CN216600648U - Communication cabinet with heat dissipation device - Google Patents

Communication cabinet with heat dissipation device Download PDF

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Publication number
CN216600648U
CN216600648U CN202123427782.1U CN202123427782U CN216600648U CN 216600648 U CN216600648 U CN 216600648U CN 202123427782 U CN202123427782 U CN 202123427782U CN 216600648 U CN216600648 U CN 216600648U
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Prior art keywords
cabinet body
cooling
cooling cavity
water
heat dissipation
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CN202123427782.1U
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Chinese (zh)
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魏桂军
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Gu'an Guangtong Railway Electrical Equipment Co ltd
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Gu'an Guangtong Railway Electrical Equipment Co ltd
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Abstract

The utility model discloses a communication cabinet with a heat dissipation device in the technical field of communication devices, which comprises a cabinet body, wherein the upper side of the cabinet body is provided with a first cooling cavity, the right side of the first cooling cavity is fixedly connected with an air inlet, and a fan is arranged in the air inlet; the inner walls of the upper side and the lower side of the first cooling cavity are respectively provided with semiconductor refrigeration plates at equal intervals; a second cooling cavity is fixedly arranged on the outer wall of the left side of the cabinet body, a water cooling mechanism is arranged in the second cooling cavity, and the second cooling cavity is connected with the first cooling cavity through a pipeline; a plurality of nozzles communicated with the right wall of the second cooling cavity are fixedly arranged on the inner wall of the left side of the cabinet body, and a heat dissipation port is arranged on the right side of the cabinet body; the device can improve the radiating efficiency greatly through the dual cooling in first cooling chamber and second cooling chamber when using, and the radiating effect is good for the holistic radiating effect of device reaches the best, has very strong practicality.

Description

Communication cabinet with heat dissipation device
Technical Field
The utility model relates to a communication device technical field specifically is a communication rack with heat abstractor.
Background
Along with the progress of society and the continuous development of science and technology, the application of communication rack in people's life is more and more extensive, often will set up heat abstractor on the rack in order to guarantee the normal operating of rack.
Chinese patent with patent number CN201120393534 discloses a heat dissipation device for a communication cabinet, which comprises an air source, and further comprises an air supply assembly installed in the communication cabinet and communicated with the air source, wherein the air supply assembly is an integral sealing structure composed of a horizontal pipeline and a vertical pipeline which are vertically communicated with each other, and the air supply assembly is provided with at least one air inlet communicated with the air source and a plurality of air holes for supplying air into the communication cabinet.
Although the problem that the local temperature in the cabinet is uneven when the existing heat dissipation device dissipates heat is solved, the problems that the heat dissipation mode is single, the heat dissipation efficiency is low, an alarm cannot be timely given out when the temperature in the cabinet is too high, and the heat dissipation reliability of the cabinet is poor still exist.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a communication rack with heat abstractor to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a communication cabinet with a heat dissipation device comprises a cabinet body, wherein a first cooling cavity is arranged on the upper side of the cabinet body, the right side of the first cooling cavity is fixedly connected with an air inlet, and a fan is arranged in the air inlet; semiconductor refrigerating plates are respectively arranged on the inner walls of the upper side and the lower side of the first cooling cavity at equal intervals; a second cooling cavity is fixedly arranged on the outer wall of the left side of the cabinet body, a water cooling mechanism is arranged in the second cooling cavity, and the second cooling cavity is connected with the first cooling cavity through a pipeline; the cabinet body is characterized in that a plurality of nozzles communicated with the right wall of the second cooling cavity are fixedly mounted on the inner wall of the left side of the cabinet body, and a heat dissipation opening is mounted on the right side of the cabinet body.
Preferably, cabinet body downside is provided with the support, support left side fixed mounting has the backup pad, water-cooling mechanism includes the heat exchanger of fixed mounting in the backup pad upside, heat exchanger upside fixed mounting has the water tank, water tank internally mounted has the micropump, be connected with the water pipe on the micropump, the inside cooling tube that is provided with of second cooling chamber, the end and the water pipe upper end fixed connection of intaking of cooling tube, the play water end fixed connection of cooling tube and the end of intaking of heat exchanger, the play water end fixedly connected with circulating pipe of heat exchanger, the terminal and water tank left side upper end wall fixed connection of circulating pipe.
Preferably, the bottom surface of the inner part of the cabinet body is fixedly provided with two brackets, two heat-conducting plates are arranged between the brackets, and the lower side of each heat-conducting plate is fixedly connected with a plurality of radiating fins which penetrate through the lower wall of the cabinet body and extend to the lower part of the cabinet body.
Preferably, the lower side of the support is provided with wheels.
Compared with the prior art, the beneficial effects of the utility model are that: when the device is used, the heat dissipation efficiency can be greatly improved through the double cooling of the first cooling cavity and the second cooling cavity, and the heat dissipation effect is good; meanwhile, the heat conducting plate can be used for radiating elements positioned at the bottom in the cabinet body, and the heat on the heat conducting plate is discharged to the outside of the cabinet body through the radiating fins, so that the radiating effect is enhanced, the integral radiating effect of the device is optimal, and the practicability is high.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic diagram of the internal structure of the present invention.
In the figure: 1. a cabinet body; 2. a support; 3. a wheel; 4. a heat dissipation port; 5. a first cooling chamber; 6. an air inlet; 7. a semiconductor refrigeration plate; 8. a fan; 9. a second cooling chamber; 10. a water tank; 11. a water pipe; 12. a micro-pump; 13. a circulation pipe; 14. a heat exchanger; 15. a support plate; 16. a cooling tube; 17. a nozzle; 18. a support; 19. a heat conducting plate; 20. and (4) radiating fins.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: a communication cabinet with a heat dissipation device comprises a cabinet body 1, wherein a first cooling cavity 5 is arranged on the upper side of the cabinet body 1, an air inlet 6 is fixedly connected to the right side of the first cooling cavity 5, and a fan 8 is installed in the air inlet 6; the inner walls of the upper side and the lower side of the first cooling cavity 5 are respectively provided with semiconductor refrigeration plates 7 at equal intervals; a second cooling cavity 9 is fixedly arranged on the outer wall of the left side of the cabinet body 1, a water cooling mechanism is arranged in the second cooling cavity 9, and the second cooling cavity 9 is connected with the first cooling cavity 5 through a pipeline; a plurality of nozzles 17 communicated with the right wall of the second cooling cavity 9 are fixedly mounted on the inner wall of the left side of the cabinet body 1, and a heat dissipation opening 4 is mounted on the right side of the cabinet body 1.
Further, a support 2 is arranged on the lower side of the cabinet body 1, a support plate 15 is fixedly mounted on the left side of the support 2, the water cooling mechanism comprises a heat exchanger 14 fixedly mounted on the upper side of the support plate 15, a water tank 10 is fixedly mounted on the upper side of the heat exchanger 14, a micro pump 12 is mounted in the water tank 10, a water pipe 11 is connected to the micro pump 12, a cooling pipe 16 is arranged in the second cooling cavity 9, the water inlet end of the cooling pipe 16 is fixedly connected with the upper end of the water pipe 11, the water outlet end of the cooling pipe 16 is fixedly connected with the water inlet end of the heat exchanger 14, the water outlet end of the heat exchanger 14 is fixedly connected with a circulating pipe 13, and the tail end of the circulating pipe 13 is fixedly connected with the upper end wall of the left side of the water tank 10; when the gas cooler is used, firstly, the fan 8 is started to suck external gas into the first cooling cavity 5, and when the gas passes through the semiconductor refrigerating plates 7 in the first cooling cavity 5, the gas can exchange heat with the semiconductor refrigerating plates 7 to be primarily cooled, and the semiconductor refrigerating plates 7 are arranged at equal intervals from top to bottom, so that the time of the gas passing through the semiconductor refrigerating plates 7 can be prolonged, and the cooling effect of the semiconductor refrigerating plates 7 on the gas is enhanced; the air flows into the second cooling cavity 9 after being primarily cooled in the first cooling cavity 5, the micro pump 12 and the heat exchanger 14 are always in a starting state, the micro pump 12 can pump cold water in the water tank 10 into the cooling pipe 16 through the water pipe 11, the air flowing into the second cooling cavity 9 can exchange heat with the cold water in the cooling pipe 16 again to realize secondary cooling, the air temperature is reduced, the water temperature is increased, the air after secondary cooling is changed into cold air, the cold air flows into the cabinet body 1 through the nozzle 17, and hot air in the cabinet body 1 is driven out from the heat dissipation port 4, so that heat dissipation is realized; and after the temperature of water rises, the water is changed into cold water after heat exchange of the heat exchanger 14, and the cold water flows back to the water tank 10 through the circulating pipe 13 for recycling, so that the energy is saved, and the environment is protected.
Furthermore, filter screens are installed in the heat dissipation opening 4 and the air inlet 6 to block external impurities.
Further, two brackets 18 are fixedly mounted on the bottom surface inside the cabinet body 1, a heat conducting plate 19 is arranged between the two brackets 18, and a plurality of radiating fins 20 penetrating through the lower wall of the cabinet body 1 and extending to the lower part of the cabinet body 1 are fixedly connected to the lower side of the heat conducting plate 19; the internal elements are arranged on the upper side of the heat conducting plate 19, the elements positioned at the bottom in the cabinet body 1 can be radiated through the heat conducting plate 19, and the heat on the heat conducting plate 19 is discharged to the outside of the cabinet body 1 through the radiating fins 20, so that the radiating effect is enhanced.
Further, the wheels 3 are arranged on the lower side of the support 2, the wheels 3 are universal wheels, the braking system is arranged on the wheels 3, when the braking system is turned on, the wheels 3 are in a braking state, the device is fixed, when the braking system is turned off, the wheels 3 are in a moving state, and the device can be moved to a target position according to requirements.
The utility model discloses a theory of operation is: when the gas cooler is used, firstly, the fan 8 is started to suck external gas into the first cooling cavity 5, when the gas passes through the semiconductor refrigerating plates 7 in the first cooling cavity 5, the gas can exchange heat with the semiconductor refrigerating plates 7, so that the gas is primarily cooled, and as the semiconductor refrigerating plates 7 are arranged at equal intervals, the time of the gas passing through the semiconductor refrigerating plates 7 can be prolonged, and the cooling effect of the semiconductor refrigerating plates 7 on the gas is enhanced; the air flows into the second cooling cavity 9 after being primarily cooled in the first cooling cavity 5, the micro pump 12 and the heat exchanger 14 are always in a starting state, the micro pump 12 can pump cold water in the water tank 10 into the cooling pipe 16 through the water pipe 11, the air flowing into the second cooling cavity 9 can exchange heat with the cold water in the cooling pipe 16 again to realize secondary cooling, the air temperature is reduced, the water temperature is increased, the air after secondary cooling is changed into cold air, the cold air flows into the cabinet body 1 through the nozzle 17, and hot air in the cabinet body 1 is driven out from the heat dissipation port 4, so that heat dissipation is realized; the heat dissipation efficiency can be greatly improved through the double cooling of the first cooling cavity 5 and the second cooling cavity 9, and the heat dissipation effect is good; meanwhile, the heat-conducting plate 19 can dissipate the heat of the elements at the bottom in the cabinet body 1, and the heat on the heat-conducting plate 19 is discharged to the outside of the cabinet body 1 through the heat-dissipating fins 20, so that the heat-dissipating effect is enhanced.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. A communication cabinet with a heat dissipation device comprises a cabinet body (1), and is characterized in that a first cooling cavity (5) is arranged on the upper side of the cabinet body (1), the right side of the first cooling cavity (5) is fixedly connected with an air inlet (6), and a fan (8) is installed in the air inlet (6); the inner walls of the upper side and the lower side of the first cooling cavity (5) are respectively provided with semiconductor refrigeration plates (7) at equal intervals; a second cooling cavity (9) is fixedly arranged on the outer wall of the left side of the cabinet body (1), a water cooling mechanism is arranged in the second cooling cavity (9), and the second cooling cavity (9) is connected with the first cooling cavity (5) through a pipeline; the utility model discloses a cabinet body, including cabinet body (1), fixed mounting has a plurality of nozzles (17) that communicate with second cooling chamber (9) right wall on the inner wall of cabinet body (1) left side, thermovent (4) are installed on cabinet body (1) right side.
2. The communication cabinet with heat dissipation device according to claim 1, wherein the cabinet body (1) is provided with a support (2) at the lower side, a supporting plate (15) is fixedly arranged on the left side of the support (2), the water cooling mechanism comprises a heat exchanger (14) fixedly arranged on the upper side of the supporting plate (15), a water tank (10) is fixedly arranged on the upper side of the heat exchanger (14), a micro pump (12) is arranged in the water tank (10), the micro pump (12) is connected with a water pipe (11), a cooling pipe (16) is arranged in the second cooling cavity (9), the water inlet end of the cooling pipe (16) is fixedly connected with the upper end of the water pipe (11), the water outlet end of the cooling pipe (16) is fixedly connected with the water inlet end of the heat exchanger (14), the water outlet end of the heat exchanger (14) is fixedly connected with a circulating pipe (13), and the tail end of the circulating pipe (13) is fixedly connected with the upper end wall of the left side of the water tank (10).
3. The communication cabinet with the heat dissipation device according to claim 1, wherein two brackets (18) are fixedly mounted on the bottom surface of the interior of the cabinet body (1), a heat conduction plate (19) is disposed between the two brackets (18), and a plurality of heat dissipation fins (20) extending to the lower side of the cabinet body (1) through the lower wall of the cabinet body (1) are fixedly connected to the lower side of the heat conduction plate (19).
4. Communication cabinet with heat sink according to claim 2, characterized in that the support (2) is provided with wheels (3) on the underside.
CN202123427782.1U 2021-12-31 2021-12-31 Communication cabinet with heat dissipation device Active CN216600648U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123427782.1U CN216600648U (en) 2021-12-31 2021-12-31 Communication cabinet with heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123427782.1U CN216600648U (en) 2021-12-31 2021-12-31 Communication cabinet with heat dissipation device

Publications (1)

Publication Number Publication Date
CN216600648U true CN216600648U (en) 2022-05-24

Family

ID=81631061

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123427782.1U Active CN216600648U (en) 2021-12-31 2021-12-31 Communication cabinet with heat dissipation device

Country Status (1)

Country Link
CN (1) CN216600648U (en)

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