:
the cooling piece comprises support rods, the inner walls of the two ends of the cylinder body are provided with brackets, the two ends of each support rod are fixed in the middle of the corresponding bracket, and the cooling piece is overhead through the two brackets;
the outer wall of the supporting rod is fixedly provided with a plurality of heat-conducting fins, the heat-conducting fins extend along the length direction of the supporting rod, and the plurality of heat-conducting fins are distributed in a circumferential array around the axis of the supporting rod; the end part of each heat conducting sheet far away from the supporting rod is propped against the refrigerating surface of the semiconductor refrigerating sheet to carry out heat transfer.
5. A pre-cooling apparatus for gas treatment as claimed in claim 4, wherein:
a plurality of grid plates are fixedly arranged between any two adjacent heat conducting fins, the grid plates are distributed in a linear array mode along the axis of the supporting rod, and the grid plates are matched with the area between the two adjacent heat conducting fins in shape and abut against the refrigerating surface of the semiconductor refrigerating fin.
6. A pre-cooling apparatus for gas treatment as claimed in claim 5, wherein:
the radiating fins, the heat conducting fins and the grid plates are made of copper metal or aluminum metal or copper alloy or aluminum alloy.
7. A pre-cooling apparatus for gas treatment according to claim 1, characterised in that:
at least two fans are installed on the bottom surface of a frame beam of the portal frame, and the fans blow towards the direction of the cooling structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111059733.9A CN113654268A (en) | 2021-09-10 | 2021-09-10 | Precooling apparatus for gas treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111059733.9A CN113654268A (en) | 2021-09-10 | 2021-09-10 | Precooling apparatus for gas treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113654268A true CN113654268A (en) | 2021-11-16 |
Family
ID=78493734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111059733.9A Pending CN113654268A (en) | 2021-09-10 | 2021-09-10 | Precooling apparatus for gas treatment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113654268A (en) |
Citations (17)
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|---|---|---|---|---|
| JPH08114362A (en) * | 1994-10-18 | 1996-05-07 | Kamimura Hiroshi | Electronic cold heat type water temperature keeping device |
| US6336497B1 (en) * | 2000-11-24 | 2002-01-08 | Ching-Bin Lin | Self-recirculated heat dissipating means for cooling central processing unit |
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| CN102759215A (en) * | 2011-04-25 | 2012-10-31 | 株式会社电装 | Magneto-caloric effect type heat pump apparatus |
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| CN107819269A (en) * | 2017-11-27 | 2018-03-20 | 新昌县城关海顺机械厂 | A kind of image intensifer heat abstractor |
| CN108679876A (en) * | 2018-08-31 | 2018-10-19 | 厦门帕尔帖电子科技有限公司 | A kind of semiconductor cooling device |
| CN208706380U (en) * | 2018-08-16 | 2019-04-05 | 苏州吴变电气科技有限公司 | A kind of coil radiator structure |
| CN111426117A (en) * | 2020-05-17 | 2020-07-17 | 济南得德环保科技有限公司 | Semiconductor refrigerator for storing food and medicine in refrigeration mode |
| CN111817182A (en) * | 2020-06-19 | 2020-10-23 | 江山海维科技有限公司 | High-low voltage switch cabinet with dampproofing heat dissipation function |
| CN112856854A (en) * | 2021-01-18 | 2021-05-28 | 滨州新拓自然能电力工程有限公司 | Gas cooler for carbon dioxide heat pump |
-
2021
- 2021-09-10 CN CN202111059733.9A patent/CN113654268A/en active Pending
Patent Citations (17)
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| JPH08114362A (en) * | 1994-10-18 | 1996-05-07 | Kamimura Hiroshi | Electronic cold heat type water temperature keeping device |
| US6336497B1 (en) * | 2000-11-24 | 2002-01-08 | Ching-Bin Lin | Self-recirculated heat dissipating means for cooling central processing unit |
| CN2562116Y (en) * | 2002-08-30 | 2003-07-23 | 李建华 | Automatic control thermostatic air exchanging devices |
| CN101495818A (en) * | 2006-07-24 | 2009-07-29 | 制冷技术应用股份有限公司 | Magnetocaloric thermal generator |
| CN101732090A (en) * | 2009-11-10 | 2010-06-16 | 上海理工大学 | Cryoablation system with precooling device and control method thereof |
| CN102022790A (en) * | 2009-12-07 | 2011-04-20 | 任永斌 | Open air working medium centrifugally compressing air conditioner |
| CN102759215A (en) * | 2011-04-25 | 2012-10-31 | 株式会社电装 | Magneto-caloric effect type heat pump apparatus |
| CN104417019A (en) * | 2013-09-02 | 2015-03-18 | 曼罗兰网络系统有限责任公司 | Rotary body of a printing press |
| CN104214744A (en) * | 2014-09-01 | 2014-12-17 | 苏州骏发精密机械有限公司 | Column-type LED (light-emitting diode) radiator |
| CN104711419A (en) * | 2015-04-02 | 2015-06-17 | 山东理工大学 | Cooling cylinder of reduced iron rotary-cylinder cooling machine |
| CN207019028U (en) * | 2017-07-14 | 2018-02-16 | 厦门宏滕光电科技有限公司 | A kind of LED lamp heat sink |
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| CN208706380U (en) * | 2018-08-16 | 2019-04-05 | 苏州吴变电气科技有限公司 | A kind of coil radiator structure |
| CN108679876A (en) * | 2018-08-31 | 2018-10-19 | 厦门帕尔帖电子科技有限公司 | A kind of semiconductor cooling device |
| CN111426117A (en) * | 2020-05-17 | 2020-07-17 | 济南得德环保科技有限公司 | Semiconductor refrigerator for storing food and medicine in refrigeration mode |
| CN111817182A (en) * | 2020-06-19 | 2020-10-23 | 江山海维科技有限公司 | High-low voltage switch cabinet with dampproofing heat dissipation function |
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