CN104976810B - Four air port refrigerating plants and its refrigeration module - Google Patents
Four air port refrigerating plants and its refrigeration module Download PDFInfo
- Publication number
- CN104976810B CN104976810B CN201410128562.4A CN201410128562A CN104976810B CN 104976810 B CN104976810 B CN 104976810B CN 201410128562 A CN201410128562 A CN 201410128562A CN 104976810 B CN104976810 B CN 104976810B
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- Prior art keywords
- air port
- air
- semiconductor chilling
- heat
- fin
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 239000006096 absorbing agent Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 235000010210 aluminium Nutrition 0.000 claims description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- XMXNVYPJWBTAHN-UHFFFAOYSA-N potassium chromate Chemical class [K+].[K+].[O-][Cr]([O-])(=O)=O XMXNVYPJWBTAHN-UHFFFAOYSA-N 0.000 claims description 2
- 229910000553 6063 aluminium alloy Inorganic materials 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000004020 conductor Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- IDNWIFWIPMFSNV-UHFFFAOYSA-L [K].[Cr](=O)(=O)(O)O Chemical compound [K].[Cr](=O)(=O)(O)O IDNWIFWIPMFSNV-UHFFFAOYSA-L 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of four air port refrigerating plants and its refrigeration module, the refrigeration module include：Semiconductor chilling plate；Heat transmitter, is made up of substrate with the fin that is a plurality of relative and being separated by certain interval taken shape on the substrate, and fin surface undulate, the substrate is fitted with the cold end of the semiconductor chilling plate；And radiator, it is made up of L-shaped heat pipe and the absorber plate that is sheathed in the two-arm of L-shaped heat pipe of correspondence and groups of fins, overall L-shaped flap-like, the absorber plate is fitted with the hot junction of the semiconductor chilling plate, the built-in superconductive liquid of heat pipe.The four air ports refrigerating plant includes housing, arc and above-mentioned refrigeration module, the housing has main casing portion, the first and second air channels, arc is placed in main casing portion and the first and second air channels surround inverted U-shaped circulation air path, semiconductor chilling plate is placed in pilot hole, heat transmitter is placed in inverted U-shaped circulation air path, and radiator is placed in the upside of arc.This refrigerating plant high cooling efficiency.
Description
Technical field
The present invention relates to technical field of refrigeration equipment, especially for cold and/or hot storage device（Such as refrigerator, refrigerator, cold and hot
Integrated cabinet etc.）The four air port refrigerating plants and its refrigeration module of low-temperature receiver are provided.
Background technology
Traditional refrigerating equipment needs to use refrigerant, and not environmentally, noise is big, and high energy consumption.
With the development of science and technology, people are combined using semiconductor chilling plate or semiconductor chilling plate with traditional compressor
For refrigerating equipment provides low-temperature receiver, but up to the present, when semiconductor chilling plate offer low-temperature receiver is used alone, refrigerating efficiency is low, nothing
Method meets 70 liters of refrigeration with upper container.
The content of the invention
It is an object of the invention to provide a kind of refrigeration module of high cooling efficiency.
It is large and medium-sized cold to meet it is a further object of the present invention to provide a kind of four air port refrigerating plants of high cooling efficiency
And/or the cooling and warming demand of hot storage device.
A kind of refrigeration module that the present invention is provided includes：
Semiconductor chilling plate；
Heat transmitter, is made up of, institute substrate with the fin that is a plurality of relative and being separated by certain interval taken shape on the substrate
Fin surface undulate is stated, the substrate is fitted with the cold end of the semiconductor chilling plate；And
Radiator, the absorber plate and groups of fins being sheathed in the two-arm of L-shaped heat pipe by L-shaped heat pipe and correspondence is constituted, whole
The L-shaped flap-like of body, the absorber plate is fitted with the hot junction of the semiconductor chilling plate, the built-in superconductive liquid of heat pipe.
In above-mentioned refrigeration module, it is preferable that the material of the heat transmitter is 6063 aluminiums or 1060 aluminiums, heat transmitter
The thickness of substrate is 2mm~5mm, and the thickness of heat transmitter fin is 0.4mm~0.6mm, is highly 40mm~65mm, adjacent fin
Between gap be 1.2mm~2mm.
In above-mentioned refrigeration module, it is preferable that heat transmitter fin surface constitutes the corrugated ridge with described half
Conductor cooling piece is vertical.
In above-mentioned refrigeration module, it is preferable that the material of the absorber plate of the radiator is 6063 aluminiums or 1060 aluminium
Material；A diameter of 8mm~10mm of the heat pipe, the intermarginal spacing of adjacent heat tube edge is 1mm~3mm, heat pipe bottom and absorber plate
The thickness sum of bottom is 1mm~2.5mm；By weight, the superconductive liquid is by 1~1.5 part of NaOH, 4~5 parts of chromic acid
Potassium, 1570~1580 parts of ethanol and 8030~8040 parts of pure water compositions.
A kind of four air port refrigerating plant that the present invention is provided includes：
Housing, the housing has main casing portion and from downward projection of first air channel in main casing portion bottom and the second air channel, the
One air channel and the second air channel is separated by a distance and its lower end is correspondingly arranged the first air port and the second air port, the top in main casing portion and
Rear lateral portion is correspondingly arranged the 3rd air port and the 4th air port, and second, third and the 4th air port are respectively provided with aerofoil fan；
Arc, is arranged in the main casing portion and first air channel and the second air channel surround an inverted U-shaped circulated air
Road, the arc sets a pilot hole；And
Above-mentioned any one refrigeration module, the semiconductor chilling plate of the refrigeration module is placed in the pilot hole, heat transmitter
It is placed in the inverted U-shaped circulation air path, radiator is placed in the upside of housing arc plate and two of its groups of fins face greatly
Should be towards the 3rd air port and the 4th air port.
In four above-mentioned air port refrigerating plants, it is preferable that first air port is with the second air port to the direction for mutually deviating from
Partially, the center line of the two is in splayed.
In four above-mentioned air port refrigerating plants, it is preferable that thermal insulation layer is set on the arc.
In four above-mentioned air port refrigerating plants, it is preferable that the inverted U-shaped circulation air path is divided into two by the heat transmitter
Section, gap between heat transmitter fin constitute it is described two sections between connection air channel, the connection air channel undulate is that release is low
Temperature absorbs high temperature or release high temperature absorbs the crucial air channel of low temperature.Connection Duct design is waveform, can play flow-disturbing, slow down
The effect of gas flow rate, cold and hot gas is reached with this and is preferably exchanged.
This four air port refrigerating plant high cooling efficiency, disclosure satisfy that big-and-middle-sized（Volume is more than 70 liters）Refrigeration plant and cold and hot
The refrigeration demand of integrated cabinet etc..
Brief description of the drawings
Fig. 1 is the structural representation of an embodiment refrigeration module；
Fig. 2 is the structural representation of an example IV air port refrigerating plant；
Fig. 3 is the front view of four air port refrigerating plants shown in Fig. 2；
Fig. 4 is the A-A sectional views of Fig. 3.
Specific embodiment
The present invention is further described with reference to the accompanying drawings and examples.
As shown in figure 1, this refrigeration module includes semiconductor chilling plate 1, heat transmitter 2 and radiator 3.Heat transmitter 2 is by substrate
21 constitute with the fin 22 that is a plurality of relative and being separated by certain interval taken shape on substrate 21, the surface undulate of fin 22,
Substrate 21 is fitted with the cold end of semiconductor chilling plate 1.Radiator 3 by L-shaped heat pipe 31, be sheathed on the heat absorption of the underarm of L-shaped heat pipe 31
Plate 32 is constituted with the groups of fins 33 for being sheathed on the upper arm of L-shaped heat pipe 31, the overall L-shaped flap-like of radiator 3, absorber plate 32 and half
The hot junction laminating of conductor cooling piece 1, the built-in superconductive liquid of heat pipe 31.
As seen from Figure 1, in the refrigeration module, the radiator being made up of L-shaped heat pipe 31, absorber plate 32 and groups of fins 33
3 overall L-shaped flap-likes, so when its absorber plate 32 and the correspondence of heat transmitter 2 are fitted in hot junction and the cold end of semiconductor chilling plate 1
Afterwards, two of groups of fins 33 big faces towards absorber plate 32 and will not can be respectively facing two adjacent faces of housing 4
（Reference picture 4, two big faces of groups of fins 33 are respectively facing the top surface and left surface of housing 4）, so as to by heat energy from housing 4
Both direction is distributed, and improves radiating efficiency.
The thermal conductivity factor of red copper about 400W/m.k, the material thermal conductivity factor about 200W/m.k of aluminium 6063 or 1060.In order to improve
Radiating efficiency, people usually expect the material using high thermal conductivity coefficient, and such as red copper does absorber plate and heat transmitter, but relatively
In aluminium, red copper is more expensive and processing difficulties.Inventor is by research, it is proposed that by structure optimization so that using inexpensive, easy
The heat transmitter 2 of 6063 or 1060 aluminiums manufacture and the effect of absorber plate 32 of processing are better than red copper heat transmitter and red copper absorber plate.
Specifically, a kind of preferably 6063 aluminiums of design or the structure of 1060 aluminium heat transmitters 2 are：The thickness of heat transmitter substrate 21
Be 2mm~5mm, the thickness of heat transmitter fin 22 is 0.4mm~0.6mm, be highly between 40mm~65mm, adjacent fin 22 between
Gap is 1.2mm~2mm.When absorber plate 32 is using 6063 aluminiums or 1060 aluminium, heat pipe 31 must be selected and filled in by various in pipe
Different superconductive liquid materials adjusts the super heat-conductive pipe of the mixed superconduction mixing liquid for constituting through ratio, preferably fills in following superconducting fluid
Body：By weight, the superconductive liquid is by 1~1.5 part of NaOH, 4~5 parts of potassium chromates, 1570~1580 parts of ethanol and 8030
~8040 parts of water compositions.Additionally, the diameter of heat pipe 31 need to be 8mm~10mm, the spacing between the edge of adjacent heat pipe 31 need to for 1mm~
3mm, the bottom of heat pipe 31 need to be 1mm~2.5mm with the thickness sum of the bottom of absorber plate 32, and the efficiency of aluminium absorber plate 32 can just surpassed
More red copper heat absorption plate efficiency.The size of absorber plate 32 it is big as semiconductor chilling plate 1 or it is big a bit.
Preferably, the surface of fin 22 constitutes the corrugated ridge 23（See Fig. 4）It is vertical with semiconductor chilling plate 1, this
Sample has reached into the air channel of curved narrow between adjacent fin 22, can further lift heat absorption efficiency.
Reference picture 2-4, this four air port refrigerating plant include housing 4, arc 5 and above-mentioned refrigeration module.
Housing 4 has main casing portion 41 and from the downward projection of air channel 43 of first air channel 42 and second in the bottom of main casing portion 41,
First air channel 42 and the second air channel 43 is separated by a distance and its lower end is correspondingly arranged the first air port 44 and the second air port 45, main casing
The top in portion 41 and rear lateral portion are correspondingly arranged the 3rd air port 46 and the 4th air port 47, and the second air port 45 sets aerofoil fan 45 ', the
Three air port 46 sets aerofoil fan 46 ', and the 4th air port 47 sets aerofoil fan 47 '.
Arc 5 is arranged at interior main casing portion 41 and the first air channel 42 and the second air channel 43 surrounds an inverted U-shaped circulation air path
51, the arc 5 sets a pilot hole 52.
The semiconductor chilling plate 1 of refrigeration module is placed in pilot hole 52, and heat transmitter 2 is placed in inverted U-shaped circulation air path 51, is dissipated
Hot device 3 is placed in the upside of the arc plate 5 of housing 4, one of the groups of fins 33 of radiator 3 it is big facing to the 3rd air port 46, it is another
One big facing to the 4th air port 47.
Its course of work is：Air enters inverted U-shaped circulation air path 51, the fin 22 by heat transmitter 2 from the first air port 44
Between gap（Curved narrow air channel）And then flowed out from the second air port 45.In the process, semiconductor chilling plate 1 is powered cold
End produces refrigerating effect so that heat energy when air flows through the gap between fin 22 in air is absorbed, while semiconductor system
After the heat energy in cold 1 hot junction passes sequentially through absorber plate 32, heat pipe 31 and groups of fins 33, from the 3rd air port 46 at the top of housing 4
The 4th air port 47 with housing sidepiece distributes.
Reference picture 4, the first air port 44 is to left avertence, the second air port 45 to 45 points of right avertence, i.e. the first air port 44 and the second air port
Not to the direction for mutually deviating from partially, the center line of the two is in splayed.Air can so preferably circulated, by falling U
Shape circulation air path 51.
Thermal insulation layer 6 further can also be set on arc 5.
Inverted U-shaped circulation air path 51 is divided into two sections by heat transmitter 2, and the gap between heat transmitter fin 22 constitutes described two sections
Between connection air channel.So ensure that air all passes through from the gap between the fin 22 of heat transmitter, realize more preferable
Heat-transfer effect.
Claims (7)
1. a kind of four air port refrigerating plant, it is characterised in that including：
Housing (4), the housing has main casing portion (41) and from downward projection of first air channel (42) in main casing portion bottom and second
Air channel (43), the first air channel and the second air channel is separated by a distance and its lower end is correspondingly arranged the first air port (44) and the second air port
(45), the top in main casing portion and rear lateral portion are correspondingly arranged the 3rd air port (46) and the 4th air port (47), second, third and the 4th wind
Mouth is respectively provided with aerofoil fan (45 ', 46 ', 47 ')；
Arc (5), is arranged in the main casing portion (41) and first air channel and the second air channel surround one and inverted U-shaped follow
Ring air channel (51), the arc sets a pilot hole (52)；And
Refrigeration module, the refrigeration module includes semiconductor chilling plate (1), heat transmitter (2) and radiator (3)；Heat transmitter (2) by
Substrate (21) and the fin (22) that is a plurality of relative and being separated by certain interval taken shape on the substrate are constituted, the fin surface
Undulate, the substrate is fitted with the cold end of the semiconductor chilling plate；Radiator (3) is by L-shaped heat pipe (31) and correspondence set
Absorber plate (32) and groups of fins (33) in the two-arm of L-shaped heat pipe are constituted, overall L-shaped flap-like, the absorber plate
Hot junction with the semiconductor chilling plate is fitted, the built-in superconductive liquid of heat pipe；The semiconductor chilling plate (1) of the refrigeration module
It is placed in the pilot hole (52), heat transmitter (2) is placed in the inverted U-shaped circulation air path (51), and radiator (3) is placed in housing
Two big faces of the upside of arc (5) and its groups of fins (33) are corresponding towards the 3rd air port (46) and the 4th air port
(47)。
2. four air port according to claim 1 refrigerating plant, it is characterised in that：The material of the heat transmitter (2) is 6063
Aluminium or 1060 aluminiums, the thickness of heat transmitter substrate (21) is 2mm~5mm, the thickness of heat transmitter fin (22) for 0.4mm~
0.6mm, highly it is 40mm~65mm, the gap between adjacent fin (22) is 1.2mm~2mm.
3. four air port according to claim 1 refrigerating plant, it is characterised in that：Heat transmitter fin (22) surface constitutes described
Corrugated ridge (23) is vertical with the semiconductor chilling plate (1).
4. four air port according to claim 1 refrigerating plant, it is characterised in that：The absorber plate (32) of the radiator (3)
Material be 6063 aluminiums or 1060 aluminiums；A diameter of 8mm~10mm of the heat pipe (31), the intermarginal spacing of adjacent heat tube edge
It is 1mm~3mm, heat pipe bottom is 1mm~2.5mm with the thickness sum of absorber plate bottom；
By weight, the superconductive liquid by 1~1.5 part of NaOH, 4~5 parts of potassium chromates, 1570~1580 parts of ethanol and
8030~8040 parts of pure water compositions.
5. four air port refrigerating plants according to Claims 1-4 any one, it is characterised in that：First air port
(44) inclined to the direction for mutually deviating from the second air port (45), the center line of the two is in splayed.
6. four air port refrigerating plants according to Claims 1-4 any one, it is characterised in that：On the arc (5)
Thermal insulation layer (6) is set.
7. four air port refrigerating plants according to Claims 1-4 any one, it is characterised in that：The heat transmitter (2) will
The inverted U-shaped circulation air path (51) is divided into two sections, the company between the gap composition between heat transmitter fin (22) is described two sections
Give a dinner for a visitor from afar, the connection air channel undulate is the crucial air channel for discharging low temperature absorption high temperature or release high temperature absorption low temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410128562.4A CN104976810B (en) | 2014-04-01 | 2014-04-01 | Four air port refrigerating plants and its refrigeration module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410128562.4A CN104976810B (en) | 2014-04-01 | 2014-04-01 | Four air port refrigerating plants and its refrigeration module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104976810A CN104976810A (en) | 2015-10-14 |
| CN104976810B true CN104976810B (en) | 2017-06-23 |
Family
ID=54273567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410128562.4A Active CN104976810B (en) | 2014-04-01 | 2014-04-01 | Four air port refrigerating plants and its refrigeration module |
Country Status (1)
| Country | Link |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106979632A (en) * | 2017-04-20 | 2017-07-25 | 华南理工大学 | A kind of oil cooling type semiconductor cold-hot double purpose device |
| CN114760813A (en) * | 2022-04-01 | 2022-07-15 | 乐山希尔电子股份有限公司 | Heat dissipation method of electronic integrated module |
| CN115076813B (en) * | 2022-06-23 | 2024-09-27 | 珠海格力电器股份有限公司 | Heat exchange system, air conditioner and control method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2394140Y (en) * | 1999-11-19 | 2000-08-30 | 赵立仁 | Semiconductor heat pipe air conditioner |
| CN101233798A (en) * | 2005-09-20 | 2008-07-30 | 松下电器产业株式会社 | Cooler for heater-containing box |
| CN102128518A (en) * | 2010-11-25 | 2011-07-20 | 华为技术有限公司 | TEC (Thermoelectric Cooling Module) refrigerating device and electrical device using same |
| CN102128517A (en) * | 2010-01-13 | 2011-07-20 | 林义民 | Cold and hot exchange device |
| CN103206805A (en) * | 2013-04-12 | 2013-07-17 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001208465A (en) * | 2000-01-31 | 2001-08-03 | Pentel Corp | Appliance for thermal insulation of drink |
-
2014
- 2014-04-01 CN CN201410128562.4A patent/CN104976810B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2394140Y (en) * | 1999-11-19 | 2000-08-30 | 赵立仁 | Semiconductor heat pipe air conditioner |
| CN101233798A (en) * | 2005-09-20 | 2008-07-30 | 松下电器产业株式会社 | Cooler for heater-containing box |
| CN102128517A (en) * | 2010-01-13 | 2011-07-20 | 林义民 | Cold and hot exchange device |
| CN102128518A (en) * | 2010-11-25 | 2011-07-20 | 华为技术有限公司 | TEC (Thermoelectric Cooling Module) refrigerating device and electrical device using same |
| CN103206805A (en) * | 2013-04-12 | 2013-07-17 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
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|---|---|
| CN104976810A (en) | 2015-10-14 |
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Effective date of registration: 20180410 Address after: 215000 Tongxin Road, Suzhou hi tech Zone, Jiangsu Province, No. 58 Patentee after: Suzhou Rongray Nano Composite Technology Co., Ltd. Address before: 10 floor, Lane 204, Songshan Road, Xinyi District, Taipei, Taiwan, China. 1 Co-patentee before: Dai Mingguang Patentee before: Yang Ransen |
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