CN214841901U - Semiconductor refrigeration medicine storage box - Google Patents
Semiconductor refrigeration medicine storage box Download PDFInfo
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- CN214841901U CN214841901U CN202121444394.1U CN202121444394U CN214841901U CN 214841901 U CN214841901 U CN 214841901U CN 202121444394 U CN202121444394 U CN 202121444394U CN 214841901 U CN214841901 U CN 214841901U
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Abstract
The utility model discloses a semiconductor refrigeration medicine storage box, which comprises a foaming box body, a semiconductor refrigeration system arranged on the foaming box body and a humidity sensor used for detecting the humidity inside the foaming box body; the foaming box body is provided with a control system and an internal circulation dehumidification system; the control system is used for comparing the humidity inside the foaming box body with the stored humidity and triggering the internal circulation dehumidification system to be opened or closed based on the comparison result; the internal circulation dehumidification system comprises an internal circulation air duct; an air inlet fan is arranged at an air inlet of the internal circulation air duct, an air return fan is arranged at an air outlet of the internal circulation air duct, and the air inlet and the air outlet are both communicated with the foaming box body; the inner circulation air duct is provided with a dehumidification component, and a condensation fin of the dehumidification component is embedded in the inner circulation air duct; the internal circulation air duct is provided with a water nozzle which is communicated with a drain pipe; the internal circulation air duct is provided with a heat preservation piece. The utility model discloses an inner loop dehumidification system circulation dehumidification to solve the inside high humidity's of medicine storage box problem, guarantee medicine low temperature drying's storage environment.
Description
Technical Field
The utility model relates to a semiconductor refrigeration technology field especially relates to a semiconductor refrigeration medicine storage box.
Background
As semiconductor refrigeration technology is known and appreciated by more and more people, the application of semiconductors in terminal products is also more and more extensive. The semiconductor refrigeration technology has the characteristics of small volume, compact structure, no vibration, environmental protection, silence, accurate temperature control, convenient installation and the like, and the current semiconductor terminal application products comprise products such as a refrigerator, a wine cabinet, a cosmetic box, an ice cream machine, a dehumidifier, a beer machine, a cooling and heating mattress and the like.
Present semiconductor fridge when operating condition, the humidity in the internal space of box can rise along with going on of time, its main reason is because, after the temperature of box the inside reached the settlement temperature, get into the heat preservation state, control system can start PID control mode, the operating voltage of whole core refrigeration module can reduce, refrigerating system's refrigerating output also can descend thereupon, original refrigerating system's moisture extraction capacity descends, the water secondary evaporation of condensation on the cold junction fin leads to the humidity in the box to rise.
With the continuous expansion of semiconductor refrigeration technology, some special application occasions need to apply the semiconductor refrigeration technology, for example, some special medicines need to be stored in a low-temperature dry environment, and the medicines need to be stored in a semiconductor refrigeration medicine storage box. Because the semiconductor fridge is at whole course of work, get into the mode that keeps warm after, humidity in the box can continuously rise, in addition when the ambient humidity is very high, in case open the medicine storage chamber door, inside highly humid air will get into the box, in order to satisfy the low temperature dry storage environment of medicine, just must solve the inside high humidity problem of box, dehumidify through effectual means.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to the defect in the background art, provide a semiconductor refrigeration medicine storage box, through the circulation dehumidification of inner loop dehumidification system to solve the inside high humidity's of medicine storage box problem, guarantee medicine low temperature drying's storage environment.
In order to solve the above problem, the utility model discloses realize according to following technical scheme:
the utility model relates to a semiconductor refrigeration medicine storage box, which comprises a foaming box body, a semiconductor refrigeration system arranged on the foaming box body and a humidity sensor used for detecting the humidity inside the foaming box body, wherein the foaming box body is provided with a control system and an internal circulation dehumidification system;
the control system is used for comparing the humidity inside the foaming box body with the stored humidity and triggering the internal circulation dehumidification system to be turned on or turned off based on the comparison result;
the internal circulation dehumidification system comprises an internal circulation air duct;
an air inlet fan is arranged at an air inlet of the internal circulation air channel, an air return fan is arranged at an air outlet of the internal circulation air channel, and the air inlet and the air outlet are both communicated with the foaming box body;
the inner circulation air duct is provided with a dehumidification component, and a condensation fin of the dehumidification component is embedded in the inner circulation air duct;
the internal circulation air duct is provided with a water nozzle which is communicated with a drain pipe.
Preferably, the internal circulation air duct is provided with a heat preservation piece, and the heat preservation piece is installed on the outer wall and/or the inner wall of the internal circulation air duct.
Preferably, the dehumidifying component comprises the condensing fin, the semiconductor refrigerating chip and a hot end radiator;
the condensation fins are embedded into the internal circulation air duct through a combined machine wire;
the condensation fin is connected with the cold end face of the semiconductor refrigeration chip, and the hot end radiator is connected with the hot end face of the semiconductor refrigeration chip.
Preferably, heat insulation cotton is arranged between the condensation fin and the cold end face of the semiconductor refrigeration chip;
the heat insulation cotton is attached to the cold end face of the semiconductor refrigeration chip in a surrounding mode.
Preferably, the inner loop wind channel is provided with non return portion, non return portion undercut forms the drainage chamber, the water injection well choke set up in the bottom in drainage chamber, just the water injection well choke is external the drain pipe.
Preferably, the internal circulation air duct comprises a first air duct and a second air duct, the connecting corner of the first air duct and the second air duct is provided with the non-return part, and one end of the drainage cavity of the non-return part is obliquely connected with the second air duct.
Preferably, the first air duct is a falling trend air duct, and the first air duct is perpendicular to the second air duct.
The condensation fin is installed in first wind channel and is located drainage chamber top.
Preferably, the foaming box body is also provided with a water receiving tray;
the drain pipe is connected to the water pan.
Preferably, the hot end radiator is provided with a radiating fan.
Preferably, the foaming box body is further provided with a power panel, and the power panel is respectively connected with the humidity sensor, the semiconductor refrigeration system, the control system and the internal circulation dehumidification system.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model has the advantages that the humidity sensor, the control system and the internal circulation dehumidification system are arranged, the humidity sensor is utilized to detect the humidity inside the box body, and the control system judges whether to open the internal circulation dehumidification system according to the humidity so as to accurately and circularly maintain the dry and low-temperature environment inside the box body;
2. the utility model is provided with the heat preservation member in the internal circulation air duct, so as to avoid the temperature of the cold air returning to the foaming box body after passing through the internal circulation air duct from being raised, thus leading to the temperature rise in the foaming box body, and ensure that the cold energy of the cold air passing through the internal circulation air duct can not be dissipated by utilizing the heat preservation member;
3. the utility model discloses a set up the drainage chamber in the inner loop wind channel, utilize the drainage chamber to drain away the comdenstion water after being dehumidified the subassembly condensation, avoid the comdenstion water backward flow to get into the foaming box.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only the embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts. Wherein:
FIG. 1 is an exploded schematic view of a semiconductor refrigerated drug storage case according to one embodiment of the present invention;
FIG. 2 is a schematic view of the dehumidifying wind direction flow of the foaming box and the internal circulation dehumidifying system according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an internal circulation air duct according to an embodiment of the present invention;
FIG. 4 is a schematic structural view of a dehumidification assembly of an embodiment of the present invention;
fig. 5 is a schematic side view of an internal circulation air duct (visible drainage chamber) according to an embodiment of the present invention;
fig. 6 is a schematic structural view of the heat insulating member of an embodiment of the present invention mounted on the outer wall of the internal circulation air duct;
fig. 7 is a schematic structural view of the heat insulating member according to an embodiment of the present invention mounted on the inner wall of the internal circulation duct.
