CN220750537U - Integrated water cooling machine capable of efficiently radiating heat - Google Patents
Integrated water cooling machine capable of efficiently radiating heat Download PDFInfo
- Publication number
- CN220750537U CN220750537U CN202321858750.3U CN202321858750U CN220750537U CN 220750537 U CN220750537 U CN 220750537U CN 202321858750 U CN202321858750 U CN 202321858750U CN 220750537 U CN220750537 U CN 220750537U
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- wall
- heat dissipation
- water
- pipe
- pipe body
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 238000001816 cooling Methods 0.000 title claims abstract description 35
- 230000017525 heat dissipation Effects 0.000 claims abstract description 61
- 238000007789 sealing Methods 0.000 claims abstract description 18
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 239000000428 dust Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 abstract description 5
- 239000007789 gas Substances 0.000 description 21
- 238000010586 diagram Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the field of water coolers, in particular to an integrated water cooler with high-efficiency heat dissipation, which comprises a pipe body, wherein a water cooling structure is arranged on the inner wall of the pipe body, heat dissipation rings are arranged on the outer walls of two ends of the pipe body, a heat dissipation component is arranged on the inner wall of each heat dissipation ring, a base is arranged on the outer wall of the bottom of the pipe body, an adding pipe is connected to one side of the outer wall of the top of the pipe body, a drain pipe is connected to the outer wall of the bottom of the pipe body, and valves are arranged in the drain pipe and the adding pipe; the water cooling structure comprises sealing plates arranged on the inner walls of the two ends of the pipe body, and a contact hole arranged in the center of the sealing plates. According to the utility model, the semiconductor refrigerating sheet releases heat to the radiating fins, so that the water in the pipe body is cooled, the two ends of the spiral pipe are connected into gas or liquid to be cooled, and the gas is fully contacted with the cooled water in the pipe body through the spiral pipe, so that heat exchange is performed, the overall working efficiency is improved, and the cooling is convenient.
Description
Technical Field
The utility model relates to the technical field of water coolers, in particular to an integrated water cooler capable of efficiently radiating heat.
Background
The water cooler is also called a cold water machine, and can provide constant temperature, constant current and constant pressure cooling water equipment, and the water cooler is divided into an air-cooled cold water machine and a water type cold water machine. The main function of the water cooler is to cool the water in the working host machine to keep the water within a certain temperature;
when the water cooler is used for cooling liquid and gas, water drops are generated in the pipeline by heat and cold contact during cooling the gas, and the water drops are easily conveyed out by the gas after being collected, so that the working efficiency of an output end is affected.
Disclosure of Invention
The utility model aims to solve the problems and the defects, and provides an integrated water cooler with high-efficiency heat dissipation: the semiconductor cooling fin is used for radiating heat, so that water in the pipe body is cooled, two ends of the spiral pipe are connected into gas or liquid needing cooling, the gas enters from one end of the spiral pipe, the gas is enabled to be in contact with water cooled in the pipe body through the spiral pipe, heat exchange is conducted, overall working efficiency is improved, cooling is facilitated, working efficiency is improved, and the water collecting box solves the problem that water drops affect the working.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the integrated water cooler comprises a pipe body, wherein a water cooling structure is arranged on the inner wall of the pipe body, heat dissipation rings are arranged on the outer walls of the two ends of the pipe body, a heat dissipation component is arranged on the inner wall of the heat dissipation rings, a base is arranged on the outer wall of the bottom of the pipe body, an adding pipe is connected to one side of the outer wall of the top of the pipe body, a drain pipe is connected to the outer wall of the bottom of the pipe body, and valves are arranged in the drain pipe and the adding pipe; the water cooling structure comprises sealing plates arranged on the inner walls of the two ends of the pipe body, a contact hole arranged in the center of the sealing plates, a heat conducting plate arranged in the contact hole in a sealing mode, heat conducting fins welded on the outer wall of one side of the heat conducting plate at equal intervals, and semiconductor refrigerating sheets arranged on the outer wall of one side of the heat conducting plate at equal intervals.
Preferably, the spiral pipe is installed at the position of the inner wall of the pipe body, which is positioned at the heat conducting fins, the top parts of the outer walls of the two ends of the spiral pipe are both connected with connecting pipes, and sealing holes are formed at the positions of the outer wall of the pipe body, which is positioned at the connecting pipes.
Preferably, the outer wall of the bottom of the spiral pipe is connected with a water collecting box, the outer wall of one end of the water collecting box is connected with a pipeline, and an electromagnetic valve is arranged in the pipeline;
according to the scheme: the inside of spiral pipe forms the drop of water, and the drop of water is collected in the bottom of spiral pipe bottom department entering into the water collection box after collecting, avoids the water in the spiral pipe to influence gas, is convenient for collect the water that congeals, prevents that water from causing the influence.
Preferably, the outer walls of one side of the sealing plate are provided with radiating fins, and the outer walls of one side of the radiating fins are attached to the outer walls of one side of the semiconductor refrigerating plate;
according to the scheme: the semiconductor cooling fin is used for releasing heat to the cooling fins, so that water in the pipe body is cooled, two ends of the spiral pipe are connected into gas or liquid needing cooling, the gas enters from one end of the spiral pipe, and the gas is enabled to be in contact with the cooled water in the pipe body through the spiral pipe, so that heat exchange is carried out, the overall working efficiency is improved, and cooling is facilitated.
Preferably, the heat dissipation assembly comprises a support frame arranged at one end inside the heat dissipation ring, fan blades rotatably connected in the support frame and a heat dissipation motor arranged at the center of the outer wall of one side of the support frame, and an output shaft of the heat dissipation motor is connected with the center of the fan blades.
Preferably, air inlets distributed at equal intervals are formed in one end of the outer wall of the heat dissipation ring, and a dust screen is mounted on the inner wall of one end of the heat dissipation ring.
Preferably, the heat dissipation motor, the electromagnetic valve and the semiconductor refrigerating sheet are connected with the switch through wires, and the switch is connected with a power supply through wires.
The beneficial effects of the utility model are as follows:
1. the semiconductor refrigerating sheet releases heat to the radiating fins, so that water in the pipe body is cooled, two ends of the spiral pipe are connected into gas or liquid to be cooled, the gas enters from one end of the spiral pipe, and the gas is enabled to be in contact with the cooled water in the pipe body through the spiral pipe for heat exchange, so that the overall working efficiency is improved, and the cooling is facilitated;
2. the inside of spiral pipe forms the drop of water, and the drop of water is collected in the bottom of spiral pipe bottom department entering into the water collection box after collecting, avoids the water in the spiral pipe to influence gas, is convenient for collect the water that congeals, prevents that water from causing the influence.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an integrated water chiller with efficient heat dissipation according to the present utility model;
FIG. 2 is a schematic diagram of the internal structure of a heat dissipation ring of an integrated water cooling machine with efficient heat dissipation according to the present utility model;
FIG. 3 is a schematic diagram showing a heat dissipation ring of an integrated water-cooling machine with efficient heat dissipation according to the present utility model;
FIG. 4 is a schematic diagram of two ends of a tube of an integrated water-cooling machine with high heat dissipation efficiency according to the present utility model;
FIG. 5 is a schematic view of the internal structure of a tube of an integrated water-cooling machine with high heat dissipation efficiency according to the present utility model;
fig. 6 is a schematic diagram of a spiral pipe structure of an integrated water cooling machine with efficient heat dissipation according to the present utility model.
