CN102235770A - Manufacturing method of semiconductor cold storage and hot storage box - Google Patents
Manufacturing method of semiconductor cold storage and hot storage box Download PDFInfo
- Publication number
- CN102235770A CN102235770A CN2010101816220A CN201010181622A CN102235770A CN 102235770 A CN102235770 A CN 102235770A CN 2010101816220 A CN2010101816220 A CN 2010101816220A CN 201010181622 A CN201010181622 A CN 201010181622A CN 102235770 A CN102235770 A CN 102235770A
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- CN
- China
- Prior art keywords
- semiconductor
- storage
- warm
- heat exchanger
- producing machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
- F25D11/025—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures using primary and secondary refrigeration systems
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to a manufacturing method of a semiconductor cold storage and hot storage box. The semiconductor cold storage and hot storage box comprises a semiconductor refrigerating and heating device and a semiconductor cold storage and hot storage box body with a large-volume storeroom, wherein the back part of the storeroom of the semiconductor cold storage and hot storage box body is provided with a semiconductor refrigerating and heating working chamber the interior and exterior of which are penetrated. The manufacturing method is characterized in that the semiconductor refrigerating and heating device is installed in the semiconductor refrigerating and heating working chamber; and then the semiconductor refrigerating and heating device, a combined type condenser and an infusion pump are communicated by virtue of connecting pipes so as to constitute a circular flow channel of a liquid coolant. The manufacturing method has the characteristics that operation is simple and convenient, the difficulty in preparatory work for box body foaming is reduced, and the work load of the after-sales repair service of a product is decreased.
Description
Technical field: the present invention relates to a kind of preparation method of semiconductor cold-storage and warm-storage case, particularly a kind of preparation method that the semiconductor cold-storage and warm-storage case of big volume storeroom is arranged.
Background technology: the refrigerator series products that big volume storeroom is arranged at present, all be foaming again after being installed to related components such as evaporimeter in the casing basically in manufacturing process, this process but is difficult to use in the industrialization of semiconductor cold-storage and warm-storage case, first cause is that foam box preparation difficulty strengthens, secondly reason is the after-sales maintenance service work difficulty increasing of the semiconductor cold-storage and warm-storage case of production like this, in addition, there is the compressor refrigerator of big volume storeroom can only freeze and to heat at present, and can freezes and the semiconductor cold-storage and warm-storage box technology that can heat can only satisfy the primary demand of little volume storeroom.
Goal of the invention: the objective of the invention is to overcome the shortcoming of prior art, propose a kind of easy and simple to handlely, reduce foam box preparation difficulty, reduce the preparation method of semiconductor cold-storage and warm-storage case of the big volume storeroom of product after-sales maintenance service workload.
Main technical schemes of the present invention: the semiconductor refrigerating heat-producing machine that will prepare in advance is installed into after the semiconductor refrigerating heat-producing machine operating room of the semiconductor cold-storage and warm-storage box body for preparing, be communicated with semiconductor refrigerating heat-producing machine, composite condenser and infusion pump with tube connector again, constitute the circulation flow passage of liquid coolant.
Concrete preparation method of the present invention may further comprise the steps:
1. preparation semiconductor cold-storage and warm-storage box body: semiconductor cold-storage and warm-storage box body outside plate, inner bag and related components assembling are finished and puts into foaming mould and foam, be prepared into the semiconductor cold-storage and warm-storage box body, the semiconductor cold-storage and warm-storage box body has a big volume storeroom, and semiconductor cold-storage and warm-storage box body storeroom back has the inside and outside semiconductor refrigerating heat-producing machine operating room that connects;
2. prepare the semiconductor refrigerating heat-producing machine: with semiconductor chilling plate, heat exchanger closely contact subsides mutually according to the order of sequence in one of the external heat exchanger of one of semiconductor refrigerating heat-producing machine metal assembly and semiconductor refrigerating heat-producing machine metal assembly, fix with fastening connection piece, form the semiconductor refrigerating heat-producing machine;
3. assembling: after the semiconductor refrigerating heat-producing machine is installed into semiconductor refrigerating heat-producing machine operating room, be communicated with semiconductor refrigerating heat-producing machine, composite condenser and infusion pump with tube connector again, constitute the circulation flow passage of liquid coolant.
Description of drawings:
Fig. 1 is a semiconductor cold-storage and warm-storage case package assembly cross-sectional schematic in the embodiment of the invention;
Fig. 2 is the warm box body structure cross-sectional schematic of hiding of cold a surname of semiconductor in the embodiment of the invention;
Fig. 3 is semiconductor refrigerating heat-producing machine in the embodiment of the invention, composite condenser and infusion pump connectivity scheme schematic diagram;
Fig. 4 is the structural representation of the external heat exchanger of semiconductor refrigerating heat-producing machine in the embodiment of the invention;
Among the figure: 1. storeroom; 2. semiconductor refrigerating heat-producing machine operating room; 3. electric controller chamber; 4. semiconductor refrigerating heat-producing machine; 5. semiconductor chilling plate; 6. interior heat exchanger; 7. external heat exchanger; 8. composite condenser; 9. infusion pump; 10. liquid coolant inflow/flow export; 11. fluid infusion exhaust outlet; 12. liquid coolant flow passage.
The present invention will be further described below in conjunction with accompanying drawing: as shown in Figure 2, semiconductor cold-storage and warm-storage box body outside plate, inner bag and related components assembling are finished and puts into foaming mould and foam, preparation semiconductor cold-storage and warm-storage box body, the warm good box body of semiconductor refrigeration has the storeroom 1 of a big volume, and semiconductor cold-storage and warm-storage box body storeroom 1 back has the inside and outside semiconductor refrigerating heat-producing machine operating room 2 that connects; As shown in Figure 1, with semiconductor chilling plate 5, heat exchanger 6 closely contact subsides are mutually according to the order of sequence fixed with fastening connection piece in one of the external heat exchanger 7 of one of semiconductor refrigerating heat-producing machine metal assembly and semiconductor refrigerating heat-producing machine metal assembly, form semiconductor refrigerating heat-producing machine 4; In conjunction with Fig. 1, Fig. 2 and shown in Figure 3, semiconductor refrigerating heat-producing machine 4 is installed into semiconductor refrigerating heat-producing machine operating room 2 after, be communicated with semiconductor refrigerating heat-producing machine 4, composite condenser 8 and infusion pump 9 with tube connector again, constitute the circulation flow passage of liquid coolant.
Have fluid infusion exhaust outlet 11 on the external heat exchanger 7 as shown in Figure 4, the liquid coolant inflow/flow export 10 that liquid coolant passes through, external heat exchanger 7 inside have liquid coolant flow passage 12.
Obviously, the fluid infusion exhaust outlet 11 that has on the external heat exchanger 7, the liquid coolant inflow/flow export 10 that liquid coolant passes through can be opened outside external heat exchanger 7 on the front plate, also can open other position on external heat exchanger 7.
Composite condenser 8 by one or more individual layer condenser parallel stack to be communicated with form.
Claims (4)
1. the preparation method of a semiconductor cold-storage and warm-storage case is characterized in that preparation process may further comprise the steps:
1). preparation semiconductor cold-storage and warm-storage casing: casing outside plate, inner bag and related components assembling are finished and puts into foaming mould and foam, be prepared into the semiconductor cold-storage and warm-storage box body, semiconductor cold-storage and warm-storage box body storeroom (1) back has the inside and outside semiconductor refrigerating heat-producing machine operating room (2) that connects;
2). preparation semiconductor refrigerating heat-producing machine (4): with the interior heat exchanger (6) of one of the external heat exchanger (7) of one of semiconductor chilling plate (5), refrigerating and heating device (4) metal assembly and refrigerating and heating device metal assembly according to the order of sequence closely contact paste mutually, fix with fastening connection piece, form semiconductor refrigerating heat-producing machine (4);
3). assembling: after semiconductor refrigerating heat-producing machine (4) is installed into semiconductor refrigerating heat-producing machine operating room (2), be communicated with semiconductor refrigerating heat-producing machine (4), composite condenser (8) and infusion pump (9) with tube connector again, constitute the circulation flow passage of liquid coolant.
2. a kind of according to claim 1 preparation method of semiconductor cold-storage and warm-storage case, it is characterized in that: have fluid infusion exhaust outlet (11) on the external heat exchanger (7), liquid coolant inflow/the flow export (10) that liquid coolant passes through, external heat exchanger (7) inside has liquid coolant flow passage (12).
3. a kind of according to claim 1 preparation method of semiconductor cold-storage and warm-storage case, it is characterized in that: the fluid infusion exhaust outlet (11) that has on the external heat exchanger (7), liquid coolant inflow/the flow export (10) that liquid coolant passes through can be opened outside external heat exchanger (7) on the front plate, also can open other position on external heat exchanger (7).
4. a kind of according to claim 1 preparation method of semiconductor cold-storage and warm-storage case is characterized in that: composite condenser (8) by one or more individual layer condenser parallel stack to be communicated with form.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101816220A CN102235770A (en) | 2010-05-08 | 2010-05-08 | Manufacturing method of semiconductor cold storage and hot storage box |
| PCT/CN2011/073567 WO2011140937A1 (en) | 2010-05-08 | 2011-04-29 | Manufacturing method for semiconductor refrigerating and heating storage box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101816220A CN102235770A (en) | 2010-05-08 | 2010-05-08 | Manufacturing method of semiconductor cold storage and hot storage box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102235770A true CN102235770A (en) | 2011-11-09 |
Family
ID=44886665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101816220A Pending CN102235770A (en) | 2010-05-08 | 2010-05-08 | Manufacturing method of semiconductor cold storage and hot storage box |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102235770A (en) |
| WO (1) | WO2011140937A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014067493A1 (en) * | 2012-11-05 | 2014-05-08 | 沈茂相 | Novel semiconductor cool/warm box and fabrication method |
| CN104329849A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Method for mounting semiconductor refrigerator |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19504383A1 (en) * | 1995-02-10 | 1996-08-14 | Dkk Ges Fuer Entwicklung Und P | Thermoelectric cooling system |
| CN2674370Y (en) * | 2003-09-24 | 2005-01-26 | 刘万辉 | Efficient semiconductor refrigerator |
| CN101206085A (en) * | 2006-12-18 | 2008-06-25 | 梁志鹏 | Direct freezing type semiconductor refrigeration device |
| CN201322491Y (en) * | 2008-12-28 | 2009-10-07 | 刘万辉 | Novel durable multi-function semiconductor refrigerating-and-heating box |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08121928A (en) * | 1994-10-26 | 1996-05-17 | Matsushita Electric Works Ltd | Refrigerator |
| CN2422596Y (en) * | 2000-04-08 | 2001-03-07 | 刘万辉 | Mixed cold-hot dual-purpose storage box |
| RU2367857C1 (en) * | 2008-05-13 | 2009-09-20 | Иван Михайлович Голенковский | Method of drinking water cooling for automated beverage tapping machine and device and drinking water cooling |
| CN101893346A (en) * | 2009-05-22 | 2010-11-24 | 刘万辉 | Method for manufacturing multifunctional semiconductor refrigerating and heating dual-purpose case |
| CN201615648U (en) * | 2010-02-24 | 2010-10-27 | 刘万辉 | Novel practical semiconductor refrigeration and heat preservation box |
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2010
- 2010-05-08 CN CN2010101816220A patent/CN102235770A/en active Pending
-
2011
- 2011-04-29 WO PCT/CN2011/073567 patent/WO2011140937A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19504383A1 (en) * | 1995-02-10 | 1996-08-14 | Dkk Ges Fuer Entwicklung Und P | Thermoelectric cooling system |
| CN2674370Y (en) * | 2003-09-24 | 2005-01-26 | 刘万辉 | Efficient semiconductor refrigerator |
| CN101206085A (en) * | 2006-12-18 | 2008-06-25 | 梁志鹏 | Direct freezing type semiconductor refrigeration device |
| CN201322491Y (en) * | 2008-12-28 | 2009-10-07 | 刘万辉 | Novel durable multi-function semiconductor refrigerating-and-heating box |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014067493A1 (en) * | 2012-11-05 | 2014-05-08 | 沈茂相 | Novel semiconductor cool/warm box and fabrication method |
| CN103808062A (en) * | 2012-11-05 | 2014-05-21 | 刘万辉 | Manufacturing method for novel semiconductor cold storage and warm storage box |
| CN104329849A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Method for mounting semiconductor refrigerator |
| CN104329849B (en) * | 2014-03-28 | 2016-06-08 | 海尔集团公司 | The installation method of a kind of semi-conductor refrigerator |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011140937A1 (en) | 2011-11-17 |
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Application publication date: 20111109 |