CN214546990U - Ice cream machine with micro-flow heat dissipation channel - Google Patents
Ice cream machine with micro-flow heat dissipation channel Download PDFInfo
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- CN214546990U CN214546990U CN202120417728.XU CN202120417728U CN214546990U CN 214546990 U CN214546990 U CN 214546990U CN 202120417728 U CN202120417728 U CN 202120417728U CN 214546990 U CN214546990 U CN 214546990U
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Abstract
The utility model discloses an ice cream machine with miniflow heat dissipation channel, including main engine body and refrigeration mechanism, refrigeration mechanism includes semiconductor cooler and heat abstractor, be equipped with many heat conduction microchannels that are parallel to each other in the heat dissipation base plate, heat conduction microchannel is injected into there is heat conduction phase transition working medium, in the heat dissipation base plate with the second face that the semiconductor cooler deviates from mutually is equipped with the multi-disc fin. The heat is transmitted from the high-heat-flow local heat energy of the semiconductor refrigerator to the whole heat dissipation substrate through the heat conduction micro-channel, so that the heat dissipation substrate of the section bar realizes temperature equalization, the defects of low heat transfer coefficient and high transmission thermal resistance of the solid section bar are overcome, the problem of high heat-end heat-flow density of the semiconductor refrigerator is effectively solved, and the heat can be rapidly transmitted to the periphery in a heat concentration state. Moreover, the heat conducting micro-channel is not contacted with the hot end of the semiconductor refrigerator, so that the generation of thermal contact resistance can be avoided, and the heat dissipation effect of the whole heat dissipation device is greatly improved.
Description
Technical Field
The utility model relates to a semiconductor refrigeration technology field especially relates to an ice-cream machine with miniflow heat dissipation channel.
Background
The semiconductor refrigeration technology has the characteristics of compact structure, small modularization, convenient control of cold quantity, no vibration during working, convenient movement and the like of a core refrigeration system, and is effectively utilized in small refrigeration appliance products such as semiconductor refrigeration wine cabinets, semiconductor refrigeration cabinets, cosmetic refrigeration cabinets and the like. With the continuous improvement of the technical level of semiconductor refrigeration, semiconductor refrigeration begins to extend to the application of products with refrigeration function requirements, and semiconductor refrigeration small ice cream makers are produced, for example, the technical schemes disclosed in the prior patents 200420021510.9 and 201710927314.X realize the production of DIY ice cream.
Different from mechanical pressing refrigeration, semiconductor refrigeration belongs to temperature difference refrigeration, the cold end refrigeration temperature of a refrigerator is closely related to the hot end temperature, and both the refrigeration quantity and the refrigeration depth are greatly influenced by heat dissipation of a hot end. The structure of the ice cream machine patent described above is known as follows: in order to ensure the miniaturization of the ice cream machine, the aluminum profile is adopted as the radiator at the hot end of the semiconductor refrigerator, and as the aluminum profile radiator has small heat conductivity coefficient (generally 150-230W/mk), large heat conduction resistance and high hot end temperature, the refrigerating performance of the cold end of the refrigerator, such as refrigerating capacity, conversion efficiency and the like, is affected, the ice cream manufacturing time is prolonged, and thermal contact resistance is generated when the radiator is in contact with the refrigerator, so that the heat radiation performance is affected. Therefore, how to improve the refrigeration performance, reduce the contact thermal resistance and realize the rapid temperature equalization of the heat dissipation substrate of the section bar on the basis of ensuring the compact structure and the miniaturization of the ice cream machine is a technical problem to be solved urgently by the conventional semiconductor refrigeration ice cream machine.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an ice cream machine with miniflow heat dissipation channel, through set up the heat conduction microchannel at heat abstractor, make the heat dissipation base plate of section bar realize quick samming, reduced thermal contact resistance, make semiconductor cooler's hot junction to the conduction thermal resistance between the environment littleer, realized better heat transfer effect.
To achieve the purpose, the utility model adopts the following technical proposal:
an ice cream machine with a microflow heat dissipation channel comprises a main machine body and a refrigerating mechanism, wherein the refrigerating mechanism is arranged inside the main machine body and comprises a semiconductor refrigerator and a heat dissipation device, the cold end of the semiconductor refrigerator is used for refrigerating a refrigerating barrel of the main machine body, and the hot end of the semiconductor refrigerator is in contact with a first plate surface of a heat dissipation substrate of the heat dissipation device;
the heat dissipation substrate is internally provided with a plurality of heat conduction micro-channels which are parallel to each other, heat conduction phase change working media are injected into the heat conduction micro-channels, and a plurality of fins are arranged on a second plate surface of the heat dissipation substrate, which is far away from the semiconductor refrigerator.
