CN219955530U - Magnetic-retaining semiconductor air conditioner - Google Patents
Magnetic-retaining semiconductor air conditioner Download PDFInfo
- Publication number
- CN219955530U CN219955530U CN202321200992.3U CN202321200992U CN219955530U CN 219955530 U CN219955530 U CN 219955530U CN 202321200992 U CN202321200992 U CN 202321200992U CN 219955530 U CN219955530 U CN 219955530U
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- China
- Prior art keywords
- air conditioner
- heat
- cabinet body
- cooling
- flitch
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 238000001816 cooling Methods 0.000 claims abstract description 61
- 239000007788 liquid Substances 0.000 claims abstract description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 239000003507 refrigerant Substances 0.000 claims description 14
- 230000000712 assembly Effects 0.000 claims description 11
- 238000000429 assembly Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 3
- 239000000523 sample Substances 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 claims 1
- 230000009471 action Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 2
- 239000003570 air Substances 0.000 description 54
- 238000005057 refrigeration Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000005679 Peltier effect Effects 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model discloses a magnetic latching semiconductor air conditioner, comprising: the air conditioner comprises an air conditioner outer cabinet body, a heat exchange mechanism and a plurality of semiconductor refrigerating sheets, wherein a water storage tank is arranged at the bottom end of the air conditioner outer cabinet body, a plurality of cooling fans are fixedly arranged on the surface of the air conditioner outer cabinet body, an air guide hopper with one side facing the surface of the cooling fans is arranged on the inner side of the air conditioner outer cabinet body, the heat exchange mechanism comprises a liquid cooling heat exchange assembly, a cooling air duct, a heat conduction flitch and a cold quantity collection assembly, and the heat conduction flitch is fixedly adhered to one side of the cold quantity collection assembly. According to the utility model, through arranging the multi-layer liquid cooling heat exchange assembly and the heat dissipation air duct structure, single action or combined action is respectively carried out on the heating surfaces of the semiconductor refrigerating sheets in different working states, liquid cooling and air cooling are carried out, and the heat productivity of the semiconductor refrigerating sheets in the refrigerating process is led out by utilizing the combined operation of the air cooling and the liquid cooling, so that the long-acting stable operation of the semiconductor refrigerating sheets is ensured.
Description
Technical Field
The utility model relates to the technical field of semiconductor air conditioners, in particular to a magnetic latching semiconductor air conditioner.
Background
A semiconductor air conditioner is an air conditioner using a semiconductor material as a cooling source. Unlike conventional compression type air conditioners, semiconductor air conditioners do not require the use of a refrigerant and mechanical compression system, but rather refrigeration is achieved by the special properties of the semiconductor material. The cooling principle of a semiconductor air conditioner is based on the Peltier effect, i.e. the transfer of heat from one side to the other by the electrothermal effect of the semiconductor material. When an electrical current passes through the semiconductor material, it absorbs heat from one side and then transfers it to the other side, where it releases heat. By controlling the direction and intensity of the current, cooling or heating can be achieved.
However, the semiconductor air conditioner realizes refrigeration and heating through the Peltier effect, in refrigeration work, the joule effect is caused by a circuit, so that the heating capacity is far more than the refrigerating capacity, especially in state operation, the refrigerating effect is closely related to the heat dissipation effect, in high power operation, the refrigerating capacity can be increased, more heat dissipation is needed to maintain the temperature balance, and the existing semiconductor air conditioner can not well solve the problem through simple air cooling.
In view of the above, the present utility model has been made in view of the above problems, and an object of the present utility model is to provide a magnetic semiconductor air conditioner that solves the problems and improves the practical value by the above technique.
Disclosure of Invention
The present utility model aims to solve one of the technical problems existing in the prior art or related technologies.
The technical scheme adopted by the utility model is as follows: a magnetically held semiconductor air conditioner comprising: the air conditioner cabinet comprises an air conditioner cabinet body, a heat exchange mechanism and a plurality of semiconductor refrigerating sheets, wherein a water storage tank is arranged at the bottom end of the air conditioner cabinet body, a plurality of cooling fans are fixedly arranged on the surface of the air conditioner cabinet body, an air guide hopper with one side facing the surface of the cooling fans is arranged on the inner side of the air conditioner cabinet body, the heat exchange mechanism comprises a liquid cooling heat exchange assembly, a heat dissipation air duct, a heat conduction flitch and a cold collecting assembly, the heat conduction flitch is fixedly adhered to one side of the cold collecting assembly, the heat dissipation air duct is located on the other side of the heat conduction flitch and is communicated with the end part of the air guide hopper, a refrigerant guide pipe used for connecting the air conditioner cabinet body is arranged at the bottom end of the liquid cooling heat exchange assembly, and a circulating pump set located inside the water storage tank is communicated with the bottom end of the cold collecting assembly.
The present utility model may be further configured in a preferred example to: the air conditioner cabinet is characterized in that the air conditioner cabinet body is of a closed cabinet body structure, an overhaul cabinet door is arranged on one side of the air conditioner cabinet body, and the radiating fans are symmetrically arranged on two sides of the air conditioner cabinet body and have the same wind directions.
The present utility model may be further configured in a preferred example to: the cold energy collection assembly comprises a water cooling coil and a plurality of fins attached to the surface of the water cooling coil, one end of the water cooling coil is communicated with the liquid inlet end of the circulating pump set, the other end of the water cooling coil is communicated with the inner cavity of the water storage tank, and the liquid outlet end of the circulating pump set is communicated with the inner cavity of the water storage tank.
The present utility model may be further configured in a preferred example to: the number of the liquid cooling heat exchange assemblies is three, the number of the semiconductor refrigerating sheets is four, the heating surfaces of two semiconductor refrigerating sheets are respectively fixed and adhered to the two sides of one liquid cooling heat exchange assembly, the number of the heat dissipation air duct, the heat conduction flitch and the cold collecting assembly is two, the heat dissipation air duct, the heat conduction flitch and the cold collecting assembly are symmetrically arranged with respect to the liquid cooling heat exchange assemblies, and the other two liquid cooling heat exchange assemblies are fixed on the heating surfaces of the other two semiconductor refrigerating sheets.
The present utility model may be further configured in a preferred example to: the heat conduction flitch is aluminum plate or copper plate structure, heat conduction grease layer has all been paintd to the both sides in heat dissipation wind channel.
The present utility model may be further configured in a preferred example to: the liquid cooling heat exchange assembly comprises a flitch and a refrigerant coil, wherein the refrigerant coil is embedded in the flitch, and the flitch is of an aluminum plate or copper plate structure.
The present utility model may be further configured in a preferred example to: the input end of radiator fan and circulating pump group electric connection have the controller, the input electric connection of controller has the embedding in liquid cooling heat exchange assembly surface temperature probe.
The beneficial effects obtained by the utility model are as follows:
1. according to the utility model, through arranging the multi-layer liquid cooling heat exchange assembly and the heat dissipation air duct structure, single action or combined action is respectively carried out on the heating surfaces of the semiconductor refrigerating sheets in different working states, liquid cooling and air cooling are carried out, and the heat productivity of the semiconductor refrigerating sheets in the refrigerating process is led out by utilizing the combined operation of the air cooling and the liquid cooling, so that the long-acting stable operation of the semiconductor refrigerating sheets is ensured.
2. According to the utility model, through a reasonable layout structure, synchronous heat dissipation and temperature control of the plurality of semiconductor refrigerating sheets are realized by the plurality of groups of heat dissipation air channels and the liquid cooling heat exchange assemblies, so that the plurality of semiconductor refrigerating sheets are arranged to cooperatively work through a small-inlet structural volume, the refrigerating and heating quantity is improved, and the efficient regulation of the ambient air is realized.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present utility model;
FIG. 2 is a schematic view of a heat exchange mechanism and air scoop mounting structure according to one embodiment of the present utility model;
FIG. 3 is a schematic top view of a heat exchange mechanism according to an embodiment of the present utility model;
fig. 4 is a schematic side view of a heat exchange mechanism according to an embodiment of the present utility model.
Reference numerals:
100. an air conditioner outer cabinet body; 110. a heat radiation fan; 120. overhauling a cabinet door; 130. an air guide hopper;
200. a water storage tank; 210. a circulating pump group;
300. a heat exchange mechanism; 310. a liquid-cooled heat exchange assembly; 320. a heat dissipation air duct; 330. a heat conductive flitch; 340. a cold energy collection assembly; 311. a refrigerant conduit; 400. semiconductor refrigerating sheet.
Detailed Description
The objects, technical solutions and advantages of the present utility model will become more apparent by the following detailed description of the present utility model with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.
The following describes a magnetically held semiconductor air conditioner provided by some embodiments of the present utility model with reference to the accompanying drawings.
Referring to fig. 1 to 4, the magnetic latching semiconductor air conditioner provided by the present utility model includes: the air conditioner cabinet body 100, the heat exchange mechanism 300 and a plurality of semiconductor refrigerating sheets 400, the bottom of the air conditioner cabinet body 100 is provided with a water storage tank 200, a plurality of radiator fans 110 are fixedly installed on the surface of the air conditioner cabinet body 100, the inner side of the air conditioner cabinet body 100 is provided with a wind scooper 130 with one side facing the surface of the radiator fans 110, the heat exchange mechanism 300 comprises a liquid cooling heat exchange component 310, a heat dissipation air duct 320, a heat conduction flitch 330 and a cold collection component 340, the heat conduction flitch 330 is fixedly attached to one side of the cold collection component 340, the heat dissipation air duct 320 is located on the other side of the heat conduction flitch 330 and is communicated with the end part of the wind scooper 130, the bottom of the liquid cooling heat exchange component 310 is provided with a refrigerant guide pipe 311 for connecting an air conditioner, and a circulating pump set 210 located inside the water storage tank 200 is communicated with the bottom of the cold collection component 340.
In this embodiment, the air conditioner cabinet 100 has a closed cabinet structure, one side of which is provided with an inspection cabinet door 120, and the cooling fans 110 are symmetrically arranged at two sides of the air conditioner cabinet 100, and the wind directions of the two cooling fans 110 are the same.
Specifically, external airflow diversion is realized through the cooling fan 110, so that airflow flux in the cooling air duct 320 is increased, and air cooling efficiency is improved.
In this embodiment, the cold collection assembly 340 includes a water-cooled coil and a plurality of fins attached to the surface of the water-cooled coil, one end of the water-cooled coil is connected to the liquid inlet end of the circulation pump set 210 and the other end is connected to the inner cavity of the water storage tank 200, and the liquid outlet end of the circulation pump set 210 is connected to the inner cavity of the water storage tank 200.
Specifically, the circulation flow of the water liquid in the cold energy collection assembly 340 is utilized to exchange the flow of the water liquid in the water storage tank 200, and the water liquid is utilized to rapidly cool the heating surface of the semiconductor refrigeration sheet 400.
In this embodiment, the number of the liquid cooling heat exchange assemblies 310 is three, the number of the semiconductor refrigeration sheets 400 is four, the heating surfaces of two semiconductor refrigeration sheets 400 are respectively fixed and adhered to the two sides of one of the liquid cooling heat exchange assemblies 310, and the numbers of the heat dissipation air duct 320, the heat conduction flitch 330 and the cold collecting assembly 340 are two groups and symmetrically arranged with respect to the liquid cooling heat exchange assemblies 310, and the other two liquid cooling heat exchange assemblies 310 are fixed on the heating surfaces of the other two semiconductor refrigeration sheets 400.
Specifically, through symmetrical layout design, the synchronous heat dissipation temperature control of a plurality of semiconductor refrigeration sheets 400 is realized by a plurality of groups of heat dissipation air channels 320 and liquid cooling heat exchange assemblies 310, so that the plurality of semiconductor refrigeration sheets 400 are arranged to cooperatively work through a small-inlet structural volume, the refrigeration and heating quantity is improved, and the efficient regulation of the ambient air is realized.
In this embodiment, the heat-conducting flitch 330 is an aluminum plate or copper plate structure, and both sides of the heat-dissipating air duct 320 are coated with a heat-conducting grease layer.
In this embodiment, the liquid-cooled heat exchange assembly 310 includes a flitch and a refrigerant coil, the refrigerant coil is embedded inside the flitch, and the flitch is an aluminum plate or copper plate structure.
Specifically, the heat is absorbed by attaching the attaching plate to the heating surface of the semiconductor refrigeration sheet 400 and is conducted to the refrigerant coil and the refrigerant, and the indoor environment is adjusted by utilizing the heat exchange between the refrigerant and the air conditioner.
In this embodiment, the inputs of the cooling fan 110 and the circulation pump unit 210 are electrically connected to a controller, and the input of the controller is electrically connected to a temperature probe embedded in the surface of the liquid cooling heat exchange component 310.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents.
Claims (7)
1. A magnetic latching semiconductor air conditioner, comprising: the air conditioner cabinet body (100), heat transfer mechanism (300) and a plurality of semiconductor refrigerating sheets (400), the bottom of the air conditioner cabinet body (100) is equipped with storage water tank (200), the fixed surface mounting of the air conditioner cabinet body (100) has a plurality of radiator fan (110), the inboard of the air conditioner cabinet body (100) is equipped with one side air guide hopper (130) to radiator fan (110) surface, heat transfer mechanism (300) include liquid cooling heat exchange assembly (310), heat dissipation wind channel (320), heat conduction flitch (330) and cold volume collection subassembly (340), heat conduction flitch (330) are fixed to paste in one side of cold volume collection subassembly (340), heat dissipation wind channel (320) are located the opposite side of heat conduction flitch (330) and are linked together with the tip of air guide hopper (130), the bottom of liquid cooling heat exchange assembly (310) is equipped with refrigerant pipe (311) that are used for connecting the air conditioner internal machine, the bottom intercommunication of cold volume collection subassembly (340) has circulating pump group (210) that are located storage water tank (200) inside.
2. The magnetic latching semiconductor air conditioner according to claim 1, wherein the air conditioner external cabinet body (100) is of a closed cabinet body structure, one side of the air conditioner external cabinet body is provided with a maintenance cabinet door (120), and the cooling fans (110) are symmetrically arranged on two sides of the air conditioner external cabinet body (100) and the wind directions of the two cooling fans (110) are the same.
3. The magnetically held semiconductor air conditioner of claim 1, wherein the cold energy collection assembly (340) comprises a water cooling coil and a plurality of fins attached to the surface of the water cooling coil, one end of the water cooling coil is communicated with a liquid inlet end of the circulating pump unit (210) and the other end of the water cooling coil is communicated with an inner cavity of the water storage tank (200), and a liquid outlet end of the circulating pump unit (210) is communicated with the inner cavity of the water storage tank (200).
4. The magnetic latching semiconductor air conditioner according to claim 1, wherein the number of the liquid cooling heat exchanging assemblies (310) is three, the number of the semiconductor refrigerating sheets (400) is four, heating surfaces of two semiconductor refrigerating sheets (400) are respectively fixed and adhered to two sides of one liquid cooling heat exchanging assembly (310), the number of the heat dissipation air duct (320), the heat conduction flitch (330) and the cooling capacity collecting assembly (340) are two groups and are symmetrically arranged with respect to the liquid cooling heat exchanging assembly (310), and the other two liquid cooling heat exchanging assemblies (310) are fixed on the heating surfaces of the other two semiconductor refrigerating sheets (400).
5. The magnetic latching semiconductor air conditioner of claim 1, wherein said heat conductive paste plate (330) is of an aluminum plate or copper plate structure, and both sides of said heat dissipation air duct (320) are coated with a heat conductive grease layer.
6. The magnetically held semiconductor air conditioner of claim 1, wherein the liquid cooled heat exchange assembly (310) comprises a flitch and a refrigerant coil, the refrigerant coil is embedded inside the flitch, and the flitch is an aluminum plate or copper plate structure.
7. The magnetic latching semiconductor air conditioner of claim 1, wherein the heat dissipating fan (110) and the circulation pump (210) are electrically connected to a controller, and the controller is electrically connected to a temperature probe embedded in the surface of the liquid cooling heat exchanging assembly (310).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321200992.3U CN219955530U (en) | 2023-05-15 | 2023-05-15 | Magnetic-retaining semiconductor air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321200992.3U CN219955530U (en) | 2023-05-15 | 2023-05-15 | Magnetic-retaining semiconductor air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219955530U true CN219955530U (en) | 2023-11-03 |
Family
ID=88548727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321200992.3U Active CN219955530U (en) | 2023-05-15 | 2023-05-15 | Magnetic-retaining semiconductor air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219955530U (en) |
-
2023
- 2023-05-15 CN CN202321200992.3U patent/CN219955530U/en active Active
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| GR01 | Patent grant |