CN214414027U - Ice cream machine with uniform and rapid heat dissipation - Google Patents
Ice cream machine with uniform and rapid heat dissipation Download PDFInfo
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- CN214414027U CN214414027U CN202120417729.4U CN202120417729U CN214414027U CN 214414027 U CN214414027 U CN 214414027U CN 202120417729 U CN202120417729 U CN 202120417729U CN 214414027 U CN214414027 U CN 214414027U
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Abstract
The utility model discloses an even quick ice-cream machine dispels heat, including the host computer body and refrigeration mechanism, refrigeration mechanism includes semiconductor refrigerator and heat abstractor, and refrigeration mechanism includes semiconductor refrigerator and heat abstractor, heat abstractor includes mounting panel, an at least heat pipe and fin group, the evaporation pipeline section of heat pipe is fixed in a vertical face of mounting panel, the hot junction of semiconductor refrigerator with the evaporation pipeline section of heat pipe contacts. The ice cream machine capable of dissipating heat uniformly and quickly is directly combined into the heat dissipating device by the fin group and the heat pipe, so that the heat efficient transmission and heat exchange processes are completed, and the uniform and quick heat dissipation can be realized while the structural design advantages of the ice cream machine capable of dissipating heat in a small and compact manner are kept.
Description
Technical Field
The utility model relates to a semiconductor refrigeration technology field especially relates to an ice cream machine that heat dissipation is even quick.
Background
The semiconductor refrigeration technology has the characteristics of compact structure, small modularization, convenient control of cold quantity, no vibration during working, convenient movement and the like of a core refrigeration system, and is effectively utilized in small refrigeration appliance products such as semiconductor refrigeration wine cabinets, semiconductor refrigeration cabinets, cosmetic refrigeration cabinets and the like. With the continuous improvement of the technical level of semiconductor refrigeration, semiconductor refrigeration begins to extend to the application of products with refrigeration function requirements, and semiconductor refrigeration small ice cream makers are produced, for example, the technical schemes disclosed in the prior patents 200420021510.9 and 201710927314.X realize the production of DIY ice cream.
Different from mechanical pressing refrigeration, semiconductor refrigeration belongs to temperature difference refrigeration, the cold end refrigeration temperature of a refrigerator is closely related to the hot end temperature, and both the refrigeration quantity and the refrigeration depth are greatly influenced by heat dissipation of a hot end. The structure of the ice cream machine patent described above is known as follows: in order to ensure the miniaturization of the ice cream machine, the aluminum profile is adopted as the radiator at the hot end of the semiconductor refrigerator, and as the heat conductivity coefficient of the aluminum profile radiator is small (generally 150-230W/mk), the heat conduction resistance is large, and the temperature of the hot end is high, the refrigerating performance of the cold end of the refrigerator, such as refrigerating capacity, conversion efficiency and the like, is influenced. Therefore, if the heat dissipation performance is to be improved, the number of fins in the aluminum profile heat sink needs to be increased, which leads to the increase of the volume of the aluminum profile heat sink, and is contrary to the design requirements of compact structure and miniaturization of the ice cream machine, how to improve the refrigeration performance and realize uniform and rapid heat dissipation on the basis of ensuring the compact structure and miniaturization of the ice cream machine, and is a technical problem to be solved urgently by the semiconductor refrigeration ice cream machine at present.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an even quick ice-cream machine dispels heat, directly by fin group and heat pipe group synthetic heat abstractor, accomplish the high-efficient transmission of heat and heat transfer process, can realize the even quick of heat dissipation when keeping the ice-cream machine structural design advantage of the miniaturization and the compact of heat dissipation.
To achieve the purpose, the utility model adopts the following technical proposal:
an ice cream machine with uniform and rapid heat dissipation comprises a main machine body and a refrigerating mechanism, wherein the refrigerating mechanism is arranged inside the main machine body and comprises a semiconductor refrigerator and a heat dissipation device, the cold end of the semiconductor refrigerator is used for refrigerating a refrigerating barrel of the main machine body, and the hot end of the semiconductor refrigerator is in contact with the heat dissipation device;
the heat dissipation device comprises a mounting plate, at least one heat pipe and a fin group, wherein an evaporation pipe section of the heat pipe is fixed on one vertical plate surface of the mounting plate, the fin group comprises a plurality of fins which are uniformly arranged at intervals in the vertical direction, and a heat dissipation pipe section of the heat pipe is wound downwards to the other vertical plate surface of the mounting plate and then sequentially penetrates through all the fins upwards;
and the hot end of the semiconductor refrigerator is in contact with the evaporation pipe section of the heat pipe.
Preferably, the upper end of the evaporator section of the heat pipe is located below the upper end of the heat sink section of the heat pipe.
Preferably, the shape of the evaporation pipe section of the heat pipe comprises one or more combinations of a straight line type, an arc type, a wave type and an angle folding type.
Preferably, the mounting plate is provided with a limiting block, and the evaporation pipe section of the heat pipe is connected with the limiting block.
Preferably, the refrigeration mechanism further comprises a fan, and an air outlet end of the fan faces to the other plate surface of the mounting plate, which is opposite to the hot end of the semiconductor refrigerator.
Preferably, the refrigeration mechanism further comprises a partition plate and a fan outer cover, the fan outer cover is connected with the shell of the main machine body, the fan outer cover is provided with an air inlet and an air outlet, the air outlet is arranged on two sides of the air inlet, and a sealing surface is arranged between the air inlet and the air outlet;
the partition board is fixed on the closed surface so as to divide the interior of the fan outer cover into an air inlet cavity and an air outlet cavity, the fan is embedded in the partition board, the air inlet end of the fan is located in the air inlet cavity, and the air outlet end of the fan and the heat dissipation device are both located in the air outlet cavity.
Preferably, the refrigeration mechanism further comprises a cold guide block, and the outer wall of the refrigeration barrel and the cold end of the semiconductor refrigerator are respectively in contact with the cold guide block.
Preferably, the refrigeration mechanism further comprises a heat insulation plate and heat insulation cotton, the semiconductor refrigerator is embedded in the heat insulation plate, and the heat insulation cotton is surrounded on the side surface of the semiconductor refrigerator;
the heat insulation plate is used for separating the cold conducting block from the heat dissipation device.
Preferably, the semiconductor refrigerator and the fan are electrically connected to a controller of the main body, and the controller is configured to perform linked parallel control on the operating voltage of the semiconductor refrigerator and the operating voltage of the fan.
The ice cream machine with uniform and quick heat dissipation has the following beneficial effects:
in the ice cream machine with uniform and rapid heat dissipation, the heat dissipation device directly adopts the heat pipe to transmit heat, and then utilizes the fin group connected with the heat pipe to finish the efficient heat transmission and heat exchange processes, so that the heat at the hot end of the semiconductor refrigerator can be directly conducted to the fins, and the heat dissipation is quicker. And the heat dissipation pipe section of the heat pipe is wound downwards to the other vertical plate surface of the mounting plate and then upwards penetrates through all fins uniformly arranged at intervals in the vertical direction in sequence, the capillary force generated by the built-in liquid absorption core of the heat pipe is utilized to realize the antigravity, so that the heat is transferred to all the fins, the height of the heat dissipation device is not much different from that of the existing section bar heat radiator, the width of the heat dissipation device can be reduced, the heat exchange effect of the heat dissipation device can be greatly improved while the structural design advantages of the compact ice cream machine with the heat dissipation miniaturization are kept, the heat dissipation is uniform and rapid, and the ice cream making time is further shortened.
Drawings
The accompanying drawings are provided to further illustrate the present invention, but the content in the accompanying drawings does not constitute any limitation to the present invention.
Fig. 1 is a schematic structural diagram of an ice cream maker according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram i of a heat dissipation device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram ii of a heat dissipation device according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a fan housing according to an embodiment of the present invention;
fig. 5 is a top view of the internal structure of the ice cream maker according to one embodiment of the present invention.
Wherein: a main body 100; a refrigeration mechanism 200; a semiconductor refrigerator 1; a heat sink 2; a mounting plate 21; a stopper 211; a heat pipe 22; an evaporation tube section 221; a heat dissipation pipe section 222; the fins 23; a refrigerating barrel 3; a fan 4; a partition 5; a fan housing 6; an air inlet 61; an air outlet 62; a sealing surface 63; an air inlet chamber 64; an air outlet chamber 65; a cold conducting block 7; a heat insulating plate 8; heat insulation cotton 9; a housing 10.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial.
In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The ice cream machine of the present invention with uniform and rapid heat dissipation will be described with reference to the accompanying drawings and embodiments.
As shown in fig. 1, the ice cream maker with uniform and rapid heat dissipation of this embodiment includes a main body 100 and a refrigeration mechanism 200, wherein the refrigeration mechanism 200 is disposed inside the main body 100, the refrigeration mechanism 200 includes a semiconductor refrigerator 1 and a heat dissipation device 2, a cold end of the semiconductor refrigerator 1 is used for refrigerating a refrigeration barrel 3 of the main body 100, and a hot end of the semiconductor refrigerator 1 is in contact with the heat dissipation device 2;
as shown in fig. 2 and 3, the heat dissipation device 2 includes a mounting plate 21, at least one heat pipe 22, and a fin group, an evaporation pipe section 221 of the heat pipe 22 is fixed to one vertical plate surface of the mounting plate 21, the fin group includes a plurality of fins 23 uniformly arranged at intervals in the vertical direction, and a heat dissipation pipe section 222 of the heat pipe 22 winds down to the other vertical plate surface of the mounting plate 21 and then sequentially penetrates through all the fins 23 upward;
the hot end of the semiconductor cooler 1 is in contact with the evaporator tube section 221 of the heat pipe 22.
It should be understood that the ice cream machine with uniform and rapid heat dissipation is to refrigerate the refrigerating barrel 3 of the main body 100 through the semiconductor refrigerator 1 in the refrigerating mechanism 200, the semiconductor refrigerator 1(Thermoelectric Cooler, abbreviated as TEC) is a refrigerating device made by using Peltier effect of semiconductor materials, and the Peltier effect is a phenomenon that when a direct current passes through a couple pair composed of two semiconductor materials, one end of the direct current absorbs heat and the other end releases heat. Semiconductor cooler 1 includes a plurality of P-type and N-type electric couple pairs (groups) connected together by conductive electrodes and sandwiched between two thermally conductive and insulating materials such as ceramic substrates, and forms hot and cold sides on semiconductor cooler 1 under the peltier effect when an electric current flows through semiconductor cooler 1.
According to the semiconductor refrigeration theory, the refrigerating capacity Q of the semiconductor refrigerator 1cComprises the following steps:
Qc＝N(αp-αn)ITc-K(Th-Tc)-0.5I2Ri，
wherein N, alphap,αn,I,K,Th,Tc,RiThe number of p-n couple pairs of the semiconductor refrigerator 1, the p-type material Seebeck coefficient, the n-type material Seebeck coefficient, the operating current, the refrigerator thermal conductance, the hot end temperature, the cold end temperature and the refrigerator internal resistance, respectively, and the refrigeration coefficient (or called conversion efficiency) is cop Qc/PiIn which P isiThe power is input to semiconductor refrigerator 1, and it can be seen that the refrigerating capacity and refrigerating efficiency of semiconductor refrigerator 1 are equal to the hot end temperature T of semiconductor refrigerator 1hCorrelation, when other parameters are relatively fixed, ThThe smaller the temperature of the hot side of the semiconductor cooler 1, the lower the cooling capacity QcAnd the larger the cop, the better the refrigeration effect. Therefore, one of the technical solutions of increasing the refrigerating capacity of the ice cream machine, increasing the forming speed of ice cream production and shortening the production time is to reduce the hot end temperature T of the semiconductor refrigerator 1h. The present embodiment is based on the above principle, and improves the heat dissipation device 2 to overcome the problem of insufficient heat dissipation matching process between the heat dissipation device 2 of the existing ice cream machine and the semiconductor refrigerator 1.
To reduce the hot end temperature T of a semiconductor refrigerator 1hIt is necessary to reduce the thermal resistance between the hot end of the semiconductor cooler 1 and the ambient air, and since the area of the hot end of the semiconductor cooler 1 itself is small, the heat flux density is large. Therefore, it isIn the ice cream machine with uniform and rapid heat dissipation, the heat dissipation device 2 directly adopts the heat pipe 22 to transmit heat, and then utilizes the fin group connected with the heat pipe 22 (the connection between the fins 23 of the fin group and the heat pipe 22 can adopt expansion joint or welding and other modes) to finish the high-efficiency heat transmission and heat exchange processes, so that the heat at the hot end of the semiconductor refrigerator 1 can be directly conducted to the fins 23; the heat exchange area can be increased by increasing the number of the fins 23, and the heat exchange area of the fins 23 is far larger than that of the fins of the existing section bar radiator because the fins are single pieces; moreover, the heat dissipation pipe section 222 of the heat pipe 22 winds down to the other vertical plate surface of the mounting plate 21 and then sequentially penetrates through all the fins 23 uniformly arranged at intervals in the vertical direction, and the capillary force generated by the liquid absorption core built in the heat pipe 22 is utilized to realize counter-gravity, so that heat is transferred to all the fins 23, the height of the heat dissipation device 2 is not much different from that of the existing section bar heat sink, the width of the heat dissipation device can be reduced, the heat exchange effect of the heat dissipation device 2 can be greatly improved while the structural design advantages of the ice cream machine with miniaturized and compact heat dissipation are maintained, the heat dissipation is uniform and rapid, and the ice cream making time is further shortened.
It should be noted that the heat pipe 22 is an artificial component with excellent heat transfer performance, and the commonly used heat pipe 22 is composed of three parts: the main body is a closed metal tube, a small amount of working medium and capillary structures are arranged in the main body, and air and other impurities in the tube must be excluded. The heat pipe 22 operates using three physical principles: the boiling point of the liquid is reduced under the vacuum state A; b the latent heat of vaporization of the same substance is much higher than the sensible heat; the liquid can flow by the suction force of the porous capillary structure to the liquid.
Specifically, the upper end of the evaporation pipe section 221 of the heat pipe 22 is located below the upper end of the heat dissipation pipe section 222 of the heat pipe 22. Therefore, when the working medium in the heat pipe 22 absorbs heat and evaporates into gas during the operation of the heat pipe 22, the working medium gas gradually rises without being forced to settle and the like to damage the working efficiency, thereby fully ensuring the evaporation efficiency of the heat pipe 22.
Preferably, the shape of the evaporation pipe section 221 of the heat pipe 22 includes, but is not limited to, a straight line shape, an arc shape, a wave shape, and a folded angle shape, and optionally one or a combination of several shapes, the straight line shape facilitates the flow of the working medium, thereby increasing the heat exchange speed; the curved surface shapes such as arc, wave and bevel can further increase the contact area between the evaporation pipe section 221 of the heating pipe 22 and the hot end of the semiconductor refrigerator 1, and increase the heat exchange amount.
Further, as shown in fig. 2, the mounting plate 21 is provided with a limiting block 211, and the evaporation pipe section 221 of the heat pipe 22 is connected to the limiting block 211. The position of stopper 211 is used for the evaporation tube section 221 of fixed heat pipe 22, avoids taking place the aversion in the use, and the connected mode can be modes such as joint, welding or screw fixation.
Furthermore, as shown in fig. 1, the refrigeration mechanism 200 further includes a fan 4, and an air outlet end of the fan 4 faces to another plate surface of the mounting plate 21, which is away from the hot end of the semiconductor refrigerator 1. The fan 4 is used for blowing heat emitted by the fins 23 of the heat dissipation device 2 to the surrounding environment, so that the heat exchange effect is improved.
Optionally, as shown in fig. 1, the refrigeration mechanism 200 further includes a partition 5 and a fan housing 6, the fan housing 6 is connected to the housing 10 of the main body 100, as shown in fig. 4, the fan housing 6 is provided with an air inlet 61 and an air outlet 62, the air outlet 62 is disposed at two sides of the air inlet 61, and a sealing surface 63 is disposed between the air inlet 61 and the air outlet 62;
the partition plate 5 is fixed to the sealing surface 63 so as to divide the interior of the fan housing 6 into an air inlet chamber 64 and an air outlet chamber 65, as shown in fig. 5, the fan 4 is embedded in the partition plate 5, the air inlet end of the fan 4 is located in the air inlet chamber 64, and the air outlet end of the fan 4 and the heat dissipation device 2 are both located in the air outlet chamber 65.
The miniaturized semiconductor refrigeration ice cream machine has small volume and compact structure, and is easy to cause thermal short circuit of air inlet and outlet flows, including an internal thermal short circuit, an external thermal short circuit and the like, so that the heat exchange effect is influenced. For this reason, based on hot air density is little, and the characteristics that rise resistance is little are compared to colder air, the utility model provides a cold, hot disconnect-type air current structural design. The heat exchange efficiency of the semiconductor refrigeration ice cream machine with the small and compact structure is effectively separated by the aid of the two independent closed structures, namely the fan 4, the partition plate 5 and the fan outer cover 6 form the air inlet cavity 64 with the closed structure at the air inlet 61 capable of entering cold air flow, the air outlet cavity 65 with the closed structure is formed between the partition plate 5 and the heat dissipation device 2 at the air outlet 62 for hot air outflow, and the cold air flow and the hot air flow are separated by the partition plate 5, so that the problem of reduction of the heat exchange efficiency caused by air short circuit is solved by means of the conduction characteristics of low hot air flow density and small upward conduction resistance of the air outlet 62 and the unique circulating air flow field, the heat exchange effect of the heat dissipation device 2 is improved, and the refrigeration performance of the semiconductor refrigeration device 1 is further improved. The ice cream forming mechanism is that when the temperature of ice cream food is reduced to a certain temperature value (such as-10 ℃), the tension between the food materials is large enough, so that air stirred into the food materials through the stirring rod can be wrapped, the food materials are puffed and formed, cold air and hot air are effectively separated, the cold production capacity of the semiconductor refrigerator 1 can be further improved, the time for the food materials to reach the rated puffing temperature is shortened, the ice cream forming and manufacturing time is further shortened, and the ice cream manufacturing effect is further improved.
More optionally, the refrigeration mechanism 200 further includes a cold guide block 7, and the outer wall of the refrigeration barrel 3 and the cold end of the semiconductor refrigerator 1 are respectively in contact with the cold guide block 7. One end of the cold guide block 7 is in contact with the cold end of the semiconductor refrigerator 1, and the other end of the cold guide block is in contact with the outer wall of the refrigerating barrel 3, so that cold energy of the cold end of the semiconductor refrigerator 1 is transmitted to the refrigerating barrel 3, and then is further transmitted to ice cream food materials in the barrel by the refrigerating barrel 3.
In order to avoid the loss of cold energy, the semiconductor refrigerator 1 can be embedded in the thermal insulation plate 8 for separating the cold guide block 7 and the heat dissipation device 2, so that the loss of cold energy from the refrigerating barrel 3 to the environment is reduced, the refrigerating effect of the ice cream machine is further improved, and the manufacturing time is shortened.
In order to reduce heat loss and improve heat transfer efficiency, heat insulation cotton 9 is further arranged between the cold guide block 7 and the heat dissipation device 2, the cold end of the semiconductor refrigerator 1 is sealed between the cold guide block 7 and the heat dissipation device 2 through the heat insulation cotton 9, the heat insulation cotton 9 is surrounded on the side face of the semiconductor refrigerator 1, the cold end of the semiconductor refrigerator 1 is enabled to work in a closed environment, isolation from the surrounding air environment is achieved, heat loss caused by heat exchange between the cold end of the semiconductor refrigerator 1 and the surrounding air can be avoided, and moisture can be prevented from entering the semiconductor refrigerator 1 to cause reduction of refrigeration performance of the semiconductor refrigerator 1. Alternatively, the two ends of the semiconductor refrigerator 1 may be attached with the heat insulation cotton 9, and the peripheries of the semiconductor refrigerator 1 and the heat insulation cotton 9 may be covered with the silica gel.
Preferably, the semiconductor refrigerator 1 and the fan 4 are electrically connected to a controller of the main body 100, and the controller is configured to perform linked parallel control on the operating voltage of the semiconductor refrigerator 1 and the operating voltage of the fan 4.
The controller of the main body 100 is used to control the start and stop of the semiconductor refrigerator 1 and the start and stop of the fan 4, and a microcontroller, such as a single chip microcomputer, commonly used in the art can be used. The controller carries out linkage parallel control on the working voltage of the semiconductor refrigerator 1 and the working voltage of the fan 4, and can realize the matching of the heat production quantity of the fan 4 and the semiconductor refrigerator 1, namely the working voltage of the semiconductor refrigerator 1 is large, the refrigerating capacity is large, the corresponding heat production quantity is also large, and therefore the rotating speed of the fan 4 is required to be high, and the air quantity is large. Because the fan 4 is connected with the semiconductor refrigerator 1 in parallel, the corresponding working voltage is also high, and at the moment, the heat dissipation air quantity is large, and the heat dissipation effect is good. Along with the ice cream preparation completion, semiconductor refrigerator 1 gets into cold insulation state, and the operating voltage of semiconductor refrigerator 1 descends, and the electric power of input reduces, the heat of output also correspondingly reduces, and at this moment, the amount of wind of fan 4 also correspondingly reduces, and the rotational speed also reduces, and the noise reduces correspondingly, can prolong the life of fan 4.