Wherein: foaming box 1, door body 2, semiconductor refrigerating system 3, control system 4, internal circulation dehumidification system 5, internal circulation wind channel 51, first wind channel 52, second wind channel 53, air inlet fan 54, return air fan 55, dehumidification subassembly 56, combination machine 561, condensation fin 562, thermal-insulated cotton 563, semiconductor refrigeration chip 564, hot junction radiator 565, radiator fan 566, drainage chamber 57, water injection well choke 58, heat preservation piece 59, drain pipe 6, water collector 7, power strip 8.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only for the purpose of illustrating and explaining the present invention, and are not to be considered as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience of description of the present invention and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the prior art, in the whole working process of the semiconductor refrigeration medicine storage box, after the semiconductor refrigeration medicine storage box enters a heat preservation mode, the humidity in the box body can continuously rise, in addition, when the environmental humidity is very high, once a medicine storage box door is opened, high-humidity air can enter the box body, in order to meet the low-temperature dry storage environment of medicines, the problem of high humidity in the box body needs to be solved, dehumidification is carried out through an effective means, in order to solve the problem, the application provides the semiconductor refrigeration medicine storage box, as shown in fig. 1, which specifically comprises a foaming box body 1, a semiconductor refrigeration system 3 installed on the foaming box body 1 and a humidity sensor used for detecting the humidity in the foaming box body 1, wherein the foaming box body 1 is provided with a control system 4 and an internal circulation dehumidification system 5;
the control system 4 is used for comparing the humidity inside the foaming box body 1 with the stored humidity and triggering the internal circulation dehumidification system 5 to be turned on or turned off based on the comparison result;
in this embodiment, the foaming box 1 is provided with the door body 2 for the switching foaming box 1, semiconductor refrigerating system 3 is used for giving foaming box 1 provides refrigeration, humidity transducer is used for detecting the inside humidity of foaming box 1 to with the inside humidity of the foaming box 1 that detects send to control system 4, control system 4 is used for comparing the inside humidity of foaming box 1 and storage humidity (the best storage humidity of medicine), trigger based on the comparison result the internal circulation dehumidification system 5 opens or closes, here can be specifically understood as before semiconductor refrigeration medicine storage box does not reach the settlement temperature, whole machine full power operation, semiconductor refrigerating system 3's refrigerating capacity is big, and dehumidification effect is better, and foaming box 1 inside humidity is lower relatively, does not open internal circulation dehumidification system 5, along with the progress of refrigeration time, the inside of the foaming box body 1 reaches a set temperature and enters a heat preservation state, the working voltage of the semiconductor refrigeration system 3 is reduced, the power is reduced, the refrigeration capacity is reduced, the dehumidification capacity is reduced, water condensed by the semiconductor refrigeration system 3 is evaporated again, the humidity in the foaming box body 1 is slowly increased, when the humidity in the foaming box body 1 is higher than the storage humidity, the control system 4 triggers the internal circulation dehumidification system 5 to be started, and the internal circulation dehumidification system 5 performs initial drying on the inside of the foaming box body 1; when the humidity inside the foaming box body 1 is lower than the storage humidity (which can be set to be lower than other self-set humidity), the control system 4 triggers the internal circulation dehumidification system 5 to close, the internal circulation dehumidification system 5 stops working, and the operation is repeated in such a way, so as to realize a low-temperature drying environment inside the foaming box body 1;
it should be noted that, the setting of the storage humidity in this embodiment may be set by the user, or the default storage humidity of this apparatus may be used; further, in this embodiment, the logic for comparing the humidity inside the foaming box 1 with the stored humidity is the logic function of the control system 4, and the triggering logic for triggering the opening and closing of the internal circulation dehumidification system 5 based on the comparison result is also the logic function of the control system 4.
As shown in fig. 3, the internal circulation dehumidification system 5 includes an internal circulation air duct 51;
an air inlet fan 54 is arranged at an air inlet of the internal circulation air duct 51, an air return fan 55 is arranged at an air outlet of the internal circulation air duct, and the air inlet and the air outlet are both communicated with the foaming box body 1;
the inner circulation air duct 51 is provided with a dehumidifying component 56, and a condensing fin 562 of the dehumidifying component 56 is embedded in the inner circulation air duct 51;
the internal circulation air duct 51 is provided with a water nozzle 58, and the water nozzle 58 is communicated with the drain pipe 6;
the internal circulation duct 51 is provided with a heat insulating member 59.
Further, in this embodiment, as shown in fig. 2, the internal circulation dehumidification system 5 includes the internal circulation air duct 51, the internal circulation air duct 51 is provided with an air inlet and an air return opening, the air inlet and the air outlet are both communicated with the foaming box 1, the air inlet is provided with the air inlet fan 54, the air return opening is provided with the air return fan 55, when the internal circulation dehumidification system 5 is turned on, the air inlet fan 54 is turned on to suck the high-humidity cold air in the foaming box 1 into the internal circulation air duct 51, and after dehumidification of the internal circulation air duct 51, the dehumidified cold air is returned to the inside of the foaming box 1 by the air return fan 55 to complete circulation;
further, in this embodiment, the process of dehumidifying the high-humidity cold air by the internal circulation air duct 51 includes dehumidifying by the dehumidifying component 56, specifically: the condensation fins 562 of the dehumidification component 56 are embedded in the internal circulation air duct 51, and condensation and drying are performed by using high-humidity cold air in the internal circulation air duct 51;
further, after the high-humidity cold air passing through the internal circulation air duct 51 is condensed by the condensing fins 562, condensed water is generated, and the condensed water flows into the drain pipe 6 from the water nozzle 58 and is drained through the drain pipe 6;
further, after the internal circulation dehumidification system 5 is opened, the cold air in the foaming box body 1 is pumped into the internal circulation air duct 51 and returns to the inside of the foaming box body 1 after dehumidification, so that in order to avoid dehumidification and drying, the cold air does not cause the temperature in the foaming box body 1 to not rise after returning to the inside of the foaming box body 1 again, the internal circulation air duct 51 needs to be insulated, and the internal circulation air duct 51 is provided with an insulation piece 59.
Preferably, as shown in fig. 6 and 7, the heat insulating member 59 is mounted on the outer wall and/or the inner wall of the internal circulation duct 51.
In this embodiment, the heat insulating member 59 may be installed on the outer wall of the internal circulation duct 51, such that the heat insulating member 59 covers the outer wall surface of the internal circulation duct 51; furthermore, the heat insulating member 59 may also be mounted on the inner wall of the internal circulation air duct 51, so that the heat insulating member 59 is attached to the inner wall of the internal circulation air duct 51;
the heat insulating member 59 in this embodiment may be heat insulating cotton, heat insulating foam, or a heat insulating material product such as heat insulating clothes.
Preferably, as shown in fig. 4, the dehumidifying component 56 includes the condensing fins 562, a semiconductor refrigeration chip 564 and a hot-side heat sink 565;
the condensation fins 562 are embedded into the internal circulation air duct 51 through a combiner wire 561;
the condensation fins 562 are connected to the cold end surface of the semiconductor refrigeration chip 564, and the hot end heat sink 565 is connected to the hot end surface of the semiconductor refrigeration chip 564.
In this embodiment, through a semiconductor refrigeration technology, after the semiconductor refrigeration chip 564 is powered on to operate, the temperature of one end of the semiconductor refrigeration chip 564 is decreased, the temperature of the other end is increased, the temperature of the other end is a hot end surface, heat is exchanged and dissipated through the hot end heat sink 565, so that cold is transferred to the condensation fins 562, the temperature of the condensation fins 562 is decreased, and when the high-temperature and high-humidity gas in the internal circulation air duct 51 passes through the condensation fins 562, condensation occurs, and a dehumidification effect is achieved.
the heat insulation cotton 563 is attached to the cold end face of the semiconductor refrigeration chip 564 in a surrounding manner.
In this embodiment, the semiconductor refrigeration chip 564 is provided with a cold end surface and a hot end surface, the hot end surface dissipates heat through the hot end heat sink 565, and cold is transferred to the condensation fin 562, but since the semiconductor refrigeration chip 564 is only clamped and mounted between the condensation fin 562 and the hot end heat sink 565, and the cold end surface and the hot end surface of the semiconductor refrigeration chip 564 are close to each other, heat at the hot end surface escapes to the cold end surface, so that the temperature of the condensation fin 562 is increased, the heat insulation cotton 563 is mounted between the condensation fin 562 and the cold end surface of the semiconductor refrigeration chip 564, and the heat dissipated at the hot end surface is separated by the heat insulation cotton 563;
further, in order to avoid thermal-insulated cotton 563 also will when isolated loss heat the cold terminal surface of semiconductor refrigeration chip 564 transmits for cold volume of condensation fin 562 is isolated, this application adopts the thermal-insulated cotton 563 of surrounding type structure, encircles thermal-insulated cotton 563 and sets up in the edge of cold terminal surface for the middle part of cold terminal surface is left and is had great area of contact and condensation fin 562 contact, guarantees the transmission of cold volume.
Preferably, as shown in fig. 5, the internal circulation air duct 51 is provided with a non-return portion, the non-return portion is recessed downward to form a drainage cavity 57, the water nozzle 58 is arranged at the bottom of the drainage cavity 57, and the water nozzle 58 is externally connected with the drainage pipe 6.
After the high wet gas of fever got into inner loop wind channel 51, through condensation of condensation fin 562, can form the comdenstion water, drips on inner loop wind channel 51, after operating time has been of a specified duration, the comdenstion water can be more and more, can follow inner loop wind channel 51 flows back and goes into in the foaming box 1, in order to avoid the emergence of above-mentioned condition, this application is in inner loop wind channel 51 has set up the non return portion, utilizes the non return portion forms the drainage chamber 57 of undercut and accepts the comdenstion water that drips, simultaneously water injection well 58 is seted up to the bottom of drainage chamber 57 water injection well choke 58 utilizes water injection well choke 58 and drain pipe 6 to drain away the comdenstion water in the drainage chamber 57.
Preferably, the internal circulation air duct 51 includes a first air duct 52 and a second air duct 53, the joint corner of the first air duct 52 and the second air duct 53 is provided with the non-return portion, and one end of the drainage cavity 57 of the non-return portion is obliquely jointed with the second air duct 53.
Preferably, the first air duct 52 is a falling trend air duct;
the first air duct 52 is perpendicular to the second air duct 53.
The condensation fins 562 are installed on the first air duct 52 and located above the drain chamber 57.
Further, in the present embodiment, the internal circulation air duct 51 is divided into a first air duct 52 and a second air duct 53, and the first air duct 52 presents a falling trend air duct, that is, high-temperature and high-humidity air flows down along the first air duct 52 to the second air duct 53; the second air duct 53 is configured as a transverse trend air duct in this embodiment, and is perpendicular to the first air duct 52, so that the first air duct 52 and the second air duct 53 can form a corner, and the non-return portion is convenient to be disposed at the corner, it should be noted that the first air duct 52 is perpendicular to the second air duct 53 is a preferred embodiment of this application, and in other embodiments, the corner angle between the first air duct 52 and the second air duct 53 can be set to be not less than 60 ° and not more than 120 °.
Further, the optimal position of the drainage cavity 57 of the non-return part is located at the corner of the first air duct 52 and the second air duct 53, and meanwhile, the condensing fin 562 is located at the upper part of the drainage cavity 57, so that condensed water can drip to the drainage cavity 57;
further, one end of the drain chamber 57 is obliquely connected to the second air duct 53, so that the condensed and dried air can smoothly transit into the second air duct 53 after passing through the corner.
Preferably, the foaming box body 1 is also provided with a water receiving tray 7;
the drain pipe 6 is connected to the drip tray 7.
The water pan 7 is used for receiving the condensed water discharged by the drain pipe 6, the water pan 7 in this embodiment is detachably mounted on the foaming box body 1, and when the water pan 7 is full of water, the water pan 7 can be detached to pour the water out, and then the water pan is mounted on the foaming box body 1.
Preferably, the hot-side heat sink 565 is provided with a heat dissipation fan 566.
In this embodiment, the hot-side heat sink 565 exchanges heat away from the semiconductor refrigeration chip 564, and in order to improve the heat exchange effect, the hot-side heat sink 565 is provided with a heat dissipation fan 566.
Preferably, the foaming box 1 is further provided with a power panel 8, and the power panel 8 is connected with the humidity sensor, the semiconductor refrigeration system 3, the control system 4 and the internal circulation dehumidification system 5 and provides electric power support.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, so that any modification, equivalent change and modification made by the technical spirit of the present invention to the above embodiments do not depart from the technical solution of the present invention, and still fall within the scope of the technical solution of the present invention.
Claims (10)
1. A semiconductor refrigeration medicine storage box comprises a foaming box body, a semiconductor refrigeration system arranged on the foaming box body and a humidity sensor used for detecting the humidity in the foaming box body;
the foaming box body is provided with a control system and an internal circulation dehumidification system;
the control system is used for comparing the humidity inside the foaming box body with the stored humidity and triggering the internal circulation dehumidification system to be turned on or turned off based on the comparison result;
the method is characterized in that:
the internal circulation dehumidification system comprises an internal circulation air duct;
an air inlet fan is arranged at an air inlet of the internal circulation air channel, an air return fan is arranged at an air outlet of the internal circulation air channel, and the air inlet and the air outlet are both communicated with the foaming box body;
the inner circulation air duct is provided with a dehumidification component, and a condensation fin of the dehumidification component is embedded in the inner circulation air duct;
the internal circulation air duct is provided with a water nozzle which is communicated with a drain pipe.
2. A semiconductor refrigerated drug storage case of claim 1 wherein:
the internal circulation air duct is provided with a heat insulation piece;
the heat insulation piece is arranged on the outer wall and/or the inner wall of the internal circulation air duct.
3. A semiconductor refrigerated drug storage case of claim 1 wherein:
the dehumidification assembly comprises the condensation fin, a semiconductor refrigeration chip and a hot end radiator;
the condensation fins are embedded into the internal circulation air duct through a combined machine wire;
the condensation fin is connected with the cold end face of the semiconductor refrigeration chip, and the hot end radiator is connected with the hot end face of the semiconductor refrigeration chip.
4. A semiconductor refrigerated drug storage case of claim 3 wherein:
heat insulation cotton is arranged between the condensation fin and the cold end surface of the semiconductor refrigeration chip;
the heat insulation cotton is attached to the cold end face of the semiconductor refrigeration chip in a surrounding mode.
5. A semiconductor refrigerated drug storage case of claim 1 wherein:
the internal circulation air duct is provided with non return portion, non return portion undercut forms the drainage chamber, the water injection well choke set up in the bottom in drainage chamber, just the water injection well choke is external the drain pipe.
6. A semiconductor refrigerated drug storage case of claim 5 wherein:
the internal circulation air duct comprises a first air duct and a second air duct, the first air duct is provided with the non-return part at the joint corner of the second air duct, and the non-return part is obliquely jointed with one end of the drainage cavity.
7. A semiconductor refrigerated drug storage case of claim 6 wherein:
the first air duct is a falling trend air duct, and the first air duct is vertical to the second air duct;
the condensation fin is installed in first wind channel and is located drainage chamber top.
8. A semiconductor refrigerated drug storage case of claim 1 wherein:
the foaming box body is also provided with a water receiving disc;
the drain pipe is connected to the water pan.
9. A semiconductor refrigerated drug storage case of claim 3 wherein:
and the hot end radiator is provided with a radiating fan.
10. A semiconductor refrigerated drug storage case of claim 1 wherein:
the foaming box body is further provided with a power panel, and the power panel is respectively connected with the humidity sensor, the semiconductor refrigeration system, the control system and the internal circulation dehumidification system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121444394.1U CN214841901U (en) | 2021-06-28 | 2021-06-28 | Semiconductor refrigeration medicine storage box |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121444394.1U CN214841901U (en) | 2021-06-28 | 2021-06-28 | Semiconductor refrigeration medicine storage box |
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| CN214841901U true CN214841901U (en) | 2021-11-23 |
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| CN202121444394.1U Active CN214841901U (en) | 2021-06-28 | 2021-06-28 | Semiconductor refrigeration medicine storage box |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114294752A (en) * | 2022-03-10 | 2022-04-08 | 天津中科先进技术研究院有限公司 | Circulating ventilation structure and capsule-shaped rescue cabinet |
| CN114521795A (en) * | 2022-02-08 | 2022-05-24 | 普沃思环保科技无锡有限公司 | Storage chamber with dehumidification drying function |
-
2021
- 2021-06-28 CN CN202121444394.1U patent/CN214841901U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114521795A (en) * | 2022-02-08 | 2022-05-24 | 普沃思环保科技无锡有限公司 | Storage chamber with dehumidification drying function |
| CN114294752A (en) * | 2022-03-10 | 2022-04-08 | 天津中科先进技术研究院有限公司 | Circulating ventilation structure and capsule-shaped rescue cabinet |
| CN114294752B (en) * | 2022-03-10 | 2022-07-12 | 天津中科先进技术产业有限公司 | Circulating ventilation structure and capsule-shaped rescue cabinet |
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