CN109819635B - Heat dissipation device - Google Patents
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- CN109819635B CN109819635B CN201910227037.0A CN201910227037A CN109819635B CN 109819635 B CN109819635 B CN 109819635B CN 201910227037 A CN201910227037 A CN 201910227037A CN 109819635 B CN109819635 B CN 109819635B
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- 230000017525 heat dissipation Effects 0.000 title description 17
- 239000007788 liquid Substances 0.000 claims abstract description 59
- 238000005452 bending Methods 0.000 claims abstract description 9
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims 1
- 238000005192 partition Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- 125000006850 spacer group Chemical group 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Abstract
The application provides a heat dissipating device, which comprises a condenser, an evaporator, a steam pipe and a liquid pipe; the condenser is used for condensing the vapor state working medium into a liquid state working medium and comprises a flat tube and a current collector; the method comprises the steps of dividing a cavity in a current collector into an upper cavity and a lower cavity which are independent of each other through a spacer, bending a flat pipe into an upper section and a lower section which are communicated with each other, communicating the upper section with the upper cavity through an upper jack, connecting the lower section with the lower cavity through a lower jack, communicating a steam pipe of a heat dissipating device with the upper cavity, and communicating a liquid pipe of the heat dissipating device with the lower cavity to form a loop; only one current collector is arranged at one end of the condenser, so that the assembly and welding processes can be effectively reduced, the labor cost is saved, and the assembly efficiency is improved; the mode of dividing the cavity in the current collector into the upper cavity and the lower cavity with different functions enables the steam pipe and the liquid pipe to be capable of arranging pipelines from the same end of the condenser, the number of electronic components which are bypassed is small, and the pipeline arrangement is more convenient and flexible.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation device.
Background
The heat dissipation device is generally used for heat dissipation of heating electronic components (such as a CPU) in electronic equipment, and the whole heat dissipation device is a loop formed by an evaporator, a condenser, a steam pipe and a liquid pipe, and working medium is filled in the loop. During operation, the bottom surface of the evaporator is contacted with the surface of the heating electronic component, so that the evaporator can absorb heat of the component, the absorbed heat causes evaporation and vaporization of liquid working medium in the evaporator, vaporized steam reaches the condenser through the steam pipe, the vaporized steam is liquefied after giving out heat in the condenser, and the vaporized steam returns to the evaporator through the liquid pipe, so that the heat dissipation function of the component is realized. Fig. 1 is a schematic diagram of a prior art thermosiphon heat sink, in which a plurality of flat tubes are arranged in parallel and spaced apart, two current collectors are connected to two ends of each flat tube, fins are interposed between the flat tubes, and then the whole is welded and sealed to form a condenser of the thermosiphon heat sink. The steam working medium entering the condenser firstly enters a space of a collector at one side, then enters a flat pipe, is condensed in the flat pipe to become liquid working medium, and is converged into the collector at the other end, and then flows back into the evaporator through a liquid pipe.
The disadvantage of the heat siphon radiator before improvement is that 1, two ends of the flat tube are respectively connected with two current collectors, the welding and assembling process is complex, 2, the steam tube and the liquid tube which enter and exit the condenser are required to be distributed at two ends of the condenser, the steam tube and the liquid tube are inconvenient to be installed and arranged in the applied electronic equipment, for example, when the heat siphon radiator is applied to a circuit board, the steam tube and the liquid tube are required to bypass various electronic components on the circuit board respectively, and then the condenser is connected from two ends respectively, and the arrangement of a pipeline is difficult.
Disclosure of Invention
In order to solve the technical problems, the application provides a heat dissipating device to solve the problems of the current heat dissipating device.
To above problem, the application provides a heat abstractor, including condenser, evaporimeter, steam pipe and liquid pipe.
And the condenser is used for condensing the vapor state working medium into a liquid state working medium and simultaneously giving out heat to the outside air or medium, and comprises a flat tube and a current collector.
The current collector comprises an upper cavity and a lower cavity, the upper cavity and the lower cavity are separated by a spacer, the upper cavity is positioned above the lower cavity, a steam pipe jack is formed in the position, corresponding to the upper cavity, of the current collector, a liquid pipe jack is formed in the position, corresponding to the lower cavity, of the current collector, an upper jack is formed in the position, corresponding to the upper cavity, of the current collector, and a lower jack is formed in the position, corresponding to the lower cavity, of the current collector.
The flat pipe comprises an upper section and a lower section which are mutually communicated, the upper section and the lower section are of an integrated structure formed by bending, the upper section is positioned above the lower section and is provided with a space, the upper section is inserted into the upper insertion hole to be communicated with the upper cavity, and the lower section is inserted into the lower insertion hole to be communicated with the lower cavity.
The evaporator is provided with a steam exhaust hole and a liquid inlet hole.
And the steam pipe is communicated with the steam discharge hole and the steam pipe insertion hole so as to introduce the steam state working medium discharged from the evaporator into the upper chamber.
And the liquid pipe is communicated with the liquid pipe jack and the liquid inlet, so that liquid working medium discharged from the lower chamber is introduced into the evaporator.
The loop formed by the evaporator, the steam pipe, the condenser and the liquid pipe is vacuumized and filled with flowing working medium.
Preferably, the flat tubes are multiple, the current collector is provided with the upper jack and the lower jack corresponding to the flat tubes, each flat tube comprises the corresponding upper segment and the corresponding lower segment, and the flat tubes are sequentially arranged from inside to outside and are adjacent to each other and are arranged at intervals between the upper segments and the adjacent lower segments.
Preferably, fins for expanding the heat dissipation area are provided at intervals between the adjacent upper sections, between the adjacent lower sections, and between the adjacent upper sections and lower sections.
Preferably, the upper section and the lower section are parallel, the flat tubes comprise inner flat tubes positioned at the innermost side, the upper section comprises an inner upper section corresponding to the inner flat tubes, and the lower section comprises an inner lower section corresponding to the inner flat tubes; the spacing distance between adjacent upper sections and between adjacent lower sections is equal to the spacing distance between the inner layer upper section and the inner layer lower section.
Preferably, the flat tube further comprises a middle section, the middle section is vertically connected between the upper section and the lower section, the flat tubes comprise a plurality of corresponding middle sections, and the adjacent middle sections are tightly attached.
Preferably, the condenser further comprises a protective frame, wherein the protective frame comprises an upper plate, a middle plate and a lower plate, the upper plate is arranged above the lower plate in parallel, and the middle plate is vertically connected with the upper plate and the middle plate;
the plurality of flat tubes comprise outer layer flat tubes positioned at the outermost side, the upper section comprises an outer layer upper section corresponding to the outer layer flat tubes, the middle section comprises an outer layer middle section corresponding to the outer layer flat tubes, and the lower section comprises an outer layer lower section corresponding to the outer layer flat tubes;
the middle plate is clung to the outer side of the middle section of the outer layer, and the interval distance between the lower plate and the lower section of the outer layer is equal to the interval distance between the upper section of the inner layer and the lower section of the inner layer.
Preferably, the upper plate is closely arranged outside the upper section of the outer layer.
Preferably, the upper plate is spaced from the upper section of the outer layer by a distance equal to the distance between the upper section of the inner layer and the lower section of the inner layer.
Preferably, fins for expanding the heat dissipation area are arranged between the upper plate and the upper section of the outer layer and between the lower plate and the lower section of the outer layer.
Preferably, the protective frame is formed by integrally bending a plate, and mounting and fixing parts for fixing the condenser are arranged on the left side and the right side of the lower plate.
Preferably, the flat tube is a micro-channel flat tube or a harmonica tube provided with a plurality of parallel independent channels.
According to the technical scheme, the application has at least the following advantages and positive effects:
the application provides a heat dissipating device, wherein a cavity in a current collector is divided into an upper cavity and a lower cavity which are mutually independent through a spacer by arranging only one current collector, a flat pipe is bent to comprise an upper section and a lower section which are mutually communicated, the upper section is communicated with the upper cavity through an upper jack, the lower section is connected with the lower cavity through a lower jack, a steam pipe of the heat dissipating device is communicated with the upper cavity, a liquid pipe of the heat dissipating device is communicated with the lower cavity, and a loop is formed; only one current collector is arranged at one end of the condenser, so that the assembly and welding processes can be effectively reduced, the labor cost is saved, and the assembly efficiency is improved; the mode of dividing the cavity in the current collector into the upper cavity and the lower cavity with different functions enables the steam pipe and the liquid pipe to be capable of arranging pipelines from the same end of the condenser, the number of electronic components which are bypassed is small, and the pipeline arrangement is more convenient and flexible.
Drawings
Fig. 1 is a schematic perspective view of a heat sink of a thermosiphon before modification.
Fig. 2 is a schematic perspective view of a heat dissipating device according to an embodiment of the present application.
Fig. 3 is a schematic perspective view of a current collector according to an embodiment of the present application.
FIG. 4 is a schematic view of a disassembled condenser according to an embodiment of the present application.
FIG. 5 is a schematic perspective view of an unfused condenser in an embodiment of the present application.
Fig. 6 is a schematic perspective view of a condenser fin according to an embodiment of the present application.
Fig. 7 is a schematic perspective view of a heat dissipating device according to an embodiment of the present application.
Fig. 8 is a schematic cross-sectional view of a flattened tube in an embodiment of the present application.
The reference numerals are as follows, 1, evaporator; 2. a steam pipe; 3. a condenser; 31. a flat tube; 31001. an independent channel; 311. an upper section; 312. a lower section; 313. a middle section; 3101. an inner flat tube; 31101. an upper section of the inner layer; 31201. the lower section of the inner layer; 3102. an outer layer flat tube; 31102. an upper section of the outer layer; 31202. an outer layer lower section; 31302. an outer middle section; 32. a current collector; 321. an upper chamber; 3211. steam pipe insertion holes; 3212. an upper jack; 3221. a liquid pipe jack; 3222. a lower jack; 323. a spacer; 33. a fin; 34. a protective frame; 341. an upper plate; 342. a middle plate; 343. a lower plate; 3431. a fixed ear; 4. and a liquid pipe.
Detailed Description
Exemplary embodiments that embody features and advantages of the present application are described in detail in the following description. It will be understood that the present application is capable of various modifications in various embodiments, all without departing from the scope of the present application, and that the description and illustrations herein are intended to be by way of illustration only and not to be limiting.
Referring to fig. 2 to 5, an embodiment of the present application provides a heat dissipating device including an evaporator 1, a steam pipe 2, a condenser 3, and a liquid pipe 4.
The condenser 3 is used for condensing the vapor state working medium into a liquid state working medium and comprises a flat tube 31, a current collector 32, fins 33 and a protective frame 34. The collector 32 is internally provided with an upper chamber 321 and a lower chamber (not shown in the figure), wherein the upper chamber 321 is used for collecting and containing the vapor state working medium transmitted by the steam pipe 2, and the lower chamber is used for containing the liquid state working medium obtained after condensation. The upper chamber 321 is located above the lower chamber, so as to utilize the characteristic that the vapor state working medium with higher temperature automatically rises and the condensed liquid state working medium automatically flows downwards under the gravity. The upper chamber 321 and the lower chamber are sealed by a septum 323. The position of the current collector 32 corresponding to the upper cavity 321 is provided with a steam pipe jack 3211, and the steam pipe jack 3211 is communicated with the upper cavity 321. The steam pipe jack 3211 is connected to one end of the steam pipe 2, so that the steam state working medium transferred from the steam pipe 2 can be introduced into the upper chamber 321. The current collector 32 is provided with a liquid pipe jack 3221 corresponding to the position of the lower chamber, and the liquid pipe jack 3221 is communicated with the lower chamber. The liquid pipe insertion hole 3221 is connected with one end of the liquid pipe 4, so that the liquid working medium in the lower cavity can be discharged through the liquid pipe 4. The current collector 32 is provided with an upper jack 3212 corresponding to the upper cavity 321, and a lower jack 3222 corresponding to the lower cavity 32.
Referring to fig. 4 and 6, the flat tube 31 includes an upper section 311 and a lower section 312 which are communicated with each other, the upper section 311 is positioned above the lower section 312 with a certain distance therebetween, and the fins 33 are disposed between the upper section 311 and the lower section 312 and respectively contact with the upper section 311 and the lower section 312 to ensure heat conduction to the fins. Thus, the high temperature vapor state working fluid condenses into a liquid state working fluid during its flow through upper section 311 and lower section 312. The connection between the upper section 311 and the lower section 312 should be provided at an end far from the inserted current collector 32 so that the vapor state working medium flows through a longer distance as much as possible to dissipate heat and condense. The upper section 311 and the lower section 312 are communicated by a special pipeline, or the upper section 311 and the lower section 312 are integrally bent, and are communicated from the bending transition part between the upper section 311 and the lower section 312. In a specific embodiment, the upper section 311 and the lower section 312 are a bent integral structure, which is convenient for manufacturing. The upper section 311 is inserted into the upper insertion hole 3212 of the current collector 32 so as to communicate with the upper chamber 321, and the lower section 312 is inserted into the lower insertion hole 3222 of the current collector 32 so as to communicate with the lower chamber.
Referring to fig. 8, the flat tube 31 is a microchannel flat tube or harmonica tube provided with a plurality of parallel independent channels 31001. Wherein, the flat tube with the cross section of the independent channel (or called hole) with the largest dimension smaller than 1mm is called a micro-channel flat tube, the flat tube with the cross section of the independent channel with the size larger than 1mm is colloquially called a harmonica tube, and the micro-channel flat tube is used as the main stream selection.
The evaporator 1 is provided to absorb heat generated by the heat generating electronic component during operation by being closely disposed on the surface of the heat generating electronic component. The evaporator is provided with a steam discharge hole and a liquid inlet hole (the steam discharge hole and the liquid inlet hole are not shown in the figure). The steam discharge hole is arranged at the top of the evaporator 1 and is communicated with the internal cavity of the evaporator 1, and the steam discharge hole is connected with the other end of the steam pipe 2, so that the steam working medium is transmitted to the upper cavity 321 of the collector 32 through the steam pipe 2. The liquid inlet is arranged on one side of the evaporator 1 close to the bottom and is connected with the inner cavity of the evaporator 1, the liquid inlet is connected with the other end of the liquid pipe 4, and the liquid working medium which flows back after condensation flows into the inner cavity of the evaporator 1 through the liquid pipe 4. The steam exhaust hole is connected with the steam pipe 2, and the liquid inlet hole is connected with the liquid pipe 4.
The evaporator 1, the steam pipe 2, the condenser 3, the liquid pipe 4 and the sealed loop of the evaporator 1 are vacuumized and filled with flowing liquid working medium.
The specific working principle of the heat dissipation device is as follows:
in a specific use, the evaporator 1 is closely arranged on the surface of a heat-generating electronic component (such as a CPU) of an electronic device (such as a computer) through the bottom surface thereof, so as to dissipate heat of the heat-generating electronic component. In the working process of the electronic equipment, the heating electronic components emit heat, so that the liquid working medium in the inner cavity of the evaporator 1 closely attached to the electronic equipment evaporates to take away the heat. By utilizing the property that high-temperature steam automatically rises, the working medium steam evaporated in the inner cavity of the evaporator 1 is discharged from a steam discharge hole at the top of the evaporator 1 and enters the upper cavity 321 of the current collector 32 through the steam pipe 2. Working medium steam in the upper chamber 321 enters the upper section 311 of the flat pipe 31 through the upper jack 3212, and gradually condenses into liquid working medium due to heat dissipation when flowing through the upper section 311 and the lower section 312 of the flat pipe 31. The liquid working medium finally flows to the lower chamber under the action of gravity, and the liquid working medium in the lower chamber flows into the inner cavity of the evaporator 1 through the liquid pipe 4. The circulation is repeated in this way, and the continuous heat dissipation function of the heating electronic components is realized.
