CN2505785Y - Multi-functional semiconductor refrigerator - Google Patents
Multi-functional semiconductor refrigerator Download PDFInfo
- Publication number
- CN2505785Y CN2505785Y CN 01271626 CN01271626U CN2505785Y CN 2505785 Y CN2505785 Y CN 2505785Y CN 01271626 CN01271626 CN 01271626 CN 01271626 U CN01271626 U CN 01271626U CN 2505785 Y CN2505785 Y CN 2505785Y
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- CN
- China
- Prior art keywords
- radiator
- warm
- heat
- refrigeration
- freezing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
A multi-functional semiconductor refrigerator comprises a refrigeration heat absorber arranged inside a refrigerating chamber, a cold-storage heat absorber arranged inside a cold-storage chamber, a warm-storage heat radiator arranged inside a warm-storage chamber, and a refrigeration heat radiator, a cold-storage heat radiator, a warm-storage heat absorber, a condenser and a transfer pump which are arranged outside the chambers, wherein, the refrigeration heat absorber is closely contacted with the refrigeration heat radiator through a freezer, while the cold-storage heat absorber is closely contacted with the cold-storage heat radiator through a freezer, and the warm-storage heat radiator is closely contacted with the warm-storage heat absorber through a freezer. The utility model is characterized in that the refrigeration heat radiator, the cold-storage heat radiator, the warm-storage heat absorber, the condenser and the transfer pump are connected one another to form a flow pathway of refrigerant.
Description
The utility model relate to a kind of by semiconductor refrigerating, heat, and the heat that semiconductor refrigerating is produced heats with semiconductor and household electrical appliance that the cold that produces neutralizes mutually and utilizes.
Now the compressor refrigerator on the market can only freeze merely, does not have heat-production functions, and the heat that refrigeration produces do not obtain utilizing yet, and has only in vain to be dispersed in the ambient air.
The purpose of this utility model provides a kind of multichip semiconductor function hutch, it has freezing, refrigeration and the warm function of hiding, and the heat that can produce refrigerating chamber, refrigerating chamber refrigeration heats with warm keeping chamber and utilizations that neutralize mutually of the cold that produces, the refrigerating efficiency and the heating efficiency of raising semiconductor chilling plate.
The purpose of this utility model is to realize by such technical scheme: it includes the freezing heat dump that is arranged in the refrigerating chamber, refrigeration heat dump in the refrigerating chamber, warm Tibetan radiator in the warm keeping chamber, and be arranged on refrigerating chamber, freezing radiator outside refrigerating chamber and the warm keeping chamber, the refrigeration radiator, the warm heat dump of hiding, condenser and infusion pump, freezing heat dump is by refrigerator and the closely contact mutually of freezing radiator, the refrigeration heat dump by refrigerator with refrigerate radiator close contact mutually, the warm radiator of hiding closely contacts with the warm heat dump of hiding mutually by heat-producing machine, refrigerator and heat-producing machine all are made up of semiconductor chilling plate, the feature of the technical program is: freezing radiator, the refrigeration radiator, the warm heat dump of hiding, condenser and infusion pump interconnect, and constitute the flow passage of refrigerant.
Operation principle of the present utility model is such: after connecting power supply, refrigerator, heat-producing machine and infusion pump all start working, refrigerator is constantly by freezing heat dump draw heat in the refrigerating chamber, and heat is delivered on the freezing radiator, take away by refrigerant again, because heat is constantly drawn, freezing indoor temperature reduces, and reaches the purpose of refrigeration.Equally, refrigerator is constantly by refrigeration heat dump draw heat in the refrigerating chamber, and heat is delivered on the refrigeration radiator, taken away by refrigerant again, because heat is constantly drawn, the refrigeration indoor temperature reduces, and reaches the purpose of refrigeration.Heat-producing machine is then by the warm constantly draw heat from refrigerant of heat dump of hiding, and heat is delivered to warm the Tibetan on the radiator, be dispersed in the warm keeping chamber again, because heat constantly increases, temperature raises in the warm keeping chamber, reach the purpose that heats, because the work of infusion pump, refrigerant is from freezing radiator, take away heat on the refrigeration radiator, heat is delivered to warm the Tibetan on the heat dump, improved the operating efficiency of heat-producing machine, if temperature is lower than environment temperature on the heat dump of warm Tibetan, then draw additional heat from surrounding air, if warm temperature of hiding on the heat dump is higher than environment temperature, then refrigerant is delivered to unnecessary heat in the condenser, be dispersed in the ambient air again, because heat-producing machine has been drawn heat by the warm heat dump of hiding from refrigerant, make that once more to flow to the temperature of refrigerant of freezing radiator and refrigeration radiator by infusion pump lower, also just improved the refrigerating efficiency of refrigerator.
Owing to adopted technique scheme, the utlity model has refrigerating chamber, refrigerating chamber and warm keeping chamber, and refrigerating chamber, refrigerating chamber refrigeration and the heat that produces heats with warm keeping chamber and the cold that produces neutralizes mutually utilization, improved the refrigerating efficiency and the heating efficiency of semiconductor chilling plate.
Description of drawings of the present utility model is as follows:
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the schematic diagram of first kind of embodiment of the utility model;
Fig. 3 is the schematic diagram of second kind of embodiment of the utility model;
Fig. 4 is the schematic diagram of the third embodiment of the utility model;
Among the figure: 1. warm keeping chamber; 2. refrigerating chamber; 3. refrigerating chamber; 4. the warm radiator of hiding; 5. refrigeration heat dump; 6. freezing heat dump; 7. heat-producing machine; 8. refrigerator; 9. refrigerator; 10. the warm heat dump of hiding; 11. refrigeration radiator; 12. freezing radiator; 13. condenser; 14. infusion pump; 15. infusion pump.
The utility model is described in further detail below in conjunction with drawings and Examples:
As shown in Figure 1, the utility model includes the freezing heat dump 6 that is arranged in the refrigerating chamber 3, refrigeration heat dump 5 in the refrigerating chamber 2, warm Tibetan radiator 4 in the warm keeping chamber 1, and be arranged on refrigerating chamber 3, freezing radiator 12 outside refrigerating chamber 2 and the warm keeping chamber 1, refrigeration radiator 11, the warm heat dump 10 of hiding, condenser 13 and infusion pump 14, freezing heat dump 6 is by refrigerator 9 and the closely contact mutually of freezing radiator 12, refrigeration heat dump 5 passes through refrigerator 8 and refrigerates radiator 11 close contact mutually, the warm radiator 4 of hiding is by heat-producing machine 7 and the closely contact mutually of warm Tibetan heat dump 10, refrigerator 8, refrigerator 9 and heat-producing machine 7 all are made up of semiconductor chilling plate, the feature of the technical program is: freezing radiator 12, refrigeration radiator 11, the warm heat dump 10 of hiding, condenser 13 and infusion pump 14 interconnect, and constitute the flow passage of refrigerant.
Operation principle of the present utility model is such: after connecting power supply, refrigerator 8, refrigerator 9, heat-producing machine 7 and infusion pump 14 are all started working, refrigerator 9 constantly passes through freezing heat dump 6 from refrigerating chamber 3 interior draw heats, and heat is delivered on the freezing radiator 12, take away by refrigerant again, because heat is constantly drawn, temperature reduces in the refrigerating chamber 3, reach the purpose of refrigeration, equally, refrigerator 8 is constantly by refrigerating heat dump 5 from refrigerating chamber 2 interior draw heats, and heat be delivered to refrigeration radiator 11 on, take away by refrigerant again, because heat is constantly drawn, temperature reduces in the refrigerating chamber 2, reach the purpose of refrigeration, 7 of heat-producing machines pass through the warm constantly draw heat from refrigerant of heat dump 10 of hiding, and heat is delivered to warm the Tibetan on the radiator 4, be dispersed into again in the warm keeping chamber 1, because heat constantly increases, temperature raises in the warm keeping chamber 1, reach the purpose that heats, because the work of infusion pump 14, refrigerant is from freezing radiator 12, take away heat on the refrigeration radiator 11, heat is delivered to warm the Tibetan on the heat dump 10, improved the operating efficiency of heat-producing machine 7, if temperature is lower than environment temperature on the heat dump 10 of warm Tibetan, then from surrounding air, draw additional heat, if warm temperature of hiding on the heat dump 10 is higher than environment temperature, then refrigerant is sent to unnecessary heat in the condenser 13, be dispersed in the ambient air again, because heat-producing machine 7 has been drawn heat by the warm heat dump 10 of hiding from refrigerant, make that once more to flow to the temperature of refrigerant of freezing radiator 12 and refrigeration radiator 11 by infusion pump 14 lower, also just improved refrigerator 8, the refrigerating efficiency of refrigerator 9.
As shown in Figure 2, be connected in series between infusion pump 14, freezing radiator 12 and the refrigeration radiator 11.
As shown in Figure 3, infusion pump 14 is connected respectively with freezing radiator 12, refrigeration radiator 11.
As shown in Figure 4, freezing radiator 12, refrigeration radiator 11 connect infusion pump 14 and infusion pump 15 respectively.
Claims (4)
1, a kind of multichip semiconductor function hutch, the freezing heat dump (6) that comprises (3) in the refrigerating chamber, refrigeration heat dump (5) in the refrigerating chamber (2), warm Tibetan radiator (4) in the warm keeping chamber (1), refrigerating chamber (3), the freezing radiator (12) that refrigerating chamber (2) and warm keeping chamber (1) are outer, refrigeration radiator (11), the warm heat dump (10) of hiding, infusion pump (14) and condenser (13), freezing heat dump (6) is by refrigerator (9) and freezing radiator (12) closely contact mutually, refrigeration heat dump (5) is by refrigerator (8) and refrigeration heat radiator (11) closely contact mutually, the warm radiator (3) of hiding is by heat-producing machine (7) and warm Tibetan heat dump (10) closely contact mutually, it is characterized in that: freezing radiator (12), refrigeration radiator (11), the warm heat dump (10) of hiding, condenser (13) and infusion pump (14) interconnect, and constitute the flow passage of refrigerant.
2, multichip semiconductor function hutch according to claim 1 is characterized in that: between infusion pump (14), freezing radiator (12) and the refrigeration radiator (11) is connected in series.
3, multichip semiconductor function hutch according to claim 1 is characterized in that: infusion pump (14) is connected respectively with freezing radiator (12), refrigeration radiator (11).
4, multichip semiconductor function hutch according to claim 1 is characterized in that: freezing radiator (12), refrigeration radiator (11) connect infusion pump (14) and infusion pump (15) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01271626 CN2505785Y (en) | 2001-11-05 | 2001-11-05 | Multi-functional semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01271626 CN2505785Y (en) | 2001-11-05 | 2001-11-05 | Multi-functional semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2505785Y true CN2505785Y (en) | 2002-08-14 |
Family
ID=33677030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01271626 Expired - Fee Related CN2505785Y (en) | 2001-11-05 | 2001-11-05 | Multi-functional semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2505785Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008077288A1 (en) * | 2006-12-22 | 2008-07-03 | Pan, Jingpo | A multi-functional semiconductor cold-storage and heat-storage two purpose box |
| WO2010072169A1 (en) * | 2008-12-28 | 2010-07-01 | 重庆森展科技有限公司 | Durable semiconductor box with two functions of refrigeration and heat preservation |
| CN101893346A (en) * | 2009-05-22 | 2010-11-24 | 刘万辉 | Method for manufacturing multifunctional semiconductor refrigerating and heating dual-purpose case |
| CN103808097A (en) * | 2012-11-05 | 2014-05-21 | 刘万辉 | Manufacturing method for novel multifunctional semiconductor cold storage and warm storage dual-purpose box |
| CN104329899A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Control method of semiconductor refrigerator |
-
2001
- 2001-11-05 CN CN 01271626 patent/CN2505785Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008077288A1 (en) * | 2006-12-22 | 2008-07-03 | Pan, Jingpo | A multi-functional semiconductor cold-storage and heat-storage two purpose box |
| WO2010072169A1 (en) * | 2008-12-28 | 2010-07-01 | 重庆森展科技有限公司 | Durable semiconductor box with two functions of refrigeration and heat preservation |
| CN101893346A (en) * | 2009-05-22 | 2010-11-24 | 刘万辉 | Method for manufacturing multifunctional semiconductor refrigerating and heating dual-purpose case |
| CN103808097A (en) * | 2012-11-05 | 2014-05-21 | 刘万辉 | Manufacturing method for novel multifunctional semiconductor cold storage and warm storage dual-purpose box |
| CN104329899A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Control method of semiconductor refrigerator |
| CN104329899B (en) * | 2014-03-28 | 2017-03-29 | 海尔集团公司 | The control method of semiconductor freezer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |