CN103808062A - Manufacturing method for novel semiconductor cold storage and warm storage box - Google Patents
Manufacturing method for novel semiconductor cold storage and warm storage box Download PDFInfo
- Publication number
- CN103808062A CN103808062A CN201210479177.5A CN201210479177A CN103808062A CN 103808062 A CN103808062 A CN 103808062A CN 201210479177 A CN201210479177 A CN 201210479177A CN 103808062 A CN103808062 A CN 103808062A
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- Prior art keywords
- storage
- semiconductor
- semiconductor refrigerating
- warm
- producing machine
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Provided is a manufacturing method for a novel semiconductor cold storage and warm storage box. The novel semiconductor cold storage and warm storage box comprises a semiconductor cold storage and warm storage box body and a semiconductor refrigerating and heating device, the semiconductor cold storage and warm storage box body comprises a large-volume storage chamber and a bottom machine chamber, and a semiconductor refrigerating and heating device working chamber cut-through internally and externally is formed in the back part of the storage chamber of the semiconductor cold storage and warm storage box body. The manufacturing method for the novel semiconductor cold storage and warm storage box is characterized in that after the semiconductor refrigerating and heating device is mounted in the semiconductor refrigerating and heating device working chamber, an external heat exchanger, a combined condenser and an infusion pump of the semiconductor refrigerating and heating device are communicated through connecting pipes to form a circulation channel of liquid refrigerant. The manufacturing method for the novel semiconductor cold storage and warm storage box has the advantages of being easy and convenient to operate, lowering foaming preparation work difficulty of the box body, and reducing after-sales maintenance service workload of products.
Description
Technical field: the present invention relates to a kind of preparation method of novel semi-conductor cold storage and hot storage apparatus, particularly a kind of preparation method of the novel semi-conductor cold storage and hot storage apparatus that has large volume storeroom.
Background technology: the refrigerator series products that has at present large volume storeroom, in manufacturing process, be all to foam again after the related components such as evaporimeter are installed in casing substantially, this process is but difficult to apply in the industrialization of semiconductor cold-storage and warm-storage case, first cause is that foam box preparation difficulty strengthens, secondly reason is the after-sales maintenance service work difficulty increasing of the semiconductor cold-storage and warm-storage case of production like this, in addition, there is at present the compressor refrigerator of large volume storeroom can only freeze and can not heat, and can freeze and the semiconductor cold-storage and warm-storage box technology that can heat can only meet the primary demand of little volume storeroom.
Goal of the invention: the object of the invention is to overcome the shortcoming of prior art, propose one easy and simple to handle, reduce foam box preparation difficulty, reduce the preparation method of the semiconductor cold-storage and warm-storage case of the large volume storeroom of product after-sales maintenance service workload.
Main technical schemes of the present invention: after previously prepared good semiconductor refrigerating heat-producing machine being installed into the semiconductor refrigerating heat-producing machine operating room of the semiconductor cold-storage and warm-storage box body preparing, be communicated with semiconductor refrigerating heat-producing machine, composite condenser and infusion pump with tube connector again, form the circulation flow passage of liquid coolant.
Concrete preparation method of the present invention comprises the following steps:
1. prepare semiconductor cold-storage and warm-storage box body: semiconductor cold-storage and warm-storage box body outside plate, inner bag and related components are assembled complete and put into foaming mould and foam, be prepared into semiconductor cold-storage and warm-storage box body, semiconductor cold-storage and warm-storage box body has a large volume storeroom, semiconductor cold-storage and warm-storage box body storeroom back has the inside and outside semiconductor refrigerating heat-producing machine operating room connecting, the machine chamber that semiconductor cold-storage and warm-storage box body bottom connects before and after being;
2. prepare semiconductor refrigerating heat-producing machine: by semiconductor chilling plate, the interior heat exchanger of one of the external heat exchanger of one of semiconductor refrigerating heat-producing machine metal assembly and semiconductor refrigerating heat-producing machine metal assembly according to the order of sequence close contact is affixed, fix with fastening connection piece, form semiconductor refrigerating heat-producing machine;
3. assembling: after semiconductor refrigerating heat-producing machine is installed into semiconductor refrigerating heat-producing machine operating room, then be communicated with external heat exchanger, composite condenser and the infusion pump of semiconductor refrigerating heat-producing machine with tube connector, form the circulation flow passage of liquid coolant.
Accompanying drawing explanation:
Fig. 1 is novel semi-conductor cold storage and hot storage apparatus package assembly cross-sectional schematic in the embodiment of the present invention;
Fig. 2 is novel semi-conductor cold storage and hot storage apparatus body structure cross-sectional schematic in the embodiment of the present invention;
Fig. 3 is semiconductor refrigerating heat-producing machine in the embodiment of the present invention, composite condenser and infusion pump connectivity scheme schematic diagram;
Fig. 4 is the structure cross-sectional schematic of the external heat exchanger of semiconductor refrigerating heat-producing machine in the embodiment of the present invention;
In figure: 1. storeroom; 2. machine chamber; 3. semiconductor refrigerating heat-producing machine operating room; 4. interior heat exchanger; 5. semiconductor chilling plate; 6. external heat exchanger; 7. interior heat exchange fan; 8. composite condenser; 9. horizontal composite condenser; 10. vertical composite condenser; 11. infusion pumps; 12. outer heat exchange blower fans; 13. fluid infusion exhaust outlets; 14. liquid coolant inflow/flow exports; 15. flow passages; 16. semiconductor refrigerating heat-producing machines.
Below in conjunction with accompanying drawing, the present invention will be further described: as shown in Figure 2, semiconductor cold-storage and warm-storage box body outside plate, inner bag and related components are assembled complete and put into foaming mould and foam, prepare semiconductor cold-storage and warm-storage box body, semiconductor cold-storage and warm-storage box body has the storeroom 1 of a large volume, semiconductor cold-storage and warm-storage box body storeroom 1 back has the inside and outside semiconductor refrigerating heat-producing machine operating room 3 connecting, the machine chamber 2 that semiconductor cold-storage and warm-storage box body bottom connects before and after being; As shown in Figure 1, by semiconductor chilling plate 5, the interior heat exchanger 4 of one of the external heat exchanger 7 of one of semiconductor refrigerating heat-producing machine 16 metal assemblies and semiconductor refrigerating heat-producing machine 16 metal assemblies according to the order of sequence close contact is affixed, and fixes with fastening connection piece, forms semiconductor refrigerating heat-producing machine 16; Shown in Fig. 1, Fig. 2 and Fig. 3, after semiconductor refrigerating heat-producing machine 16 is installed into semiconductor refrigerating heat-producing machine operating room 3, be communicated with again external heat exchanger 6, composite condenser 8 and the infusion pump 11 of semiconductor refrigerating heat-producing machine 16 with tube connector, form the circulation flow passage of liquid coolant.
As shown in Figure 1, Figure 3 in technical solution of the present invention, composite condenser 8 is interconnected and is combined and form by horizontal composite condenser 9 and vertical composite condenser 10, horizontal composite condenser 9 and infusion pump 11 are placed in the machine chamber 2 of novel semi-conductor cold storage and hot storage apparatus, and vertically composite condenser 10 is placed in the outer back side of novel semi-conductor cold storage and hot storage apparatus.
In technical solution of the present invention, horizontal composite condenser 9 is communicated with and is formed by one or more horizontal individual layer condenser.
In technical solution of the present invention, vertically composite condenser 10 is communicated with and is formed by one or more vertical individual layer condenser.
In technical solution of the present invention, horizontal composite condenser 9 sides in machine chamber 2 are provided with the outer heat exchange blower fan 12 of can improve the standard composite condenser 9 and air heat-exchange ability as shown in Figure 1.
In technical solution of the present invention, interior heat exchanger 4 is finned heat exchangers as shown in Figure 1, and interior heat exchanger 4 is near interior heat exchange fan 7.
As shown in Figure 4 in technical solution of the present invention, on the external heat exchanger 6 of semiconductor refrigerating heat-producing machine 16, have liquid coolant inflow/flow export 14 and fluid infusion exhaust outlet 13 that liquid coolant passes through, external heat exchanger 6 inside have the flow passage 15 of the mobile S shape of liquid coolant.
In technical solution of the present invention, semiconductor refrigerating heat-producing machine 16 is made up of at least one sub-semiconductor refrigerating heat-producing machine, and fluid infusion exhaust outlet 13 is driveed on the external heat exchanger of the sub-semiconductor refrigerating heat-producing machine the highest in position.
Claims (8)
1. a preparation method for novel semi-conductor cold storage and hot storage apparatus, is characterized in that preparation process comprises the following steps:
1). prepare semiconductor cold-storage and warm-storage box body: casing outside plate, inner bag and related components are assembled complete and put into foaming mould and foam, be prepared into semiconductor cold-storage and warm-storage box body, semiconductor cold-storage and warm-storage box body storeroom (1) back has the inside and outside semiconductor refrigerating heat-producing machine operating room (3) connecting, the machine chamber (2) that semiconductor cold-storage and warm-storage box body bottom connects before and after being.
2). prepare semiconductor refrigerating heat-producing machine (16): by the interior heat exchanger (4) of one of the external heat exchanger (6) of one of semiconductor chilling plate (5), refrigerating and heating device metal assembly and refrigerating and heating device metal assembly according to the order of sequence close contact be affixed, fix with fastening connection piece, form semiconductor refrigerating heat-producing machine (16);
3). assembling: after semiconductor refrigerating heat-producing machine (16) is installed into semiconductor refrigerating heat-producing machine operating room (3), be communicated with again external heat exchanger (6), composite condenser (8) and the infusion pump (11) of semiconductor refrigerating heat-producing machine (16) with tube connector, form the circulation flow passage of liquid coolant.
2. a kind of preparation method of novel semi-conductor cold storage and hot storage apparatus as claimed in claim 1, it is characterized in that: composite condenser (8) is interconnected and is combined and form by horizontal composite condenser (9) and vertical composite condenser (10), horizontal composite condenser (9) and infusion pump (11) are placed in the machine chamber (2) of novel semi-conductor cold storage and hot storage apparatus, and vertically composite condenser (10) is placed in the outer back side of novel semi-conductor cold storage and hot storage apparatus.
3. a kind of preparation method of novel semi-conductor cold storage and hot storage apparatus as claimed in claim 1, is characterized in that: horizontal composite condenser (9) is communicated with and is formed by one or more horizontal individual layer condenser.
4. a kind of preparation method of novel semi-conductor cold storage and hot storage apparatus as claimed in claim 1, is characterized in that: vertically composite condenser (10) is communicated with and is formed by one or more vertical individual layer condenser.
5. a kind of preparation method of novel semi-conductor cold storage and hot storage apparatus as claimed in claim 1, is characterized in that: horizontal composite condenser (9) side in machine chamber (2) is provided with the outer heat exchange blower fan (12) of can improve the standard composite condenser (9) and air heat-exchange ability.
6. a kind of preparation method of novel semi-conductor cold storage and hot storage apparatus as claimed in claim 1, is characterized in that: interior heat exchanger (4) is finned heat exchanger, interior heat exchanger is near interior heat exchange fan (7).
7. a kind of preparation method of novel semi-conductor cold storage and hot storage apparatus as claimed in claim 1, it is characterized in that: on the external heat exchanger (6) of semiconductor refrigerating heat-producing machine (16), have liquid coolant inflow/flow export (14) and fluid infusion exhaust outlet (13) that liquid coolant passes through, external heat exchanger (6) inside has the flow passage (15) of the mobile S shape of liquid coolant.
8. a kind of preparation method of novel semi-conductor cold storage and hot storage apparatus as claimed in claim 1, it is characterized in that: semiconductor refrigerating heat-producing machine (16) is made up of at least one sub-semiconductor refrigerating heat-producing machine, and fluid infusion exhaust outlet (13) is driveed on the sub-external heat exchanger of the sub-semiconductor refrigerating heat-producing machine the highest in position.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210479177.5A CN103808062A (en) | 2012-11-05 | 2012-11-05 | Manufacturing method for novel semiconductor cold storage and warm storage box |
| PCT/CN2013/086519 WO2014067493A1 (en) | 2012-11-05 | 2013-11-04 | Novel semiconductor cool/warm box and fabrication method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210479177.5A CN103808062A (en) | 2012-11-05 | 2012-11-05 | Manufacturing method for novel semiconductor cold storage and warm storage box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103808062A true CN103808062A (en) | 2014-05-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210479177.5A Pending CN103808062A (en) | 2012-11-05 | 2012-11-05 | Manufacturing method for novel semiconductor cold storage and warm storage box |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103808062A (en) |
| WO (1) | WO2014067493A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106471321A (en) * | 2014-06-16 | 2017-03-01 | 利勃海尔-家用电器奥克森豪森有限责任公司 | Heat-insulating container |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19504383A1 (en) * | 1995-02-10 | 1996-08-14 | Dkk Ges Fuer Entwicklung Und P | Thermoelectric cooling system |
| CN2674370Y (en) * | 2003-09-24 | 2005-01-26 | 刘万辉 | Efficient semiconductor refrigerator |
| CN201322491Y (en) * | 2008-12-28 | 2009-10-07 | 刘万辉 | Novel durable multi-function semiconductor refrigerating-and-heating box |
| CN201873148U (en) * | 2010-11-18 | 2011-06-22 | 刘万辉 | Novel cold storage and heat storage tank of compressor |
| CN201973955U (en) * | 2010-11-13 | 2011-09-14 | 刘万辉 | Novel structure semiconductor refrigerating and heating box |
| CN102235770A (en) * | 2010-05-08 | 2011-11-09 | 刘万辉 | Manufacturing method of semiconductor cold storage and hot storage box |
| CN202171364U (en) * | 2011-07-22 | 2012-03-21 | 刘万辉 | High-efficient practical semi-conductor refrigerating and heating storage box |
| CN202182587U (en) * | 2011-07-18 | 2012-04-04 | 刘万辉 | High-efficiency novel-structure semiconductor refrigeration and warm-storage box |
| CN202350374U (en) * | 2011-10-03 | 2012-07-25 | 刘万辉 | Simple efficient semiconductor cold/warm storage container |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060185711A1 (en) * | 2005-02-22 | 2006-08-24 | Daewoo Electronics Corporation | Storage container using a thermoelement |
| CN201954832U (en) * | 2010-12-29 | 2011-08-31 | 刘万辉 | Novel efficient and practical semiconductor refrigerating and heating box |
| CN202869071U (en) * | 2012-11-07 | 2013-04-10 | 刘万辉 | Novel simple and efficient semiconductor refrigerating and heating storage box |
-
2012
- 2012-11-05 CN CN201210479177.5A patent/CN103808062A/en active Pending
-
2013
- 2013-11-04 WO PCT/CN2013/086519 patent/WO2014067493A1/en active Application Filing
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19504383A1 (en) * | 1995-02-10 | 1996-08-14 | Dkk Ges Fuer Entwicklung Und P | Thermoelectric cooling system |
| CN2674370Y (en) * | 2003-09-24 | 2005-01-26 | 刘万辉 | Efficient semiconductor refrigerator |
| CN201322491Y (en) * | 2008-12-28 | 2009-10-07 | 刘万辉 | Novel durable multi-function semiconductor refrigerating-and-heating box |
| CN102235770A (en) * | 2010-05-08 | 2011-11-09 | 刘万辉 | Manufacturing method of semiconductor cold storage and hot storage box |
| CN201973955U (en) * | 2010-11-13 | 2011-09-14 | 刘万辉 | Novel structure semiconductor refrigerating and heating box |
| CN201873148U (en) * | 2010-11-18 | 2011-06-22 | 刘万辉 | Novel cold storage and heat storage tank of compressor |
| CN202182587U (en) * | 2011-07-18 | 2012-04-04 | 刘万辉 | High-efficiency novel-structure semiconductor refrigeration and warm-storage box |
| CN202171364U (en) * | 2011-07-22 | 2012-03-21 | 刘万辉 | High-efficient practical semi-conductor refrigerating and heating storage box |
| CN202350374U (en) * | 2011-10-03 | 2012-07-25 | 刘万辉 | Simple efficient semiconductor cold/warm storage container |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106471321A (en) * | 2014-06-16 | 2017-03-01 | 利勃海尔-家用电器奥克森豪森有限责任公司 | Heat-insulating container |
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| Publication number | Publication date |
|---|---|
| WO2014067493A1 (en) | 2014-05-08 |
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Application publication date: 20140521 |
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