CN206556482U - Heat-pipe radiator - Google Patents

Abstract

It there is provided herein a kind of heat-pipe radiator.The heat-pipe radiator may include the first and second plates spaced apart, and each plate has circumferential edge, wherein the circumferential edge of the first and second plates is bonded together to form evaporation cavity；It is formed at the hole in the first plate；Formed in the second plate and the stretching ring spacer relative with the hole；And it is formed at being tightly connected between stretching ring spacer and the first plate.Wherein stretching ring spacer crosses evaporation cavity and through the hole in the first plate.The stretching ring spacer can be multi-drawing distance piece and can have stepped profile.In some cases, two plates are all so molded so that one or more stretch rings are formed on one sheet, and the heat input face protruded is formed on the other sheet.It can also be provided that realizing support and the powder pillar of working medium capillary moving.

Description

Heat-pipe radiator

Technical field

This specification relates in general to the manufacture method of heat exchanger and heat exchanger.More specifically, this specification It is related to the heat pipe for cooling down electro-heat equipment and other heat exchangers with evaporation cavity and internal working medium, and manufactures this heat The method of pipe and heat exchanger, wherein electro-heat equipment is, for example, IC chip and other electrical equipments.

Background technology

With size and the power increase of IC chip, in some cases, required radiator has developed It is extremely bigger than chip.When the heat flux applied to whole heat input face is uniform, radiator is most efficient.When with big The radiator in heat input face when being attached to the much smaller contact zone of thermal source, the often heat input face to heat along radiator It is transferred to radiator and does not cause serious resistance with other surface portions that the contact zone of IC chip is directly contacted.Compared with Gao Gong The thermal source of rate and reduced size, or deviate the thermal source at radiator center, it will usually increase this hot-fluid resistance.This phenomenon meeting Cause the significant difference of the heat transfer effectiveness of radiator each several part.The consequence that this unbalanced heat transfer is caused is exactly, due to High running temperature, which reduces the Performance And Reliability of IC chip.

Overcome the brute-force mode of this hot-fluid resistance in radiator (such as size is more than the radiator of device to be cooled) Size including increasing radiator, increases the thickness of the spreader surface contacted with device to be cooled, increase cooling radiator Cooling air-flow, and reduce the temperature of cooling air-flow.However, these modes would generally increase weight, noise, system complexity and Cost.

If relatively easy, lightweight heat exchanger were designed, and the radiator could efficiently spread or with other sides Heat is passed by formula from heat-producing device or element, lighter in weight, easy to manufacture and being very suitable for ensure with equipment to be cooled and Elements into intimate is contacted, and this heat exchanger will have significant advantage.

The content of the invention

Disclosing a kind of inexpensive, simple, lightweight is used to cool down IC chip and other electron component Heat-pipe radiator.The term " heat-pipe radiator " (or similar terms) used herein and in the appended claims includes any Heat transfer unit (HTU) with evaporation cavity, wherein working medium receive heat from the Part I (such as evaporation part) of heat pipe, transmit the heat To the Part II (such as condensation part) of heat pipe, the heat is passed in environment or another device herein, then working medium The Part I of heat pipe is back to repeat said process, there is which kind of shape, size and construction but regardless of heat pipe.In some realities Apply in example, working medium is evaporated in the Part I of heat pipe, then condensed in the Part II of heat pipe.Heat-pipe radiator disclosed herein Manufacture with little need for additional space, it is possible to provide extra surface area is used to cool down IC chip, and is especially suitable for Passed to for setting up and maintaining to carry out heat channel with heater element and device and/or other heat transfer elements by heat from the integrated circuit Chip moves to heat can be by more easily handled position.Moreover, heat-pipe radiator disclosed herein is configurable to ensure Accurate flatness and substantially by the heat transfer of thermal source a to radiator.For this purpose, heat pipe heat radiation disclosed herein Utensil has the through hole through its body (for example, penetrating and penetrate the evaporation cavity of heat-pipe radiator) in favor of installation.

Heat-pipe radiator disclosed herein need not carry out major change to circuit board or slot, because the heat pipe heat radiation Device using be attached to integrated circuit mounted board or the conventional screw or other fasteners of similar adjacent structure keep with it is integrated Circuit chip is in close contact.This means the relatively little of simple part of quantity can be used in disclosed heat-pipe radiator.Moreover, with In keeping identical screw on an integrated circuit die or other fasteners to can be used for radiator (example heat-pipe radiator Such as, radiating fin, coldplate or similar device) it is fixed on another surface of heat-pipe radiator.

In certain embodiments, the internal structure of heat-pipe radiator is the vacuum evaporation of a fluid with limited quantity Chamber.The internal structure of the heat-pipe radiator may include one or more distance pieces, and distance piece is in the two plates or forms the evaporation Extend between any other border structure of chamber and contacted with the two plates or border structure.These distance pieces prevent these plates to Interior bending, therefore the contact surface of heat-pipe radiator can be maintained flat to be contacted with IC chip and other equipment and element. These distance pieces can by it is initial when all separated with two plates, then engage with two boards or otherwise fixed element shape Into, can be formed by the part of any one or two plate, wherein these plates from initial flat condition deformation (for example, punching press, Impressing, perforation (pierced), extruding are stretched), it might even be possible to by the part global formation of two plates, such as by processing, increase Amount manufacture and casting operation.These distance pieces can use a variety of different shapes, such as hollow or solid post, rod, bar, wall or Other elements, can have any desired shape of cross section, but still cross evaporation cavity as described above, and can be along distance piece The shape of cross section and/or size that length has constant or change (that is, are become from a wherein plate for evaporation cavity to another plate Change, such as cone, truncated cone-shaped, hourglass-shaped or other shapes).The molding mode of distance piece is at least partially dependent on, these Spacing body can also evaporate the depression in cavity plate by any one or two and be formed.

Porous capillary core material can cover the inner surface of heat-pipe radiator.Moreover, porous capillary core material can be at least partly It is located at the surface in heat-pipe radiator around distance piece, or can even forms at least part distance piece.By this way, it is many Hole capillary core material can form porous wick structure post, and one or more positions of the porous wick structure post in evaporation cavity are across two Space between individual plate.

These distance pieces can support the plate of heat-pipe radiator, them can be prevented to be deformed inward, prevent plate from distorting, destroy its institute What is needed is used for the shape (for example, flat, reservoir etc.) with adjacent elements and device intimate heat transfer contact.These distance pieces The part capillary wick of cavity space is evaporated across the inside between two plates available for support.In certain embodiments, across plate it Between the capillary stem in space the feature of (gravity-independent) unrelated with gravity can be provided for heat-pipe radiator, permit Perhaps working medium by liquid-sucking core or along liquid-sucking core do not need gravity flowing.

These distance pieces also make it that to be formed that to penetrate and penetrate the hole of evaporation cavity-according to heat-pipe radiator be vacuum Air-locked fact, this is substantially inconsistent with the fact.This is by ensuring that empty space part (as described above) and plate are whole It is body formed and/or in a kind of air-locked mode of vacuum engage and realize with plate.Distance piece and plate global formation are sealed extremely After plate, sealing passage can be formed in distance piece, the sealing passage will not the vacuum integrity of opposite heat tube radiator cause any shadow Ring, it is completely isolated between the hole and heat-pipe radiator inside.

This specification thus provides the heat-pipe radiator with excellent heat transfer property, while having relatively simple mode With using standard screw or other may pass through evaporation cavity fastener effectively and be firmly installed heat-pipe radiator.

Although challenge in terms of hot-fluid described here, heat transfer and heat management is described on cooling IC chip , other electronic installations (for example, amplifier, voltage regulator, triode etc.) or even other equipment and device are (for example, horse Reach, battery, bearing etc.) cooling there is also similar challenge.Improvement disclosed herein is equally applicable to all these heater elements.

Brief description of the drawings

Fig. 1 is three-dimensional exploded view of the heat-pipe radiator according to the embodiment of this specification one, as illustrated, heat pipe heat radiation utensil There is the through hole through evaporation cavity and contacted with fin plate radiator.

Fig. 2 is the plan of Fig. 1 heat-pipe radiator.

Fig. 3 is the side view of Fig. 1 heat-pipe radiator.

Fig. 4 is the plan of Fig. 1 heat-pipe radiator.

Fig. 5 is cross-sectional view of the heat-pipe radiator according to another embodiment of this specification.

Fig. 6 is cross-sectional view of the heat-pipe radiator according to another embodiment of this specification.

Fig. 7 is cross-sectional view of the heat-pipe radiator according to another embodiment of this specification.

Fig. 8 is cross-sectional view of the heat-pipe radiator according to another embodiment of this specification.

Embodiment

Before describing the embodiments in more detail, it should be understood that the invention is not restricted to institute hereafter or in accompanying drawing in the application The detailed construction or arrangement of elements of description.The embodiment that the present invention can realize for other manner.

Fig. 1 is the three-dimensional exploded view of heat-pipe radiator 10 according to an embodiment of the invention.The heat-pipe radiator 10 includes The evaporation cavity (vapor chamber) formed between contact plate 18 and cover plate 20.The heat-pipe radiator 10 can also include wing Sheet 16, the fin plate 16 can be contacted with cover plate 20.Optionally, can also set installed part (only as some examples, such as institute Show the block or pad 28,30,34,36 in embodiment；Plate 32) in favor of heat-pipe radiator 10 relative to surrounding environment (for example, circuit Plate, frame etc.) installation and/or alignment.

The heat-pipe radiator 10 shown in Fig. 1-4 is a border structure to be formed by the way that two boards are sealed and shape Into.This two boards includes above-mentioned contact plate 18 and cover plate 20.The border structure can be mutual by the outer edge of every block of plate 18,20 Contact and formed.In an illustrated embodiment, contact plate 18 and cover plate 20 are sealed (such as by welding or copper in its circumferential edge Weldering) together to form the inside evaporation cavity of the heat pipe soaking plate 10.Then the heat-pipe radiator 10 is evacuated to remove There is on-condensible gas, appropriate heat-transfer fluid is then filled with evaporation cavity.Vacuumizing can use pipe 38 to be carried out using known method.

Fig. 2 shows the plan of the heat-pipe radiator 10.As shown in Figures 2 and 3, contact plate 18 may include the hot defeated of protrusion Enter face 22.In addition, contact plate 18 includes distance piece 26, the distance piece 26 crosses the evaporation cavity and contacted with relative cover plate 20. In the embodiment shown in Fig. 1-4, distance piece 26 is the stretch ring (drawn as formed by the material deformation of contact plate 18 Collar it is), therefore with contact plate 18 integral.The cover plate 20 includes the hole 56 relative with stretching ring spacer 26, in stretching It is tightly connected between ring spacer 26 and cover plate 20 along the circumference formation in hole 56.Airtight engagement between plate 18,20 can be used Existing technique is realized, for example, pass through welding or brazing.Stretching ring spacer 26 can ensure that, even if heat-pipe radiator 10 is interior Pressure difference between portion space and surrounding environment may cause plate 18,20 deformation, the interval between contact plate 18 and cover plate 20 in opposite directions Also it will be maintained.

Stretching ring spacer 26 and hole 56 form sealing passage through evaporation cavity, the sealing passage can accommodate screw or its Its fastener 40.Due to the airtight engagement between stretching ring spacer 26 and cover plate 20, the sealing passage passes through heat pipe heat radiation The evaporation cavity of device 10 but not destroy its vacuum integrity.The screw 40 may include screw terminal 42 and threaded portion 44.In some realities Apply in example, the screw 40 is allowed to contact with cover plate 20 for fastening fin plate 16, threaded portion can be used for fastening heat-pipe radiator 10 Contact plate 18 be allowed to contact with thermal source, for example contacted with IC chip (not shown).Settable extra fastening accessory, Such as spring 46 and pad 48.

Although in the embodiment shown in Fig. 1-4, stretching ring spacer 26 is illustrated as being formed by the material of contact plate 18, It should be appreciated that in certain embodiments, the stretching ring spacer 26 may be formed in cover plate 20 or be formed by cover plate 20, And corresponding hole may be formed in contact plate 18 to form the sealing passage through evaporation cavity.

Heat-pipe radiator 10 may also comprise at least one layer of liquid-sucking core (wick) material (not shown), liquid-sucking core material covering The part or all of inner surface of contact plate 18, includes the inner surface in face of evaporation cavity of stretching ring spacer 26.In some implementations In example, at least one layer of liquid-sucking core material can also cover the part or all of inner surface of cover plate 20.It can use according to demand any Suitable liquid-sucking core material, such as sintering metal capillary wick (capillary wick).As known to industry, capillary wick is provided The mechanism of the higher evaporation ends of temperature will be fed back in the liquid of the relatively low condensation part condensation of heat pipe temperature, the liquid is in evaporation Evaporated at end.Then the steam produced in evaporation part flows to condensation part, condenses again.This twice state change (high-temperature region Evaporation and the condensation of low-temperature space) by the heat transmission of evaporation part to condensation part.

In a preferred embodiment, the size of evaporation cavity 10 is approximately 5.709 inches × 5.906 inches and (not included Installing plate 32 shown in Fig. 1-3), gross thickness is 0.217 inch (not including the fin plate 16 and its fin shown in Fig. 1-3).Separately Outside, in a preferred embodiment, cover plate 20 and contact plate 18 are made up of oxygen-free copper (OFHC), and stretching distance piece 26, which is crossed over, to be steamed Send out the height of chamber 14.In the present embodiment, a diameter of 0.472 inch of the planar portions of stretching distance piece 26, capillary wick is by sintering Copper powders are constituted.In addition, in the present embodiment, the external diameter of stretching distance piece 26 is 0.472 inch, a diameter of the 0.244 of hole 26 Inch.

Fig. 5 is the cross-sectional view of distance piece 126 and adjacent heat-pipe radiator structure, and it can replace Fig. 1's -4 Any or all of distance piece 26 in embodiment.In this manual, it is all where appropriate, similar elements label represent identical member Part, the element numbers for adding 100 represent the element changed.If inconsistent between not illustrating embodiment, with reference to Fig. 1-4 reality The various features and element for applying example description are equally applicable to Fig. 5 embodiment.It should be appreciated that change element except Beyond this description, same characteristics and advantage containing counter element.In the 5 embodiment of figure 5, cover plate 120 includes stretching interannular Spacing body 126, the stretching ring spacer 126 is arranged to relative with the hole 156 in contact plate 118.Stretching ring spacer 126 crosses steaming Send out chamber 114 and pass through hole 156.The stretching ring spacer 126 can be by one or many of the mould of one or a series of size gradation Individual forming operation is formed.In certain embodiments, the stretching depth (that is, in order to cross evaporation cavity 114) of distance piece 126 is formed More than the diameter of distance piece 126, so as to be that thicker heat-pipe radiator and/or more evaporation cavity shapes provide important design Selection.Bonding station formation gas tight seal between stretching ring spacer 126 and contact plate 118.Stretch ring spacer 126 Form the sealing passage for penetrating evaporation cavity 114 together with hole 156.As illustrated, liquid-sucking core material 150 is attached to contact plate 118 Inner surface, include the inner surface of the position of heat input face 122 of respective protrusions.

Another advantage of Fig. 5 heat-pipe radiator 110 is the base (pedestal) cooperatively formed in contact plate 118 124 use the distance piece 126 at least partly formed by cover plate 120 condensation part of heat-pipe radiator 110 (its as).The base can Formed in any suitable manner, such as punching press, impressing, it provide not only for hot with equipment to be cooled or elements into intimate The raised heat exchange surface of contact, additionally advantageously forms the reservoir for collecting working medium in evaporation cavity 114.Heat pipe is molded to dissipate The plate 118,120 of hot device 110 is to form the work of distance piece 126 and heat input and output characteristic (for example, base, installation base etc.) Skill (for example, punching press, stretching, impressing etc.) provides the design flexibility dramatically increased and selection for heat-pipe radiator.At this point, In certain embodiments, distance piece 126 may be formed in any one of plate 118,120 or both, rather than as shown in Figure 5 only Formed on cover plate 120.

Fig. 6 is the cross-sectional view of distance piece 226 and adjacent heat-pipe radiator structure, and it can replace Fig. 1's -4 Any or all of distance piece 26 in embodiment.In this manual, it is all where appropriate, similar elements label represent identical member Part, the element numbers for adding 200 represent the element that embodiment relative to Fig. 1-4 makes change.If not illustrating embodiment Between it is inconsistent, be equally applicable to Fig. 6 embodiment with reference to Fig. 1-4 various features that describe of embodiment and element.In Fig. 6 Embodiment in, cover plate 120 includes multistage stretching ring spacer 226, and the multistage stretching ring spacer 226 crosses evaporation cavity 214. Contact plate 218 includes hole 256, and hole 256 is arranged to relative with multistage stretching ring spacer 226.The multistage stretching ring spacer 226 There are two different-diameters over its axial length, two different-diameters are by the rack-like object area (shelf that radially extends Region) 260 (for example, substantial parallel with cover plate 20 in an illustrated embodiment) are separated.By using with this structure Multistage stretching ring spacer 226, it is possible to achieve the hole significantly increased and the stretching ring spacer 226 significantly increased.This is favourable In more heat-pipe radiator design alternatives, such as thicker heat-pipe radiator or with the steaming for benefiting from this distance piece 226 Send out the heat-pipe radiator of chamber shape.The circumference of the stretching ring spacer 226 along hole 256 is contacted with contact plate 218, is tightly connected Formed between stretching ring spacer 226 and contact plate 218, so as to form the sealing passage 212 for penetrating evaporation cavity 216.In Fig. 6 In shown embodiment, the stretching ring spacer 226 passes through hole 256, but in other embodiments, the stretching ring spacer 226 Along the inner surface of the circumference abutting contact plate 218 in hole 256.In addition, similar stretching ring spacer may be formed at contact plate 218 On, it is relative with a similar hole on cover plate 220, so as to form similar sealing passage.

Fig. 7 is the cross-sectional view of distance piece 326 and adjacent heat-pipe radiator structure, and it can replace Fig. 1's -4 Any or all of distance piece 26 in embodiment.In this manual, it is all where appropriate, similar elements label represent identical member Part, the element numbers for adding 300 represent the element that embodiment relative to Fig. 1-4 makes change.If not illustrating embodiment Between it is inconsistent, be equally applicable to Fig. 7 embodiment with reference to Fig. 1-4 various features that describe of embodiment and element.Should Understand, in Fig. 7 embodiment, hole 368 is formed in contact plate 318, and a corresponding axial hole 366 is formed relative Cover plate 320 in.It is arranged in ring or tubular distance piece 326 in evaporation cavity 314, and extends contact plate 318 and cover plate 320 Between.Circumference of the distance piece 326 in hole 368 is contacted with contact plate 318, and the circumference in hole 366 is contacted with cover plate 320.Sealing It is formed in connection between distance piece 326 and cover plate and the hole 366,368 of contact plate 320,318.Therefore, distance piece 326 and each The circumference position of the wound hole 366,368 of plate 318,320 forms the sealing passage 312 through evaporation cavity 314.This shown in Fig. 7 Manufacturing cost can be significantly reduced by planting heat-pipe radiator 310, and in some cases, it is possible to decrease to the need of expensive metal former Ask, and these expensive metal formers are held for stretching, punching press, impressing or on any one or two plate 318,320 It is required for row metal forming operation.In certain embodiments, when assembling the heat-pipe radiator 310, first by distance piece 326 Each hole 366,368 positions of cover plate 320 or contact plate 318 are respectively positioned at, another plate 318,320 is then positioned at this (as needed, used on a little distance pieces 326 with carrying out the follow-up brazing of the component, welding, Diffusion Welding or other bonding operations Appropriate fixture).It should be pointed out that in certain embodiments, and not all using the distance piece in heat-pipe radiator 310 all It is the annular spacer assembled in the above described manner.In same heat-pipe radiator, these distance pieces can with it is disclosed herein its The distance piece of its type is used cooperatively.

Fig. 8 is the cross-sectional view of another distance piece 426 and adjacent heat-pipe radiator structure, and it can replace figure Any or all of distance piece 26 in 1-4 embodiment.In this manual, it is all where appropriate, similar elements label represent it is identical Element, the element numbers for adding 400 represent the element that embodiment relative to Fig. 1-4 makes change.If not illustrating reality Apply inconsistent between example, Fig. 8 embodiment is equally applicable to reference to Fig. 1-4 various features that describe of embodiment and element. In the embodiment shown in fig. 8, heat-pipe radiator 410 includes one or more metal columns 470, and metal column 470 is in evaporation cavity Bridged in 414 between contact plate 418 and cover plate 420.Can be covered with liquid-sucking core material 450 on metal column 470.In addition, heat pipe Radiator 410 may include one or more powder pillars 472, and powder pillar 472 bridges at contact plate 418 and lid in evaporation cavity 414 Between plate 420.Each powder pillar 472 is made up of liquid-sucking core material 450.Although metal column 470 and/or powder pillar 472 can be located at Peripheral wall in evaporation cavity 414 with evaporation cavity 414 separate (for example, with the marginal position facing each other of plate 418,420 Border structure is separated) any position, in certain embodiments, one or more metal columns and/or one or more powder pillars 472 position is arranged to be allowed to the location contacts in contrast to heat input face 422 with contact plate 418.For example, shown in Fig. 8 In embodiment, the metal column 470 covered with liquid-sucking core extends from the position in contrast to heat input face 422 of contact plate 418, and horizontal Evaporation cavity 414 is worn with the interior side contacts with cover plate 420.Metal column 470 and/or powder pillar 472 can be contact plate 418 and cover plate 420 provide structural support.In addition, the metal column 470 and powder pillar 472 of covering liquid-sucking core can utilize the connection of continuous capillary wick Cover plate 420 and contact plate 418, the heat input face 422 of contact plate 428 is back to the working medium for promoting condensation from cover plate 420. The liquid-sucking core material of this description and liquid-sucking core position can ensure that, even if the direction of heat-pipe radiator 410 is arranged to the phase of cover plate 420 It is reverse for contact plate 418, even if or heat-pipe radiator 410 run in low gravitation or agravic environment, in cover plate The working medium of 420 inner surface condensation still therefore will can be used as evaporation part with liquid-sucking core material using that can be back to The inner surface of contact plate 428.

It should be appreciated that any amount of metal column 470 and powder pillar 472 can be used in it is any shown in Fig. 1-7 In one heat-pipe radiator embodiment.

Various heat-pipe radiators described here provide the efficient hand for being used for cooling down integrated circuit or other heater elements Section, and can just reach above-mentioned purpose without using larger radiator.Larger radiator not only increases weight, and heat transfer Efficiency is also high unlike the heat transfer efficiency of radiator described here.

It should be appreciated that shown form of the invention is preferred embodiment.The function or construction of each element can Carry out various changes.Equivalent element and structure can replace the element and structure for illustrating and describing herein.Some features can be independent It is used alone in further feature, the spirit and scope of the present invention defined without departing from preceding claims.For example, through hole It can also penetrate through the heat pipe border structure with curved surface or the heat pipe border knot with multiple offset planes (offset planes) Structure, it forms multiple different height to contact with multiple thermals source or radiator.

The various features and advantage of the present invention are set forth in preceding claims.

Claims (20)

1. a kind of heat-pipe radiator, including：

First plate, first plate has circumferential edge and raised heat input face；

Second plate, second plate is spaced apart with first plate and with circumferential edge, the circumference of first and second plate Edge join is together to form evaporation cavity；

Hole, the hole is formed in first plate；

Distance piece, distance piece formation is in second plate and relative with the hole；And

It is tightly connected, described be tightly connected is formed between the distance piece and first plate；

Wherein, the distance piece crosses the evaporation cavity and the circumference in the hole is contacted with first plate.

2. heat-pipe radiator as claimed in claim 1, wherein the distance piece passes through the hole in first plate.

3. heat-pipe radiator as claimed in claim 1, in addition to the capillary core material on the inner surface of first plate.

4. heat-pipe radiator as claimed in claim 3, wherein the capillary wick material is sintering capillary core material.

5. heat-pipe radiator as claimed in claim 1, wherein the depth of the distance piece is more than the diameter of the distance piece.

6. heat-pipe radiator as claimed in claim 1, wherein described be tightly connected is carried out sealedly using brazing.

7. heat-pipe radiator as claimed in claim 1, wherein the heat input face is at least partly by the boss of first plate Formed, the boss relative to first plate adjacent area not on the same face.

8. heat-pipe radiator as claimed in claim 7, in addition to it is opposite with the heat input face positioned at first plate Capillary core material on inner surface.

9. heat-pipe radiator as claimed in claim 1, wherein the distance piece is hollow.

10. heat-pipe radiator as claimed in claim 9, wherein the distance piece has opposite openend, a fastener energy Enough through the openend.

11. heat-pipe radiator as claimed in claim 1, in addition to a fastener, the fastener are contained in the distance piece It is interior.

12. heat-pipe radiator as claimed in claim 1, in addition to it is connected to the radiator of second plate.

13. heat-pipe radiator as claimed in claim 1, in addition at least one post, the post cross the evaporation cavity and with The first and second plates contact.

14. heat-pipe radiator as claimed in claim 13, wherein the post is metal column.

15. heat-pipe radiator as claimed in claim 14, in addition to the capillary core on the outer surface of the metal column Material.

16. heat-pipe radiator as claimed in claim 15, wherein the capillary wick material is along the metal column from described first Plate extends to second plate.

17. heat-pipe radiator as claimed in claim 14, wherein the first position of the post from first plate extends to institute The second place of the second plate is stated, wherein in the first position, heat is applied to the heat-pipe radiator.

18. heat-pipe radiator as claimed in claim 13, wherein the post is made up of capillary core material.

19. heat-pipe radiator as claimed in claim 18, wherein the first position of the post from first plate extends to institute The second place of the second plate is stated, wherein in the first position, heat is applied to the heat-pipe radiator.

20. heat-pipe radiator as claimed in claim 1, in addition to the second distance piece formed on first plate.