As will be understood by those skilled in the art, the main body 100 further includes a stirring device covering the upper portion of the cooling tub 3, and the stirring device extends into the cooling tub 3 through a stirring rod to stir the ice cream material. Other configurations and the like and operation of the ice cream maker according to the present embodiment are known to those skilled in the art and will not be described in detail herein.
The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.
Claims (9)
1. The utility model provides an ice-cream machine that heat dissipation is even quick, includes the host computer body and refrigeration mechanism, refrigeration mechanism set up in the inside of the host computer body, its characterized in that: the refrigerating mechanism comprises a semiconductor refrigerator and a heat radiating device, wherein the cold end of the semiconductor refrigerator is used for refrigerating a refrigerating barrel of the main machine body, and the hot end of the semiconductor refrigerator is in contact with the heat radiating device;
the heat dissipation device comprises a mounting plate, at least one heat pipe and a fin group, wherein an evaporation pipe section of the heat pipe is fixed on one vertical plate surface of the mounting plate, the fin group comprises a plurality of fins which are uniformly arranged at intervals in the vertical direction, and a heat dissipation pipe section of the heat pipe is wound downwards to the other vertical plate surface of the mounting plate and then sequentially penetrates through all the fins upwards;
and the hot end of the semiconductor refrigerator is in contact with the evaporation pipe section of the heat pipe.
2. An ice cream machine with uniform and rapid heat dissipation according to claim 1, wherein: the upper end part of the evaporation pipe section of the heat pipe is positioned below the upper end part of the heat dissipation pipe section of the heat pipe.
3. An ice cream machine with uniform and rapid heat dissipation according to claim 1, wherein: the shape of the evaporation pipe section of the heat pipe comprises one or more combinations of a linear type, an arc type, a wave type and a folded angle type.
4. An ice cream machine with uniform and rapid heat dissipation according to claim 1, wherein: the mounting panel is equipped with the stopper, the evaporation pipeline section of heat pipe with the stopper is connected.
5. An ice cream machine with uniform and rapid heat dissipation according to claim 1, wherein: the refrigerating mechanism further comprises a fan, and the air outlet end of the fan faces to the other plate surface, which is opposite to the hot end of the semiconductor refrigerator, in the mounting plate.
6. An ice cream machine with uniform and rapid heat dissipation according to claim 5, wherein: the refrigerating mechanism also comprises a partition plate and a fan outer cover, the fan outer cover is connected with the shell of the main machine body, the fan outer cover is provided with an air inlet and an air outlet, the air outlet is arranged on two sides of the air inlet, and a sealing surface is arranged between the air inlet and the air outlet;
the partition board is fixed on the closed surface so as to divide the interior of the fan outer cover into an air inlet cavity and an air outlet cavity, the fan is embedded in the partition board, the air inlet end of the fan is located in the air inlet cavity, and the air outlet end of the fan and the heat dissipation device are both located in the air outlet cavity.
7. An ice cream machine with uniform and rapid heat dissipation according to claim 1, wherein: the refrigerating mechanism further comprises a cold guide block, and the outer wall of the refrigerating barrel and the cold end of the semiconductor refrigerator are respectively in contact with the cold guide block.
8. An ice cream machine with uniform and rapid heat dissipation according to claim 7, wherein: the refrigerating mechanism further comprises a heat insulation plate and heat insulation cotton, the semiconductor refrigerator is embedded in the heat insulation plate, and the heat insulation cotton is surrounded on the side face of the semiconductor refrigerator;
the heat insulation plate is used for separating the cold conducting block from the heat dissipation device.
9. An ice cream machine with uniform and rapid heat dissipation according to claim 5, wherein: the semiconductor refrigerator and the fan are electrically connected with the controller of the main machine body, and the controller is used for performing linkage parallel control on the working voltage of the semiconductor refrigerator and the working voltage of the fan.
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| CN202120417729.4U CN214414027U (en) | 2021-02-25 | 2021-02-25 | Ice cream machine with uniform and rapid heat dissipation |
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| CN202120417729.4U CN214414027U (en) | 2021-02-25 | 2021-02-25 | Ice cream machine with uniform and rapid heat dissipation |
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