CN220670285U - Industrial heat exchanger based on Peltier effect - Google Patents
Industrial heat exchanger based on Peltier effect Download PDFInfo
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- CN220670285U CN220670285U CN202322346157.7U CN202322346157U CN220670285U CN 220670285 U CN220670285 U CN 220670285U CN 202322346157 U CN202322346157 U CN 202322346157U CN 220670285 U CN220670285 U CN 220670285U
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- heat exchange
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- heat exchanger
- heat
- shell
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- 230000005679 Peltier effect Effects 0.000 title claims abstract description 18
- 239000012530 fluid Substances 0.000 claims abstract description 39
- 239000004065 semiconductor Substances 0.000 claims abstract description 38
- 238000009413 insulation Methods 0.000 claims abstract description 13
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to an industrial heat exchanger based on the Peltier effect, which comprises a supporting seat, wherein the top of the supporting seat is provided with a shell with a hollow inside in a matched manner, the inside of the shell is provided with a plurality of first cavities and second cavities corresponding to the first cavities one by one, a plurality of heat exchange cavities are arranged between a single first cavity and a corresponding single second cavity in a matched manner, a plurality of through holes are formed in the side wall surface of the single heat exchange cavity, a heat insulation shell with a hollow inside is arranged in the single through hole in a matched manner, a semiconductor refrigerating sheet is arranged in the heat insulation shell in a matched manner, two working end surfaces of the semiconductor refrigerating sheet are respectively provided with radiating fins in a matched manner, one radiating fin is positioned in the corresponding heat exchange cavity, and the other radiating fin is positioned outside the heat exchange cavity. Through setting up the semiconductor refrigeration piece, can make radiating fin intensify or the cooling, radiating fin direct and fluid contact to can effectively improve the heat exchange efficiency of heat exchanger, shorten heat transfer time, effectively improve production efficiency.
Description
Technical Field
The utility model relates to the technical field of heat exchangers, in particular to an industrial heat exchanger based on the Peltier effect.
Background
The heat exchanger is an important refrigeration device, and is widely applied to various industrial production fields such as chemical industry, petroleum, power, food and the like by enabling a refrigerant to absorb or release heat so as to exchange heat with surrounding media. The heat exchangers are generally classified into air-cooled heat exchangers and liquid-cooled heat exchangers, wherein the air-cooled heat exchangers perform heat dissipation and refrigeration by heat exchange between heat dissipation fins and external air, and the heat exchange time is long and the heat exchange efficiency is low.
In the prior art, the air-cooled radiator increases air fluidity by arranging a fan so as to improve heat radiation efficiency. However, the fan is generally arranged, so that the heat dissipation time is still longer, and the problem of low heat exchange efficiency of the traditional air-cooled radiator is difficult to solve, so that the production efficiency is low.
Disclosure of Invention
The applicant provides an industrial heat exchanger based on the Peltier effect aiming at the defects in the prior art, and the semiconductor refrigerating sheet is arranged to enable the radiating fins to be heated or cooled, and the radiating fins are directly contacted with fluid, so that the heat exchange efficiency of the heat exchanger can be effectively improved, the heat exchange time is shortened, and the production efficiency is effectively improved.
The technical scheme adopted by the utility model is as follows:
the utility model provides an industrial heat exchanger based on Peltier effect, which comprises a supporting pedestal and is characterized in that the top of the supporting seat is matched and provided with a shell with hollow inside, the inside of the shell is matched and provided with a plurality of first cavities and second cavities corresponding to the first cavities one by one, a single first cavity is correspondingly communicated with an inflow port arranged on the wall surface of the shell, a single second cavity is correspondingly communicated with an outflow port arranged on the wall surface of the shell, a plurality of heat exchange cavities are matched and provided between the single first cavity and the corresponding single second cavity, the side wall surface of the single heat exchange cavity is provided with a plurality of through holes, the inside of the single through hole is matched and provided with a heat insulation shell with hollow inside, the inside of the heat insulation shell is matched and provided with a semiconductor refrigeration sheet, two working end surfaces of the semiconductor refrigeration sheet are respectively matched and provided with heat dissipation fins, one heat dissipation fin is positioned inside the corresponding heat exchange cavity, and the other heat dissipation fin is positioned outside the heat exchange cavity;
the heat exchanger is provided with a control system in a matched mode, and the control system is electrically connected with the semiconductor refrigerating sheet.
As a further improvement of the above technical scheme:
when the heat exchanger works, fluid flows into the first cavity from the inflow port and then flows into the heat exchange cavity, the control system drives one working end surface of the semiconductor refrigerating sheet to refrigerate or heat, so that the fluid in the heat exchange cavity is refrigerated or heated through the radiating fins in the heat exchange cavity, then the fluid in the heat exchange cavity flows into the second cavity and then flows out of the heat exchanger through the outflow port, and heat exchange is completed.
The inflow port is disposed below the outflow port.
The heat shield is arranged outside the single heat exchange cavity in a matched mode.
A plurality of layers of guide plates are sequentially arranged in the single heat exchange cavity at intervals from top to bottom, and square grooves for allowing fluid to pass through are formed in the end faces of the guide plates.
The two working end surfaces of the semiconductor refrigerating sheet are respectively matched with the radiating fins through heat conduction silicone grease.
The single through hole is sealed and installed with the heat insulation shell through a sealing ring.
The control system comprises a multi-output power adapter, a microprocessor and a temperature sensor, each output end of the multi-output power adapter is connected with a plurality of semiconductor refrigerating sheets, and the temperature sensor is arranged on the wall surface of the second cavity;
the temperature sensor collects the temperature of the fluid in the second cavity in real time and generates a collected temperature signal to the microprocessor, and the microprocessor controls one or more output ends of the multi-output power adapter to output corresponding driving voltage according to the temperature signal sent by the temperature sensor.
The top cooperation of shell is installed the fan, the structure of fan is: the motor is arranged at the output end of the motor, and is connected with a fan arranged inside the shell.
The wall surface of the shell is provided with a plurality of openings.
The beneficial effects of the utility model are as follows:
the heat exchange device is compact and reasonable in structure and convenient to operate, and the heat exchange cavity, the semiconductor refrigerating sheet, the heat insulation shell and the radiating fins are arranged, so that the semiconductor refrigerating sheet can refrigerate or heat fluid in the heat exchange cavity through the radiating fins, the heat exchange efficiency is effectively improved, the heat exchange time is shortened, and the production efficiency is guaranteed.
The utility model also has the following advantages:
(1) The heat exchanger has the dual functions of refrigeration and heating, so that the refrigerator can refrigerate or heat fluid in the heat exchange cavity according to the use requirement, and the heat exchanger has multiple purposes, saves the production space and reduces the production cost.
(2) According to the heat exchange cavity, the partition plate is arranged, the grooves are formed in the partition plate, and the inflow port is arranged below the outflow port, so that fluid in the heat exchange cavity flows in a serpentine shape from bottom to top, the contact area between the fluid and the radiating fins in the heat exchange cavity can be increased, and the heat exchange efficiency is improved.
(3) According to the heat exchange device, the heat shield and the heat insulation shell are arranged, so that heat exchange between two radiating fins, between a plurality of heat exchange cavities and between the heat exchange cavities and the external environment can be prevented, and the heat exchange efficiency is improved.
(4) According to the utility model, the control system is arranged to monitor the temperature of the fluid in the second cavity, so that the temperature of the fluid subjected to heat exchange of the heat exchanger is effectively monitored, and the microprocessor can timely regulate the output voltage of the multi-output power adapter according to the temperature signal, so that the energy consumption can be reduced.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic view of an installation structure of a heat exchange cavity in the present utility model.
Fig. 3 is a full cross-sectional view of a heat exchange chamber, a first chamber, and a second chamber of the present utility model.
Fig. 4 is a schematic view of a mounting structure of a heat dissipating fin and a heat insulating shell according to the present utility model.
Fig. 5 is a front view of fig. 4.
Fig. 6 is a cross-sectional view of section A-A of fig. 5.
Fig. 7 is a schematic view of the present utility model in an operating state.
Wherein: 1. a support base; 2. a housing; 3. a heat exchange cavity; 4. a deflector; 5. a through hole; 6. a semiconductor refrigeration sheet; 7. a heat radiation fin; 8. a heat insulating case; 9. a first cavity; 10. a second cavity; 11. an inflow port; 12. an outflow port; 13. an opening.
Detailed Description
The following describes specific embodiments of the present utility model with reference to the drawings.
The structure and the function of the utility model are as follows:
as shown in fig. 1-6, an industrial heat exchanger based on the peltier effect comprises a supporting seat 1, wherein a hollow inner shell 2 is cooperatively arranged at the top of the supporting seat 1, a plurality of first cavities 9 are cooperatively arranged in the shell 2, and second cavities 10 which are in one-to-one correspondence with the first cavities 9, the single first cavities 9 are correspondingly communicated with an inflow port 11 arranged on the wall surface of the shell 2, the single second cavities 10 are correspondingly communicated with an outflow port 12 arranged on the wall surface of the shell 2, a plurality of heat exchange cavities 3 are cooperatively arranged between the single first cavities 9 and the corresponding single second cavities 10, a plurality of through holes 5 are arranged on the side wall surface of the single heat exchange cavity 3, a hollow inner heat insulation shell 8 is cooperatively arranged in the single through holes 5, a semiconductor refrigerating sheet 6 is cooperatively arranged in the heat insulation shell 8, heat dissipation fins 7 are respectively cooperatively arranged on two working end surfaces of the semiconductor refrigerating sheet 6, one heat dissipation fin 7 is positioned in the corresponding heat exchange cavity 3, and the other heat dissipation fin 7 is positioned outside the corresponding heat exchange cavity 3; the heat exchanger is provided with a control system in a matched mode, and the control system is electrically connected with the semiconductor refrigerating sheet 6. When the heat exchanger works, fluid flows into the first cavity 9 from the inflow port 11 and then flows into the heat exchange cavity 3, the control system drives one working end surface of the semiconductor refrigerating sheet 6 to refrigerate or heat, so that the fluid in the heat exchange cavity 3 is refrigerated or heated through the radiating fins 7 positioned in the heat exchange cavity 3, then the fluid in the heat exchange cavity 3 flows into the second cavity 10 and then flows out of the heat exchanger through the outflow port 12, and heat exchange is completed. In the utility model, the semiconductor refrigerating sheet 6 is based on the Peltier effect, when current passes through the semiconductor refrigerating sheet 6, one working end face of the semiconductor refrigerating sheet has an endothermic phenomenon, and the other end face has an exothermic phenomenon; when the current direction passing through the semiconductor refrigerating sheet 6 is changed, the working end face which absorbs heat originally generates heat, and the working end face which absorbs heat originally generates heat; the working end face of the semiconductor refrigerating sheet 6 is controlled by the control system to absorb heat or emit heat, so that the fluid in the heat exchange cavity 3 is subjected to heat exchange.
The inflow port 11 is provided below the outflow port 12; a plurality of layers of guide plates 4 are sequentially arranged in the single heat exchange cavity 3 from top to bottom at intervals, and square grooves for allowing fluid to pass through are formed in the end faces of the guide plates 4. The fluid in the heat exchange cavity 3 can flow in a serpentine shape from bottom to top, and the contact area between the fluid and the radiating fins 7 in the heat exchange cavity 3 can be increased, so that the heat exchange efficiency is improved.
A heat shield is arranged outside the single heat exchange cavity 3 in a matched manner; the two working end surfaces of the semiconductor refrigerating sheet 6 are respectively matched and installed with the radiating fins 7 through heat conduction silicone grease; the single through hole 5 is sealed and mounted with the heat insulation shell 8 by a sealing ring. The heat insulation shell 8 can separate the two radiating fins 7, so that heat exchange is prevented from being generated between the two radiating fins 7, and the heat insulation cover can prevent heat exchange from being generated between the heat exchange cavity 3 and the external environment, so that the heat exchange efficiency is improved.
The control system comprises a multi-output power adapter, a microprocessor and a temperature sensor, wherein each output end of the multi-output power adapter is connected with a plurality of semiconductor refrigerating sheets 6, and the temperature sensor is arranged on the wall surface of the second cavity 10; the temperature sensor collects the temperature of the fluid in the second cavity 10 in real time, and the collected temperature signal is sent to the microprocessor, and the microprocessor controls one or more output ends of the multi-output power adapter to output corresponding driving voltage according to the temperature signal sent by the temperature sensor. Through setting up control system, detect the fluid temperature in the second cavity 10 to effectively monitor the fluid temperature through the heat exchanger heat transfer, microprocessor can in time adjust the output voltage of many output power adapter according to this temperature signal, thereby reduce the energy consumption.
The fan is installed in the top cooperation of shell 2, and the structure of fan is: the motor is included, and the output end of the motor is connected with a fan positioned in the shell 2; a plurality of openings 13 are provided in the wall surface of the housing 2. Through setting up fan and opening 13, can strengthen the mobility of the inside air of shell 1 to strengthen the heat dissipation, improve the refrigeration efficiency of heat exchanger.
The working process of the utility model is as follows:
as shown in fig. 7, the direction of the arrow in fig. 7 indicates the flow direction of the fluid in the heat exchange chamber 3;
when the heat exchanger works, fluid flows into the first cavity 9 from the inflow port 11 and then flows into the heat exchange cavity 3;
when the fluid in the heat exchange cavity 3 is required to be refrigerated, the multi-output power adapter drives the working end face of the semiconductor refrigeration piece 6 connected with the heat exchange fins 7 positioned in the heat exchange cavity 3 to refrigerate, and meanwhile, the other working end face of the semiconductor refrigeration piece 6 heats;
at this time, the heat exchange fins 7 positioned in the heat exchange cavity 3 refrigerate the fluid in the heat exchange cavity 3, so that the temperature of the fluid is reduced, the fan is started, the air fluidity in the shell 1 is improved, and the heat dissipation of the heat exchange fins 7 positioned outside the heat exchange cavity 3 is accelerated;
the fluid in the heat exchange cavity 3 flows into the second cavity 10 and then flows out of the heat exchanger through the outflow port 12 to finish refrigeration;
when the fluid in the heat exchange cavity 3 is required to be heated, the multi-output power adapter outputs driving voltage which is opposite to that during refrigeration, so that the working end face of the semiconductor refrigeration sheet 6 connected with the heat exchange fins 7 positioned in the heat exchange cavity 3 is driven to heat, and meanwhile, the other working end face of the semiconductor refrigeration sheet 6 is refrigerated;
at this time, the heat exchange fins 7 positioned in the heat exchange cavity 3 heat the fluid in the heat exchange cavity 3, so that the temperature of the fluid is increased;
the fluid in the heat exchange cavity 3 flows into the second cavity 10 and then flows out of the heat exchanger through the outflow port 12 to finish heating;
in the refrigerating or heating process of the heat exchanger, the temperature sensor feeds back the temperature at the outlet of the heat exchanger to the microprocessor in real time, so that one or more output ends of the multi-output power adapter output corresponding driving voltages;
in the daily working mode of the heat exchanger, one output end of the multi-output power adapter outputs driving voltage so as to drive the semiconductor refrigerating sheet 6 connected with the heat exchanger;
when the heat exchange power needs to be increased, the heat exchanger is switched to a high-power working mode, and a plurality of output ends of the multi-output power adapter simultaneously output driving voltages, so that all the semiconductor refrigerating sheets 6 are driven;
meanwhile, the microprocessor controls the amplitude of the driving voltage output by the multi-output power adapter according to the temperature signal fed back by the temperature sensor in real time;
because the refrigerating capacity and heating capacity of the working end face of the semiconductor refrigerating sheet 6 are in direct proportion to the amplitude of the current flowing through the semiconductor refrigerating sheet 6, the output of the multi-output power adapter is controlled by the control system, so that the fluid temperature in the second cavity 10 meets the use requirement.
The above description is intended to illustrate the utility model and not to limit it, the scope of which is defined by the claims, and any modifications can be made within the scope of the utility model.
Claims (10)
1. An industrial heat exchanger based on the peltier effect, characterized in that: the heat exchange device comprises a supporting seat (1), wherein an inner hollow shell (2) is arranged at the top of the supporting seat (1) in a matched mode, a plurality of first cavities (9) are arranged in the shell (2) in a matched mode, a plurality of second cavities (10) which correspond to the first cavities (9) one by one are arranged in the shell (2), a single first cavity (9) is correspondingly communicated with an inflow opening (11) arranged on the wall surface of the shell (2), a single second cavity (10) is correspondingly communicated with an outflow opening (12) arranged on the wall surface of the shell (2), a plurality of heat exchange cavities (3) are arranged between the single first cavity (9) and the corresponding single second cavity (10) in a matched mode, a plurality of through holes (5) are formed in the side wall surface of the single heat exchange cavity (3), a semiconductor refrigerating sheet (6) is arranged in the single through hole (5) in a matched mode, two working end faces of the semiconductor refrigerating sheet (6) are respectively matched with a fin (7), one fin (7) is arranged in the corresponding heat exchange cavity (7) and the other fin (7) is located in the heat exchange cavity (3);
the heat exchanger is provided with a control system in a matched mode, and the control system is electrically connected with the semiconductor refrigerating sheet (6).
2. An industrial heat exchanger based on the peltier effect as set forth in claim 1, wherein: when the heat exchanger works, fluid flows into the first cavity (9) from the inflow port (11) and then flows into the heat exchange cavity (3), the control system drives one working end face of the semiconductor refrigerating sheet (6) to refrigerate or heat, so that the fluid in the heat exchange cavity (3) is refrigerated or heated through the radiating fins (7) positioned in the heat exchange cavity (3), then the fluid in the heat exchange cavity (3) flows into the second cavity (10), and then flows out of the heat exchanger through the outflow port (12), and heat exchange is completed.
3. An industrial heat exchanger based on the peltier effect as set forth in claim 1, wherein: the inflow opening (11) is arranged below the outflow opening (12).
4. An industrial heat exchanger based on the peltier effect as set forth in claim 1, wherein: the heat shield is arranged outside the single heat exchange cavity (3) in a matched mode.
5. An industrial heat exchanger based on the peltier effect as set forth in claim 1, wherein: a plurality of layers of guide plates (4) are sequentially arranged in the single heat exchange cavity (3) from top to bottom at intervals, and square grooves for allowing fluid to pass through are formed in the end faces of the guide plates (4).
6. An industrial heat exchanger based on the peltier effect as set forth in claim 1, wherein: the two working end surfaces of the semiconductor refrigerating sheet (6) are respectively matched with the radiating fins (7) through heat conduction silicone grease.
7. An industrial heat exchanger based on the peltier effect as set forth in claim 1, wherein: the single through hole (5) is hermetically arranged with the heat insulation shell (8) through a sealing ring.
8. An industrial heat exchanger based on the peltier effect as set forth in claim 1, wherein: the control system comprises a multi-output power adapter, a microprocessor and a temperature sensor, wherein each output end of the multi-output power adapter is connected with a plurality of semiconductor refrigerating sheets (6), and the temperature sensor is arranged on the wall surface of the second cavity (10);
the temperature sensor collects the temperature of the fluid in the second cavity (10) in real time, and the collected temperature signals are generated to the microprocessor, and the microprocessor controls one or more output ends of the multi-output power adapter to output corresponding driving voltages according to the temperature signals sent by the temperature sensor.
9. An industrial heat exchanger based on the peltier effect as set forth in claim 1, wherein: the top cooperation of shell (2) is installed the fan, the structure of fan is: the motor is included, the output of motor is connected with the fan that is located inside shell (2).
10. An industrial heat exchanger based on the peltier effect as set forth in claim 1, wherein: a plurality of openings (13) are arranged on the wall surface of the shell (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322346157.7U CN220670285U (en) | 2023-08-29 | 2023-08-29 | Industrial heat exchanger based on Peltier effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322346157.7U CN220670285U (en) | 2023-08-29 | 2023-08-29 | Industrial heat exchanger based on Peltier effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220670285U true CN220670285U (en) | 2024-03-26 |
Family
ID=90353544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322346157.7U Active CN220670285U (en) | 2023-08-29 | 2023-08-29 | Industrial heat exchanger based on Peltier effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220670285U (en) |
-
2023
- 2023-08-29 CN CN202322346157.7U patent/CN220670285U/en active Active
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