Preferably, at least one reinforcing rib is arranged on one side of the heat conduction micro-channel close to the first plate surface;
the length direction of the reinforcing ribs and the fins are parallel to each other, or the reinforcing ribs are obliquely arranged relative to the fins.
Preferably, the shape of the reinforcing rib comprises one or more combination of a straight line type, an arc type, a wave type and a dog-ear type.
Preferably, the shape of the cross section of the heat conductive microchannel perpendicular to the heat dissipation substrate includes one or more combinations of a circle, a polygon, an arch, and a multi-arc.
Preferably, a connecting microchannel for communicating all the heat conducting microchannels is further arranged in the heat dissipation substrate.
Preferably, the heat dissipation device further comprises a sealing head, the heat conduction micro-channel penetrates through the inside of the heat dissipation substrate, and two ends of the heat conduction micro-channel are sealed through the sealing head respectively.
Preferably, the distribution area of the heat-conducting micro-channels is not smaller than the bonding area; the heat conducting micro-channel and the fin are parallel or perpendicular to each other.
Preferably, the refrigeration mechanism further comprises a fan, a partition plate and a fan outer cover, the fan outer cover is connected with the shell of the main machine body, the fan outer cover is provided with an air inlet and an air outlet, the air outlet is arranged on two sides of the air inlet, and a sealing surface is arranged between the air inlet and the air outlet;
the partition board is fixed on the closed surface, so that the interior of the fan outer cover is divided into an air inlet cavity and an air outlet cavity, the fan is embedded in the partition board, the air inlet end of the fan is located in the air inlet cavity, the air outlet end of the fan and the heat dissipation device are both located in the air outlet cavity, and the second board surface of the heat dissipation base board faces the air outlet end of the fan.
Preferably, the refrigerating mechanism further comprises a cold guide block, a heat insulation plate and heat insulation cotton, and the outer wall of the refrigerating barrel and the cold end of the semiconductor refrigerator are both in contact with the cold guide block;
the semiconductor refrigerator is embedded in the heat insulation plate, and the side surface of the semiconductor refrigerator is surrounded by the heat insulation cotton;
the heat insulation plate is used for separating the cold conducting block from the heat dissipation device.
Preferably, the semiconductor refrigerator and the fan are electrically connected to a controller of the main body, and the controller is configured to perform linked parallel control on the operating voltage of the semiconductor refrigerator and the operating voltage of the fan.
The ice cream machine with the micro-flow heat dissipation channel has the following beneficial effects:
in the ice cream machine with the microflow heat dissipation channel, a plurality of heat conduction micro channels which are parallel to each other are arranged in the heat dissipation substrate, and the heat conduction micro channels transmit the local heat energy of the high heat flow of the semiconductor refrigerator to the whole heat dissipation substrate, so that the heat dissipation substrate of the section bar realizes temperature equalization, the defects of low heat transfer coefficient and large transmission thermal resistance of the solid section bar are overcome, the problem of large heat flux density of the hot end of the semiconductor refrigerator is effectively solved, and the heat can be rapidly transmitted to the periphery under the heat concentration state. The heat dissipation substrate with uniform temperature enables heat energy transmitted to the heat dissipation substrate to be improved in heat exchange quantity and heat exchange efficiency between the fins connected with the heat dissipation substrate and ambient air, the temperature of the heat dissipation substrate is reduced, the heat end temperature of the semiconductor refrigerator attached to the heat dissipation substrate is reduced due to the matched use of the heat conduction micro-channels and the fins, the cold production quantity and the refrigeration coefficient of the semiconductor refrigerator are improved, and therefore the speed of ice cream making and forming is increased.
Moreover, the heat conducting micro-channel is not contacted with the hot end of the semiconductor refrigerator, so that the generation of thermal contact resistance can be avoided, and the heat dissipation effect of the whole heat dissipation device is greatly improved.
Drawings
The accompanying drawings are provided to further illustrate the present invention, but the content in the accompanying drawings does not constitute any limitation to the present invention.
Fig. 1 is a schematic structural diagram of an ice cream maker according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a heat conducting microchannel according to an embodiment of the present invention;
FIG. 4 is a schematic diagram II of a structure of a heat conducting microchannel according to an embodiment of the present invention;
fig. 5 is a schematic view iii of a structure of a heat conducting micro channel according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram I of a reinforcing rib according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram ii of a reinforcing rib according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram iii of a reinforcing rib according to an embodiment of the present invention;
FIG. 9 is a schematic structural diagram IV of a reinforcing rib according to an embodiment of the present invention;
fig. 10 is a schematic view v of a structure of a reinforcing rib according to an embodiment of the present invention;
fig. 11 is a schematic structural view vi of a reinforcing rib according to an embodiment of the present invention;
FIG. 12 is a schematic diagram of a connecting microchannel structure according to one embodiment of the present invention;
FIG. 13 is a schematic view of a fan housing according to an embodiment of the present invention;
fig. 14 is a top view of the internal structure of the ice cream maker according to one embodiment of the present invention.
Wherein: a main body 100; a refrigeration mechanism 200; a semiconductor refrigerator 1; a heat sink 2; a heat dissipation substrate 21; a first board surface 211; a second deck 212; a bonding region 213; a thermally conductive microchannel 22; a reinforcing rib 221; the fins 23; connecting the microchannels 24; a seal head 25; a refrigerating barrel 3; a fan 4; a partition 5; a fan housing 6; an air inlet 61; an air outlet 62; a sealing surface 63; an air inlet chamber 64; an air outlet chamber 65; a cold conducting block 7; a heat insulating plate 8; heat insulation cotton 9; a housing 10.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial.
In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The ice cream machine with micro-flow heat dissipation channel according to the present invention will be described with reference to the accompanying drawings and embodiments.
As shown in fig. 1 to 3, the ice cream machine with a microfluidic heat dissipation channel of the present embodiment includes a main body 100 and a refrigeration mechanism 200, where the refrigeration mechanism 200 is disposed inside the main body 100, the refrigeration mechanism 200 includes a semiconductor refrigerator 1 and a heat dissipation device 2, a cold end of the semiconductor refrigerator 1 is used for refrigerating a refrigeration barrel 3 of the main body 100, and a hot end of the semiconductor refrigerator 1 is in contact with a first plate surface 212 of a heat dissipation substrate 21 of the heat dissipation device 2;
a plurality of parallel heat conduction micro-channels 22 are arranged in the heat dissipation substrate 21, a heat conduction phase change working medium is injected into the heat conduction micro-channels 22, and a plurality of fins 23 are arranged on a second plate surface 212 of the heat dissipation substrate 21, which is far away from the semiconductor refrigerator 1.
It should be understood that the ice cream machine with the micro-flow heat dissipation channel is to refrigerate the refrigerating barrel 3 of the main body 100 through the semiconductor refrigerator 1 in the refrigerating mechanism 200, the semiconductor refrigerator 1(Thermoelectric Cooler, abbreviated as TEC) is a refrigerating device made by using Peltier effect of semiconductor materials, and the Peltier effect is a phenomenon that when a direct current passes through a couple pair composed of two semiconductor materials, one end of the direct current absorbs heat and the other end releases heat. Semiconductor cooler 1 includes a plurality of P-type and N-type electric couple pairs (groups) connected together by conductive electrodes and sandwiched between two thermally conductive and insulating materials such as ceramic substrates, and forms hot and cold sides on semiconductor cooler 1 under the peltier effect when an electric current flows through semiconductor cooler 1.
According to the semiconductor refrigeration theory, the refrigerating capacity Q of the semiconductor refrigerator 1cComprises the following steps:
Qc＝N(αp-αn)ITc-K(Th-Tc)-0.5I2Ri，
wherein N, alphap,αn,I,K,Th,Tc,RiThe number of p-n couple pairs of the semiconductor refrigerator 1, the p-type material Seebeck coefficient, the n-type material Seebeck coefficient, the operating current, the refrigerator thermal conductance, the hot end temperature, the cold end temperature and the refrigerator internal resistance, respectively, and the refrigeration coefficient (or called conversion efficiency) is cop Qc/PiIn which P isiThe power is input to semiconductor refrigerator 1, and it can be seen that the refrigerating capacity and refrigerating efficiency of semiconductor refrigerator 1 are equal to the hot end temperature T of semiconductor refrigerator 1hCorrelation, when other parameters are relatively fixed, ThThe smaller the temperature of the hot side of the semiconductor cooler 1, the lower the cooling capacity QcAnd the larger the cop, the better the refrigeration effect. Therefore, one of the technical solutions of increasing the refrigerating capacity of the ice cream machine, increasing the forming speed of ice cream production and shortening the production time is to reduce the hot end temperature T of the semiconductor refrigerator 1h. The present embodiment is based on the above principle, and improves the heat dissipation device 2 to overcome the problem of insufficient heat dissipation matching process between the heat dissipation device 2 of the existing ice cream machine and the semiconductor refrigerator 1.
To reduce the hot end temperature T of a semiconductor refrigerator 1hIt is necessary to reduce the thermal resistance between the hot end of the semiconductor cooler 1 and the ambient air, and since the area of the hot end of the semiconductor cooler 1 itself is small, the heat flux density is large. In the ice cream machine with the microflow heat dissipation channel, a plurality of heat conduction micro-channels 22 which are parallel to each other are arranged in a heat dissipation substrate 21, and the heat conduction micro-channels 22 transmit the heat of the local heat energy of the high heat flow of the semiconductor refrigerator 1 to the whole heat dissipation substrate 21, so that the heat dissipation substrate 21 of the section bar realizes temperature equalization, and the defects of low heat transfer coefficient and large transmission heat resistance of the solid section bar are overcomeThe heat-conducting heat pipe type semiconductor refrigerator has the advantages that the problem of large heat flux density of the hot end of the semiconductor refrigerator 1 is effectively solved, and heat can be rapidly transmitted to the periphery in a heat concentration state.
The heat conduction micro-channel 22 is arranged inside the heat dissipation substrate 21 and close to the first plate surface 212 in contact with the hot end of the semiconductor refrigerator 1, and the heat conduction micro-channel 22 is injected with a heat conduction phase change working medium, so that heat is rapidly transmitted to the periphery, the whole heat dissipation substrate 21 has isothermal property, and efficient transmission of heat energy of the heat dissipation substrate 21 is achieved. Moreover, the heat conducting micro-channel 22 is not in contact with the hot end of the semiconductor cooler 1, so that the generation of thermal contact resistance can be avoided, and the heat dissipation effect of the whole heat dissipation device 2 is greatly improved. The number and distribution of the heat conductive micro-channels 22 are preferably such that they cover the entire heat dissipation substrate 21.
The heat dissipation substrate 21 with uniform temperature improves the heat exchange amount and the heat exchange efficiency between the heat energy transmitted to the heat dissipation substrate 21 and the ambient air through the fins 23 connected with the heat dissipation substrate 21, reduces the temperature of the heat dissipation substrate 21, and reduces the hot end temperature T of the semiconductor refrigerator 1 attached to the heat dissipation substrate 21 through the cooperation of the heat conduction micro-channels 22 and the fins 23hThe cold production capacity and the refrigeration coefficient of the semiconductor refrigerator 1 are improved, so that the speed of making and forming the ice cream is accelerated.
Preferably, as shown in fig. 6, in order to increase the heat dissipation area and enhance the heat exchange effect, at least one reinforcing rib 221 is disposed on one side of the heat conducting microchannel 22 close to the first plate surface 212; the number and distribution of the ribs 221 are preferably such that they cover the side adjacent to the first panel surface 212; the length direction of the reinforcing ribs 221 and the fins 23 may be parallel to each other, or the reinforcing ribs 221 may be inclined with respect to the fins 23, as shown in fig. 7, which has a certain guiding effect on the flow direction of the heat-conducting phase-change working medium of the heat-conducting microchannel 22, and the arrangement direction of the reinforcing ribs 221 may be set as required.
Specifically, the shape of the reinforcing rib 221 includes, but is not limited to, a linear shape, an arc shape, a wave shape, and a dog-ear shape, as shown in fig. 6 to 11, a combination of one or more of the shapes may be selected, the linear shape is favorable for the flow of the heat-conducting phase-change working medium, so as to improve the heat exchange speed, and the curved surface shapes such as the arc shape, the wave shape, and the dog-ear shape can further increase the contact area between the reinforcing rib 221 and the heat-conducting phase-change working medium, and increase the heat exchange amount. The wavy form is shown in fig. 10, and the dog-ear form is shown in fig. 11.
More specifically, the shape of the cross section of the heat conducting microchannel 22 perpendicular to the heat dissipating substrate 21 includes, but is not limited to, a circle, a polygon, an arch, and a multi-arc, and as shown in fig. 3 to 5, one or a combination of several shapes may be selected optionally. The round shape is beneficial to the flowing of the heat-conducting phase-change working medium, thereby improving the heat exchange speed; the polygonal shape, the arc shape and the multiple arc shape can further increase the area of the side of the heat conducting micro-channel 22 close to the first plate surface 212 of the heat dissipating substrate 21, thereby increasing the heat exchange amount.
In the above mentioned shapes, the circle may be a perfect circle, an ellipse or/and an oval; the polygon can be a triangle (divided into a general triangle, a right-angled triangle, an isosceles triangle, an equilateral triangle and the like), a quadrangle (divided into a trapezoid, a right-angled trapezoid, an isosceles trapezoid, a parallelogram and the like, wherein the parallelogram is divided into a rectangle, a rhombus, a square) or/and a pentagon and the like; the arch is a graph formed by straight lines and circular arcs and comprises a major arc arch, a minor arc arch or/and a parabolic arch and the like); the multi-arc shape comprises a crescent, a grain shape, a Taiji gourd shape and the like.
Further, as shown in fig. 2 and 12, the heat dissipation device 2 further includes a sealing head 25, the heat conducting micro channel 22 penetrates through the heat dissipation substrate 21, and two ends of the heat conducting micro channel 22 are sealed by the sealing head 25 respectively. The connecting micro-channel 24 connects the heat conducting micro-channels 22 into a whole, so that the heat of the hot end of the semiconductor refrigerator 1 can be rapidly transmitted to the periphery of the heat dissipation substrate 21, and the temperature uniformity of the heat dissipation substrate 21 is improved. Two ends of the heat conduction micro-channel 22 are respectively sealed through the seal heads 25, so that the leakage of the heat conduction phase change working medium is avoided.
Furthermore, the distribution area of the heat conducting micro-channel 22 is not smaller than the bonding area 213, which is beneficial to transmitting the hot end heat of the semiconductor cooler 1 to the periphery of the heat dissipation substrate 21; the heat conducting micro-channel 22 and the fin 23 are parallel or vertical to each other, and the heat conducting micro-channel and the fin are matched with each other, so that the heat dissipation effect is improved.
Optionally, as shown in fig. 1, the refrigeration mechanism 200 further includes a fan 4, a partition 5 and a fan housing 6, the fan housing 6 is connected to the housing 10 of the main body 100, the fan housing 6 is provided with an air inlet 61 and an air outlet 62, as shown in fig. 13, the air outlet 62 is disposed at two sides of the air inlet 61, and a sealing surface 63 is disposed between the air inlet 61 and the air outlet 62;
as shown in fig. 14, the partition plate 5 is fixed to the sealing surface 63 so as to partition the interior of the fan housing 6 into an air inlet chamber 64 and an air outlet chamber 65, the fan 4 is embedded in the partition plate 5, the air inlet end of the fan 4 is located in the air inlet chamber 64, the air outlet end of the fan 4 and the heat dissipation device 2 are both located in the air outlet chamber 65, and the second plate surface 212 of the heat dissipation substrate 21 faces the air outlet end of the fan 4.
The miniaturized semiconductor refrigeration ice cream machine has small volume and compact structure, and is easy to cause thermal short circuit of air inlet and outlet flows, including an internal thermal short circuit, an external thermal short circuit and the like, so that the heat exchange effect is influenced. For this reason, based on hot air density is little, and the characteristics that rise resistance is little are compared to colder air, the utility model provides a cold, hot disconnect-type air current structural design. The heat exchange efficiency of the semiconductor refrigeration ice cream machine with the small and compact structure is effectively separated by the aid of the two independent closed structures, namely the fan 4, the partition plate 5 and the fan outer cover 6 form the air inlet cavity 64 with the closed structure at the air inlet 61 capable of entering cold air flow, the air outlet cavity 65 with the closed structure is formed between the partition plate 5 and the heat dissipation device 2 at the air outlet 62 for hot air outflow, and the cold air flow and the hot air flow are separated by the partition plate 5, so that the problem of reduction of the heat exchange efficiency caused by air short circuit is solved by means of the conduction characteristics of low hot air flow density and small upward conduction resistance of the air outlet 62 and the unique circulating air flow field, the heat exchange effect of the heat dissipation device 2 is improved, and the refrigeration performance of the semiconductor refrigeration device 1 is further improved. The ice cream forming mechanism is that when the temperature of ice cream food is reduced to a certain temperature value (such as-10 ℃), the tension between the food materials is large enough, so that air stirred into the food materials through the stirring rod can be wrapped, the food materials are puffed and formed, cold air and hot air are effectively separated, the cold production capacity of the semiconductor refrigerator 1 can be further improved, the time for the food materials to reach the rated puffing temperature is shortened, the ice cream forming and manufacturing time is further shortened, and the ice cream manufacturing effect is further improved.
Specifically, as shown in fig. 1, the refrigeration mechanism 200 further includes a cold guide block 7, a thermal insulation plate 8 and thermal insulation cotton 9, the outer wall of the refrigeration barrel 3 and the cold end of the semiconductor refrigerator 1 are both in contact with the cold guide block 7, one end of the cold guide block 7 is in contact with the cold end of the semiconductor refrigerator 1, and the other end of the cold guide block is in contact with the outer wall of the refrigeration barrel 3, so that cold at the cold end of the semiconductor refrigerator 1 is conducted to the refrigeration barrel 3, and then the refrigeration barrel 3 further conducts the cold to the ice cream food material in the barrel.
In order to avoid the loss of the cooling capacity, as shown in fig. 1, the semiconductor refrigerator 1 is embedded in the thermal insulation plate 8, and the thermal insulation plate 8 is used for separating the cold guide block 7 and the heat dissipation device 2, so that the cooling capacity loss from the refrigerating barrel 3 to the environment is reduced, the refrigerating effect of the ice cream machine is further improved, and the manufacturing time is shortened.
In order to reduce heat loss and improve heat transfer efficiency, as shown in fig. 1, heat insulation cotton 9 is further arranged between the cold guide block 7 and the heat dissipation device 2, the cold end of the semiconductor refrigerator 1 is sealed between the cold guide block 7 and the heat dissipation device 2 by the heat insulation cotton 9, the heat insulation cotton 9 is surrounded on the side surface of the semiconductor refrigerator 1, so that the cold end of the semiconductor refrigerator 1 works in a closed environment to realize isolation from the ambient air environment, heat loss caused by heat exchange between the cold end of the semiconductor refrigerator 1 and the ambient air can be avoided, and moisture can be prevented from entering the semiconductor refrigerator 1 to cause reduction of refrigeration performance of the semiconductor refrigerator 1. Alternatively, the two ends of the semiconductor refrigerator 1 may be attached with the heat insulation cotton 9, and the peripheries of the semiconductor refrigerator 1 and the heat insulation cotton 9 may be covered with the silica gel.
Preferably, the semiconductor refrigerator 1 and the fan 4 are electrically connected to a controller of the main body 100, and the controller is configured to perform linked parallel control on the operating voltage of the semiconductor refrigerator 1 and the operating voltage of the fan 4.
The controller of the main body 100 is used to control the start and stop of the semiconductor refrigerator 1 and the start and stop of the fan 4, and a microcontroller, such as a single chip microcomputer, commonly used in the art can be used. The controller carries out linkage parallel control on the working voltage of the semiconductor refrigerator 1 and the working voltage of the fan 4, and can realize the matching of the heat production quantity of the fan 4 and the semiconductor refrigerator 1, namely the working voltage of the semiconductor refrigerator 1 is large, the refrigerating capacity is large, the corresponding heat production quantity is also large, and therefore the rotating speed of the fan 4 is required to be high, and the air quantity is large. Because the fan 4 is connected with the semiconductor refrigerator 1 in parallel, the corresponding working voltage is also high, and at the moment, the heat dissipation air quantity is large, and the heat dissipation effect is good. Along with the ice cream preparation completion, semiconductor refrigerator 1 gets into cold insulation state, and the operating voltage of semiconductor refrigerator 1 descends, and the electric power of input reduces, the heat of output also correspondingly reduces, and at this moment, the amount of wind of fan 4 also correspondingly reduces, and the rotational speed also reduces, and the noise reduces correspondingly, can prolong the life of fan 4.
As will be understood by those skilled in the art, the main body 100 further includes a stirring device covering the upper portion of the cooling tub 3, and the stirring device extends into the cooling tub 3 through a stirring rod to stir the ice cream material. Other configurations and the like and operation of the ice cream maker according to the present embodiment are known to those skilled in the art and will not be described in detail herein.
The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. An ice cream machine with miniflow heat dissipation channel, includes the main engine body and refrigeration mechanism, refrigeration mechanism sets up in the inside of main engine body, its characterized in that: the refrigerating mechanism comprises a semiconductor refrigerator and a heat dissipation device, wherein the cold end of the semiconductor refrigerator is used for refrigerating a refrigerating barrel of the main body, and the hot end of the semiconductor refrigerator is in contact with the first plate surface of a heat dissipation substrate of the heat dissipation device;
the heat dissipation substrate is internally provided with a plurality of heat conduction micro-channels which are parallel to each other, heat conduction phase change working media are injected into the heat conduction micro-channels, and a plurality of fins are arranged on a second plate surface of the heat dissipation substrate, which is far away from the semiconductor refrigerator.
2. Ice cream machine with microfluidic heat dissipation channels according to claim 1, characterized in that: at least one reinforcing rib is arranged on one side of the heat conduction micro-channel close to the first plate surface;
the length direction of the reinforcing ribs and the fins are parallel to each other, or the reinforcing ribs are obliquely arranged relative to the fins.
3. Ice cream machine with microfluidic heat dissipation channels according to claim 2, characterized in that: the shape of the reinforcing rib comprises one or more combinations of a linear type, an arc type, a wave type and a folded angle type.
4. Ice cream machine with microfluidic heat dissipation channels according to claim 1, characterized in that: the shape of the cross section of the heat conducting microchannel perpendicular to the heat radiating substrate comprises one or more combination of circle, polygon, arch and multi-arc.
5. Ice cream machine with microfluidic heat dissipation channels according to claim 1, characterized in that: and a connecting microchannel for communicating all the heat conducting microchannels is also arranged in the heat dissipation substrate.
6. Ice cream machine with microfluidic heat dissipation channels according to claim 5, characterized in that:
the heat dissipation device further comprises a sealing head, the heat conduction micro-channel penetrates through the inside of the heat dissipation substrate, and two ends of the heat conduction micro-channel are sealed through the sealing head respectively.
7. Ice cream machine with microfluidic heat dissipation channels according to claim 1, characterized in that: the distribution area of the heat conduction micro-channel is not smaller than the joint area; the heat conducting micro-channel and the fin are parallel or perpendicular to each other.
8. Ice cream machine with microfluidic heat dissipation channels according to claim 1, characterized in that: the refrigerating mechanism also comprises a fan, a partition plate and a fan outer cover, wherein the fan outer cover is connected with the shell of the main machine body, the fan outer cover is provided with an air inlet and an air outlet, the air outlet is arranged at two sides of the air inlet, and a sealing surface is arranged between the air inlet and the air outlet;
the partition board is fixed on the closed surface, so that the interior of the fan outer cover is divided into an air inlet cavity and an air outlet cavity, the fan is embedded in the partition board, the air inlet end of the fan is located in the air inlet cavity, the air outlet end of the fan and the heat dissipation device are both located in the air outlet cavity, and the second board surface of the heat dissipation base board faces the air outlet end of the fan.
9. Ice cream machine with microfluidic heat dissipation channels according to claim 1, characterized in that: the refrigerating mechanism also comprises a cold guide block, a heat insulation plate and heat insulation cotton, wherein the outer wall of the refrigerating barrel and the cold end of the semiconductor refrigerator are both contacted with the cold guide block;
the semiconductor refrigerator is embedded in the heat insulation plate, and the side surface of the semiconductor refrigerator is surrounded by the heat insulation cotton;
the heat insulation plate is used for separating the cold conducting block from the heat dissipation device.
10. Ice cream machine with microfluidic heat dissipation channels according to claim 8, characterized in that: the semiconductor refrigerator and the fan are electrically connected with the controller of the main machine body, and the controller is used for performing linkage parallel control on the working voltage of the semiconductor refrigerator and the working voltage of the fan.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114847790A (en) * | 2022-05-17 | 2022-08-05 | 浙江大学台州研究院 | Energy-saving intelligent semiconductor heat pump toilet seat |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114847790A (en) * | 2022-05-17 | 2022-08-05 | 浙江大学台州研究院 | Energy-saving intelligent semiconductor heat pump toilet seat |
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