CN115076813B - Heat exchange system, air conditioner and control method - Google Patents
Heat exchange system, air conditioner and control method Download PDFInfo
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- CN115076813B CN115076813B CN202210719178.6A CN202210719178A CN115076813B CN 115076813 B CN115076813 B CN 115076813B CN 202210719178 A CN202210719178 A CN 202210719178A CN 115076813 B CN115076813 B CN 115076813B
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000004065 semiconductor Substances 0.000 claims abstract description 130
- 239000003507 refrigerant Substances 0.000 claims abstract description 10
- 238000005057 refrigeration Methods 0.000 claims description 74
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 74
- 238000010438 heat treatment Methods 0.000 claims description 35
- 238000001816 cooling Methods 0.000 claims description 27
- 230000017525 heat dissipation Effects 0.000 claims description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 238000010981 drying operation Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims 1
- 238000005265 energy consumption Methods 0.000 abstract description 10
- 230000002035 prolonged effect Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 description 11
- 238000004378 air conditioning Methods 0.000 description 10
- 230000005679 Peltier effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/65—Electronic processing for selecting an operating mode
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/70—Control systems characterised by their outputs; Constructional details thereof
- F24F11/72—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure
- F24F11/74—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure for controlling air flow rate or air velocity
- F24F11/77—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure for controlling air flow rate or air velocity by controlling the speed of ventilators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/70—Control systems characterised by their outputs; Constructional details thereof
- F24F11/80—Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air
- F24F11/86—Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air by controlling compressors within refrigeration or heat pump circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0007—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater cooling apparatus specially adapted for use in air-conditioning
- F24F5/001—Compression cycle type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
- F24F2110/10—Temperature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
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- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Signal Processing (AREA)
- Fluid Mechanics (AREA)
- Mathematical Physics (AREA)
- Fuzzy Systems (AREA)
- Thermal Sciences (AREA)
- Air Conditioning Control Device (AREA)
Abstract
The invention discloses a heat exchange system, an air conditioner and a control method, relates to the field of air conditioners, and solves the problem that an air conditioner indoor unit cannot blow cold air or hot air within a period of time after the air conditioner is started in the prior art. The heat exchange system comprises a first heat exchange mechanism and a second heat exchange mechanism, wherein the first heat exchange mechanism is a refrigerant heat exchange mechanism and is used for carrying out primary heat exchange on air, the second heat exchange mechanism is a semiconductor heat exchange mechanism and is used for carrying out secondary heat exchange on at least part of air after the primary heat exchange. According to the heat exchange system, the first heat exchange mechanism is combined with the second heat exchange mechanism, so that the first gust perceived by an indoor unit of the air conditioner after being started is cold air or hot air, and the using body feeling of a user is improved; on the other hand, the time for maintaining the strong load operation of the compressor in the first heat exchange mechanism can be reduced, the energy consumption can be reduced, the service life of the compressor can be prolonged, and the service cycle of the air conditioner can be prolonged.
Description
Technical Field
The invention relates to the technical field of air conditioners, in particular to a heat exchange system, an air conditioner and a control method.
Background
In the prior art, the air conditioner heat exchange system consists of a compressor, a condenser, a liquid storage dryer, an expansion valve, an evaporator, a blower and the like, and all the components are connected into a closed system by adopting a copper pipe (or an aluminum pipe) and a high-pressure rubber pipe. The larger energy consumption component of the air conditioner is a compressor, and the compressor starts to work under the drive of a motor to drive the refrigerant to circularly flow in the sealed air conditioning system so as to realize refrigeration or heating.
However, the applicant has found that the existing air conditioning heat exchange systems have at least the following drawbacks: (1) After the air conditioner is started, the compressor and the fan act firstly, the compressor needs to circulate the refrigerant in the whole air conditioner pipeline system, after the refrigerant circulates, the air blown out by the indoor unit through the evaporator is really cold air or hot air, and as the compressor circulates the refrigerant for a certain time, the indoor unit of the air conditioner cannot blow out the cold air or the hot air in a period of time after the air conditioner is started; (2) When it is desired to achieve rapid cooling or heating in a short period of time, the compressor needs to be maintained in a strong load state to operate, affecting the service life of the compressor.
The prior art discloses a Peltier effect environment-friendly air conditioner which comprises an indoor host system, a heat radiation system and a hot water supply system, wherein low temperature generated by a semiconductor refrigeration sheet set of the indoor host system is blown out by a cooling fan, namely cold air generated by the refrigeration air conditioner can cool the indoor, high temperature generated by the semiconductor refrigeration sheet set of a refrigeration device is conducted to a hot end water tank, and hot water in the hot end water tank is conveyed to the heat radiation system through a pipeline; or the hot water in the hot-end water tank is conveyed to a hot water supply system through a pipeline, and the hot water can supply domestic water for people. Although the peltier effect environment-friendly air conditioner can realize refrigeration without using a compressor and a refrigerant, the refrigeration effect is still to be improved, and the use experience effect is poor.
Disclosure of Invention
One of the purposes of the invention is to provide a heat exchange system, which solves the technical problem that an air conditioner indoor unit cannot blow cold air or hot air in a period of time after the air conditioner is started in the prior art. The technical effects that can be produced by the preferred technical scheme of the present invention are described in detail below.
In order to achieve the above purpose, the present invention provides the following technical solutions:
The heat exchange system comprises a first heat exchange mechanism and a second heat exchange mechanism, wherein the first heat exchange mechanism is a refrigerant heat exchange mechanism and is used for carrying out primary heat exchange on air, the second heat exchange mechanism is a semiconductor heat exchange mechanism and is used for carrying out secondary heat exchange on at least part of air after the primary heat exchange.
According to a preferred embodiment, the second heat exchange mechanism comprises a semiconductor cooling fin electrically connected to a power source for powering the semiconductor cooling fin.
According to a preferred embodiment, the second heat exchange mechanism further comprises an air duct, the semiconductor refrigeration sheet is fixed in the air duct, and the semiconductor refrigeration sheet separates the air duct into a cold air duct and a hot air duct.
According to a preferred embodiment, the second heat exchange mechanism further comprises a cold air cavity and a hot air cavity, and the cold air cavity is communicated with the cold air duct, and the hot air cavity is communicated with the hot air duct.
According to a preferred embodiment, the second heat exchange mechanism further comprises a first fan and a second fan, wherein the first fan is arranged at the joint of the cold air cavity and the cold air duct, and the second fan is arranged at the joint of the hot air cavity and the hot air duct.
According to a preferred embodiment, the air duct is of an arc-shaped structure, the cold air cavity and the hot air cavity are arranged at two ends of the air duct, and the semiconductor refrigerating sheet is arranged in the middle of the air duct.
According to a preferred embodiment, the air duct is provided with a first air hole for air circulation.
According to a preferred embodiment, a second air hole is arranged on one of the cold air cavity and the hot air cavity, and the second air hole is used for ventilation; the other one of the cold air cavity and the hot air cavity is of a closed structure.
According to a preferred embodiment, the hot air cavity is located above a water pan of the air conditioner.
According to a preferred embodiment, the heat end surface of the semiconductor refrigeration sheet is provided with a heat dissipation assembly, and the heat dissipation assembly is used for dissipating heat generated by the heat end surface of the semiconductor refrigeration sheet.
According to a preferred embodiment, the heat dissipation assembly comprises a heat dissipation paste layer and/or a heat dissipation aluminum block, wherein the heat dissipation paste layer is coated on the hot end surface of the semiconductor refrigeration sheet, and the thickness of the heat dissipation paste layer is 0.1-0.5 mm; the heat dissipation aluminum block is fixed on the hot end face of the semiconductor refrigerating sheet.
The heat exchange system provided by the invention has at least the following beneficial technical effects:
According to the heat exchange system, the first heat exchange mechanism and the second heat exchange mechanism are combined, so that at least part of air can perform double heat exchange, rapid refrigeration or rapid heating can be realized, the air conditioning system can reach the set temperature at the highest speed and can be maintained for a long time, and energy rationalization and application are realized. Therefore, the heat exchange system can lead the first gust perceived by the indoor unit of the air conditioner after the indoor unit of the air conditioner is started to be cold air or hot air, improve the using body feeling of a user, and solve the technical problem that the indoor unit of the air conditioner cannot blow out the cold air or the hot air in a period of time after the air conditioner is started in the prior art; on the other hand, through combining first heat transfer mechanism with second heat transfer mechanism, still reducible first heat transfer mechanism in the compressor maintain the time of strong load operation, reduce the energy consumption, still can increase the life of compressor, prolong the life of air conditioner, solved the air conditioner among the prior art hope when realizing quick refrigeration or heating in the short time, need the compressor to maintain to operate under the strong load state, influence the problem of compressor's life.
A second object of the present invention is to provide an air conditioner.
The air conditioner comprises a shell and a heat exchange system, wherein the heat exchange system is the heat exchange system according to any technical scheme of the invention, the heat exchange system is arranged in the shell, an air outlet is further formed in the shell, and air subjected to primary heat exchange and secondary heat exchange with the heat exchange system is blown out from the air outlet.
According to a preferred embodiment, a water receiving disc is further arranged in the shell, the water receiving disc is located below the hot air cavity of the heat exchange system, and the water receiving disc is of a structure which is inclined downwards towards the inlet of the hot air cavity.
According to a preferred embodiment, a humidity sensor is arranged in the water receiving disc, the humidity sensor is located at one end, close to the inlet of the hot air cavity, in the water receiving disc, and the humidity sensor is used for detecting humidity in the water receiving disc.
The air conditioner provided by the invention has at least the following beneficial technical effects:
The air conditioner provided by the invention has the advantages that the heat exchange system of any one of the technical schemes can realize rapid refrigeration or rapid heating, so that the air conditioner system can reach the set temperature at the highest speed and maintain for a long time, and the reasonable application of energy is realized. Therefore, the air conditioner can lead the first gust perceived by the air conditioner indoor unit after the air conditioner indoor unit is started to be cold air or hot air, improves the using body feeling of a user, and solves the technical problem that the air conditioner indoor unit cannot blow out the cold air or the hot air in a period of time after the air conditioner indoor unit is started in the prior art; on the other hand, through combining first heat transfer mechanism with second heat transfer mechanism, still reducible first heat transfer mechanism in the compressor maintain the time of strong load operation, reduce the energy consumption, still can increase the life of compressor, prolong the life of air conditioner, solved the air conditioner among the prior art hope when realizing quick refrigeration or heating in the short time, need the compressor to maintain to operate under the strong load state, influence the problem of compressor's life.
A third object of the present invention is to provide a control method of an air conditioner.
The control method of the air conditioner according to any one of the technical schemes of the invention comprises the following steps:
Acquiring an operation mode of an air conditioner;
And adjusting the power-on duty ratio of the semiconductor refrigerating sheet, the frequency of the compressor and/or the rotating speed of the indoor unit fan based on the operation mode of the air conditioner, and keeping the ambient temperature at the target temperature set by a user.
According to a preferred embodiment, the operation mode of the air conditioner includes an instantaneous quick-change mode, and when the air conditioner is in the instantaneous quick-change mode, the method comprises the steps of:
Acquiring an ambient temperature T 1, a temperature T 2 at an air outlet and a target temperature T 3 set by a user;
Calculating a difference delta T 1 between a target temperature T 3 set by a user and an ambient temperature T 1, and calculating a difference delta T 2 between a temperature T 2 at an air outlet and the ambient temperature T 1;
And adjusting the duty ratio of the power-on of the semiconductor refrigerating sheet, the frequency of the compressor and the rotating speed of the indoor unit fan based on the difference value delta T 1 between the target temperature T 3 set by a user and the ambient temperature T 1 and/or the difference value delta T 2 between the temperature T 2 at the air outlet and the ambient temperature T 1, and keeping the ambient temperature at the target temperature set by the user.
According to a preferred embodiment, the instantaneous quick-heating mode includes an instantaneous quick-cooling mode and an instantaneous quick-heating mode, and when the air conditioner is in the instantaneous quick-cooling mode, and
When the delta T 1 is less than or equal to minus 5 ℃ or delta T 2 is more than or equal to 5 ℃, the duty ratio of the power obtained by the semiconductor refrigerating sheet is adjusted to 100%, the compressor is adjusted to operate at the maximum frequency, and the indoor unit fan is adjusted to operate at the highest wind level;
When the temperature is minus 5 ℃ and is less than DeltaT 1 and less than 0 ℃ or the temperature is less than DeltaT 2 and is less than 5 ℃, the duty ratio of the power obtained by the semiconductor refrigerating sheet is adjusted towards the direction of reducing, the compressor is adjusted to operate under 80% of the maximum frequency, and the indoor unit fan is adjusted to operate at the highest wind level;
When the delta T 1 is more than or equal to 0 ℃ or the delta T 2 is less than or equal to 0 ℃, the duty ratio of the power of the semiconductor refrigerating sheet is reduced to 0, the first fan and the second fan are powered off, the compressor is adjusted to operate under 60% of the maximum frequency, and the indoor unit fan is adjusted to operate in a middle gear.
According to a preferred embodiment, the duty cycle of the semiconductor refrigeration tablet power up is linearly related to the magnitude of the difference Δt 1 between the user-set target temperature T 3 and the ambient temperature T 1.
According to a preferred embodiment, the operation mode of the air conditioner further includes a normal heat exchange mode, and when the air conditioner is in the normal heat exchange mode, the method includes the steps of:
The frequency of the compressor is obtained and,
The operating state of the semiconductor refrigeration sheet is adjusted based on the frequency of the compressor, and the compressor is maintained to operate at 80% of the maximum frequency.
According to a preferred embodiment, the semiconductor refrigeration sheet is controlled to be in a non-operating state when the compressor frequency is less than 80% of the maximum frequency;
When the frequency of the compressor is more than or equal to 80% of the maximum frequency, the semiconductor refrigerating sheet is controlled to be in a working state, and the compressor is kept to run at 80% of the maximum frequency by adjusting the duty ratio of power obtained by the semiconductor refrigerating sheet.
According to a preferred embodiment, the operation mode of the air conditioner further includes a drying operation mode, and when the air conditioner is in the drying operation mode, the method includes the steps of:
acquiring the humidity in the water receiving disc;
and adjusting the working states of the semiconductor refrigerating sheet and the second fan based on the humidity in the water receiving disc, and enabling the humidity in the water receiving disc to be less than 50%.
According to a preferred embodiment, when the humidity in the water receiving disc is more than or equal to 50%, the duty ratio of the power obtained by the semiconductor refrigerating sheet is adjusted to 100%, and the second fan is in an on state;
when the humidity in the water receiving disc is less than 50%, the duty ratio of the semiconductor refrigerating sheet to power is reduced to 0, the second fan is in a closed state, and the unit enters a standby state.
The control method of the air conditioner provided by the invention has at least the following beneficial technical effects:
The control method of the air conditioner comprises the following steps: acquiring an operation mode of an air conditioner; the duty ratio of the power-on of the semiconductor refrigerating sheet, the frequency of the compressor and/or the rotating speed of the fan of the indoor unit are/is adjusted based on the running mode of the air conditioner, and the ambient temperature is kept at the target temperature set by a user, so that the rapid refrigeration or rapid heating can be realized, the air conditioning system can reach the set temperature at the fastest speed and can be maintained for a long time, and the reasonable application of energy is realized. Therefore, the control method of the air conditioner can lead the first gust perceived by the indoor unit of the air conditioner after the indoor unit of the air conditioner is started to be cold air or hot air, improve the using body feeling of a user, and solve the technical problem that the indoor unit of the air conditioner cannot blow out the cold air or the hot air within a period of time after the air conditioner is started in the prior art; on the other hand, the time for maintaining the strong load operation of the compressor in the first heat exchange mechanism can be reduced, the energy consumption can be reduced, the service life of the compressor can be prolonged, the service period of the air conditioner can be prolonged, and the problems that the service life of the compressor is influenced because the compressor is required to be maintained to operate in a strong load state when the air conditioner in the prior art hopes to realize rapid refrigeration or heating in a short time are solved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a first partial schematic view of a preferred embodiment of an air conditioner of the present invention;
FIG. 2 is a second partial schematic view of a preferred embodiment of the air conditioner of the present invention;
FIG. 3 is a schematic view of a preferred embodiment of a second heat exchange mechanism of the present invention;
FIG. 4 is a schematic diagram of a semiconductor refrigeration sheet of the present invention connected to a power source;
FIG. 5 is a schematic view of a preferred embodiment of a control method of an air conditioner according to the present invention;
fig. 6 is a schematic diagram of a control method of the air conditioner in the instant quick heat exchange mode.
In the figure: 101. a semiconductor refrigeration sheet; 102. a power supply; 103. an air duct; 1031. a first wind hole; 104. a cold air chamber; 1041. a second air hole; 105. a hot air chamber; 106. a first fan; 107. a second fan; 20. a housing; 201. an air outlet; 202. and (5) a water receiving tray.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, based on the examples herein, which are within the scope of the invention as defined by the claims, will be within the scope of the invention as defined by the claims.
The heat exchange system, the air conditioner and the control method of the present invention will be described in detail with reference to fig. 1 to 6 of the accompanying drawings and examples 1 to 3.
Example 1
The heat exchange system of the present invention will be described in detail in this example.
The heat exchange system of the embodiment comprises a first heat exchange mechanism and a second heat exchange mechanism. Preferably, the first heat exchange mechanism is a refrigerant heat exchange mechanism, and the first heat exchange mechanism is used for carrying out primary heat exchange on air. Preferably, the second heat exchange mechanism is a semiconductor heat exchange mechanism, and the second heat exchange mechanism is used for performing secondary heat exchange on at least part of air after performing primary heat exchange. The first heat exchange mechanism is a heat exchange mechanism commonly used in the existing air conditioning system, and specifically comprises a compressor, a condenser, a liquid storage dryer, an expansion valve, an evaporator, a blower and the like, wherein the compressor drives a refrigerant to circularly flow in each part so as to realize refrigeration or heating. The structure and the working principle of the first heat exchange mechanism are not described in detail here. More preferably, part of air subjected to heat exchange by the first heat exchange mechanism is blown out from an air outlet of the air conditioner; the rest air can enter the second heat exchange mechanism, and the second heat exchange mechanism carries out secondary heat exchange to enable the air to become cold air with lower temperature (the air conditioner is in a refrigerating mode) or hot air with higher temperature (the air conditioner is in a heating mode), and the air after secondary heat exchange is blown out from an air outlet of the air conditioner, so that the air felt by a user is mixed air of primary heat exchange and secondary heat exchange, quick refrigeration or quick heating can be realized, the air conditioning system can reach the set temperature at the fastest speed and can be maintained for a long time, and the use experience of the user can be improved.
According to the heat exchange system, the first heat exchange mechanism and the second heat exchange mechanism are combined, so that at least part of air can perform double heat exchange, rapid refrigeration or rapid heating can be realized, the air conditioning system can reach the set temperature at the highest speed and can maintain the set temperature for a long time, and energy rationalization and application are realized. Therefore, the heat exchange system of the embodiment can lead the first gust perceived by the indoor unit of the air conditioner to be cold air or hot air, improve the using body feeling of a user, and solve the technical problem that the indoor unit of the air conditioner cannot blow out the cold air or the hot air in a period of time after the air conditioner is started in the prior art; on the other hand, through combining first heat transfer mechanism with second heat transfer mechanism, still reducible first heat transfer mechanism in the compressor maintain the time of strong load operation, reduce the energy consumption, still can increase the life of compressor, prolong the life of air conditioner, solved the air conditioner among the prior art hope when realizing quick refrigeration or heating in the short time, need the compressor to maintain to operate under the strong load state, influence the problem of compressor's life.
According to a preferred embodiment, the second heat exchange mechanism comprises a semiconductor cooling fin 101 and a power source 102, the semiconductor cooling fin 101 being electrically connected to the power source 102, and the power source 102 being used to power the semiconductor cooling fin 101, as shown in fig. 4. Preferably, the semiconductor refrigeration sheet 101, also called a thermoelectric refrigeration sheet, is a heat pump, and utilizes the peltier effect of semiconductor materials to generate heat and cold. More preferably, the semiconductor cooling sheet 101 has an N-type semiconductor on one side and a P-type semiconductor on the other side. The material of the semiconductor may be of the type known in the art, and is not limited herein. Specifically, when the power supply 102 supplies power to the semiconductor refrigerating sheet 101, the direct current passes through the couple formed by connecting two different semiconductor materials in series, the two ends of the couple can absorb heat and release heat respectively, so that the purposes of refrigeration and heating can be realized. It is understood that when direct current is applied to the semiconductor cooling fin 101, the semiconductor cooling fin 101 may be cooled and heated. More specifically, by changing the direction of the current, the semiconductor cooling sheet 101 can be heated while cooling is performed before heating. According to the heat exchange system of the preferred technical scheme of the embodiment, the second heat exchange mechanism comprises the semiconductor refrigerating sheet 101 and the power supply 102, the power supply 102 supplies power to the semiconductor refrigerating sheet 101, so that the semiconductor refrigerating sheet 101 can refrigerate and heat at one side, the first heat exchange mechanism can be assisted in refrigerating or heating, rapid refrigerating or rapid heating is realized, the air conditioning system can reach a set temperature at the highest speed and can be maintained for a long time, and energy rationalization and application are realized.
According to a preferred embodiment, the second heat exchanging mechanism further comprises a wind channel 103, the semiconductor refrigeration sheet 101 is fixed in the wind channel 103, and the semiconductor refrigeration sheet 101 separates the wind channel 103 into a cold wind channel and a hot wind channel, as shown in fig. 2 and 3. Preferably, the air duct 103 is provided with a first air hole 1031, and the first air hole 1031 is used for air circulation, as shown in fig. 3. The first wind hole 1031 may have various shapes, such as a circle, a square, a triangle, etc.; the number of first wind holes 1031 may be determined based on the size of the wind tunnel 103 and the aperture of the first wind holes 1031. In the heat exchange system according to the preferred embodiment, the second heat exchange mechanism further includes an air duct 103, where the air duct 103 may be used to fix the semiconductor refrigeration sheet 101, and may also be used to circulate cool air and hot air generated by the semiconductor refrigeration sheet 101, and specifically, the directions of arrows in fig. 2 show the directions of the cool air and the hot air generated by the semiconductor refrigeration sheet 101. Further, the air duct 103 is provided with a first air hole 1031, and cold air and hot air generated by the semiconductor refrigeration sheet 101 can exchange heat with the rest of air by the action of the first air hole 1031.
According to a preferred embodiment, the second heat exchange mechanism further comprises a cold air chamber 104 and a hot air chamber 105, and the cold air chamber 104 is in communication with a cold air duct, and the hot air chamber 105 is in communication with a hot air duct, as shown in fig. 2 and 3. Preferably, one of the cold air chamber 104 and the hot air chamber 105 is provided with a second air hole 1041, and the second air hole 1041 is used for ventilation; the other of the cool air chamber 104 and the warm air chamber 105 is a closed structure, as shown in fig. 2 and 3. More preferably, when the heat exchange system is a refrigeration system, the cold air cavity 104 is provided with a second air hole 1041, and the hot air cavity 105 is of a closed structure; when the heat exchange system is a heating system, the hot air cavity 105 is provided with a second air hole 1041, and the cold air cavity 104 is of a closed structure. According to the heat exchange system of the preferred technical scheme of the embodiment, the second heat exchange mechanism further comprises a cold air cavity 104 and a hot air cavity 105, the cold air cavity 104 is communicated with the cold air duct, the hot air cavity 105 is communicated with the hot air duct, so that cold air generated by the semiconductor refrigerating sheet 101 enters the cold air cavity 104, hot air generated by the semiconductor refrigerating sheet 101 enters the hot air cavity 105, and air subjected to heat exchange by the first heat exchange mechanism is subjected to secondary heat exchange in the cold air cavity 104 or the hot air cavity 105, and therefore rapid refrigeration or rapid heating is achieved.
According to a preferred embodiment, the second heat exchange mechanism further comprises a first fan 106 and a second fan 107, wherein the first fan 106 is disposed at the connection between the cold air chamber 104 and the cold air duct, and the second fan 107 is disposed at the connection between the hot air chamber 105 and the hot air duct, as shown in fig. 2 and 3. Preferably, the first fan 106 and the second fan 107 may be conventional low-power fans. In the heat exchange system according to the preferred embodiment, the second heat exchange mechanism further includes a first fan 106 and a second fan 107, and by the action of the first fan 106 and the second fan 107, the speed of cold air and hot air generated on both sides of the semiconductor refrigeration sheet 101 entering the cold air cavity 104 and the hot air cavity 105 can be increased.
According to a preferred embodiment, the air duct 103 has an arc-shaped structure, the cool air chamber 104 and the hot air chamber 105 are disposed at both ends of the air duct 103, and the semiconductor cooling fin 101 is disposed at the middle of the air duct 103, as shown in fig. 3. According to the heat exchange mechanism of the preferred technical scheme of the embodiment, the semiconductor refrigerating sheet 101 is arranged in the middle of the air duct 103, the cold air cavity 104 and the hot air cavity 105 are arranged at two ends of the air duct 103, the first fan 106 is arranged at the joint of the cold air cavity 104 and the cold air duct, and the second fan 107 is arranged at the joint of the hot air cavity 105 and the hot air duct, so that the distance between the first fan 106 and the second fan 107 and the semiconductor refrigerating sheet 101 is as small as possible, the energy transmission is facilitated, and the efficiency of cold air and hot air generated on two sides of the semiconductor refrigerating sheet 101 entering the cold air cavity 104 and the hot air cavity 105 is highest.
According to a preferred embodiment, the hot air cavity 105 is located above the water pan 202 of the air conditioner, as shown in FIG. 2. Preferably, when the heat exchange system is a refrigerating system, the hot air cavity 105 passes through the unit and has the same path with a drain pipe of the air conditioner, so that heat in the hot air cavity 105 can be discharged outdoors. Preferably, the cold air cavity 104 is arranged near the electrical box of the air conditioner, and heat dissipation and cooling can be performed on heating elements of the electrical box through cold air in the cold air cavity 104. According to the heat exchange mechanism of the preferred technical scheme of the embodiment, the hot air cavity 105 is positioned above the water receiving disc 202 of the air conditioner, accumulated water in the water receiving disc 202 can be dried through heat in the hot air cavity 105, and dirty blockage caused by long-time accumulated water in the water receiving disc 202 is prevented; the cold air cavity 104 is arranged near the electric box of the air conditioner, and heat dissipation and cooling can be performed on the heating element of the electric box through cold air in the cold air cavity 104, so that the reliability of the electric box can be improved. In the heat exchange system according to the preferred embodiment of the present invention, the cold air chamber 104 and the hot air chamber 105 are disposed at corresponding positions, so that the cooling capacity and the heat generated by the semiconductor cooling fin 101 can be used in various ways.
According to a preferred embodiment, the hot side of the semiconductor refrigeration sheet 101 is provided with a heat dissipating component for dissipating heat generated by the hot side of the semiconductor refrigeration sheet 101. Preferably, the heat dissipation assembly comprises a heat dissipation paste layer and/or a heat dissipation aluminum block, wherein the heat dissipation paste layer is coated on the hot end surface of the semiconductor refrigerating sheet 101, and the thickness of the heat dissipation paste layer is 0.1-0.5 mm; the heat-radiating aluminum block is fixed to the hot end face of the semiconductor cooling fin 101. More preferably, the thickness of the heat dissipating paste layer is 0.2mm. In the heat exchange system of the preferred technical scheme of the embodiment, when the heat exchange system is used for refrigeration, the heat end surface of the semiconductor refrigeration sheet 101 is provided with the heat dissipation component, and the heat generated by the heat end surface of the semiconductor refrigeration sheet 101 can be better dissipated through the heat dissipation component, so that the refrigeration effect of the cold end surface of the semiconductor refrigeration sheet 101 is favorably enhanced, and the refrigeration effect of the heat exchange system can be improved; correspondingly, when the heat exchange system is used for heating, the heat radiating component can better radiate the cold energy generated by the cold end surface of the semiconductor refrigerating plate 101, so that the heating effect of the hot end surface of the semiconductor refrigerating plate 101 is enhanced, and the heating effect of the heat exchange system can be improved.
Example 2
The present embodiment describes the air conditioner of the present invention in detail.
The air conditioner of the present embodiment includes a cabinet 20 and a heat exchange system, as shown in fig. 1 and 2. Preferably, the heat exchange system is the heat exchange system according to any one of the embodiments 1, the heat exchange system is disposed in the casing 20, the casing 20 is further provided with an air outlet 201, and air after primary heat exchange and secondary heat exchange with the heat exchange system is blown out from the air outlet 201, as shown in fig. 1 and 2. The remaining structure of the air conditioner may be the same as the prior art, and will not be described again here.
The air conditioner of the embodiment has the heat exchange system of any one of the technical schemes of the embodiment 1, and can realize rapid refrigeration or rapid heating, so that the air conditioner system can reach the set temperature at the fastest speed and maintain for a long time, and the energy rationalization application is realized. Therefore, the air conditioner of the embodiment can lead the first gust perceived by the air conditioner indoor unit after the air conditioner indoor unit is started to be cold air or hot air, improve the using body feeling of a user, and solve the technical problem that the air conditioner indoor unit cannot blow out the cold air or the hot air in a period of time after the air conditioner is started in the prior art; in addition, through combining first heat exchange mechanism with second heat exchange mechanism, still reducible first heat exchange mechanism in the compressor maintain the time of strong load operation, reduce the energy consumption, still can increase the life of compressor, prolong the life of air conditioner, solved the air conditioner among the prior art hope when realizing quick refrigeration or heating in the short time, need the compressor to maintain to operate under the strong load state, influence the problem of compressor's life.
According to a preferred embodiment, a water tray 202 is also provided within the housing 20, the water tray 202 being located below the hot air cavity 105 of the heat exchange system, as shown in FIG. 2. Preferably, the water pan 202 is inclined downward toward the inlet of the hot air chamber 105. In the air conditioner according to the preferred technical scheme of the embodiment, the water pan 202 is positioned below the hot air cavity 105 of the heat exchange system, so that accumulated water in the water pan 202 can be dried by heat in the hot air cavity 105, and dirty blockage caused by long-time accumulated water in the water pan 202 is prevented; further, the water receiving tray 202 is inclined downward toward the inlet of the hot air chamber 105, so that water in the water receiving tray 202 can flow to one end close to the inlet of the hot air chamber 105, and the drying effect of the hot air chamber 105 on the accumulated water in the water receiving tray 202 can be enhanced.
According to a preferred embodiment, a humidity sensor is disposed in the water pan 202, the humidity sensor is located at an end of the water pan 202 near the inlet of the hot air chamber 105, and the humidity sensor is used for detecting the humidity in the water pan 202. In the air conditioner according to the preferred embodiment, a humidity sensor is disposed in the water pan 202, the humidity in the water pan 202 can be detected by the humidity sensor, and the air conditioner can determine whether the water pan 202 needs to be dried based on the detection result of the humidity sensor.
Example 3
The present embodiment describes a control method of the air conditioner of the present invention in detail.
Fig. 5 shows a flowchart of a control method of the air conditioner. As shown in fig. 5, the control method of the air conditioner according to any one of the embodiments 2 includes the following steps:
and acquiring the operation mode of the air conditioner.
The duty ratio of the power supplied to the semiconductor refrigeration sheet 101, the compressor frequency, and/or the rotational speed of the indoor unit fan are adjusted based on the operation mode of the air conditioner, and the ambient temperature is maintained at a target temperature set by the user.
According to the control method of the air conditioner, the operation mode of the air conditioner is obtained; and adjusting the duty ratio of the power supply of the semiconductor refrigerating sheet, the frequency of the compressor and/or the rotating speed of the fan of the indoor unit based on the running mode of the air conditioner, and keeping the ambient temperature at the target temperature set by a user, so that rapid refrigeration or rapid heating can be realized, an air conditioning system can reach the set temperature at the fastest speed and can be maintained for a long time, and the reasonable application of energy is realized. Therefore, the control method of the air conditioner can enable the first gust perceived by the indoor unit of the air conditioner after the indoor unit of the air conditioner is started to be cold air or hot air, improve the using body feeling of a user, and solve the technical problem that the indoor unit of the air conditioner cannot blow out the cold air or the hot air in a period of time after the air conditioner is started in the prior art; on the other hand, the time for maintaining the strong load operation of the compressor in the first heat exchange mechanism can be reduced, the energy consumption can be reduced, the service life of the compressor can be prolonged, the service period of the air conditioner can be prolonged, and the problems that the service life of the compressor is influenced because the compressor is required to be maintained to operate in a strong load state when the air conditioner in the prior art hopes to realize rapid refrigeration or heating in a short time are solved.
According to a preferred embodiment, the operation mode of the air conditioner includes an instantaneous quick-change mode. The instant quick heat exchange mode is suitable for the starting instant of the air conditioner. As shown in fig. 6, when the air conditioner is in the instantaneous quick-change mode, the compressor is turned on, the semiconductor cooling fin 101, the first fan 106 and the second fan are all turned on, and after about 2 seconds, the indoor unit fan is turned on. Preferably, when the air conditioner is in the instantaneous quick heat exchange mode, the method comprises the following steps: the ambient temperature T 1, the temperature T 2 at the air outlet 201, and the target temperature T 3 set by the user are acquired. Specifically, the ambient temperature T 1 and the temperature T 2 at the air outlet 201 may be obtained by a temperature sensor, and the target temperature T 3 set by the user is set by the user and obtained by an input module. The difference Δt 1 between the target temperature T 3 set by the user and the ambient temperature T 1 is calculated, and the difference Δt 2 between the temperature T 2 at the air outlet 201 and the ambient temperature T 1 is calculated. Specifically, Δt 1＝T3－T1,ΔT2＝T2－T1. Based on the magnitude of the difference deltat 1 between the target temperature T 3 and the ambient temperature T 1 and/or the magnitude of the difference deltat 2 between the temperature T 2 at the outlet 201 and the ambient temperature T 1 set by the user, The duty ratio of the power to be supplied to the semiconductor refrigeration sheet 101, the frequency of the compressor, and the rotational speed of the indoor unit fan are adjusted, and the ambient temperature is maintained at a target temperature set by the user.
According to a preferred embodiment, the instantaneous quick heating mode includes an instantaneous quick cooling mode and an instantaneous quick heating mode. When the air conditioner is in an instantaneous rapid refrigeration mode and delta T 1 ℃ is less than or equal to minus 5 ℃ or delta T 2 is more than or equal to 5 ℃, the duty ratio of the power obtained by the semiconductor refrigerating sheet 101 is adjusted to 100%, the compressor is adjusted to the maximum frequency to operate, and the indoor unit fan is adjusted to the highest wind gear to operate; when the temperature is minus 5 ℃ and is less than DeltaT 1 and less than 0 ℃ or the temperature is less than DeltaT 2 and is less than 5 ℃, the duty ratio of the power obtained by the semiconductor refrigerating sheet 101 is adjusted towards the direction of reducing, the compressor is adjusted to operate under 80% of the maximum frequency, and the indoor unit fan is adjusted to operate at the highest wind level; when the delta T 1 is more than or equal to 0 ℃ or the delta T 2 is less than or equal to 0 ℃, the duty ratio of the power of the semiconductor refrigerating sheet 101 is reduced to 0, the first fan 106 and the second fan 107 are powered off, the compressor is adjusted to run under 60% of the maximum frequency, and the indoor unit fan is adjusted to run at a middle gear. It can be seen that the control method of the instant quick heating mode can be obtained based on the control method similar to the instant quick cooling mode.
The preferred technical solution of this embodiment is a control method of an air conditioner, Based on the magnitude of the difference deltat 1 between the target temperature T 3 and the ambient temperature T 1 and/or the magnitude of the difference deltat 2 between the temperature T 2 at the outlet 201 and the ambient temperature T 1 set by the user, The duty ratio, the frequency of the compressor and the rotating speed of the fan of the indoor unit, which are obtained by adjusting the semiconductor refrigerating sheet 101, are adjusted, and the environment temperature is kept at the target temperature set by the user, so that the air conditioner can realize rapid refrigeration or rapid heating, and the air conditioning system can reach the set temperature at the fastest speed and maintain for a long time, thereby realizing the reasonable application of energy. Specifically, when DeltaT 1 is less than or equal to minus 5 ℃ or DeltaT 2 is more than or equal to 5 ℃, namely the target temperature T 3 set by the user is 5 ℃ less than or equal to the ambient temperature T 1, Or when the temperature T 2 at the air outlet 201 is 5 ℃ higher than the ambient temperature T 1 and above, the duty ratio of the power supplied by the semiconductor refrigerating sheet 101 is adjusted to 100%, the compressor is adjusted to the maximum frequency to operate, and the indoor unit fan is adjusted to the maximum wind gear to operate, so that the first heat exchange mechanism and the second heat exchange mechanism of the air conditioner are operated under the full load condition, and the air conditioner can realize rapid refrigeration. when the temperature is minus 5 ℃ and is less than DeltaT 1 and less than 0 ℃ or the temperature is less than DeltaT 2 and is less than 5 ℃, the duty ratio of the power obtained by the semiconductor refrigerating sheet 101 is adjusted towards the direction of reducing, the compressor is adjusted to be operated under 80 percent of the maximum frequency, the indoor unit fan is adjusted to be operated at the highest wind level, the air conditioner is enabled to refrigerate through the first heat exchange mechanism, the second heat exchange mechanism is used for assisting in refrigeration, the time for maintaining the strong load operation of the compressor in the first heat exchange mechanism can be reduced, the energy consumption is reduced, the service life of the compressor can be prolonged, and the service cycle of the air conditioner can be prolonged. When DeltaT 1 is more than or equal to 0 ℃ or DeltaT 2 is less than or equal to 0 ℃, the duty ratio of the power of the semiconductor refrigerating sheet 101 is reduced to 0, the first fan 106 and the second fan 107 are powered off, the compressor is adjusted to be operated under 60% of the maximum frequency, the indoor unit fan is adjusted to be operated at a middle gear, at the moment, the ambient temperature T 1 is lower than the target temperature T 3 set by a user, auxiliary refrigeration is not needed by the second heat exchange mechanism, the compressor is regulated to run under 60% of the maximum frequency, and the indoor unit fan is regulated to run at the middle gear, so that the ambient temperature can be kept at the target temperature set by a user.
According to a preferred embodiment, the duty cycle at which the semiconductor refrigeration tablet 101 is powered is linearly related to the magnitude of the difference Δt 1 between the user-set target temperature T 3 and the ambient temperature T 1. For example, when Δt 1 = -4 ℃, the duty cycle of the power supplied to the semiconductor refrigeration sheet 101 is 80%; when Δt 1 = -3 ℃, the duty cycle of the power supplied to the semiconductor refrigeration sheet 101 is 60%. The duty ratio of the power supplied to the semiconductor refrigeration sheet 101 is not limited to this, and the difference Δt 1 between the target temperature T 3 set by the user and the ambient temperature T 1 may be the rest of the linear relationship. In the preferred technical solution of this embodiment, the duty ratio of the power obtained by the semiconductor refrigeration piece 101 is linearly related to the difference Δt 1 between the target temperature T 3 and the ambient temperature T 1 set by the user, the linear relationship between the target temperature T 3 and the ambient temperature T 1 is stored in advance, and the semiconductor refrigeration piece 101 can be quickly adjusted to the corresponding power obtained duty ratio by searching the linear relationship between the target temperature T 3 and the ambient temperature T 1.
According to a preferred embodiment, the operation mode of the air conditioner further includes a normal heat exchange mode. The normal heat exchange mode is an operation mode after the quick heat exchange mode is finished at the moment of starting the air conditioner. Preferably, when the air conditioner is in the normal heat exchange mode, the method comprises the following steps: the frequency of the compressor is obtained, the operating state of the semiconductor refrigeration sheet 101 is adjusted based on the frequency of the compressor, and the compressor is maintained to operate at 80% of the maximum frequency. More preferably, when the compressor frequency is less than 80% of the maximum frequency, the semiconductor refrigerating sheet 101 is controlled to be in a non-working state; when the frequency of the compressor is more than or equal to 80% of the maximum frequency, the semiconductor refrigerating sheet 101 is controlled to be in a working state, and the compressor is kept to operate at 80% of the maximum frequency by adjusting the duty ratio of power obtained by the semiconductor refrigerating sheet 101. The larger the compressor frequency, the higher the duty cycle at which the semiconductor refrigeration sheet 101 is powered.
According to the control method of the air conditioner in the preferred technical scheme of the embodiment, the working state of the semiconductor refrigerating sheet 101 is adjusted based on the frequency of the compressor, the compressor is maintained to operate at 80% of the maximum frequency, the pressure of the compressor can be shared by the semiconductor refrigerating sheet 101, so that the compressor is maintained to operate at 80% of the maximum frequency, the time for maintaining the strong load operation of the compressor can be reduced, the energy consumption can be reduced, the service life of the compressor can be prolonged, and the service period of the air conditioner can be prolonged. Specifically, when the compressor frequency is less than 80% of the maximum frequency, the semiconductor refrigerating sheet 101 is in a non-working state, and the semiconductor refrigerating sheet 101 is not required to share the pressure of the compressor; when the frequency of the compressor is more than or equal to 80% of the maximum frequency, the semiconductor refrigerating sheet 101 is controlled to be in a working state, and the compressor is maintained to run at 80% of the maximum frequency by adjusting the duty ratio of power obtained by the semiconductor refrigerating sheet 101, so that the pressure of the compressor can be shared by the semiconductor refrigerating sheet 101, and the time for maintaining the strong load running of the compressor is reduced.
According to a preferred embodiment, the operation mode of the air conditioner further includes a drying operation mode. The drying mode may be triggered by a user or automatically by the air conditioner. Preferably, when the air conditioner is in a drying operation mode, the method comprises the following steps: acquiring the humidity in the water pan 202; the operating states of the semiconductor refrigeration sheet 101 and the second fan 107 are adjusted based on the humidity in the water tray 202, and the humidity in the water tray 202 is made to be less than 50%. More preferably, when the humidity in the water pan 202 is more than or equal to 50%, the duty ratio of the power to be supplied to the semiconductor refrigeration sheet 101 is adjusted to 100%, and the second fan 107 is in an on state; when the humidity in the water pan 202 is less than 50%, the duty ratio of the semiconductor refrigerating sheet 101 to be powered is reduced to 0, the second fan 107 is in a closed state, and the unit enters a standby state.
According to the control method of the air conditioner in the preferred technical scheme of the embodiment, the working states of the semiconductor refrigerating sheet 101 and the second fan 107 are adjusted based on the humidity in the water receiving disc 202, specifically, when the humidity in the water receiving disc 202 is more than or equal to 50%, the duty ratio of the power supplied to the semiconductor refrigerating sheet 101 is adjusted to 100%, and the second fan 107 is in an on state, so that accumulated water in the water receiving disc 202 can be dried to the humidity less than 50% in the water receiving disc 202 through heat generated by the semiconductor refrigerating sheet 101, and dirty blockage caused by long-time accumulated water in the water receiving disc 202 is prevented; when the humidity in the water pan 202 is less than 50%, the duty ratio of the semiconductor refrigerating sheet 101 to be powered is reduced to 0, the second fan 107 is in a closed state, the unit enters a standby state, and the accumulated water in the water pan 202 is not required to be dried.
In the description of the present invention, it is to be noted that, unless otherwise indicated, the meaning of "plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "head," "tail," and the like are used as an orientation or positional relationship based on that shown in the drawings, merely to facilitate description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (14)
1. The heat exchange system is characterized by comprising a first heat exchange mechanism and a second heat exchange mechanism, wherein the first heat exchange mechanism is a refrigerant heat exchange mechanism and is used for carrying out primary heat exchange on air, the second heat exchange mechanism is a semiconductor heat exchange mechanism and is used for carrying out secondary heat exchange on at least part of air after the primary heat exchange;
the second heat exchange mechanism comprises a semiconductor refrigeration sheet (101) and a power supply (102), wherein the semiconductor refrigeration sheet (101) is electrically connected with the power supply (102), and the power supply (102) is used for supplying power to the semiconductor refrigeration sheet (101);
The second heat exchange mechanism further comprises an air duct (103), the semiconductor refrigerating sheet (101) is fixed in the air duct (103), and the semiconductor refrigerating sheet (101) divides the air duct (103) into a cold air duct and a hot air duct;
The second heat exchange mechanism further comprises a cold air cavity (104) and a hot air cavity (105), the cold air cavity (104) is communicated with the cold air duct, and the hot air cavity (105) is communicated with the hot air duct;
The air duct (103) is of an arc-shaped structure, the cold air cavity (104) and the hot air cavity (105) are arranged at two ends of the air duct (103), and the semiconductor refrigerating sheet (101) is arranged in the middle of the air duct (103);
The air duct (103) is provided with a first air hole (1031), and the first air hole (1031) is used for air circulation;
a second air hole (1041) is arranged on one of the cold air cavity (104) and the hot air cavity (105), and the second air hole (1041) is used for air circulation; the other one of the cold air cavity (104) and the hot air cavity (105) is of a closed structure;
the heat-dissipating component is arranged on the hot end surface of the semiconductor refrigerating sheet (101) and used for dissipating heat generated by the hot end surface of the semiconductor refrigerating sheet (101);
the heat dissipation assembly comprises a heat dissipation paste layer and/or a heat dissipation aluminum block, wherein the heat dissipation paste layer is coated on the hot end surface of the semiconductor refrigeration sheet (101), and the thickness of the heat dissipation paste layer is 0.1-0.5 mm; the heat dissipation aluminum block is fixed on the hot end surface of the semiconductor refrigerating sheet (101).
2. The heat exchange system according to claim 1, wherein the second heat exchange mechanism further comprises a first fan (106) and a second fan (107), wherein the first fan (106) is disposed at a junction of the cold air chamber (104) and the cold air duct, and the second fan (107) is disposed at a junction of the hot air chamber (105) and the hot air duct.
3. The heat exchange system of claim 1, wherein the hot air chamber (105) is located above a water pan (202) of the air conditioner.
4. An air conditioner is characterized by comprising a casing (20) and a heat exchange system, wherein the heat exchange system is the heat exchange system according to any one of claims 1 to 3, the heat exchange system is arranged in the casing (20), an air outlet (201) is further formed in the casing (20), and air subjected to primary heat exchange and secondary heat exchange with the heat exchange system is blown out from the air outlet (201).
5. The air conditioner according to claim 4, wherein a water receiving tray (202) is further disposed in the casing (20), the water receiving tray (202) is located below the hot air chamber (105) of the heat exchange system, and the water receiving tray (202) is configured to be inclined downward toward the inlet of the hot air chamber (105).
6. The air conditioner according to claim 5, wherein a humidity sensor is disposed in the water pan (202), the humidity sensor is located at an end of the water pan (202) near the inlet of the hot air chamber (105), and the humidity sensor is used for detecting humidity in the water pan (202).
7. A control method of an air conditioner according to any one of claims 4 to 6, comprising the steps of:
Acquiring an operation mode of an air conditioner;
The duty ratio of the power supply of the semiconductor refrigerating sheet (101), the frequency of the compressor and/or the rotational speed of the indoor unit fan are adjusted based on the operation mode of the air conditioner, and the ambient temperature is maintained at the target temperature set by the user.
8. The control method of an air conditioner according to claim 7, wherein the operation mode of the air conditioner includes an instant quick heat exchange mode, and when the air conditioner is in the instant quick heat exchange mode, comprising the steps of:
Acquiring an ambient temperature T 1, a temperature T 2 at an air outlet (201) and a target temperature T 3 set by a user;
Calculating a difference DeltaT 1 between a target temperature T 3 set by a user and an ambient temperature T 1, and calculating a difference DeltaT 2 between a temperature T 2 at an air outlet (201) and the ambient temperature T 1;
And adjusting the duty ratio of power-on of the semiconductor refrigerating sheet (101), the frequency of the compressor and the rotating speed of the indoor unit fan based on the difference value delta T 1 between the target temperature T 3 set by a user and the ambient temperature T 1 and/or the difference value delta T 2 between the temperature T 2 at the air outlet (201) and the ambient temperature T 1, and keeping the ambient temperature at the target temperature set by the user.
9. The control method of an air conditioner according to claim 8, wherein the instantaneous quick heat exchange mode includes an instantaneous quick cooling mode and an instantaneous quick heating mode, and when the air conditioner is in the instantaneous quick cooling mode, and
When the delta T 1 ℃ is less than or equal to minus 5 ℃ or delta T 2 is more than or equal to 5 ℃, the duty ratio of the power obtained by the semiconductor refrigerating sheet (101) is adjusted to 100%, the compressor is adjusted to operate at the maximum frequency, and the indoor unit fan is adjusted to operate at the highest wind level;
When the temperature is minus 5 ℃ and is less than DeltaT 1 and less than 0 ℃ or the temperature is less than DeltaT 2 and is less than 5 ℃, the duty ratio of the power obtained by the semiconductor refrigerating sheet (101) is adjusted towards the direction of reducing, the compressor is adjusted to operate under 80% of the maximum frequency, and the fan of the indoor unit is adjusted to operate at the highest wind level;
When the delta T 1 is more than or equal to 0 ℃ or the delta T 2 is less than or equal to 0 ℃, the duty ratio of the power of the semiconductor refrigerating sheet (101) is reduced to 0, the first fan (106) and the second fan (107) are powered off, the compressor is adjusted to run under 60% of the maximum frequency, and the indoor unit fan is adjusted to run at a middle wind speed.
10. The control method of an air conditioner according to claim 9, wherein the duty ratio of the power supplied to the semiconductor cooling fin (101) is linearly related to the magnitude of the difference Δt 1 between the target temperature T 3 set by the user and the ambient temperature T 1.
11. The control method of an air conditioner according to claim 8, wherein the operation mode of the air conditioner further includes a normal heat exchange mode, and when the air conditioner is in the normal heat exchange mode, comprising the steps of:
The frequency of the compressor is obtained and,
The operating state of the semiconductor refrigeration sheet (101) is adjusted based on the frequency of the compressor, and the compressor is maintained to operate at 80% of the maximum frequency.
12. The control method of an air conditioner according to claim 11, wherein the semiconductor cooling fin (101) is controlled to be in a non-operating state when the compressor frequency is less than 80% of the maximum frequency;
When the frequency of the compressor is more than or equal to 80% of the maximum frequency, the semiconductor refrigerating sheet (101) is controlled to be in a working state, and the compressor is kept to operate at 80% of the maximum frequency by adjusting the duty ratio of electricity obtained by the semiconductor refrigerating sheet (101).
13. The control method of an air conditioner according to claim 11, wherein the operation mode of the air conditioner further includes a drying operation mode, and when the air conditioner is in the drying operation mode, comprising the steps of:
Acquiring the humidity in the water receiving disc (202);
the working states of the semiconductor refrigerating sheet (101) and the second fan (107) are adjusted based on the humidity in the water receiving disc (202), and the humidity in the water receiving disc (202) is enabled to be less than 50%.
14. The control method of an air conditioner according to claim 13, wherein when the humidity in the water pan (202) is not less than 50%, the duty ratio of the power to be supplied to the semiconductor refrigeration sheet (101) is adjusted to 100%, and the second fan (107) is in an on state;
when the humidity in the water receiving disc (202) is less than 50%, the duty ratio of the power obtained by the semiconductor refrigerating sheet (101) is reduced to 0, the second fan (107) is in a closed state, and the unit enters a standby state.
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| CN211146959U (en) * | 2019-09-12 | 2020-07-31 | 赵进洲 | Air temperature adjusting device and air conditioner |
| CN114517967A (en) * | 2022-03-31 | 2022-05-20 | 美的集团武汉暖通设备有限公司 | Control method of air conditioner, air conditioner and computer readable storage medium |
| CN217763721U (en) * | 2022-06-23 | 2022-11-08 | 珠海格力电器股份有限公司 | Heat exchange system and air conditioner |
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| CN104976810B (en) * | 2014-04-01 | 2017-06-23 | 杨然森 | Four-air outlet refrigeration device and its refrigeration module |
| CN113266884B (en) * | 2021-05-31 | 2022-11-18 | 青岛海尔空调器有限总公司 | Air conditioner and control method thereof |
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| CN211146959U (en) * | 2019-09-12 | 2020-07-31 | 赵进洲 | Air temperature adjusting device and air conditioner |
| CN114517967A (en) * | 2022-03-31 | 2022-05-20 | 美的集团武汉暖通设备有限公司 | Control method of air conditioner, air conditioner and computer readable storage medium |
| CN217763721U (en) * | 2022-06-23 | 2022-11-08 | 珠海格力电器股份有限公司 | Heat exchange system and air conditioner |
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