CN104976810A - Four-vent refrigeration device and refrigeration module thereof - Google Patents
Four-vent refrigeration device and refrigeration module thereof Download PDFInfo
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- CN104976810A CN104976810A CN201410128562.4A CN201410128562A CN104976810A CN 104976810 A CN104976810 A CN 104976810A CN 201410128562 A CN201410128562 A CN 201410128562A CN 104976810 A CN104976810 A CN 104976810A
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- air port
- air
- refrigeration
- air channel
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A four-vent refrigeration device and a refrigeration module thereof are provided; the refrigeration module comprises the following elements: a semiconductor refrigeration sheet; a heat transmitter formed by a substrate and a plurality of fins arranged on the substrate at certain intervals, the surface of the fin is a wave form, and the substrate is attached to a cold end of the semiconductor refrigeration sheet; a radiator formed by an L-shape hot pipe, and heat absorption plates and heat radiation sheets correspondingly sleeved on the L-shape hot pipe, the radiator is in a L-shape bending plate, the heat absorption plates are attached to a hot end of the semiconductor refrigeration sheet, and the hot pipe is filled with a superconductive liquid. The four-vent refrigeration device comprises a housing, an arc plate and the refrigeration module; the housing comprises a main housing portion, a first wind path and a second wind path; the arc plate is arranged in the main housing portion, and form an inverted U type cycle air channel with the first and second wind paths; the refrigeration sheet is arranged in an assembling hole; the heat transmitter is arranged in the inverted U type cycle air channel; the radiator is placed on an upper portion of the arc plate. The refrigeration device is high in refrigeration efficiency.
Description
Technical field
The present invention relates to technical field of refrigeration equipment, especially cold and/or hot memory device (as refrigerator, refrigerator, cold-hot integrated cabinet etc.) provides four air port refrigerating plant and refrigeration modules thereof of low-temperature receiver.
Background technology
Tradition refrigerating equipment needs to use refrigerant, and not environmentally, noise is large, and energy consumption is high.
Along with the development of science and technology, people adopt semiconductor chilling plate or semiconductor chilling plate and traditional compressor to be integrated as refrigerating equipment and provide low-temperature receiver, but up to the present, are used alone semiconductor chilling plate when providing low-temperature receiver, refrigerating efficiency is low, cannot meet 70 liters with the refrigeration of upper container.
Summary of the invention
The object of this invention is to provide the refrigeration module that a kind of refrigerating efficiency is high.
Another object of the present invention is to provide four high air port refrigerating plants of a kind of refrigerating efficiency, to meet the cooling and warming demand of large and medium-sized cold and/or hot memory device.
A kind of refrigeration module provided by the invention comprises:
Semiconductor chilling plate;
Heat transmitter, by substrate with take shape in a plurality of relative on this substrate and fin that is certain interval of being separated by forms, described fin surface undulate, the cold junction of described substrate and described semiconductor chilling plate is fitted; And
Radiator, by L shape heat pipe with corresponding be sheathed on absorber plate in the two-arm of L shape heat pipe and groups of fins is formed, overall L-shaped flap-like, fit in the hot junction of described absorber plate and described semiconductor chilling plate, the in-built superconductive liquid of described heat pipe.
In above-mentioned refrigeration module, preferably, the material of described heat transmitter is 6063 aluminiums or 1060 aluminiums, and the thickness of heat transmitter substrate is 2mm ~ 5mm, the thickness of heat transmitter fin is 0.4mm ~ 0.6mm, is highly 40mm ~ 65mm, and the gap between adjacent fin is 1.2mm ~ 2mm.
In above-mentioned refrigeration module, preferably, the heat transmitter fin surface described corrugated ridge of formation is vertical with described semiconductor chilling plate.
In above-mentioned refrigeration module, preferably, the material of the absorber plate of described radiator is 6063 aluminiums or 1060 aluminiums; The diameter of described heat pipe is 8mm ~ 10mm, and the spacing between adjacent heat tube edges is 1mm ~ 3mm, bottom heat pipe with absorber plate bottom thickness sum be 1mm ~ 2.5mm; By weight, described superconductive liquid is made up of 1 ~ 1.5 part of NaOH, 4 ~ 5 parts of potassium chromates, 1570 ~ 1580 parts of ethanol and 8030 ~ 8040 parts of pure water.
A kind of four air port refrigerating plants provided by the invention comprise:
Housing, this housing has main casing portion and the first outstanding air channel and the second air channel bottom main casing portion downwards, first air channel and the second air channel is separated by a distance and its lower end correspondence arranges the first air port and the second air port, the top in main casing portion and rear lateral portion correspondence arrange the 3rd air port and the 4th air port, and second, third and the 4th air port all arrange aerofoil fan;
Arc, be arranged in described main casing portion, with described first air channel and the second air channel and surround an inverted U-shaped circulation air path, this arc arranges a pilot hole; And
Any one refrigeration module above-mentioned, the semiconductor chilling plate of this refrigeration module is placed in described pilot hole, heat transmitter is placed in described inverted U-shaped circulation air path, and radiator is placed in the upside of housing arc plate and two of its groups of fins large faces are corresponding to described 3rd air port and the 4th air port.
In four above-mentioned air port refrigerating plants, preferably, described first air port and the second air port are inclined to the direction deviated from mutually, and the center line of the two is splayed.
In four above-mentioned air port refrigerating plants, preferably, described arc arranges thermal insulation layer.
In four above-mentioned air port refrigerating plants, preferably, described inverted U-shaped circulation air path is divided into two sections by described heat transmitter, connection air channel between described two sections of gap formation between heat transmitter fin, this connection air channel undulate is the crucial air channel that release low temperature absorption high temperature or release high temperature absorb low temperature.Connection Duct design is waveform, can play the effect of flow-disturbing, mitigation of gases flow velocity, reaches cold and hot gas exchange better with this.
These four air port refrigerating plant refrigerating efficiencies are high, can meet the refrigeration demand of big-and-middle-sized (volume is more than 70 liters) refrigeration plant and cold-hot integrated cabinet etc.
Accompanying drawing explanation
Fig. 1 is the structural representation of an embodiment refrigeration module;
Fig. 2 is the structural representation of an embodiment four air port refrigerating plant;
Fig. 3 is the front view of four air port refrigerating plants shown in Fig. 2;
Fig. 4 is the A-A sectional view of Fig. 3.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is further described.
As shown in Figure 1, this refrigeration module comprises semiconductor chilling plate 1, heat transmitter 2 and radiator 3.Heat transmitter 2 by substrate 21 with take shape in a plurality of relative on substrate 21 and the fin 22 of certain interval of being separated by forms, the surperficial undulate of fin 22, substrate 21 is fitted with the cold junction of semiconductor chilling plate 1.Radiator 3 is made up of L shape heat pipe 31, the absorber plate 32 being sheathed on L shape heat pipe 31 underarm and the groups of fins 33 that is sheathed on L shape heat pipe 31 upper arm, the overall L-shaped flap-like of radiator 3, absorber plate 32 is fitted with the hot junction of semiconductor chilling plate 1, the in-built superconductive liquid of heat pipe 31.
As seen from Figure 1, in this refrigeration module, the overall L-shaped flap-like of the radiator 3 be made up of L shape heat pipe 31, absorber plate 32 and groups of fins 33, like this when behind the hot junction that its absorber plate 32 and heat transmitter 2 correspondence are fitted in semiconductor chilling plate 1 and cold junction, two large faces of groups of fins 33 can not towards absorber plate 32 and can respectively towards two adjacent faces of housing 4 (with reference to Fig. 4, two large faces of groups of fins 33 are respectively towards end face and the left surface of housing 4), thus the both direction of heat energy from housing 4 is distributed, improve radiating efficiency.
The thermal conductivity factor of red copper is about 400W/m.k, and aluminium 6063 or 1060 material thermal conductivity factor is about 200W/m.k.In order to improve radiating efficiency, people usually expect adopting the material of high thermal conductivity coefficient, as red copper, do absorber plate and heat transmitter, but relative to aluminium, the more expensive and processing difficulties of red copper.Inventor, by research, proposes and makes to adopt low cost, the heat transmitter 2 of 6063 or 1060 aluminium manufactures easily processed and the effect of absorber plate 32 to be better than red copper heat transmitter and red copper absorber plate by structure optimization.Particularly, more a kind of preferably 6063 aluminiums of design or the structure of 1060 aluminium heat transmitters 2 are: the thickness of heat transmitter substrate 21 is 2mm ~ 5mm, the thickness of heat transmitter fin 22 is 0.4mm ~ 0.6mm, is highly 40mm ~ 65mm, and the gap between adjacent fin 22 is 1.2mm ~ 2mm.When absorber plate 32 adopts 6063 aluminiums or 1060 aluminium, heat pipe 31 must select in pipe the super heat-conductive pipe of filling in and being adjusted the mixed superconduction mixing material formed by multiple different superconductive liquid material through ratio, preferably fill in following superconductive liquid: by weight, this superconductive liquid is made up of 1 ~ 1.5 part of NaOH, 4 ~ 5 parts of potassium chromates, 1570 ~ 1580 parts of ethanol and 8030 ~ 8040 parts of water.In addition, the diameter of heat pipe 31 is required to be 8mm ~ 10mm, and the spacing between adjacent heat pipe 31 edge is required to be 1mm ~ 3mm, bottom heat pipe 31 with absorber plate 32 bottom thickness sum be required to be 1mm ~ 2.5mm, aluminium absorber plate 32 usefulness just can be made to surmount red copper absorber plate usefulness.Absorber plate 32 size is the same with semiconductor chilling plate 1 large or a bit large.
Preferably, fin 22 surface forms described corrugated ridge 23(and sees Fig. 4) vertical with semiconductor chilling plate 1, between adjacent fin 22, reach into the air channel of curved narrow like this, heat absorption efficiency can have been promoted further.
With reference to Fig. 2-4, these four air port refrigerating plants comprise housing 4, arc 5 and above-mentioned refrigeration module.
Housing 4 has main casing portion 41 and the first air channel 42 and the second air channel 43 outstanding bottom main casing portion 41 downwards, first air channel 42 and the second air channel 43 is separated by a distance and its lower end correspondence arranges the first air port 44 and the second air port 45, the top in main casing portion 41 and rear lateral portion correspondence arrange the 3rd air port 46 and the 4th air port 47, second air port 45 arranges aerofoil fan 45 ', 3rd air port 46 arranges aerofoil fan 46 ', and the 4th air port 47 arranges aerofoil fan 47 '.
Arc 5 is arranged in main casing portion 41, with the first air channel 42 and the second air channel 43 and surrounds an inverted U-shaped circulation air path 51, and this arc 5 arranges a pilot hole 52.
The semiconductor chilling plate 1 of refrigeration module is placed in pilot hole 52, heat transmitter 2 is placed in inverted U-shaped circulation air path 51, radiator 3 is placed in the upside of housing 4 arc plate 5, one of the groups of fins 33 of radiator 3 greatly facing to the 3rd air port 46, another is greatly facing to the 4th air port 47.
Its course of work is: air enters inverted U-shaped circulation air path 51, gap (curved narrow air channel) between the fin 22 of heat transmitter 2, then flows out from the second air port 45 from the first air port 44.In the process, semiconductor chilling plate 1 be energized cold junction produce refrigerating effect, the heat energy during gap making air flow through between fin 22 in air is absorbed, the heat energy in semiconductor chilling plate 1 hot junction is successively by after absorber plate 32, heat pipe 31 and groups of fins 33 simultaneously, distributes from the 3rd air port 46 at housing 4 top and the 4th air port 47 of housing sidepiece.
With reference to Fig. 4, the first air port 44 is to left avertence, the second air port 45 to right avertence, and namely the first air port 44 is inclined respectively to the direction deviated from mutually with the second air port 45, and the center line of the two is splayed.Air can be made like this to circulate better, by inverted U-shaped circulation air path 51.
Further thermal insulation layer 6 can also be set on arc 5.
Inverted U-shaped circulation air path 51 is divided into two sections by heat transmitter 2, the connection air channel between described two sections of gap formation between heat transmitter fin 22.Can ensure that air all passes through from the gap between the fin 22 of heat transmitter like this, realize better heat-transfer effect.
Claims (8)
1. a refrigeration module, is characterized in that, comprising:
Semiconductor chilling plate (1);
Heat transmitter (2), by substrate (21) with take shape in a plurality of relative on this substrate and the fin (22) of certain interval of being separated by forms, described fin surface undulate, the cold junction of described substrate and described semiconductor chilling plate is fitted; And
Radiator (3), by L shape heat pipe (31) with corresponding be sheathed on absorber plate (32) in the two-arm of L shape heat pipe and groups of fins (33) is formed, overall L-shaped flap-like, fit in the hot junction of described absorber plate and described semiconductor chilling plate, the in-built superconductive liquid of described heat pipe.
2. refrigeration module according to claim 1, it is characterized in that: the material of described heat transmitter (2) is 6063 aluminiums or 1060 aluminiums, the thickness of heat transmitter substrate (21) is 2mm ~ 5mm, the thickness of heat transmitter fin (22) is 0.4mm ~ 0.6mm, is highly 40mm ~ 65mm, and the gap between adjacent fin (22) is 1.2mm ~ 2mm.
3. refrigeration module according to claim 1, is characterized in that: it is vertical with described semiconductor chilling plate (1) that heat transmitter fin (22) surface forms described corrugated ridge (23).
4. refrigeration module according to claim 1, is characterized in that:
The material of the absorber plate (32) of described radiator (3) is 6063 aluminiums or 1060 aluminiums; The diameter of described heat pipe (31) is 8mm ~ 10mm, and the spacing between adjacent heat tube edges is 1mm ~ 3mm, bottom heat pipe with absorber plate bottom thickness sum be 1mm ~ 2.5mm;
By weight, described superconductive liquid is made up of 1 ~ 1.5 part of NaOH, 4 ~ 5 parts of potassium chromates, 1570 ~ 1580 parts of ethanol and 8030 ~ 8040 parts of pure water.
5. four air port refrigerating plants, is characterized in that, comprising:
Housing (4), this housing has main casing portion (41) and outstanding the first air channel (42) and the second air channel (43) bottom main casing portion downwards, first air channel and the second air channel is separated by a distance and its lower end correspondence arranges the first air port (44) and the second air port (45), the top in main casing portion and rear lateral portion correspondence arrange the 3rd air port (46) and the 4th air port (47), and second, third and the 4th air port all arrange aerofoil fan (45 ', 46 ', 47 ');
Arc (5), be arranged in described main casing portion (41), with described first air channel and the second air channel and surround an inverted U-shaped circulation air path (51), this arc arranges a pilot hole (52);
Refrigeration module described in Claims 1-4 any one, the semiconductor chilling plate (1) of this refrigeration module is placed in described pilot hole (52), heat transmitter (2) is placed in described inverted U-shaped circulation air path (51), and radiator (3) is placed in the upside of housing arc plate (5) and two of its groups of fins (33) large faces are corresponding to described 3rd air port (46) and the 4th air port (47).
6. four air port refrigerating plants according to claim 5, is characterized in that: to the direction deviated from mutually partially, the center line of the two is splayed for described first air port (44) and the second air port (45).
7. four air port refrigerating plants according to claim 5, is characterized in that: described arc (5) is arranged thermal insulation layer (6).
8. four air port refrigerating plants according to claim 5, it is characterized in that: described inverted U-shaped circulation air path (51) is divided into two sections by described heat transmitter (2), connection air channel between described two sections of gap formation between heat transmitter fin (22), this connection air channel undulate is the crucial air channel that release low temperature absorption high temperature or release high temperature absorb low temperature.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410128562.4A CN104976810B (en) | 2014-04-01 | 2014-04-01 | Four air port refrigerating plants and its refrigeration module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410128562.4A CN104976810B (en) | 2014-04-01 | 2014-04-01 | Four air port refrigerating plants and its refrigeration module |
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| CN104976810A true CN104976810A (en) | 2015-10-14 |
| CN104976810B CN104976810B (en) | 2017-06-23 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106979632A (en) * | 2017-04-20 | 2017-07-25 | 华南理工大学 | A kind of oil cooling type semiconductor cold-hot double purpose device |
| CN114760813A (en) * | 2022-04-01 | 2022-07-15 | 乐山希尔电子股份有限公司 | Heat dissipation method of electronic integrated module |
| CN115076813A (en) * | 2022-06-23 | 2022-09-20 | 珠海格力电器股份有限公司 | Heat exchange system, air conditioner and control method |
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| CN102128517A (en) * | 2010-01-13 | 2011-07-20 | 林义民 | Cold and hot exchange device |
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| CN2394140Y (en) * | 1999-11-19 | 2000-08-30 | 赵立仁 | Semiconductor heat pipe air conditioner |
| JP2001208465A (en) * | 2000-01-31 | 2001-08-03 | Pentel Corp | Appliance for thermal insulation of drink |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106979632A (en) * | 2017-04-20 | 2017-07-25 | 华南理工大学 | A kind of oil cooling type semiconductor cold-hot double purpose device |
| CN114760813A (en) * | 2022-04-01 | 2022-07-15 | 乐山希尔电子股份有限公司 | Heat dissipation method of electronic integrated module |
| CN115076813A (en) * | 2022-06-23 | 2022-09-20 | 珠海格力电器股份有限公司 | Heat exchange system, air conditioner and control method |
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| CN104976810B (en) | 2017-06-23 |
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Effective date of registration: 20180410 Address after: 215000 Tongxin Road, Suzhou hi tech Zone, Jiangsu Province, No. 58 Patentee after: Suzhou Rongray Nano Composite Technology Co., Ltd. Address before: 10 floor, Lane 204, Songshan Road, Xinyi District, Taipei, Taiwan, China. 1 Co-patentee before: Dai Mingguang Patentee before: Yang Ransen |
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