CN2394140Y - Semiconductor heat pipe air conditioner - Google Patents

Semiconductor heat pipe air conditioner Download PDF

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Publication number
CN2394140Y
CN2394140Y CN 99254327 CN99254327U CN2394140Y CN 2394140 Y CN2394140 Y CN 2394140Y CN 99254327 CN99254327 CN 99254327 CN 99254327 U CN99254327 U CN 99254327U CN 2394140 Y CN2394140 Y CN 2394140Y
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China
Prior art keywords
heat
heat pipe
fan
utility
model
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 99254327
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Chinese (zh)
Inventor
赵立仁
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Individual
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Individual
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Priority to CN 99254327 priority Critical patent/CN2394140Y/en
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Publication of CN2394140Y publication Critical patent/CN2394140Y/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to an indoor temperature lowering device, particularly a semiconductor heat pipe air conditioner. The utility model has the technical proposal that the utility model is composed of an evaporator 1, a semiconductor refrigeration block 2, a heat tubular radiator 3 and a fan 4. The semiconductor refrigeration block is arranged between the evaporator and the heat pipe with the refrigerate block cold surface contacting with the evaporator and the refrigerate block heat delivery surface contacting with the heat pipe, and the fan 4 is arranged beside the evaporator 1. After power on, the refrigerate surface of the semiconductor refrigeration block begins refrigerating, the fan blows cold air into the room, and the heat delivery surface of the refrigerate block sends out heat with the outdoor heat radiating plate emitting heat outdoor. The utility model has the characteristics of reasonable structure, no freon, no compressor, ideal cooling-down effect, etc.

Description

Heat pipe-type semiconductor air conditioner device
The utility model relates to a kind of room temperature lowering device, particularly heat pipe-type semiconductor air conditioner device.
When at present needing to reduce indoor temperature, generally adopt air-conditioning or electric fan to lower the temperature, but common air-conditioning cost an arm and a leg owing to have structure such as compressor, the fluorine refrigeration contaminated environment of use, undesirable with the electric fan cool effect.
The utility model purpose provides a kind of heat pipe-type semiconductor air conditioner device, floride-free, compressor-free, and the cooling-down effect ideal solves the problems referred to above that prior art exists.
The technical solution of the utility model is: constitute heat pipe-type semiconductor air conditioner device by evaporimeter, semiconductor refrigerating piece, heat-pipe radiator, fan, evaporimeter is to be formed by stacking by some evaporating plates, leave the gap between each evaporating plate, heat-pipe radiator is made of heat pipe and fin, fin be fixed on stretch out on the heat pipe outdoor, the semiconductor refrigerating piece is placed between evaporimeter and the heat pipe, the chill surface of cold-making block contacts with evaporimeter, the radiating surface of cold-making block contacts with heat pipe, on the evaporimeter next door fan is set.
Adopt the utility model, the semiconductor refrigerating piece is started working after connecting power supply, chill surface begins refrigeration, be delivered to the evaporimeter of contact with it, the fan on next door is blown into cold air indoor, satisfies indoor reduction temperature needs, the radiating surface evolution of heat of cold-making block, be delivered to the heat pipe of contact with it, heat distributed outdoor by outdoor fin.
The utlity model has characteristics such as rational in infrastructure, floride-free, compressor-free, cooling-down effect ideal, compare cost with common air-conditioning low, non-environmental-pollution.
Accompanying drawing 1 is the utility model example structure schematic diagram.
Accompanying drawing 2 is an evaporation structure schematic diagram among the utility model embodiment.
Accompanying drawing 3 is a heat-pipe radiator structure schematic diagram among the utility model embodiment.
Below in conjunction with accompanying drawing, further specify the utility model by embodiment, in an embodiment, by evaporimeter (1), semiconductor refrigerating piece (2), heat-pipe radiator (3), centrifugal fan (4), aerofoil fan (5) constitutes heat pipe-type semiconductor air conditioner device, evaporimeter is to be formed by stacking the casing shape by some evaporating plates (6), leave the gap between each evaporating plate, heat-pipe radiator is made of heat pipe (7) and fin (8), fin be fixed on stretch out on the heat pipe outdoor, the semiconductor refrigerating piece is placed between evaporimeter and the heat pipe, the chill surface of cold-making block contacts with evaporimeter, the radiating surface of cold-making block contacts with heat pipe, on evaporimeter (1) next door centrifugal fan (4) is set, aerofoil fan (5) is set on fin (8) next door of heat-pipe radiator.Open chill surface behind the semiconductor refrigerating piece connection power supply and begin refrigeration, be delivered to the evaporimeter of contact with it, the centrifugal fan on next door is blown into cold air indoor, satisfy indoor reduction temperature needs, the radiating surface evolution of heat of cold-making block, be delivered to the heat pipe of contact with it, by outdoor fin heat distributed outdoor, the aerofoil fan on next door is strengthened radiating effect.

Claims (2)

1, a kind of heat pipe-type semiconductor air conditioner device, comprise evaporimeter (1), semiconductor refrigerating piece (2), heat-pipe radiator (3), fan (4) in it is characterized in that forming, evaporimeter is to be formed by stacking by some evaporating plates (6), leave the gap between each evaporating plate, heat-pipe radiator is made of heat pipe (7) and fin (8), fin be fixed on stretch out on the heat pipe outdoor, the semiconductor refrigerating piece is placed between evaporimeter and the heat pipe, the chill surface of cold-making block contacts with evaporimeter, the radiating surface of cold-making block contacts with heat pipe, on evaporimeter (1) next door fan (4) is set.
2, the 1 described heat pipe-type semiconductor air conditioner device according to claim also has aerofoil fan (5) in it is characterized in that forming, and aerofoil fan (5) is arranged on fin (8) next door of heat-pipe radiator (3).
CN 99254327 1999-11-19 1999-11-19 Semiconductor heat pipe air conditioner Expired - Fee Related CN2394140Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 99254327 CN2394140Y (en) 1999-11-19 1999-11-19 Semiconductor heat pipe air conditioner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 99254327 CN2394140Y (en) 1999-11-19 1999-11-19 Semiconductor heat pipe air conditioner

Publications (1)

Publication Number Publication Date
CN2394140Y true CN2394140Y (en) 2000-08-30

Family

ID=34037993

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 99254327 Expired - Fee Related CN2394140Y (en) 1999-11-19 1999-11-19 Semiconductor heat pipe air conditioner

Country Status (1)

Country Link
CN (1) CN2394140Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104976810A (en) * 2014-04-01 2015-10-14 杨然森 Four-vent refrigeration device and refrigeration module thereof
CN108204636A (en) * 2017-11-28 2018-06-26 珠海格力电器股份有限公司 A kind of dehumidifier and its control method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104976810A (en) * 2014-04-01 2015-10-14 杨然森 Four-vent refrigeration device and refrigeration module thereof
CN104976810B (en) * 2014-04-01 2017-06-23 杨然森 Four air port refrigerating plants and its refrigeration module
CN108204636A (en) * 2017-11-28 2018-06-26 珠海格力电器股份有限公司 A kind of dehumidifier and its control method

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee