CN108917444A - A kind of flexible flat heat pipe structure - Google Patents

A kind of flexible flat heat pipe structure Download PDF

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Publication number
CN108917444A
CN108917444A CN201811039105.2A CN201811039105A CN108917444A CN 108917444 A CN108917444 A CN 108917444A CN 201811039105 A CN201811039105 A CN 201811039105A CN 108917444 A CN108917444 A CN 108917444A
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CN
China
Prior art keywords
heat pipe
flat
flat plate
plate case
capillary wick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811039105.2A
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Chinese (zh)
Inventor
向建化
曹杰
张春良
周超
王品
王一品
郑浩星
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Guangzhou University
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Guangzhou University
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Publication date
Application filed by Guangzhou University filed Critical Guangzhou University
Priority to CN201811039105.2A priority Critical patent/CN108917444A/en
Publication of CN108917444A publication Critical patent/CN108917444A/en
Pending legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A kind of flexible flat heat pipe structure, it is related to flat-plate heat pipe technical field, its structure includes flexible thermally conductive flat plate case, filling liquid pipe and capillary wick, the inside of flat plate case is hollow, filling liquid pipe is connected with flat plate case, capillary wick is located inside flat plate case, the capillary wick is using capillary wick made of foam copper or copper wire establishment item, a kind of flexible flat heat pipe structure of the invention, by using flexible thermally conductive flat plate case, and using capillary wick made of foam copper or copper wire establishment item, so that size can be set as needed in flat-plate heat pipe structure, shape and thickness, and there is good flexibility, it can be used for the heat dissipation of the electronic equipment of curved-surface structure.

Description

A kind of flexible flat heat pipe structure
Technical field
The present invention relates to flat-plate heat pipe technical fields, more particularly to a kind of flexible flat heat pipe structure.
Background technique
With the development of society, electronic equipment occupies the every aspect in personal lifestyle, brought for us quick, efficient Life style.But in electronic technology into high frequency, high energy, high integration development process, in electronic component unit volume Heat flow density is increasing.Heating tape comes the problems such as electronic failure, performance decline and service life reduction, heat dissipation Problem has become the bottleneck for restricting electronic technology development.
Flat-plate heat pipe refers to that a kind of heat pipe of writing board shape, flat-plate heat pipe belong to a seed type of heat pipe, and plate heat Pipe has the advantages that more to protrude than general heat pipe, and shape is very beneficial for carrying out thermal diffusion to central heat source.Its work is former Reason is that flat-plate heat pipe is the vacuum cavity that an inner wall has capillary structure, and cavity is evacuated and is filled with working medium, when heat by When heat source to evaporating area, the working medium inside cavity can start the phenomenon that generating liquid-phase vaporization in the environment of rough vacuum, Working medium absorbs thermal energy at this time and rapid spatial expansion, the working medium of gas phase can be full of entire cavity quickly, when gas-phase working medium contacts To one than colder region when will generate condensation the phenomenon that, to release the heat accumulated in evaporation, the liquid after condensation Phase working medium due to the capillary action of capillary structure return evaporation heat source at, this process will in the cavity in cycles into Row, so circulation just can take away the heat of module generation.
Ordinary flat heat pipe overall structure is partially thick, and volume is larger, can not adapt to microminiature electronic structure opposite heat tube volume Requirement.The planform of advanced electronic equipment opposite heat tube put forward new requirements and classic flat-plate heat pipe because material and Prevent internal working medium gasification expansion from flat-plate heat pipe being caused to deform, classic flat-plate heat pipe does not have good elasticity, is not available In some electronic elements with special construction.
Summary of the invention
A kind of flexible flat heat pipe structure is provided it is an object of the invention to avoid shortcoming in the prior art, it should Size, shape and thickness can be set as needed in flexible flat heat pipe structure, and has good flexibility, can be used for curved-surface structure Electronic equipment heat dissipation.
The purpose of the present invention is achieved through the following technical solutions:
A kind of flexible flat heat pipe structure is provided, including flexible thermally conductive flat plate case, filling liquid pipe and capillary wick, plate The inside of shell be it is hollow, filling liquid pipe is connected with flat plate case, and capillary wick is located inside flat plate case, and the capillary wick is to adopt The capillary wick made of foam copper or copper wire establishment item.
Wherein, the flat plate case is using flat plate case made of copper sheet flexible.
Wherein, the flat plate case is using flat plate case made of titanium metal plate flexible.
Wherein, the flat plate case with a thickness of 0.05 to 0.1mm.
Wherein, the flat plate case with a thickness of 0.06 to 0.09mm.
Wherein, the flat plate case includes the first plate body and the second plate body being correspondingly arranged up and down, the first plate body and second The edge of plate body welds together.
Wherein, the upper and lower surfaces of the capillary wick interior table with the first plate body of the flat plate case, the second plate body respectively Face connection.The channel of the capillary wick and flat plate case inner surface composition enclosed cross.
Wherein, the upper and lower surfaces of the capillary wick are with the flat plate case surface by way of welding, bonding or compression It links together.
Wherein, the thickness of the capillary wick is not more than 1mm, and porosity is 60% or more.
Wherein, the shape of the flat plate case is irregular shape.
Beneficial effects of the present invention:
A kind of flexible flat heat pipe structure of the invention by using flexible thermally conductive flat plate case, and uses foam Capillary wick made of copper or copper wire establishment item, so that size, shape and thickness can be set as needed in flat-plate heat pipe structure, and With good flexibility, it can be used for the heat dissipation of the electronic equipment of curved-surface structure.
The present invention has the following advantages that:
First, flat-plate heat pipe can conduct heat to other positions rapidly, then after local location is heated along two-dimensional directional By bigger heat dissipation area by the outside dissipation of heat, the heat flow density of heat source is effectively reduced, realizes high efficiency and heat radiation.
Second, in evaporation region, shell is contacted with capillary core outer surface, the liquid working substance of capillary wick surface region directly by Thermal evaporation, subsequently into closed channel, it is not necessary to pass through liquid level, reduce flow resistance.
Third, in condenser zone, gas working medium is directly contacted with the lower plate body wall surface of temperature, after being condensed into liquid, hair The porous structure of thin core can transfer quickly the liquid in channel, and making cold wall face again has high-efficiency condensation ability, reduces Heat transfer resistance improves condensation efficiency.
4th, one or more through-holes can be set in capillary wick, making to heat gaseous working medium in the groove of side can be with It is flowed directly into the groove of the other side by through-hole, reduces Working fluid flow resistance.
5th, capillary wick can change thickness, in the case where capillary force is constant, reduce liquid working substance in porous structure Flow resistance.
Therefore, flat-plate heat pipe of the invention can be effectively reduced the heat flow density of heat source, samming when the plane that radiates is larger Property is good, effectively improves heat transfer efficiency.It also can be realized excellent average temperature performance in anti-gravity.
Detailed description of the invention
Invention is described further using attached drawing, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention, For those of ordinary skill in the art, without creative efforts, it can also be obtained according to the following drawings Its attached drawing.
Fig. 1 is the schematic diagram of flexible flat heat pipe structure of the invention.
Fig. 2 is the decomposition texture schematic diagram of flexible flat heat pipe structure of the invention.
Fig. 3 is the diagrammatic cross-section of flexible flat heat pipe structure of the invention.
First plate body 1, the second plate body 2, filling liquid pipe 3, capillary wick 4, gap 5.
Specific embodiment
In order to facilitate the present invention is understood, the explanation of a step will be made to the present invention according to relevant drawings below.It is provided in attached drawing Relatively good embodiment of the invention.But the present invention can be realized with many different forms, be not limited in this paper institute The embodiment referred to.On the contrary, showing that the purpose of these embodiments is in order to the more detailed of description of contents disclosed in this invention Carefully.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.
As shown in Figure 1 to Figure 3, a kind of flexible flat heat pipe in irregular shape, including Plate Shell are present embodiments provided Body (not identifying), filling liquid pipe 3 and capillary wick 4.Flat plate case is flat plate case made of copper sheet with a thickness of 0.08mm, capillary Core is thickness in 1mm foam copper below.
Wherein, the flat plate case inner hollow setting.The first plate body 1, the second plate body 2 of the flat plate case use not Regular shape, there are gap 5, the filling liquid pipes 3 to be connected to the plate by the gap 5 processing at the flat plate case edge On shell.The capillary wick 4 is set to the inside of the flat plate case, and the upper and lower surfaces of the capillary wick 4 respectively with it is described The inner surface connection of the first plate body 1, the second plate body 2 of flat plate case;The capillary wick 4 is set to the inside of the flat plate case Spaced gap;The channel of the capillary wick 4 and flat plate case composition enclosed cross.
In the present embodiment, the flat plate case includes the first plate body 1 being correspondingly arranged up and down, the second plate body 2.Described One plate body 1 and the second plate body 2 are correspondingly connected with by processing edge, so as to form the hollow structure of capillary wick 4 is accommodated, and are used for solid Surely the gap 5 for connecting filling liquid pipe 3 is set to the edge of flat plate case.
The gap of the capillary wick 4 can be axial symmetry setting, is also possible to shift to install or angle is arranged in a crossed manner, can also Setting is combined in two ways.Preferably, gap is to shift to install or angle is arranged in a crossed manner.
The closed channel of the gap of the capillary wick 4 and flat plate case composition is the gas stream in working medium circulation flow process Channel is moved, the porous structure in capillary wick 4 is liquid working substance flow channel.
The inner surface of the surface of the capillary wick 4 and the first plate body 1, the second plate body 2 can pass through welding, bonding or compression Etc. modes connect.The area of the capillary wick 4 is less than the area of flat-plate heat pipe.
The capillary wick 4 is single capillary structure, selects 60% or more porosity.Big porosity can guarantee biggish Permeability, and the resistance of Working fluid flow can be reduced, increase working medium circulation.High porosity can also reduce returning for condensate liquid Flowing pressure, and capillary limitation can be increased, these are all conducive to the heat transfer property for improving heat pipe.
It is appreciated that the either end of flat-plate heat pipe provided in this embodiment can be used as evaporation ends, and the other end can be made For condensation end, and it is interconnected between evaporation ends and condensation end without obvious boundary.
It is following that flat-plate heat pipe working principle provided by the invention is further described:
Fig. 2, Fig. 3 are please referred to, the above-mentioned flat-plate heat pipe course of work is illustrated, through filling liquid pipe 3 into flat-plate heat pipe Portion is filled with working medium, and after a certain position of flat-plate heat pipe is heated, the heat affected zone temperature of the first plate body 1 or the second plate body 2 rises, heat Amount is transmitted to the inside of flat-plate heat pipe rapidly, because plate body inner surface is contacted with capillary wick 4,4 proximity region of capillary wick Liquid working substance by thermal evaporation, the gas of generation enters in the gap of two sides, and gas condenses into liquid, working medium phase in condensation end to the cold Change discharges heat, and the liquid of generation is adsorbed and flowed into inside capillary wick 4 by the porous structure of two sides.Meanwhile because capillary wick 4 The evaporation of outer surface heated liquid, the liquid inside capillary wick 4 in the case where capillary force is acted on to surface flow, so the liquid of condensation end Constantly flowed to evaporation ends.It by the gas-liquid phase transition of working medium and circulates, the heat of evaporation ends is constantly transmitted to condensation end.
After flat-plate heat pipe is heated at one end, it can be reached quickly to the other positions and other end surface heat transfer of the same end To the purpose for increasing heat dissipation area reinforcing heat dissipation effect, hence it is evident that reduce the heat flow density of heat source.In evaporation ends, 4 table of capillary wick Then the liquid working substance in face region is flowed to two sides gap by thermal evaporation, it is not necessary to pass through liquid level, reduce flow resistance;Cold Solidifying end, gas working medium is directly contacted with the lower plate body surface of temperature, and after being condensed into liquid, the porous structure of capillary wick 4 can be fast Liquid in speed absorption gap, makes condensation end surfaces have condensation again, reduces heat transfer resistance.Capillary wick 4 can be selected With the bigger foam copper product of porosity, big porosity can guarantee biggish permeability, and can reduce Working fluid flow Resistance, increase working medium circulation.High porosity can also reduce the return pressure of condensate liquid, and can increase capillary pole Limit, these are all conducive to the heat transfer property for improving heat pipe.The flat-plate heat pipe structure of the present embodiment either flat plate case or hair The structure of thin core all has good flexibility, is able to satisfy in the case where certain bending setting, heat pipe structure is not destroyed, and is had Good average temperature performance.
The flat-plate heat pipe of the prior art is usually to carry out pressing processing using molding pipe, so its shape is generally advised Then, the flat-plate heat pipe of the present embodiment because being flexible, and is divided into the first plate body 1 and the first plate body 2, so the first plate The shape of body 1 and the second plate body 2 can be set to irregular shape, i.e., the shape of flat-plate heat pipe is arranged according to actual needs, so The first plate body 1 and the second plate body 2 are welded again afterwards, corresponding, capillary wick 4 is also irregular shape, as shown in Fig. 2, hair Thin core 4 is dendroid, in this way, flat-plate heat pipe after local location is heated, can be passed to other positions rapidly along two-dimensional directional Then the outside dissipation of heat is effectively reduced the heat flow density of heat source by bigger heat dissipation area, realizes high efficiency and heat radiation by heat.
The present embodiment has the following advantages that:
First, flat-plate heat pipe can conduct heat to other positions rapidly, then after local location is heated along two-dimensional directional By bigger heat dissipation area by the outside dissipation of heat, the heat flow density of heat source is effectively reduced, realizes high efficiency and heat radiation.
Second, in evaporation region, shell is contacted with capillary core outer surface, the liquid working substance of capillary wick surface region directly by Thermal evaporation, subsequently into closed channel, it is not necessary to pass through liquid level, reduce flow resistance.
Third, in condenser zone, gas working medium is directly contacted with the lower plate body wall surface of temperature, after being condensed into liquid, hair The porous structure of thin core can transfer quickly the liquid in channel, and making cold wall face again has high-efficiency condensation ability, reduces Heat transfer resistance improves condensation efficiency.
4th, one or more through-holes can be set in capillary wick, making to heat gaseous working medium in the groove of side can be with It is flowed directly into the groove of the other side by through-hole, reduces Working fluid flow resistance.
5th, capillary wick can change thickness, in the case where capillary force is constant, reduce liquid working substance in porous structure Flow resistance.
Therefore, the flat-plate heat pipe of the present embodiment can be effectively reduced the heat flow density of heat source when the plane that radiates is larger, Warm nature is good, effectively improves heat transfer efficiency.It also can be realized excellent average temperature performance in anti-gravity.
Each technical characteristic of embodiment described above can be combined arbitrarily, for brevity, not to above-mentioned reality All possibility combinations of each technical characteristic in example are applied all to be illustrated.But the as long as combination of these technologies spy card There is no contradictions, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, illustrate it is more specific and detailed, but simultaneously Therefore it cannot think the limitation to patent of invention range.In addition, for those of ordinary skill in the art, not departing from Under conditions of present inventive concept, several improvement can also be made, these are all within the scope of protection of the present invention.So the present invention The protection scope of patent should be determined by the appended claims.

Claims (10)

1. a kind of flexible flat heat pipe structure, it is characterised in that:Including flexible thermally conductive flat plate case, filling liquid pipe and capillary Core, the inside of flat plate case be it is hollow, filling liquid pipe is connected with flat plate case, and capillary wick is located inside flat plate case, the hair Thin core is using capillary wick made of foam copper or copper wire establishment item.
2. a kind of flexible flat heat pipe structure as described in claim 1, it is characterised in that:The flat plate case is using flexibility Copper sheet made of flat plate case.
3. a kind of flexible flat heat pipe structure as claimed in claim 2, it is characterised in that:The flat plate case is using flexibility Titanium metal plate made of flat plate case.
4. a kind of flexible flat heat pipe structure as described in claim 1, it is characterised in that:The flat plate case with a thickness of 0.05 to 0.1mm.
5. a kind of flexible flat heat pipe structure as claimed in claim 4, it is characterised in that:The flat plate case with a thickness of 0.06 to 0.09mm.
6. a kind of flexible flat heat pipe structure as described in claim 1, it is characterised in that:The flat plate case includes right up and down The edge of the first plate body and the second plate body that should be arranged, the first plate body and the second plate body welds together.
7. a kind of flexible flat heat pipe structure as described in claim 1, it is characterised in that:The upper and lower surfaces of the capillary wick It is connect respectively with the inner surface of the first plate body of the flat plate case, the second plate body.
8. a kind of flexible flat heat pipe structure as described in claim 1, it is characterised in that:The upper and lower surfaces of the capillary wick It is linked together by way of welding, bonding or compression with the flat plate case surface.
9. a kind of flexible flat heat pipe structure as described in claim 1, it is characterised in that:The thickness of the capillary wick is not more than 1mm, porosity are 60% or more.
10. a kind of flexible flat heat pipe structure as described in claim 1, it is characterised in that:The shape of the flat plate case is Irregular shape.
CN201811039105.2A 2018-09-06 2018-09-06 A kind of flexible flat heat pipe structure Pending CN108917444A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110518162A (en) * 2019-07-17 2019-11-29 南京航空航天大学 A kind of power battery module temperature control system based on ultra-thin panel flexible heat pipe
CN111654998A (en) * 2020-05-25 2020-09-11 南京理工大学 Ultrathin flexible heat dissipation device of flexible electronic device and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0059581A2 (en) * 1981-03-04 1982-09-08 National Research Development Corporation Improvements in heat pipes
CN101943491A (en) * 2010-09-07 2011-01-12 万建红 Flexible heat pipe flat-plate solar water heater
CN106091765A (en) * 2016-06-15 2016-11-09 广东工业大学 A kind of flat-plate heat pipe and preparation method thereof
CN107660099A (en) * 2016-07-26 2018-02-02 东莞爵士先进电子应用材料有限公司 Flat thin membrane type heat abstractor
CN108366508A (en) * 2017-01-26 2018-08-03 中国科学院工程热物理研究所 A kind of flexibility microflute group's radiator
CN208936834U (en) * 2018-09-06 2019-06-04 广州大学 A kind of flexible flat heat pipe structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0059581A2 (en) * 1981-03-04 1982-09-08 National Research Development Corporation Improvements in heat pipes
CN101943491A (en) * 2010-09-07 2011-01-12 万建红 Flexible heat pipe flat-plate solar water heater
CN106091765A (en) * 2016-06-15 2016-11-09 广东工业大学 A kind of flat-plate heat pipe and preparation method thereof
CN107660099A (en) * 2016-07-26 2018-02-02 东莞爵士先进电子应用材料有限公司 Flat thin membrane type heat abstractor
CN108366508A (en) * 2017-01-26 2018-08-03 中国科学院工程热物理研究所 A kind of flexibility microflute group's radiator
CN208936834U (en) * 2018-09-06 2019-06-04 广州大学 A kind of flexible flat heat pipe structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110518162A (en) * 2019-07-17 2019-11-29 南京航空航天大学 A kind of power battery module temperature control system based on ultra-thin panel flexible heat pipe
CN110518162B (en) * 2019-07-17 2022-04-08 南京航空航天大学 Power battery module temperature control system based on ultra-thin flat flexible heat pipe
CN111654998A (en) * 2020-05-25 2020-09-11 南京理工大学 Ultrathin flexible heat dissipation device of flexible electronic device and preparation method thereof

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