CN2674370Y - Efficient semiconductor refrigerator - Google Patents
Efficient semiconductor refrigerator Download PDFInfo
- Publication number
- CN2674370Y CN2674370Y CNU032808631U CN03280863U CN2674370Y CN 2674370 Y CN2674370 Y CN 2674370Y CN U032808631 U CNU032808631 U CN U032808631U CN 03280863 U CN03280863 U CN 03280863U CN 2674370 Y CN2674370 Y CN 2674370Y
- Authority
- CN
- China
- Prior art keywords
- heat exchanger
- condenser
- radiator
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to an efficient semiconductor refrigerator, comprising an inner heat exchanger in the refrigerator and an external heat exchanger outside the refrigerator, a heat emitter, an infusion pump and a semiconductor refrigerator, and the inner heat exchanger closely connects with the external heat exchanger through the semiconductor refrigerator. The utility model is characterized in that the external heat exchanger, the infusion pump and the heat emitter mutually communicate with each other forming the refrigerant channel, and a post condenser and a side built-in condenser communicate with each other forming the heat emitter. The utility model has the features of free vibration, high efficiency, environmental protection and safety.
Description
Technical field: the utility model relates to a kind of heat abstractor that is used for semiconductor refrigerating and dispels the heat.
Background technology: the used heat abstractor of conventional semiconductor refrigerating box has two kinds of forms usually, and a kind of is that side of body gilled radiator adds blower fan, and advantage is simple in structure, but efficient is low, noise is big; Another kind is that the evaporation storehouse adds condenser, and advantage is a noiselessness, but because structure is special, and difficulty of processing is big, is difficult to use in the heat radiation of big volume refrigerating box refrigeration.
Summary of the invention: the purpose of this utility model provide a kind of simple in structure, efficient is high, the heat abstractor of noiseless substantially semiconductor refrigerating, can be used for the semiconductor refrigeration box refrigeration of big volume.
The purpose of this utility model is to realize by such technical scheme, it comprises interior heat exchanger and outer external heat exchanger, radiator, infusion pump and the semiconductor cooler of refrigerating chamber that is arranged in the refrigerating chamber, external heat exchanger is made by heat conductivility good metal material, inside has flow channel and the import and the outlet of refrigerant, and radiator is interconnected by built-in condenser of side and post-condenser and forms.The built-in condenser of side closely contacts mutually with the internal face of semiconductor refrigeration box two outer side panels respectively, interior heat exchanger is by semiconductor cooler and external heat exchanger closely contact mutually, it is characterized in that: external heat exchanger, radiator, infusion pump interconnect, and constitute the flow passage of refrigerant.
Operation principle of the present utility model is such: during semiconductor refrigeration box work, semiconductor cooler is constantly by interior heat exchanger draw heat in the refrigerating chamber, and heat is delivered on the external heat exchanger, along with heat is constantly siphoned away, the refrigeration indoor temperature reduces, reach the purpose of refrigeration, because the work of infusion pump, refrigerant is constantly taken away heat from external switch, be delivered on each condenser of radiator, be dispersed into again in the semiconductor refrigeration box ambient air, because radiator is to be made of the polylith condenser, area of dissipation is big, thereby efficient is higher, fully reduce the temperature on the external switch, helped improving the refrigerating efficiency of semiconductor cooler.
Description of drawings: description of drawings of the present utility model is as follows:
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is structure and the schematic diagram of first kind of embodiment of the utility model;
Fig. 3 is structure and schematic diagram for second kind of embodiment of the utility model;
Among the figure: 1. refrigerating chamber; 2. interior heat exchanger; 3. semiconductor cooler; 4. external heat exchanger; 5. radiator; 6. infusion pump; 7. post-condenser; 8. the built-in condenser of side.
The specific embodiment: the utility model is described further below in conjunction with drawings and Examples:
As shown in Figure 1, the utility model comprises interior heat exchanger 2 and refrigerating chamber 1 external heat exchanger 4 outward that is arranged in the refrigerating chamber 1, radiator 5, infusion pump 6 and semiconductor cooler 3, external heat exchanger 5 is made by heat conductivility good metal material, inside has flow channel and the import and the outlet of refrigerant, and radiator 5 is interconnected by built-in condenser 8 of side and post-condenser 7 and forms.The built-in condenser 8 of side closely contacts mutually with the inwall of semiconductor refrigeration box two outer side panels respectively, interior heat exchanger 2 is by semiconductor cooler 3 and external heat exchanger 4 closely contact mutually, it is characterized in that: external heat exchanger 4, radiator 5, infusion pump 6 interconnect, and constitute the flow passage of refrigerant.
Operation principle of the present utility model is such: during semiconductor refrigeration box work, semiconductor cooler 3 constantly passes through interior heat exchanger 2 from refrigerating chamber 1 interior draw heat, and heat is delivered on the external switch 4, along with heat is constantly siphoned away, temperature reduces in the refrigerating chamber 1, reach the purpose of refrigeration, because the work of infusion pump 6, refrigerant is constantly taken away heat from external switch 4, be delivered on each condenser of radiator 5, be dispersed into again in the semiconductor refrigeration box ambient air, because radiator 5 is to be made of the polylith condenser, area of dissipation is big, thereby efficient is higher, fully reduce the temperature on the external heat exchanger 4, helped improving the refrigerating efficiency of semiconductor cooler 3.
As shown in Figure 2, the post-condenser 7 of composition radiator 5 and side internal-mounted condenser 8 can be parallel the connections; As shown in Figure 3, the post-condenser 7 of composition radiator 5 and side internal-mounted condenser 8 can be that serial is communicated with.
Claims (4)
1, a kind of high efficiency semiconductor refrigerating box, it comprises interior heat exchanger (2) and outer external heat exchanger (4), radiator (5), infusion pump (6), the semiconductor cooler (3) of refrigerating chamber (3) that is arranged in the refrigerating chamber (1), interior heat exchanger (2) is by semiconductor cooler (3) and external heat exchanger (4) closely contact mutually, it is characterized in that: external heat exchanger (4), radiator (5) and infusion pump (6) are interconnected, and constitute the flow passage of refrigerant.
2, a kind of according to claim 1 high efficiency semiconductor refrigerating box is characterized in that: radiator (5) is interconnected by post-condenser (7) and the built-in condenser of side (8) and forms.
3, a kind of according to claim 1 high efficiency semiconductor refrigerating box is characterized in that: post-condenser (7) is parallel the connection with the built-in condenser of side (8).
4, a kind of according to claim 1 high efficiency semiconductor refrigerating box is characterized in that: post-condenser (7) is that serial is communicated with the built-in condenser of side (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032808631U CN2674370Y (en) | 2003-09-24 | 2003-09-24 | Efficient semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032808631U CN2674370Y (en) | 2003-09-24 | 2003-09-24 | Efficient semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2674370Y true CN2674370Y (en) | 2005-01-26 |
Family
ID=34473808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU032808631U Expired - Fee Related CN2674370Y (en) | 2003-09-24 | 2003-09-24 | Efficient semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2674370Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102235770A (en) * | 2010-05-08 | 2011-11-09 | 刘万辉 | Manufacturing method of semiconductor cold storage and hot storage box |
| CN103808062A (en) * | 2012-11-05 | 2014-05-21 | 刘万辉 | Manufacturing method for novel semiconductor cold storage and warm storage box |
-
2003
- 2003-09-24 CN CNU032808631U patent/CN2674370Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102235770A (en) * | 2010-05-08 | 2011-11-09 | 刘万辉 | Manufacturing method of semiconductor cold storage and hot storage box |
| CN103808062A (en) * | 2012-11-05 | 2014-05-21 | 刘万辉 | Manufacturing method for novel semiconductor cold storage and warm storage box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |