CN101206085A - Direct freezing type semiconductor refrigeration device - Google Patents
Direct freezing type semiconductor refrigeration device Download PDFInfo
- Publication number
- CN101206085A CN101206085A CNA2006101242499A CN200610124249A CN101206085A CN 101206085 A CN101206085 A CN 101206085A CN A2006101242499 A CNA2006101242499 A CN A2006101242499A CN 200610124249 A CN200610124249 A CN 200610124249A CN 101206085 A CN101206085 A CN 101206085A
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- CN
- China
- Prior art keywords
- type semiconductor
- semiconductor refrigeration
- cold
- refrigeration device
- freezing type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to a straight cold type semiconductor refrigeration plant comprising an insulating layer (6), a box body (1), a radiator (2), a radiating fan (20), a refrigeration chip (3) and a refrigeration block (4); the invention is characterized in that the box body (1) is molded by metal and is closely connected with the refrigeration block (4). The invention has the advantages that: 1) the invention simplifies the structure and reduces the failure rate and the manufacturing cost; 2) the invention increases an effective using space of a refrigerating chamber.
Description
Affiliated technical field
The present invention relates to a kind of refrigerating plant, especially direct freezing type semiconductor refrigeration device.
Background technology
The typical refrigeration structure of semiconductor cooler in the market as shown in Figure 1, mainly by thermal insulation layer (6), casing (1), radiator (2), radiator fan (20), refrigerating chip (3), cross cold (4), cold-making block (5), box fan (50) etc. and form; By cold-making block in the case (5) and fan (50) refrigeration, utilize radiator (2) and radiator fan (20) in air, to dispel the heat.
There is following problem points in this refrigeration structure: fan (50) and cold-making block (5) 1) are set in the case have occupied the interior volume of case, cause effective usage space to reduce; 2) in case, be equipped with fan (50) and cold-making block (5), make the product structure complexity, the fault rate height; 3) parts are many, cost is high.
Summary of the invention
In order to overcome conventional semiconductor refrigerating plant deficiency, the invention provides a kind of direct freezing type semiconductor refrigeration device, this apparatus structure is simple, and is stable and reliable for performance, and cost is low.
The technical solution adopted for the present invention to solve the technical problems is:
Direct freezing type semiconductor refrigeration device comprises casing (1), radiator (2), radiator fan (20), refrigerating chip (3), crosses cold (4), it is characterized in that: casing (1) by metal forming and with cross cold (4) and closely be connected.
The bottom of described casing (1) is provided with a through hole, crosses that cold (4) are suitable can to embed in this through hole.
Describedly cross cold (4) and closely be connected with casing (1).
The invention has the beneficial effects as follows: 1) structure is greatly simplified, and fault rate reduces, and has reduced manufacturing cost; 2) the effective usage space of refrigerating chamber increases;
Description of drawings
Fig. 1 is existing semiconductor cooler structural representation.
Fig. 2 is a structural representation of the present invention.
The specific embodiment
The present invention is further described below in conjunction with drawings and Examples.
Consult Fig. 2, direct freezing type semiconductor refrigeration device, comprise thermal insulation layer (6), casing (1), radiator (2), radiator fan (20), refrigerating chip (3), cross cold (4), its design feature is: casing (1) by metal forming and with cross cold (4) and closely be connected.The bottom of wherein said casing (1) is provided with a through hole, crosses that cold (4) are suitable can to embed in this through hole, and closely is connected with casing (1).
The present invention is with respect to traditional structure, cancelled the parts in the casees such as cold-making block in the case and fan, and structure is greatly simplified, and reduced manufacturing cost, and increased effective usage space of refrigerating chamber; The present invention is directly passed to the metal box inner chamber by crossing the cold cold that refrigerating chip is produced, and makes the cooling of metal box inner chamber.Utilize vast heat exchange area of metal box inner chamber and the big characteristics of metal fever conductivity,, make cooling in the case by the convection current of air Natural Circulation.
Above-described specific embodiment only is preferred embodiment of the present invention, and the equivalent arrangements of being done according to the present patent application claim all should be technology of the present invention and contains such as.
Claims (3)
1. direct freezing type semiconductor refrigeration device comprises casing (1), radiator (2), radiator fan (20), refrigerating chip (3), crosses cold (4), it is characterized in that: casing (1) by metal forming and with cross cold (4) and closely be connected.
2. direct freezing type semiconductor refrigeration device according to claim 1 is characterized in that: the bottom of casing (1) is provided with a through hole, crosses that cold (4) are suitable can to embed in this through hole.
3. direct freezing type semiconductor refrigeration device according to claim 2 is characterized in that: describedly cross cold (4) and closely be connected with casing (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101242499A CN101206085A (en) | 2006-12-18 | 2006-12-18 | Direct freezing type semiconductor refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101242499A CN101206085A (en) | 2006-12-18 | 2006-12-18 | Direct freezing type semiconductor refrigeration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101206085A true CN101206085A (en) | 2008-06-25 |
Family
ID=39566465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101242499A Pending CN101206085A (en) | 2006-12-18 | 2006-12-18 | Direct freezing type semiconductor refrigeration device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101206085A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102235770A (en) * | 2010-05-08 | 2011-11-09 | 刘万辉 | Manufacturing method of semiconductor cold storage and hot storage box |
| CN106461292A (en) * | 2014-06-16 | 2017-02-22 | 利勃海尔-家用电器利恩茨有限责任公司 | Temperature-controlled container |
| CN109916134A (en) * | 2019-04-22 | 2019-06-21 | 苏州奥德机械有限公司 | A kind of semiconductor refrigerating constant temperature water tank |
-
2006
- 2006-12-18 CN CNA2006101242499A patent/CN101206085A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102235770A (en) * | 2010-05-08 | 2011-11-09 | 刘万辉 | Manufacturing method of semiconductor cold storage and hot storage box |
| CN106461292A (en) * | 2014-06-16 | 2017-02-22 | 利勃海尔-家用电器利恩茨有限责任公司 | Temperature-controlled container |
| CN109916134A (en) * | 2019-04-22 | 2019-06-21 | 苏州奥德机械有限公司 | A kind of semiconductor refrigerating constant temperature water tank |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |