CN101893346A - Method for manufacturing multifunctional semiconductor refrigerating and heating dual-purpose case - Google Patents
Method for manufacturing multifunctional semiconductor refrigerating and heating dual-purpose case Download PDFInfo
- Publication number
- CN101893346A CN101893346A CN2009101452560A CN200910145256A CN101893346A CN 101893346 A CN101893346 A CN 101893346A CN 2009101452560 A CN2009101452560 A CN 2009101452560A CN 200910145256 A CN200910145256 A CN 200910145256A CN 101893346 A CN101893346 A CN 101893346A
- Authority
- CN
- China
- Prior art keywords
- chamber
- semiconductor refrigerating
- producing machine
- refrigerating heat
- heating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a method for manufacturing a multifunctional semiconductor refrigerating and heating dual-purpose case. The case comprises a dual-purpose case body, an upper chamber semiconductor refrigerating and heating device and a lower chamber semiconductor refrigerating and heating device, wherein the dual-purpose case body is provided with two independent storage rooms, namely an upper storage room and a lower storage room. The case is characterized in that: after the upper chamber semiconductor refrigerating and heating device is arranged in an upper workroom and the lower chamber semiconductor refrigerating and heating device is arranged in a lower workroom, a cyclic flow passage of a liquid refrigerant is formed by communicating the upper chamber semiconductor refrigerating and heating device, the lower chamber semiconductor refrigerating and heating device, a composite condenser and an infusion pump through a connecting pipe. The method of the invention has the advantages of reducing the difficulty in the foaming preparation work of the case body and bringing convenience to the after-sales maintenance of a product, along with simple and convenient operation.
Description
Technical field: the present invention relates to a kind of preparation method of semiconductor cooling-heating box, particularly a kind of have two independently preparation methods of the multifunction semiconductor cold-storage and warm-storage two-purpose box of storeroom.
Background technology: the refrigerator series products that has chamber between two at present, all be foaming again after being installed to related components such as evaporimeter in the casing basically in manufacturing process, this process but is difficult to use in the industrialization of multifunction semiconductor cold-storage and warm-storage two-purpose box, first cause is that foam box preparation difficulty strengthens, and secondly reason is the after-sales maintenance service work difficulty increasing of multifunction semiconductor cold-storage and warm-storage two-purpose box.
Goal of the invention: the objective of the invention is to overcome the shortcoming of prior art, propose a kind of easy and simple to handlely, reduce foam box preparation difficulty, reduce the preparation method of the multifunction semiconductor cold-storage and warm-storage two-purpose box of product after-sales maintenance service workload.
Main technical schemes of the present invention: the semiconductor refrigerating heat-producing machine that will prepare in advance is installed into after the operating room of each chamber of multifunction semiconductor cold-storage and warm-storage two-purpose box casing for preparing, be communicated with semiconductor refrigerating heat-producing machine, composite condenser and infusion pump with tube connector again, constitute the circulation flow passage of liquid coolant.
Concrete preparation method of the present invention may further comprise the steps:
1. preparation dual-purpose case casing: dual-purpose case casing outside plate, inner bag and related components assembling are finished and puts into foaming mould and foam, be prepared into the dual-purpose case casing, between two difference that have the dual-purpose case casing independently go up the chamber and down between the chamber, the back, chamber has operating room, chamber between inside and outside going up of connecting between going up, down between the back, chamber have the inside and outside operating room, following chamber that connects.
2. preparation semiconductor refrigerating heat-producing machine: with relevant semiconductor chilling plate, refrigerating and heating device metal assembly according to the order of sequence closely contact paste mutually, fix with fastening connection piece, on compositions between chamber semiconductor refrigerating heat-producing machine and following between chamber semiconductor refrigerating heat-producing machine.
3. assembling: will go up a chamber semiconductor refrigerating heat-producing machine be installed between the operating room, chamber and time between chamber semiconductor refrigerating heat-producing machine be installed into down between after the operating room, chamber, chamber semiconductor refrigerating heat-producing machine between be communicated with going up with tube connector again, down between chamber semiconductor refrigerating heat-producing machine, composite condenser and infusion pump, constitute the circulation flow passage of liquid coolant.
Description of drawings:
Fig. 1 is a multifunction semiconductor cold-storage and warm-storage two-purpose box package assembly schematic diagram;
Fig. 2 is a multifunction semiconductor cold-storage and warm-storage two-purpose box casing cross-sectional schematic;
Fig. 3 be go up in the technical solution of the present invention between chamber semiconductor refrigerating heat-producing machine, down between chamber semiconductor refrigerating heat-producing machine, composite condenser and infusion pump connectivity scheme schematic diagram;
Fig. 4 be in the technical solution of the present invention on another between chamber semiconductor refrigerating heat-producing machine, down between chamber semiconductor refrigerating heat-producing machine, composite condenser and infusion pump connectivity scheme schematic diagram;
Among the figure: 1. chamber between going up; 2. chamber between following; 3. indoor heat exchanger between going up; Indoor heat exchanger between 4 times; 5. semiconductor refrigerating heat-producing machine in chamber between going up; 6. chamber semiconductor refrigerating heat-producing machine between following; 7. composite condenser; 8. infusion pump; 9. electric control panel; 10. operating room, chamber between going up; 11. operating room, chamber down; 12. semiconductor chilling plate; 13. semiconductor chilling plate; 14. refrigerating and heating device metal assembly; 15. refrigerating and heating device metal assembly; 16. refrigerating and heating device metal assembly; 17. refrigerating and heating device metal assembly.
The present invention will be further described below in conjunction with accompanying drawing: as shown in Figure 2, dual-purpose case casing outside plate, inner bag and related components assembling are finished and puts into foaming mould and foam, be prepared into the dual-purpose case casing, between two difference that have the dual-purpose case casing independently go up chamber 1 and down between chamber 2,1 back, chamber has operating room, chamber 10 between inside and outside going up of connecting between going up, down between 2 backs, chamber have the inside and outside operating room, following chamber 11 that connects; As shown in Figure 1, semiconductor chilling plate 12, refrigerating and heating device metal assembly 14 and refrigerating and heating device metal assembly 16 are closely contacted subsides mutually according to the order of sequence, fix with fastening connection piece, chamber semiconductor refrigerating heat-producing machine 5 between on the composition, semiconductor chilling plate 13, refrigerating and heating device metal assembly 15 and refrigerating and heating device metal assembly 17 are closely contacted subsides mutually according to the order of sequence, fix chamber semiconductor refrigerating heat-producing machine 6 between composition is following with fastening connection piece; In conjunction with illustrated in figures 1 and 2, to go up a chamber semiconductor refrigerating heat-producing machine 5 be installed between operating room, chamber 10 and chamber semiconductor refrigerating heat-producing machine 6 between down is installed into down between after the operating room, chamber 11, chamber semiconductor refrigerating heat-producing machine 5 between be communicated with going up with tube connector again, down between chamber semiconductor refrigerating heat-producing machine 6, composite condenser 7 and infusion pump 8, constitute the circulation flow passage of liquid coolant.
As shown in Figure 3 in the technical solution of the present invention, down between chamber semiconductor refrigerating heat-producing machine (6), go up between chamber semiconductor refrigerating heat-producing machine (5), composite condenser (7) and infusion pump (8) be that the circulation of serial successively is communicated with, constitute the circulation flow passage of liquid coolant.
As shown in Figure 4 in the technical solution of the present invention, also can be down between chamber semiconductor refrigerating heat-producing machine 6 and last chamber semiconductor refrigerating heat-producing machine 5 walk abreast earlier are communicated with after, be communicated with composite condenser 7 and the mutual successively serial circulation of infusion pump 8 again, constitute the circulation flow passage of liquid coolant.
Claims (3)
1. the preparation method of a multifunction semiconductor cold-storage and warm-storage two-purpose box is characterized in that preparation process may further comprise the steps:
1). preparation dual-purpose case casing: casing outside plate, inner bag and related components assembling are finished and puts into foaming mould and foam, be prepared into the dual-purpose case casing, between two difference that have the dual-purpose case casing independently go up chamber (1) and down between chamber (2), back, chamber (1) has operating room, chamber (10) between inside and outside going up of connecting between going up, down between back, chamber (2) have the inside and outside operating room, following chamber (11) that connects.
2). preparation semiconductor refrigerating heat-producing machine: with semiconductor chilling plate (12), refrigerating and heating device metal assembly (14) and refrigerating and heating device metal assembly (16) according to the order of sequence closely contact paste mutually, fix with fastening connection piece, on the composition between chamber semiconductor refrigerating heat-producing machine (5); With semiconductor chilling plate (13), refrigerating and heating device metal assembly (15) and refrigerating and heating device metal assembly (17) according to the order of sequence closely contact paste mutually, fix with fastening connection piece, form down between chamber semiconductor refrigerating heat-producing machine (6).
3). assembling: will go up a chamber semiconductor refrigerating heat-producing machine (5) be installed between operating room, chamber (10) and time between chamber semiconductor refrigerating heat-producing machine (6) be installed into down between after the operating room, chamber (11), chamber semiconductor refrigerating heat-producing machine (5) between be communicated with going up with tube connector again, down between chamber semiconductor refrigerating heat-producing machine (6), composite condenser (7) and infusion pump (8), constitute the circulation flow passage of liquid coolant.
2. a kind of manufacture method of multifunction semiconductor cold-storage and warm-storage two-purpose box according to claim 1, it is characterized in that: chamber semiconductor refrigerating heat-producing machine (6) down, go up between chamber semiconductor refrigerating heat-producing machine (5), composite condenser (7) and infusion pump (8) be that the circulation of serial successively is communicated with, constitute the circulation flow passage of liquid coolant.
3. a kind of manufacture method of multifunction semiconductor cold-storage and warm-storage two-purpose box according to claim 1, it is characterized in that: also can be down between chamber semiconductor refrigerating heat-producing machine (6) and last chamber semiconductor refrigerating heat-producing machine (5) walk abreast earlier be communicated with after, be communicated with composite condenser (7) and the mutual successively serial circulation of infusion pump (8) again, constitute the circulation flow passage of liquid coolant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101452560A CN101893346A (en) | 2009-05-22 | 2009-05-22 | Method for manufacturing multifunctional semiconductor refrigerating and heating dual-purpose case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101452560A CN101893346A (en) | 2009-05-22 | 2009-05-22 | Method for manufacturing multifunctional semiconductor refrigerating and heating dual-purpose case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101893346A true CN101893346A (en) | 2010-11-24 |
Family
ID=43102617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101452560A Pending CN101893346A (en) | 2009-05-22 | 2009-05-22 | Method for manufacturing multifunctional semiconductor refrigerating and heating dual-purpose case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101893346A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011140937A1 (en) * | 2010-05-08 | 2011-11-17 | 重庆森展科技有限公司 | Manufacturing method for semiconductor refrigerating and heating storage box |
| WO2012019353A1 (en) * | 2010-08-12 | 2012-02-16 | 重庆森展科技有限公司 | Method for fabricating multifunctional semiconductor refrigeration and heat preservation dual-purpose box |
| WO2014067492A1 (en) * | 2012-11-05 | 2014-05-08 | 沈茂相 | Novel multi-functional semiconductor refrigerating and warming dual-purpose box and manufacturing method |
| WO2022067607A1 (en) * | 2020-09-30 | 2022-04-07 | 利辛县雨若信息科技有限公司 | Warm-keeping and refrigerated double-duty device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2105024U (en) * | 1991-11-15 | 1992-05-20 | 天津市致冷器厂 | Cold or hot storing case for train |
| CN2404073Y (en) * | 1999-10-24 | 2000-11-01 | 刘万辉 | Semi-conductor cold-storage and heat-storage two purpose box |
| CN2505785Y (en) * | 2001-11-05 | 2002-08-14 | 刘万辉 | Multi-functional semiconductor refrigerator |
| CN1975291A (en) * | 2006-12-22 | 2007-06-06 | 潘景泼 | Multifunction semiconductor cold-storage and warm-storage two-purpose box |
-
2009
- 2009-05-22 CN CN2009101452560A patent/CN101893346A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2105024U (en) * | 1991-11-15 | 1992-05-20 | 天津市致冷器厂 | Cold or hot storing case for train |
| CN2404073Y (en) * | 1999-10-24 | 2000-11-01 | 刘万辉 | Semi-conductor cold-storage and heat-storage two purpose box |
| CN2505785Y (en) * | 2001-11-05 | 2002-08-14 | 刘万辉 | Multi-functional semiconductor refrigerator |
| CN1975291A (en) * | 2006-12-22 | 2007-06-06 | 潘景泼 | Multifunction semiconductor cold-storage and warm-storage two-purpose box |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011140937A1 (en) * | 2010-05-08 | 2011-11-17 | 重庆森展科技有限公司 | Manufacturing method for semiconductor refrigerating and heating storage box |
| WO2012019353A1 (en) * | 2010-08-12 | 2012-02-16 | 重庆森展科技有限公司 | Method for fabricating multifunctional semiconductor refrigeration and heat preservation dual-purpose box |
| WO2014067492A1 (en) * | 2012-11-05 | 2014-05-08 | 沈茂相 | Novel multi-functional semiconductor refrigerating and warming dual-purpose box and manufacturing method |
| CN103808097A (en) * | 2012-11-05 | 2014-05-21 | 刘万辉 | Manufacturing method for novel multifunctional semiconductor cold storage and warm storage dual-purpose box |
| WO2022067607A1 (en) * | 2020-09-30 | 2022-04-07 | 利辛县雨若信息科技有限公司 | Warm-keeping and refrigerated double-duty device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101893346A (en) | Method for manufacturing multifunctional semiconductor refrigerating and heating dual-purpose case | |
| CN204202181U (en) | Hot water or cold water's integrated water tank | |
| CN201322491Y (en) | Novel durable multi-function semiconductor refrigerating-and-heating box | |
| CN203605361U (en) | Air conditioner and air conditioner outdoor unit | |
| CN103808097A (en) | Manufacturing method for novel multifunctional semiconductor cold storage and warm storage dual-purpose box | |
| CN103185467A (en) | Manufacturing method for external heat exchanger of semiconductor refrigerating and heating device | |
| CN102235770A (en) | Manufacturing method of semiconductor cold storage and hot storage box | |
| CN201194729Y (en) | Heat pump type rice steaming vehicle | |
| CN103851786B (en) | Multipurpose water tank and the temperature equalizing method of interior case and outer container | |
| CN107738396B (en) | Modified polyurethane for thermoelectric semiconductor filling and the thermoelectric semiconductor using the modified polyurethane fill mold, foam process | |
| CN201954832U (en) | Novel efficient and practical semiconductor refrigerating and heating box | |
| CN202229500U (en) | Compressor-free refrigerator | |
| CN201852369U (en) | Directionally-placed comprehensive heat exchanger | |
| CN201331212Y (en) | A new high-efficiency hot and cold complementary type integrated heat exchanger | |
| CN201218640Y (en) | Combined double door deep cooling box | |
| CN103808062A (en) | Manufacturing method for novel semiconductor cold storage and warm storage box | |
| CN202868986U (en) | Heat pump boiling water machine | |
| CN202869114U (en) | Novel simple and efficient dual-purpose semiconductor refrigerating and heating storage box | |
| CN201588685U (en) | High and low temperature radiator | |
| CN100404977C (en) | Electronic heat energy conversion cooling system | |
| CN205747341U (en) | Battery rack air-conditioning | |
| CN216858786U (en) | Full-automatic liquid cooling hot charging machine | |
| CN210951677U (en) | Automatic water replenishing device of constant temperature and humidity machine | |
| CN218891103U (en) | Stamping die with cooling structure | |
| CN213778366U (en) | Heat-insulation energy-saving high-low temperature all-in-one machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20101124 |