CN201973955U - Novel structure semiconductor refrigerating and heating box - Google Patents
Novel structure semiconductor refrigerating and heating box Download PDFInfo
- Publication number
- CN201973955U CN201973955U CN2010206174343U CN201020617434U CN201973955U CN 201973955 U CN201973955 U CN 201973955U CN 2010206174343 U CN2010206174343 U CN 2010206174343U CN 201020617434 U CN201020617434 U CN 201020617434U CN 201973955 U CN201973955 U CN 201973955U
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- CN
- China
- Prior art keywords
- semiconductor refrigerating
- heat exchanger
- composite condenser
- condenser
- storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Other Air-Conditioning Systems (AREA)
Abstract
The utility model discloses a novel structure semiconductor refrigerating heating box, which comprises an indoor heat exchanger, a semiconductor refrigerating and heating device, an outdoor heat exchanger, a composite condenser, an infusion pump and an electronic control board. One side of the semiconductor refrigerating and heating device is tightly contacted with the indoor heat exchanger; the other side of the semiconductor refrigerating and heating device is tightly contacted with the inner front side of the outdoor heat exchanger; the semiconductor refrigerating and heating device is electrically connected with the electronic control board; the outdoor heat exchanger, the composite condenser and the infusion pump are mutually connected and communicated to form a cyclic flowing passageway for liquid coolants. The novel structure semiconductor refrigerating and heating box is characterized in that the composite condenser is arranged in a bottom machine room of the semiconductor refrigerating and heating box; and a fan which can improve the heat exchange efficiency of the composite condenser and the air can be mounted beside the composite condenser. The novel structure semiconductor refrigerating and heating box has the characteristics that the novel structure semiconductor refrigerating and heating box can refrigerate or heat freely, and almost has no noises; moreover, the refrigerating and heating efficiency is far higher than that of a previous semiconductor refrigerating and heating box.
Description
Technical field: the utility model relates to the household electrical appliance that a kind of semiconductor refrigerating heats, particularly a kind of new construction semiconductor cold-storage and warm-storage case and be applied to a kind of novel comprehensive heat exchanger on this new construction semiconductor cold-storage and warm-storage case.
Background technology: at present, two kinds of semiconductor refrigeration boxes are arranged on the market. a kind of is the semiconductor refrigeration box that carries out external heat-exchanging with the fan radiation fin, not only can freeze but also can heat in the case, but refrigerating efficiency is low and obvious noise arranged, also having a kind of is the semiconductor refrigeration box that carries out external heat-exchanging with the heat pipe-type heat abstractor, refrigerating efficiency is high slightly, can not heat but freeze only in the case.
Summary of the invention: the purpose of this utility model provides a kind of like this new construction semiconductor cold-storage and warm-storage case, and it can freeze arbitrarily or heat, basic noiselessness, and refrigerating efficiency and heating efficiency are far above former semiconductor cold-storage and warm-storage case.
The purpose of this utility model is to realize by following technical scheme: make the cold-storage and warm-storage box body that has a storeroom and bottom machine chamber of suitable material, be made into suitable indoor heat exchanger with heat conductivility good metal material, being made into liquid coolant with suitable material can be at the outdoor heat exchanger of internal flow, the one side of semiconductor refrigerating heat-producing machine and indoor heat exchanger closely contact mutually, the another side of semiconductor refrigerating heat-producing machine closely contacts mutually with the interior front of outdoor heat exchanger, should interior front be to make with heat conductivility good metal material, the inside of outdoor heat exchanger has the flow passage that liquid coolant flows, have the liquid coolant inflow entrance that is connected with the mobile flow passage of the liquid coolant of outdoor heat exchanger inside on the outdoor heat exchanger, the liquid coolant flow export, and discharge air during system's liquid feeding and be used for replenishing the fluid infusion exhaust outlet of liquid feeding, make special-purpose Electronic Control plate, the Electronic Control plate is electrically connected mutually with the semiconductor refrigerating heat-producing machine, be made into composite condenser with heat conductivility good metal material, composite condenser is communicated with by one or more individual layer condenser and forms, the position of each individual layer condenser is parallel stacking, select suitable infusion pump for use, outdoor heat exchanger, composite condenser and infusion pump are interconnected to constitute the circulation flow passage that liquid coolant flows, and it is characterized in that: composite condenser is to be placed in the bottom machine chamber of new construction semiconductor cold-storage and warm-storage case.
Operation principle of the present utility model is such, here the refrigeration with the semiconductor cold-storage and warm-storage case illustrates, start working after the energising of semiconductor cold-storage and warm-storage case, the semiconductor refrigerating heat-producing machine is by indoor heat exchanger draw heat in the storeroom continuously, heat is passed to outdoor heat exchanger, the storage indoor temperature reduces, reach the purpose of refrigeration, because the work of infusion pump, liquid coolant is a kind of by outdoor heat exchanger like this, circulate in a kind of so comprehensive heat exchanger that composite condenser and infusion pump are interconnected to constitute, make the heat on the outdoor heat exchanger be brought on the composite condenser continuously, be dispersed in the ambient air again, because composite condenser is communicated with by one or more individual layer condenser and forms, usually be communicated with composition with two parallel stacking of individual layer condenser, with the effective heat exchange area of external environment condition greater than the individual layer condenser, so with the heat exchange efficiency of external environment condition greater than the individual layer condenser, if the blower fan that can improve composite condenser and air heat exchange efficiency is installed at composite condenser side place, to be higher then with the heat exchange efficiency of external environment condition, discharge air when having system's liquid feeding on the outdoor heat exchanger and be used for replenishing the fluid infusion exhaust outlet of liquid feeding, then be convenient to produce and maintenance.
Description of drawings: description of drawings of the present utility model is as follows:
Fig. 1 is the sectional structure schematic diagram of embodiment of the present utility model;
Fig. 2 is the syndeton schematic diagram of outer loop heat-exchange system embodiment of the present utility model.
Among the figure: 1. storeroom; 2. semiconductor refrigerating heat-producing machine; 3. indoor heat exchanger; 4. outdoor heat exchanger; 5. composite condenser; 6. infusion pump; 7. bottom machine chamber; 8. Electronic Control plate.
The specific embodiment: the utility model is described further below in conjunction with drawings and Examples:
As Fig. 1, shown in Figure 2, make the cold-storage and warm-storage box body that has a storeroom 1 and bottom machine chamber 7 of suitable material, be made into suitable indoor heat exchanger 3 with heat conductivility good metal material, being made into liquid coolant with suitable material can be at the outdoor heat exchanger 4 of internal flow, the one side of semiconductor refrigerating heat-producing machine 2 and indoor heat exchanger 3 closely contact mutually, the another side of semiconductor refrigerating heat-producing machine 2 closely contacts mutually with the interior front of outdoor heat exchanger 4, should interior front be to make with heat conductivility good metal material, the inside of outdoor heat exchanger 4 has liquid coolant flowing liquid refrigerant flow passage, having the liquid coolant that the liquid coolant flowing liquid refrigerant flow passage with outdoor heat exchanger 4 inside is connected on the outdoor heat exchanger 4 flows into and the liquid coolant flow export, and discharge air during system's liquid feeding and be used for replenishing the fluid infusion exhaust outlet of liquid feeding, make special-purpose Electronic Control plate 8, Electronic Control plate 8 is electrically connected mutually with semiconductor refrigerating heat-producing machine 2, be made into composite condenser 5 with heat conductivility good metal material, composite condenser 5 is communicated with by one or more individual layer condenser and forms, the position of each individual layer condenser is parallel stacking, select suitable infusion pump 6 for use, outdoor heat exchanger 4, composite condenser 5 and infusion pump 6 are interconnected to constitute the circulation flow passage that liquid coolant flows.It is characterized in that: composite condenser 5 is to be placed in the bottom machine chamber 7 of semiconductor cold-storage and warm-storage case.
Operation principle of the present utility model is such, here the refrigeration with the semiconductor cold-storage and warm-storage case illustrates, start working after the energising of semiconductor cold-storage and warm-storage case, semiconductor refrigerating heat-producing machine 2 passes through indoor heat exchanger 3 continuously from storeroom 1 interior draw heat, heat is passed to outdoor heat exchanger 4, temperature reduces in the storeroom 1, reach the purpose of refrigeration, because the work of infusion pump 6, liquid coolant a kind of like this by outdoor heat exchanger 4, circulate in a kind of so comprehensive heat exchanger that composite condenser 5 and infusion pump 6 are interconnected to constitute, make the heat on the outdoor heat exchanger 4 be brought to continuously on the composite condenser 5, be dispersed in the ambient air again, because composite condenser 5 is communicated with by one or more individual layer condenser and forms, usually be communicated with composition with two parallel stacking of individual layer condenser, with the effective heat exchange area of external environment condition greater than the individual layer condenser, so with the heat exchange efficiency of external environment condition greater than the individual layer condenser, if the blower fan that can strengthen composite condenser 5 and air exchange capability of heat is installed at composite condenser 5 side places, then composite condenser 5 will be higher with the heat exchange efficiency of external environment condition, discharge air when having system's liquid feeding on the outdoor heat exchanger 4 and be used for replenishing the fluid infusion exhaust outlet of liquid feeding, then be convenient to produce and maintenance.
Obviously, the blower fan that can improve composite condenser 5 and air heat exchange efficiency can be installed at composite condenser 5 side places.
Obviously, also the blower fan that can improve composite condenser 5 and air heat exchange efficiency can be installed at composite condenser 5 side places.
Claims (3)
1. new construction semiconductor cold-storage and warm-storage case, it comprises storeroom (1), bottom machine chamber (7), indoor heat exchanger (3), semiconductor refrigerating heat-producing machine (2), outdoor heat exchanger (4), composite condenser (5), infusion pump (6) and Electronic Control plate (8), the one side of semiconductor refrigerating heat-producing machine (2) and indoor heat exchanger (3) closely contact mutually, the another side of semiconductor refrigerating heat-producing machine (2) and the closely contact mutually of the interior front of outdoor heat exchanger (4), semiconductor refrigerating heat-producing machine (2) is electrically connected mutually with Electronic Control plate (8), outdoor heat exchanger (4), composite condenser (5) and infusion pump (6) interconnect connection, constitute the circulation flow passage of liquid coolant, it is characterized in that: composite condenser (5) is to be placed in the bottom machine chamber (7) of semiconductor cold-storage and warm-storage case.
2. a kind of according to claim 1 new construction semiconductor cold-storage and warm-storage case is characterized in that: composite condenser (5) by one or more individual layer condenser parallel stack to be communicated with form.
3. a kind of according to claim 1 new construction semiconductor cold-storage and warm-storage case is characterized in that: the blower fan that can improve composite condenser (5) and air heat exchange efficiency is installed at composite condenser (5) side place.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206174343U CN201973955U (en) | 2010-11-13 | 2010-11-13 | Novel structure semiconductor refrigerating and heating box |
| PCT/CN2011/081959 WO2012062204A1 (en) | 2010-11-13 | 2011-11-08 | Semiconductor cold and heat storage box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206174343U CN201973955U (en) | 2010-11-13 | 2010-11-13 | Novel structure semiconductor refrigerating and heating box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201973955U true CN201973955U (en) | 2011-09-14 |
Family
ID=44579054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206174343U Expired - Fee Related CN201973955U (en) | 2010-11-13 | 2010-11-13 | Novel structure semiconductor refrigerating and heating box |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN201973955U (en) |
| WO (1) | WO2012062204A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012062204A1 (en) * | 2010-11-13 | 2012-05-18 | 沈茂相 | Semiconductor cold and heat storage box |
| CN103808062A (en) * | 2012-11-05 | 2014-05-21 | 刘万辉 | Manufacturing method for novel semiconductor cold storage and warm storage box |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08121928A (en) * | 1994-10-26 | 1996-05-17 | Matsushita Electric Works Ltd | Refrigerator |
| RU2367857C1 (en) * | 2008-05-13 | 2009-09-20 | Иван Михайлович Голенковский | Method of drinking water cooling for automated beverage tapping machine and device and drinking water cooling |
| CN201322491Y (en) * | 2008-12-28 | 2009-10-07 | 刘万辉 | Novel durable multi-function semiconductor refrigerating-and-heating box |
| CN201615648U (en) * | 2010-02-24 | 2010-10-27 | 刘万辉 | Novel practical semiconductor refrigeration and heat preservation box |
| CN201973955U (en) * | 2010-11-13 | 2011-09-14 | 刘万辉 | Novel structure semiconductor refrigerating and heating box |
| CN202016654U (en) * | 2010-12-29 | 2011-10-26 | 刘万辉 | A new structure and multifunction semiconductor box serving dual purposes of cold storage and warm storage |
-
2010
- 2010-11-13 CN CN2010206174343U patent/CN201973955U/en not_active Expired - Fee Related
-
2011
- 2011-11-08 WO PCT/CN2011/081959 patent/WO2012062204A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012062204A1 (en) * | 2010-11-13 | 2012-05-18 | 沈茂相 | Semiconductor cold and heat storage box |
| CN103808062A (en) * | 2012-11-05 | 2014-05-21 | 刘万辉 | Manufacturing method for novel semiconductor cold storage and warm storage box |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012062204A1 (en) | 2012-05-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: SHEN MAOXIANG Effective date: 20150716 Owner name: CHONGQING SAIMI KANGDA INVESTMENT HOLDINGS CO., LT Free format text: FORMER OWNER: LIU WANHUI Effective date: 20150716 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150716 Address after: 402260 Jiangjin District, Chongqing Fu Industrial Park demolition and resettlement of the comprehensive building A District, building 2-2, No. 1 Patentee after: Chongqing match meter Kang Da share control takeover Co., Ltd Address before: 400050 Chongqing, Yangjiaping, a village of democracy, building 2, unit 2, building 1, No. 14 Patentee before: Liu Wanhui Patentee before: Shen Maoxiang |
|
| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: Chongqing match meter Kang Da share control takeover Co., Ltd Document name: Notification to Pay the Fees |
|
| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: Chongqing match meter Kang Da share control takeover Co., Ltd Document name: Notification of Termination of Patent Right |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110914 Termination date: 20171113 |