Further, a plurality of flat tubes 31 are arranged in the condenser 3, an upper jack 3212 and a lower jack 3222 corresponding to each flat tube 31 are arranged on the current collector 32, each upper jack 3212 is communicated with the upper cavity 321, and each lower jack 3222 is communicated with the lower cavity. Each flat tube 31 comprises a corresponding upper section 311 and a corresponding lower section 312, and the flat tubes 31 are sequentially arranged from inside to outside, namely, each flat tube 31 is sequentially sleeved from inside to outside, and the adjacent upper sections 311 and the adjacent lower sections 312 are arranged at intervals. For example, the flat tube arranged at the innermost layer is called a first flat tube, the secondary inner layer flat tube arranged near the outer side of the first flat tube is called a second flat tube, the flat tube arranged near the outer side of the second flat tube is called a third flat tube, namely the second flat tube is sleeved outside the first flat tube, and the third flat tube is sleeved outside the second flat tube. And the first flat tube, the second flat tube and the third flat tube are all provided with intervals. The arrangement of the multi-flat tube can expand the heat radiation area of the condenser 3 to the surrounding air or medium so as to adapt to the heat radiation requirement of certain power.
Referring to fig. 4 to 6, in the multi-flat tube arrangement scheme, the upper section 311 and the lower section 312 may be arranged in parallel, where the plurality of flat tubes includes an inner flat tube 3101 (corresponding to the first flat tube in the above example) located at the innermost side, the upper section 311 includes an inner upper section 31101 corresponding to the inner flat tube 3101, and the lower section 312 includes an inner lower section 31201 corresponding to the inner flat tube 3101. The spacing distance between adjacent upper segments 311 and between adjacent lower segments 312 is equal to the spacing distance between inner layer upper segment 31101 and inner layer lower segment 31201, facilitating uniform heat dissipation. And fins 33 of the same specification (equal height) can be provided between the adjacent upper sections 311, between the adjacent lower sections 312, and between the inner layer upper section 31101 and the inner layer lower section 31201, thereby facilitating modular manufacturing, saving manufacturing costs, and improving assembly efficiency. The arrangement of the fins 33 in the interval of the flat tubes 31 is not only used for conducting heat of the flat tubes 31 to accelerate heat dissipation efficiency, but also capable of keeping the interval distance and the relative position between the flat tubes 31, and further supporting the flat tubes 31.
In actual manufacturing, the upper section 311 and the lower section 312 of the flat tube 31 that are mutually communicated may be integrally bent, and the bending manner may be an arc-shaped transition portion or a vertical straight plate transition portion at the bending portion. Specifically, when the straight plate transition portion is referred to as a middle section 313 of the flat tube, the middle section 313 is vertically connected between the upper section 311 and the lower section 312, the flat tubes 31 include a plurality of corresponding middle sections 313, and the adjacent middle sections 313 are tightly attached. No space is needed between the middle sections 313 of the adjacent flat pipes 31, so that the overall length of the condenser 3 is reduced, and the flat pipes 31 are conveniently fixed through the mutual close fit of the middle sections 313.
Referring to fig. 4 to 7, the protective frame 34 includes an upper plate 341, a middle plate 342, and a lower plate 343, the upper plate 341 being disposed in parallel above the lower plate 343, the middle plate 342 vertically connecting the upper plate 341 and the lower plate 343. The upper plate 341, the middle plate 342 and the lower plate 343 are formed by bending the same plate, wherein fixing lugs 3431 are arranged on two sides of the lower plate 343, screw holes are formed in the fixing lugs 3431, and the condenser 3 can be fixed in the electronic equipment through the fixing lugs 3431. The plurality of flat tubes 31 include an outer flat tube 3102 located at an outermost side, the upper section 311 includes an outer upper section 31102 corresponding to the outer flat tube 3102, the middle section 313 includes an outer middle section 31302 corresponding to the outer flat tube 3102, and the lower section 312 includes an outer lower section 31202 corresponding to the outer flat tube 3102. The middle plate 342 is tightly fixed on the outer side of the outer middle section 31302, and the interval distance between the lower plate 343 and the outer lower section 31202 is equal to the interval distance between the inner upper section 31101 and the inner lower section 31201 in the above embodiment, so that fins are conveniently arranged between the outer lower section 31202 and the lower plate 343, and heat dissipation of the outer lower section from the bottom is facilitated.
Referring to fig. 7, a space may be provided between the upper plate 341 and the outer layer upper section 31102, such that the space is equal to the space between the inner layer upper section 31101 and the inner layer lower section 31201, so as to facilitate heat dissipation of the outer layer upper section 31102 and facilitate fin arrangement between the outer layer upper section 31102 and the upper plate 341. In other embodiments, referring to fig. 6, upper plate 341 may also be positioned snugly outside of outer upper section 31102 to accommodate the particular condenser 3 height specifications.
While the present application has been described with reference to several exemplary embodiments, it is understood that the terminology used is intended to be in the nature of words of description and illustration rather than of limitation. As the present application may be embodied in several forms without departing from the spirit or essential attributes thereof, it should be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the metes and bounds of the claims, or equivalences of such metes and bounds are therefore intended to be embraced by the appended claims.
Claims (11)
1. A heat sink, comprising:
a condenser comprising a flat tube and a current collector;
the current collector comprises an upper chamber and a lower chamber, wherein the upper chamber and the lower chamber are separated by a partition, and the upper chamber is positioned above the lower chamber; a steam pipe jack is formed in the position, corresponding to the upper cavity, of the current collector, and a liquid pipe jack is formed in the position, corresponding to the lower cavity, of the current collector; an upper jack is formed in the position, corresponding to the upper cavity, of the current collector, and a lower jack is formed in the position, corresponding to the lower cavity, of the current collector;
the flat pipe comprises an upper section and a lower section which are communicated with each other, the upper section and the lower section are of an integrated structure formed by bending, and the upper section is positioned above the lower section and is provided with a space; the upper section is inserted into the upper jack to communicate with the upper chamber, and the lower section is inserted into the lower jack to communicate with the lower chamber;
the evaporator is provided with a steam exhaust hole and a liquid inlet hole;
the steam pipe is communicated with the steam exhaust hole and the steam pipe insertion hole so as to introduce the steam state working medium exhausted from the evaporator into the upper chamber;
the liquid pipe is communicated with the liquid pipe jack and the liquid inlet so as to introduce the liquid working medium discharged from the lower chamber into the evaporator;
the loop formed by the evaporator, the steam pipe, the condenser and the liquid pipe is vacuumized and filled with flowing working medium.
2. The heat dissipating device of claim 1, wherein a plurality of said flat tubes are provided, said current collector is provided with said upper and lower insertion holes corresponding to a plurality of said flat tubes, each of said flat tubes comprises a corresponding upper segment and a corresponding lower segment, and a plurality of said flat tubes are provided in sequence from inside to outside with spaces between adjacent upper segments and between adjacent lower segments.
3. The heat dissipating device according to claim 1 or 2, wherein fins for expanding a heat dissipating area are provided at intervals between adjacent upper segments, between adjacent lower segments, and between adjacent upper segments and lower segments.
4. The heat dissipating device of claim 2, wherein said upper section and said lower section are parallel, said plurality of flat tubes comprising an innermost flat tube, said upper section comprising an inner upper section corresponding to said inner flat tube, said lower section comprising an inner lower section corresponding to said inner flat tube; the spacing distance between adjacent upper sections and between adjacent lower sections is equal to the spacing distance between the inner layer upper section and the inner layer lower section.
5. The heat dissipating device of claim 4, wherein said flat tube further comprises a middle section, said middle section being vertically connected between said upper section and said lower section, and wherein a plurality of said flat tubes comprise a corresponding plurality of said middle sections, adjacent ones of said middle sections being disposed in close proximity.
6. The heat sink of claim 5, wherein the condenser further comprises a protective frame comprising an upper plate, a middle plate, and a lower plate, the upper plate being disposed in parallel above the lower plate, the middle plate vertically connecting the upper plate and the middle plate;
the plurality of flat tubes comprise outer layer flat tubes positioned at the outermost side, the upper section comprises an outer layer upper section corresponding to the outer layer flat tubes, the middle section comprises an outer layer middle section corresponding to the outer layer flat tubes, and the lower section comprises an outer layer lower section corresponding to the outer layer flat tubes;
the middle plate is clung to the outer side of the middle section of the outer layer, and the interval distance between the lower plate and the lower section of the outer layer is equal to the interval distance between the upper section of the inner layer and the lower section of the inner layer.
7. The heat sink of claim 6 wherein the upper plate is disposed immediately outboard of the upper section of the outer layer.
8. The heat sink of claim 6 wherein the upper plate is spaced from the upper outer layer section a distance equal to the spaced distance between the upper inner layer section and the lower inner layer section.
9. The heat dissipating device of claim 8, wherein fins for expanding a heat dissipating area are provided between the upper plate and the outer layer upper section and between the lower plate and the outer layer lower section.
10. The heat dissipating device according to any one of claims 6 to 9, wherein the protective frame is formed by integrally bending a plate material, and mounting and fixing portions for fixing the condenser are provided on both left and right sides of the lower plate.
11. The heat dissipating device of claim 1, wherein the flat tube is a microchannel flat tube or a harmonica tube provided with a plurality of parallel independent channels.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920332370 | 2019-03-15 | ||
| CN2019203323703 | 2019-03-15 |
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| CN109819635A CN109819635A (en) | 2019-05-28 |
| CN109819635B true CN109819635B (en) | 2024-01-26 |
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| CN201910227037.0A Active CN109819635B (en) | 2019-03-15 | 2019-03-25 | Heat dissipation device |
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| CN209824307U (en) * | 2019-03-15 | 2019-12-20 | 深圳智焓热传科技有限公司 | Heat sink device |
| CN111669944A (en) * | 2020-06-22 | 2020-09-15 | 深圳市鸿富诚屏蔽材料有限公司 | 3D phase change superconducting radiator |
| CN114096108B (en) * | 2020-08-24 | 2023-03-24 | 华为技术有限公司 | Heat sink and method for manufacturing the same |
| CN114641190A (en) * | 2022-04-11 | 2022-06-17 | 广西自贸区见炬科技有限公司 | High-dimensional radiator for heat-generating component driven by steam power and gravity |
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| CN204421708U (en) * | 2015-02-04 | 2015-06-24 | 董陈 | Thermosyphon heat dissipation device |
| CN207247967U (en) * | 2017-09-30 | 2018-04-17 | 深圳智焓热传科技有限公司 | Thermosyphon heat dissipation device |
| CN209824307U (en) * | 2019-03-15 | 2019-12-20 | 深圳智焓热传科技有限公司 | Heat sink device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102202488A (en) * | 2010-03-26 | 2011-09-28 | 富准精密工业(深圳)有限公司 | Heat-pipe heat radiation apparatus |
| CN105579792A (en) * | 2014-09-02 | 2016-05-11 | 阿威德热合金有限公司 | Evaporator and condenser section structure for thermosiphon |
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2019
- 2019-03-25 CN CN201920381063.4U patent/CN209824307U/en not_active Withdrawn - After Issue
- 2019-03-25 CN CN201910227037.0A patent/CN109819635B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204421708U (en) * | 2015-02-04 | 2015-06-24 | 董陈 | Thermosyphon heat dissipation device |
| CN207247967U (en) * | 2017-09-30 | 2018-04-17 | 深圳智焓热传科技有限公司 | Thermosyphon heat dissipation device |
| CN209824307U (en) * | 2019-03-15 | 2019-12-20 | 深圳智焓热传科技有限公司 | Heat sink device |
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| Publication number | Publication date |
|---|---|
| CN109819635A (en) | 2019-05-28 |
| CN209824307U (en) | 2019-12-20 |
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