CN201242125Y - LED lamp with improved heat radiating structure - Google Patents
LED lamp with improved heat radiating structure Download PDFInfo
- Publication number
- CN201242125Y CN201242125Y CNU2008200501151U CN200820050115U CN201242125Y CN 201242125 Y CN201242125 Y CN 201242125Y CN U2008200501151 U CNU2008200501151 U CN U2008200501151U CN 200820050115 U CN200820050115 U CN 200820050115U CN 201242125 Y CN201242125 Y CN 201242125Y
- Authority
- CN
- China
- Prior art keywords
- led lamp
- semiconductor refrigerating
- semiconductor chilling
- chilling plate
- refrigerating piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 37
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 10
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound 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[Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000004411 aluminium Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 15
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000005057 refrigeration Methods 0.000 description 2
- 101700039143 LAMP2 Proteins 0.000 description 1
- 230000035508 accumulation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Abstract
The utility model discloses an LED lamp with an improved heat dissipation structure. The LED lamp comprises a semiconductor refrigerating piece and an LED lamp group which is attached on a cooling end of the semiconductor refrigerating piece and is composed of LED lamps, wherein the LED lamp utilizes the characteristic that one end of the semiconductor refrigerating piece is used to refrigerate cold and the other end is used to heat when electric current passes through the semiconductor refrigerating piece, heat which is generated by the LED lamps in work can be dissipated in time, the structure is simple, the heat dissipation effect is ideal, the volume is small, the heat of a heating end of the semiconductor refrigerating piece can be effectively dissipated in time through an aluminum radiating flange which is attached on the heating end of the semiconductor refrigerating piece, and the heat dissipation effect is intensified. Furthermore, two ends of the semiconductor refrigerating piece are covered with plane ceramic materials, a circuit of an electronic element can be customized on the ceramic materials of the cooling end of the semiconductor refrigerating piece, the heat dissipation effect can be more ideal, and the LED lamp can be widely used in LED lighting lamps, LED display screens and the like.
Description
Technical field
The utility model relates to a kind of illuminating lamp, particularly a kind of LED lamp of radiator structure improvement.
Background technology
At present, the LED lamp of high-power (more than the 1W) can only be converted into luminous energy with about 10% input power, all the other 90% have changed into heat energy, if heat energy can not leave timely and effectively, to cause the device chip temperature too high, cause a series of disastrous effects, as quicken Embedding Material and wear out, the speed-up chip light decay, simultaneously because a large amount of heat accumulations, thermal stress can make the LED lamp damage, thereby causes LED to shorten device lifetime, heat dissipation problem has become the key in the high-powered LED lamp dress envelope, and other of LED lamp used as also there is same problem in LED display etc., and in order to address this problem, the radiating mode of employing has following two kinds at present:
A kind of is to install aluminium radiator fin additional: this mode is fit to low power illuminating product heat radiation, after temperature reaches suction, heat radiation balance, temperature is basicly stable, temperature no longer rises, thereby plays the effect of heat radiation, and the advantage of this mode is simple, easy for installation, but its volume is big, when the power of product increased, the volume of radiator was restricted, and cost increases.
Another kind is to install aluminium radiator fin and fan additional: this mode is used in the relatively large illuminating product of power usually, after fin increases fan, increased the convection current of air, thereby play radiating effect, but this mode volume is big, and bigger noise is arranged, the life-span of fan is short, after fan is bad,, cause the damage of product easily as untimely replacing.
In a word, two kinds of above-mentioned radiating modes can only make the temperature of device drop near environment temperature, and radiating effect is undesirable, and the volume of radiator structure is big, is unfavorable for the miniaturization of product.
Summary of the invention
In order to overcome the deficiencies in the prior art, the utility model provides a kind of radiating effect desirable LED lamp.
The technical scheme that its technical problem that solves the utility model adopts is:
The LED lamp of a kind of radiator structure improvement, comprise the LED lamp group formed by the LED lamp and with the cooling mechanism of its applying, described cooling mechanism comprises semiconductor chilling plate, described LED lamp group is fitted in the cold junction of semiconductor chilling plate.
As further improvement of the utility model, described semiconductor chilling plate and LED lamp group are serially connected in the two ends of power supply.
Further improve as of the present utility model, the hot junction of described semiconductor chilling plate is fitted with aluminium radiator fin.
Further improve as of the present utility model, the two ends of described semiconductor chilling plate are coated with the ceramic material layer on plane, and the circuit of electronic component is customizable on the cold junction ceramic material layer of semiconductor chilling plate.
The beneficial effects of the utility model are: cooling mechanism of the present utility model comprises semiconductor chilling plate, LED lamp group is fitted in the cold junction of semiconductor chilling plate, it utilizes semiconductor chilling plate to flow through the Shi Yiduan refrigeration at electric current, the characteristic of one end heating, the heat that produces in the work of LED lamp is in time dissipated, it is simple in structure, the radiating effect ideal, volume is little, has the conventional unrivaled superiority of radiator structure of passing through finned or finned and fan, and the hot junction of semiconductor chilling plate of the present utility model is fitted with aluminium radiator fin, can be effectively the heat in semiconductor chilling plate hot junction be in time dissipated, strengthened the effect of heat radiation.In addition, the two ends of semiconductor chilling plate of the present utility model are coated with the ceramic material on plane, the circuit of electronic component is customizable on the cold junction ceramic material of semiconductor chilling plate, and its radiating effect can be desirable more, can be widely used in LED illuminating lamp and LED display etc.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is a semiconductor chilling plate structure chart of the present utility model;
Fig. 2 is the catenation principle figure of LED lamp and semiconductor chilling plate;
Fig. 3 is the structure chart of embodiment cooling system.
The specific embodiment
With reference to Fig. 1, Fig. 2, Fig. 3, a kind of LED lamp of radiator structure improvement, comprise the LED lamp group formed by LED lamp 2 and with the cooling mechanism of its applying, described cooling mechanism comprises semiconductor chilling plate 3, described LED lamp group is fitted in the cold junction of semiconductor chilling plate 3, it utilizes semiconductor chilling plate to flow through the Shi Yiduan refrigeration at electric current, the characteristic of one end heating, the heat that produces in the work of LED lamp is in time dissipated, it is simple in structure, the radiating effect ideal, volume is little, have the conventional unrivaled superiority of radiator structure of passing through finned or finned and fan, can be widely used in LED illuminating lamp and LED display etc.
As further improvement of the utility model, described semiconductor chilling plate 3 and LED lamp group are serially connected in the two ends of power supply, do not need independently power supply power supply, have simplified circuit structure.
Further improve as of the present utility model, the hot junction of described semiconductor chilling plate 3 is fitted with aluminium radiator fin 4, can be effectively the heat in semiconductor chilling plate hot junction be in time dissipated, and has strengthened the effect of heat radiation.
Further improve as of the present utility model, the two ends of described semiconductor chilling plate are coated with the ceramic material layer 1 on plane, and the circuit of electronic component is customizable on the cold junction ceramic material layer 1 of semiconductor chilling plate, and its radiating effect can be desirable more.
Claims (4)
1, a kind of LED lamp of radiator structure improvement, comprise the LED lamp group formed by LED lamp (2) and with the cooling mechanism of its applying, it is characterized in that described cooling mechanism comprises semiconductor chilling plate (3), described LED lamp group is fitted in the cold junction of semiconductor chilling plate (3).
2, the LED lamp of a kind of radiator structure improvement according to claim 1 is characterized in that described semiconductor chilling plate (3) and LED lamp group are serially connected in the two ends of power supply.
3, the LED lamp of a kind of radiator structure improvement according to claim 1 is characterized in that the hot junction of described semiconductor chilling plate (3) is fitted with aluminium radiator fin (4).
4, the LED lamp of improveing according to claim 1,2 or 3 described a kind of radiator structures, it is characterized in that the two ends of described semiconductor chilling plate are coated with the ceramic material layer on plane (1), the circuit of electronic component is customizable on the cold junction ceramic material layer (1) of semiconductor chilling plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200501151U CN201242125Y (en) | 2008-07-01 | 2008-07-01 | LED lamp with improved heat radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200501151U CN201242125Y (en) | 2008-07-01 | 2008-07-01 | LED lamp with improved heat radiating structure |
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| Publication Number | Publication Date |
|---|---|
| CN201242125Y true CN201242125Y (en) | 2009-05-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200501151U Expired - Lifetime CN201242125Y (en) | 2008-07-01 | 2008-07-01 | LED lamp with improved heat radiating structure |
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| Country | Link |
|---|---|
| CN (1) | CN201242125Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810620A (en) * | 2012-07-13 | 2012-12-05 | 重庆绿色科技开发有限公司 | Light emitting diode (LED) encapsulated by adopting semiconductor refrigeration plate as support |
| CN102129952B (en) * | 2010-01-12 | 2013-07-17 | 上海微电子装备有限公司 | Cooling device of high-pressure gas discharge lamp and condenser |
| CN103836386A (en) * | 2012-11-23 | 2014-06-04 | 海洋王（东莞）照明科技有限公司 | Lamp and cooling device thereof |
| WO2015027708A1 (en) * | 2013-09-02 | 2015-03-05 | 华为技术有限公司 | Optical device packaging device and optical module |
-
2008
- 2008-07-01 CN CNU2008200501151U patent/CN201242125Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102129952B (en) * | 2010-01-12 | 2013-07-17 | 上海微电子装备有限公司 | Cooling device of high-pressure gas discharge lamp and condenser |
| CN102810620A (en) * | 2012-07-13 | 2012-12-05 | 重庆绿色科技开发有限公司 | Light emitting diode (LED) encapsulated by adopting semiconductor refrigeration plate as support |
| CN103836386A (en) * | 2012-11-23 | 2014-06-04 | 海洋王（东莞）照明科技有限公司 | Lamp and cooling device thereof |
| WO2015027708A1 (en) * | 2013-09-02 | 2015-03-05 | 华为技术有限公司 | Optical device packaging device and optical module |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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| CX01 | Expiry of patent term |
Granted publication date: 20090520 |