CN114641190A - High-dimensional radiator for heat-generating component driven by steam power and gravity - Google Patents
High-dimensional radiator for heat-generating component driven by steam power and gravity Download PDFInfo
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- CN114641190A CN114641190A CN202210375937.1A CN202210375937A CN114641190A CN 114641190 A CN114641190 A CN 114641190A CN 202210375937 A CN202210375937 A CN 202210375937A CN 114641190 A CN114641190 A CN 114641190A
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- 230000005484 gravity Effects 0.000 title claims abstract description 26
- 238000001704 evaporation Methods 0.000 claims abstract description 45
- 230000008020 evaporation Effects 0.000 claims abstract description 42
- 230000017525 heat dissipation Effects 0.000 claims abstract description 35
- 238000009833 condensation Methods 0.000 claims abstract description 15
- 230000005494 condensation Effects 0.000 claims abstract description 15
- 238000011049 filling Methods 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims description 45
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 230000002209 hydrophobic effect Effects 0.000 claims description 12
- 239000012530 fluid Substances 0.000 claims description 10
- 230000001965 increasing effect Effects 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 7
- 238000005057 refrigeration Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 abstract description 21
- 239000000306 component Substances 0.000 description 18
- 230000000694 effects Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a high-dimensional radiator for a steam power and gravity driven heat-generating component, which is used for electronic elements and comprises an evaporation chamber; the evaporation chamber is arranged opposite to the heat dissipation end of the electronic element; the evaporation chamber is also communicated with a filling pipeline; the heat dissipation assembly is communicated with the evaporation chamber through a steam conduit and a condensation conduit; the heat dissipation assembly is obliquely arranged; the fan is fixedly arranged on the mounting plate; the mounting plate is fixedly connected with the heat dissipation assembly; the fan is arranged opposite to the heat dissipation assembly. The invention has simple and compact structure, less parts, good temperature stability of the electronic components under high heat flow density, good performance of the radiator, environment-friendly refrigerant and wide application prospect.
Description
Technical Field
The invention relates to the technical field of heat dissipation of heat-generating components, in particular to a high-dimensional heat radiator of a heat-generating component driven by steam power and gravity.
Background
With the development of 5G, new energy vehicles and AI industries, electronic devices and chips are continuously advancing towards miniaturization and high integration. Along with the increase of the heat flux density of electronic products, the temperature control problem has gradually become a main cause of failure of modern electronic products, and becomes a bottleneck restricting the development of industries. The heat pipe is widely applied to various heat dissipation scenes as a recognized efficient heat exchange device, however, the traditional heat pipe is difficult to meet the increasing thermal control requirement due to the problems of heat transmission distance, installation flexibility and the like. People need to arrange in advance to find a safer, more reliable and more efficient heat exchange device.
The loop heat pipe is used as a high-efficiency heat exchange device for realizing heat transmission through flowing phase change of working fluid, the requirements of a space detector on high-efficiency heat exchange and high temperature uniformity can be met, a gas-liquid pipeline of the loop heat pipe has certain flexibility, the requirements of long-distance heat transmission and isolation of a refrigerator on vibration interference of the detector can be met, and meanwhile, the loop heat pipe is easy to arrange in a complex space. The loop heat pipe drives the working medium to flow by means of capillary force of the capillary core, and the whole loop heat pipe system has no moving part, so that the loop heat pipe system has the characteristics of long service life and high reliability. The loop heat pipe has the advantages of strong heat transfer capability, low heat transfer resistance, long transmission distance, good isothermal property, no moving part, no need of external force driving and the like, and also has great advantages in the fields of 5G, new energy vehicles and AI high heat flow electronic components and chip heat dissipation. For example, in the case of the SwitchAlpha 12 ultrathin tablet personal computer, the core component in the Liquid Loop Liquid cooling heat dissipation assembly adopted in the heat dissipation system is just a Loop heat pipe, and meanwhile, the Loop heat pipe is widely applied to the whole new energy automobile thermal control technology. Therefore, the loop heat pipe has very important research value and very wide application prospect in the aerospace thermal control field and the commercial electronic product heat dissipation field.
Disclosure of Invention
The invention aims to provide a high-dimensional heat radiator for heat-generating components driven by steam power and gravity, which solves the problems in the prior art, can solve the heat dissipation problem of electronic components at different placing positions and is suitable for being used in different spaces.
In order to achieve the purpose, the invention provides the following scheme: the invention provides a high-dimensional radiator of a steam power and gravity driven heat-generating component, which is used for electronic elements and comprises an evaporation chamber; the evaporation chamber is arranged right opposite to the heat dissipation end of the electronic element; the evaporation chamber is also communicated with a filling pipeline;
a heat dissipating component; the heat dissipation assembly is communicated with the evaporation chamber through a steam conduit and a condensation conduit; the heat dissipation assembly is obliquely arranged;
mounting a plate; the fan is fixedly arranged on the mounting plate; the mounting plate is fixedly connected with the heat dissipation assembly; the fan is arranged opposite to the heat dissipation assembly.