In the figure: the heat-dissipating device comprises a tube body 1, a heat-dissipating ring 2, a base 3, an additional tube 4, a heat-dissipating component 5, a water-cooling structure 6, a supporting frame 7, fan blades 8, a heat-dissipating motor 9, an air inlet 10, a dust screen 11, a sealing plate 12, a heat-conducting plate 13, a heat-conducting fin 14, a semiconductor refrigerating sheet 15, a spiral tube 16, a connecting tube 17, a heat-dissipating fin 18 and a water collecting box 19.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Example 1:
referring to fig. 1-3, an integrated water cooler with efficient heat dissipation comprises a pipe body 1, wherein a water cooling structure 6 is arranged on the inner wall of the pipe body 1, heat dissipation rings 2 are arranged on the outer walls of two ends of the pipe body 1, a heat dissipation component 5 is arranged on the inner wall of each heat dissipation ring 2, a base 3 is arranged on the outer wall of the bottom of the pipe body 1, an adding pipe 4 is connected to one side of the outer wall of the top of the pipe body 1, a drain pipe is connected to the outer wall of the bottom of the pipe body 1, valves are arranged in the drain pipe and the adding pipe 4, the adding pipe 4 and the drain pipe in the pipe body 1 are convenient for adding water and draining water through the valves, the free clearance after the whole combination is less, the whole integration level is improved, the heat dissipation component 5 and the water cooling structure 6 are arranged on the two ends of the pipe body 1, the water cooling speed in the pipe body 1 is improved, and the whole working efficiency is improved;
the heat dissipation assembly 5 comprises a support frame 7 arranged at one end inside the heat dissipation ring 2, fan blades 8 rotatably connected in the support frame 7 and a heat dissipation motor 9 arranged at the center of the outer wall of one side of the support frame 7, an output shaft of the heat dissipation motor 9 is connected with the center of the fan blades 8, and the heat dissipation motor 9 is started to drive the fan blades 8 on the support frame 7 to rotate, so that air enters from an air inlet hole 10 on the heat dissipation ring 2 and is discharged from a dust screen 11, and the heat dissipation fins 18 are cooled;
one end of the outer wall of the heat dissipation ring 2 is provided with air inlets 10 which are distributed equidistantly, and the inner wall of one end of the heat dissipation ring 2 is provided with a dust screen 11;
the heat radiation motor 9, the electromagnetic valve and the semiconductor refrigerating sheet 15 are connected with a switch through wires, and the switch is connected with a power supply through wires.
Example 2:
referring to fig. 1 and 3-6, the water cooling structure 6 comprises a sealing plate 12 installed on the inner walls of the two ends of the pipe body 1, a contact hole formed in the center of the sealing plate 12, a heat conducting plate 13 installed in the contact hole in a sealing manner, heat conducting fins 14 welded on the outer walls of the heat conducting plate 13 at equal intervals on the outer walls of the heat conducting plate 13 on the side close to each other, and semiconductor refrigerating sheets 15 installed on the outer walls of the heat conducting plate 13 at equal intervals, wherein the heat conducting fins 14 on the heat conducting plate 13 are matched with the semiconductor refrigerating sheets 15 and the radiating fins 18, so that water is cooled conveniently, and the cooling rate is improved;
the spiral tube 16 is arranged at the position of the heat conducting fin 14 on the inner wall of the tube body 1, the top parts of the outer walls of the two ends of the spiral tube 16 are connected with the connecting pipes 17, sealing holes are formed in the positions of the outer walls of the tube body 1 and the connecting pipes 17, and the spiral tube 16 ensures that the path side length of gas in the tube body 1 is convenient for full heat exchange;
the outer wall of the bottom of the spiral tube 16 is connected with a water collecting box 19, one end of the water collecting box 19 is connected with a pipeline, an electromagnetic valve is arranged in the pipeline, water drops are easily formed in the spiral tube 16 in the process, the water drops fall into the bottom end of the spiral tube 16 after being collected, and water enters the water collecting box 19 at the bottom end of the spiral tube 16 to be collected, so that the influence of water in the spiral tube 16 on gas is avoided;
radiating fins 18 are mounted on one side outer wall of the sealing plate 12, and one side outer wall of the radiating fins 18 is attached to one side outer wall of the semiconductor refrigerating plate 15.
Working principle: when the heat-dissipation device is used, water is added into the pipe body 1 through the adding pipe 4, the whole pipe body 1 is filled with water, the temperature in the added water is transferred to the heat-conduction plate 13 through the heat-conduction fins 14, the semiconductor refrigerating plate 15 is started to absorb heat of the heat-conduction plate 13, the semiconductor refrigerating plate 15 releases heat of the heat-dissipation fins 18, water in the pipe body 1 is cooled, gas or liquid needing cooling is connected into the two ends of the spiral pipe 16, the flow rate of the water and the gas is slower in the process, the gas enters from one end of the spiral pipe 16, the gas is enabled to be in contact with the cooled water in the pipe body 1 through the spiral pipe 16, heat exchange is carried out, the temperature of the gas exhausted from the other end of the spiral pipe 16 is reduced, water drops are easy to form in the spiral pipe 16, the water drops fall into the bottom end of the spiral pipe 16 after being collected, the water enters into the water collecting box 19 at the bottom end of the spiral pipe 16, the heat-dissipation motor 9 is started to drive the fan blades 8 on the support frame 7 to rotate, the gas enters the air inlet hole 10 on the heat-dissipation ring 2 and is exhausted from the dust-proof net 11, and the heat-dissipation fins 18 are cooled.
While the exemplary embodiments of the present utility model have been described in detail with reference to the examples, those skilled in the art will appreciate that various modifications and adaptations to the specific examples described above can be made and that various combinations of the features and structures presented herein can be practiced without departing from the scope of the present utility model, which is defined by the appended claims. The foregoing description of specific exemplary embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the utility model and its practical application to thereby enable one skilled in the art to make and utilize the utility model in various exemplary embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the utility model be defined by the claims and their equivalents.
Claims (7)
1. The utility model provides an integrated water-cooling machine of high-efficient heat dissipation, includes body (1), its characterized in that, water-cooling structure (6) are installed to the inner wall of body (1), and heat dissipation ring (2) are installed to the both ends outer wall of body (1), heat dissipation subassembly (5) are installed to the inner wall of heat dissipation ring (2), and base (3) are installed to the bottom outer wall of body (1), top outer wall one side of body (1) is connected with interpolation pipe (4), and the bottom outer wall of body (1) is connected with the drain pipe, all install the valve in drain pipe and the interpolation pipe (4);
the water cooling structure (6) comprises a sealing plate (12) arranged on the inner walls of the two ends of the pipe body (1), a contact hole formed in the center of the sealing plate (12), a heat conducting plate (13) arranged in the contact hole in a sealing mode, heat conducting fins (14) welded on the outer wall of one side of the heat conducting plate (13) at equal intervals, and semiconductor refrigerating sheets (15) arranged on the outer wall of one side of the heat conducting plate (13) at equal intervals.
2. The integrated water cooler with high efficiency heat dissipation according to claim 1, wherein the spiral tube (16) is installed at the position of the heat conducting fin (14) on the inner wall of the tube body (1), the top parts of the outer walls of the two ends of the spiral tube (16) are connected with connecting pipes (17), and sealing holes are formed at the positions of the connecting pipes (17) on the outer wall of the tube body (1).
3. The integrated water cooler with high efficiency heat dissipation according to claim 2, wherein the bottom outer wall of the spiral tube (16) is connected with a water collecting box (19), and one end outer wall of the water collecting box (19) is connected with a pipeline, and an electromagnetic valve is installed in the pipeline.
4. The integrated water cooling machine with efficient heat dissipation according to claim 1, wherein heat dissipation fins (18) are installed on one side outer wall of the sealing plate (12), and one side outer wall of the heat dissipation fins (18) is attached to one side outer wall of the semiconductor refrigerating sheet (15).
5. The integrated water cooling machine with high heat dissipation efficiency according to claim 1, wherein the heat dissipation assembly (5) comprises a support frame (7) installed at one end inside the heat dissipation ring (2), fan blades (8) rotatably connected in the support frame (7) and a heat dissipation motor (9) installed at the center of one side outer wall of the support frame (7), and an output shaft of the heat dissipation motor (9) is connected with the center of the fan blades (8).
6. The integrated water cooling machine with high-efficiency heat dissipation according to claim 1, wherein air inlets (10) distributed at equal intervals are formed at one end of the outer wall of the heat dissipation ring (2), and a dust screen (11) is mounted on the inner wall of one end of the heat dissipation ring (2).
7. The integrated water cooling machine with high heat dissipation according to claim 5, wherein the heat dissipation motor (9), the electromagnetic valve and the semiconductor refrigerating sheet (15) are connected with a switch through wires, and the switch is connected with a power supply through wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321858750.3U CN220750537U (en) | 2023-07-15 | 2023-07-15 | Integrated water cooling machine capable of efficiently radiating heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321858750.3U CN220750537U (en) | 2023-07-15 | 2023-07-15 | Integrated water cooling machine capable of efficiently radiating heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220750537U true CN220750537U (en) | 2024-04-09 |
Family
ID=90566460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321858750.3U Active CN220750537U (en) | 2023-07-15 | 2023-07-15 | Integrated water cooling machine capable of efficiently radiating heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220750537U (en) |
-
2023
- 2023-07-15 CN CN202321858750.3U patent/CN220750537U/en active Active
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