CN202168313U - Heat radiation device - Google Patents
Heat radiation device Download PDFInfo
- Publication number
- CN202168313U CN202168313U CN2011202343489U CN201120234348U CN202168313U CN 202168313 U CN202168313 U CN 202168313U CN 2011202343489 U CN2011202343489 U CN 2011202343489U CN 201120234348 U CN201120234348 U CN 201120234348U CN 202168313 U CN202168313 U CN 202168313U
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- temperature
- uniforming plate
- heat
- heat pipe
- fin
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Abstract
The utility model discloses a heat radiation device, particularly to a heat radiation device applied to a heating electronic component. The heat radiation device comprises at least one temperature-uniforming plate which is arranged relatively above the heating electronic component, a heat pipe and a cooling fin, wherein the temperature-uniforming plate is shaped as a chamber and is provided with working solution and capillary organizations, the heat pipe is shaped as a chamber and is provided with working solution and capillary organizations, a free end of the heat pipe is connected with the temperature-uniforming plate, the chamber of the temperature-uniforming plate and the chamber of the heat pipe are communicated so that working solution in vapour state or liquid state can exchange and move between the heat pipe and the temperature-uniforming plate, and the bottom of the cooling fin is welded above the temperature-uniforming plate. With such a structure, the temperature-uniforming plate absorbs heat of a heating electronic component, and the temperature-uniforming plate, the heat pipe and the communication structure between the temperature-uniforming plate and the heat pipe, together with vapour-liquid state conversion of the working solution and heat exchange structure of the cooling fin, improve heat radiation efficiency of the whole heat radiation device.
Description
Technical field
The utility model relates to a kind of heat abstractor, relates in particular to a kind of being applied on the heating electronic element, can promote the heat abstractor of heat exchanger effectiveness.
Background technology
Develop rapidly along with industries such as IT, communication, LED, solar energy; Wherein the caloric value of used electronic element is also significantly promoting; Simultaneously because the miniaturization of electric component; The density of heat flow rate of the electric component that makes significantly increases, and heat-dissipating space constantly reduces, so utilize traditional radiating subassembly to be difficult to well solve relevant hot arraign topic.
At present more radiating subassembly adopts to be welded to each other by temperature-uniforming plate, fin and heat pipe and forms.Fin is welded on the temperature-uniforming plate, and heat pipe is welded on the temperature-uniforming plate, and is arranged on the fin, accomplishes the transmission of heat.This radiator structure independently separately; Mostly connected mode between them is Type of Welding; Because the heat transfer limitations of this connected mode makes heat not pass to fin more directly, fast, uniformly, is unfavorable for the exchange heat of fin and surrounding environment; Thereby reduce the heat dispersion of radiator, cause its hot transfer efficiency not reach desirable condition.
Summary of the invention
The utility model provides a kind of heat abstractor, solves to cause its hot transfer efficiency not reach the problem of ideal conditions owing to radiating subassembly can not more directly, fast, evenly transmit heat at present.
The technical scheme of the utility model is: this heat abstractor; Comprise at least one temperature-uniforming plate, place the relative upper position of heating electronic element, this temperature-uniforming plate is a cavity body structure; In have working solution and capillary structure, the profile of temperature-uniforming plate is square, rectangle or circle; At least one heat pipe; This heat pipe is a cavity body structure, in have working solution and capillary structure, a free end of this heat pipe links to each other with temperature-uniforming plate one end; Intracavity inter-connection, thus the working solution of the steam state of making, liquid different shape can exchange motion between heat pipe and temperature-uniforming plate; At least one fin, its bottom is welded in the temperature-uniforming plate top.Fin is made up of and horizontal or vertical being located on the said temperature-uniforming plate the radiating fin of a plurality of certain spacing arrangement.
On fin, pass at least one heat pipe, so like this, the heat that thermal source produces passes to enclosure interior by temperature-uniforming plate surface housing, and the working solution heating with in the inner capillary structure layer of temperature-uniforming plate makes it to produce phase transformation, becomes steam.Steam void through temperature-uniforming plate is delivered to temperature-uniforming plate top with steam or through the steam void that temperature-uniforming plate is communicated with heat pipe steam is delivered to another free end of heat pipe.Another free end at temperature-uniforming plate top or heat pipe; Be cooled region, the heat transferred that the steam transmission is come is to fin, and the heat exchange through fin; With heat dissipation; Make the working solution cooling, thereby working solution becomes liquid state by steam, through capillary structure and working solution pressure reduction it is back to heating region again.
Perhaps when heat-dissipating space can not satisfy radiating condition, increase at least one radiating shell, be connected with another free end outer surface of heat pipe, preferred weld is in the outer surface of said heat pipe.Be used for increasing area of dissipation, thus utilize temperature-uniforming plate with heat transferred to the vertically disposed fin of temperature-uniforming plate on, and through the heat pipe that links to each other with temperature-uniforming plate with heat transferred to radiating shell, heat is just distributed by fin and radiating shell.
So; Through the structure of above-mentioned utility model, this heat abstractor utilizes working solution liquid-gas phase transition and transmission to reach the purpose of transmitting heat, and makes heat reach rapid diffusion through temperature-uniforming plate and Heat Transfer of Heat Pipe on Heat Pipe combination; Equally distributed effect is to promote the heat exchanger effectiveness of heat radiation module.
Description of drawings
Fig. 1 is the stereogram of the heat abstractor of the utility model first embodiment.
Fig. 2 is the profile of the heat abstractor of the utility model first embodiment.
Fig. 3 is the stereogram of the heat abstractor of the utility model second embodiment.
Fig. 4 is the stereogram of the heat abstractor of the utility model the 3rd embodiment.
Wherein, each Reference numeral representative as follows: 1-temperature-uniforming plate 2-heat pipe 3-fin 4-housing 5-heating electronic element 11-temperature-uniforming plate inner chamber 21-heat pipe inner chamber.
Embodiment
Detailed description of relevant the utility model and technology contents, conjunction with figs. are explained as follows, and reference and explanation usefulness only are provided, and are not to be used for limiting the utility model.
The utility model provides a kind of heat abstractor; Like Fig. 1, shown in Figure 2; In first embodiment of the utility model, this heat abstractor places the top of heating electronic element 5, comprises a temperature-uniforming plate 1; This temperature-uniforming plate 1 is rectangle and is cavity body structure, has working solution and capillary structure in the temperature-uniforming plate inner chamber 11.Temperature-uniforming plate 1 top is provided with some groups of fin 3, is preferably 5 groups, is rectilinear arrangement.Each fin 3 is made up of the radiating fin of a plurality of certain spacing arrangement, in the horizontal direction of each fin 3, each side passes a heat pipe 2, and this heat pipe 2 is a cavity body structure, has working solution and capillary structure in the heat pipe inner chamber 21.A free end of this heat pipe 2 links to each other with temperature-uniforming plate 1 one ends, and promptly temperature-uniforming plate inner chamber 11 is connected with heat pipe inner chamber 21, thereby makes the working solution of different shape can between heat pipe 2 and temperature-uniforming plate 1, exchange motion.So like this, at heating region, the heat that heating electronic element 5 produces passes to enclosure interior by temperature-uniforming plate 1 surperficial housing, with the heating of the working solution in the temperature-uniforming plate 1 inner capillary structure layer, makes it to produce phase transformation, becomes steam.Steam is delivered to temperature-uniforming plate top or through the heat pipe inner chamber 21 that is connected with temperature-uniforming plate inner chamber 11 steam is delivered to another free end of heat pipe 2 through temperature-uniforming plate inner chamber 11.Thereby, at another free end of temperature-uniforming plate 1 top or heat pipe 2, i.e. cooled region; The heat transferred that the steam transmission is come arrives fin 3; And the heat exchange through fin 3, with heat dissipation, make the working solution cooling; Thereby working solution becomes liquid state by steam, through capillary structure and working solution pressure reduction it is back to heating region again.
As shown in Figure 3, in second embodiment of the utility model, this heat abstractor comprises a temperature-uniforming plate 1, and this temperature-uniforming plate 1 is circular and is cavity body structure, in have working solution and capillary structure.Temperature-uniforming plate 1 top is provided with some fin 3, is preferably one group, and this fin 3 is made up of the radiating fin of a plurality of certain spacing arrangement, and radiating fin is horizontally and is upper and lower stacked together.In the vertical direction of fin 3, be upward through some heat pipes 2 from its bottom, be preferably the six roots of sensation; This heat pipe 2 is a cavity body structure; Have working solution and capillary structure in it, the lower end of this heat pipe 2 links to each other with the circular edge of temperature-uniforming plate 1, and the temperature-uniforming plate inner chamber is connected with heat pipe inner chamber.
As shown in Figure 4, in the 3rd embodiment of the utility model, this heat abstractor comprises a temperature-uniforming plate 1; This temperature-uniforming plate 1 is rectangle and is cavity body structure; In have working solution and capillary structure, temperature-uniforming plate 1 top is provided with some groups of fin 3, is preferably one group; Radiating fin by a plurality of certain spacing arrangement constitutes, and is rectilinear arrangement.Right ends in temperature-uniforming plate 1 level respectively connects some heat pipes 2, is preferably each four, and this heat pipe 2 is a cavity body structure, has working solution and capillary structure in it.A free end of this heat pipe 2 links to each other with temperature-uniforming plate 1 one ends, and promptly the temperature-uniforming plate inner chamber is connected with heat pipe inner chamber, and another free end is bent upwards, and is C or anti-C type.At the outer surface of heat pipe 2, be covered with at least one radiating shell 4, radiating shell 4 is the N type, and the last outer surface of heat pipe 2 is connected with the upper inner surface of radiating shell 4.Radiating shell is welded in the outer surface of said heat pipe.Thereby increased area of dissipation, utilized temperature-uniforming plate 1 that heat transferred is arrived fin 3, and heat transferred has been arrived radiating shell 4 through the heat pipe 2 that links to each other with temperature-uniforming plate 1.
Claims (6)
1. heat abstractor, the heat radiation of the electronic element that is used to generate heat is characterized in that, comprising:
At least one temperature-uniforming plate is positioned at the relative upper position of said heating electronic element;
At least one fin, its bottom is welded in the temperature-uniforming plate top;
At least one heat pipe is connected with said temperature-uniforming plate, the intracavity inter-connection of free-ended inner chamber of its heat pipe and said temperature-uniforming plate one end.
2. heat abstractor as claimed in claim 1 is characterized in that the profile of said temperature-uniforming plate is square, rectangle or circle.
3. according to claim 1 or claim 2 heat abstractor is characterized in that said heat pipe passes said fin.
4. heat abstractor as claimed in claim 3, said fin is horizontal or vertical to be located on the said temperature-uniforming plate.
5. according to claim 1 or claim 2 heat abstractor is characterized in that also comprise at least one radiating shell, this radiating shell is welded in the outer surface of said heat pipe.
6. heat abstractor as claimed in claim 5, said fin is vertical on the said temperature-uniforming plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202343489U CN202168313U (en) | 2011-07-05 | 2011-07-05 | Heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202343489U CN202168313U (en) | 2011-07-05 | 2011-07-05 | Heat radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202168313U true CN202168313U (en) | 2012-03-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202343489U Expired - Fee Related CN202168313U (en) | 2011-07-05 | 2011-07-05 | Heat radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202168313U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104209718A (en) * | 2013-06-04 | 2014-12-17 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacturing method of multi-cavity heat exchanger |
| CN104427826A (en) * | 2013-08-29 | 2015-03-18 | 昆山广兴电子有限公司 | Heat radiation module |
| CN105241288A (en) * | 2015-10-26 | 2016-01-13 | 楹联新能源科技南通有限公司 | Novel efficient constant temperature module |
| CN107172854A (en) * | 2017-05-17 | 2017-09-15 | 南京林业大学 | Vehicle-mounted integrated controller cooling system based on plate-fin heat pipe radiator |
| WO2021037206A1 (en) * | 2019-08-30 | 2021-03-04 | 华为技术有限公司 | Vehicle-mounted apparatus and vehicle |
| CN113692191A (en) * | 2021-08-19 | 2021-11-23 | 维沃移动通信有限公司 | Heat dissipation back splint and electronic equipment subassembly |
-
2011
- 2011-07-05 CN CN2011202343489U patent/CN202168313U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104209718A (en) * | 2013-06-04 | 2014-12-17 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacturing method of multi-cavity heat exchanger |
| CN104427826A (en) * | 2013-08-29 | 2015-03-18 | 昆山广兴电子有限公司 | Heat radiation module |
| CN104427826B (en) * | 2013-08-29 | 2018-01-30 | 昆山广兴电子有限公司 | Radiating module |
| CN105241288A (en) * | 2015-10-26 | 2016-01-13 | 楹联新能源科技南通有限公司 | Novel efficient constant temperature module |
| CN107172854A (en) * | 2017-05-17 | 2017-09-15 | 南京林业大学 | Vehicle-mounted integrated controller cooling system based on plate-fin heat pipe radiator |
| CN107172854B (en) * | 2017-05-17 | 2019-04-02 | 南京林业大学 | Vehicle-mounted integrated controller cooling system based on plate-fin heat pipe radiator |
| WO2021037206A1 (en) * | 2019-08-30 | 2021-03-04 | 华为技术有限公司 | Vehicle-mounted apparatus and vehicle |
| US11839065B2 (en) | 2019-08-30 | 2023-12-05 | Huawei Technologies Co., Ltd. | Temperature equalizing vehicle-mountable device |
| CN113692191A (en) * | 2021-08-19 | 2021-11-23 | 维沃移动通信有限公司 | Heat dissipation back splint and electronic equipment subassembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120314 Termination date: 20200705 |