The heat dissipation assembly comprises flat condensation pipes, fins, a liquid collecting pipe and a gas collecting pipe; the condensation flat pipes are arranged in a plurality of equal intervals; a plurality of fluid channels are arranged in the flat condenser pipe; two ends of the flat condensing pipe are respectively arranged on the liquid collecting pipe and the gas collecting pipe; the liquid collecting pipe is arranged below the gas collecting pipe and is parallel to the gas collecting pipe; the fins are arranged between any two adjacent outer side walls of the condenser flat tubes.
One side of the liquid collecting pipe is communicated with the condensing conduit; one side of the gas collecting pipe is communicated with the steam guide pipe; the steam guide pipe and the condensing guide pipe are respectively arranged on two sides of the flat condensing pipe.
The top of one side of the evaporation chamber is communicated with the steam guide pipe, and the bottom of the side of the evaporation chamber is also communicated with the filling pipeline; the filling pipeline is communicated with the refrigeration box; the bottom of the other side of the evaporation chamber is communicated with the condensation duct.
An arc groove is arranged in the evaporation chamber.
The liquid collecting pipe and the gas collecting pipe are of square structures, and a fluid channel and a gas channel which are communicated with the flat condensing pipe are respectively arranged in the liquid collecting pipe and the gas collecting pipe; the fluid channel in the liquid collecting pipe is communicated with the condensing conduit; and a gas channel in the gas collecting pipe is communicated with the steam conduit.
The liquid collecting pipe is internally coated with a gas collecting hydrophobic coating which is used for preventing the working medium from being condensed and adhered on the liquid collecting pipe to influence the heat transfer performance; the gas collecting pipe is internally provided with an inclined groove, so that the influence of capillary force and gravity is increased, and the condensed working medium can quickly flow back to the evaporation chamber for cycle work.
The inner wall of the steam guide pipe is coated with a steam hydrophobic coating for ensuring that a steam working medium can flow quickly; an inner groove is formed in the condensation guide pipe, so that the capillary force of liquid backflow is increased, and the working medium can be enabled to quickly flow back to the evaporation chamber.
The top end and the bottom end of the mounting plate are respectively fixedly connected with the corner of the gas collecting pipe and the corner of the liquid collecting pipe; the mounting panel set up in condenser flat tube below, the fan is restricted in the mounting panel with between the condenser flat tube.
The condenser flat tubes are obliquely arranged, and the included angle between the condenser flat tubes and the horizontal plane is 58-62 degrees; the distance between the adjacent condenser flat tubes is 7.4mm-7.8 mm;
the thickness of the fin is 0.08mm-0.12 mm; the distance between the adjacent fins is 2.4mm-2.8 mm.
The invention discloses the following technical effects: this radiator unit adopts loop heat pipe radiator, has solved traditional heat pipe radiator and has dispeled the heat and receive the restriction of distance factor, can better adapt to in the middle of the multiple heat production components and parts, and its radiating effect is also relatively good many moreover.
The arrangement of the steam conduit and the refrigeration condensing conduit accords with the aerodynamic principle, the flow resistance of a gaseous refrigerant and a liquid refrigerant in the whole radiator structure can be reduced, and the flow of the steam refrigerant in a condensing section can be increased, so that the condensing capacity is enhanced, and the heat dissipation effect of the radiator is exerted to the maximum extent.
The invention can well transfer heat to the external environment without using a fan under the condition of lower heat flow density of the electronic component, thereby realizing passive heat dissipation under the condition of low heat flow density.
The invention has simple and compact structure, less parts, good temperature stability of the electronic components under high heat flow density, good performance of the radiator, environment-friendly refrigerant and wide application prospect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is an isometric view of a unitary structure;
FIG. 2 is a structural elevation view;
FIG. 3 is a top view of the structure;
FIG. 4 is a side view;
FIG. 5 is an isometric view of the vaporization chamber construction;
FIG. 6 is a schematic view of a condenser flat tube structure;
FIG. 7 is a cross-sectional view of a steam conduit;
FIG. 8 is a cross-sectional view of a condensing duct;
FIG. 9 is a sectional view of a collector tube;
fig. 10 is a header axis view.
Wherein, 1, filling a pipeline; 2. an evaporation chamber; 3. a steam conduit; 4. a fin; 5. flat condenser tubes; 6. a liquid collecting pipe; 7. a condensing conduit; 8. mounting a plate; 9. a gas collecting pipe; 10. an arc-shaped groove; 11. a steam hydrophobic coating; 12. an inner groove; 13. a gas-collecting hydrophobic coating; 14. the trench is sloped.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
The invention provides a high-dimensional radiator of a steam power and gravity driven heat-generating component, which is used for electronic elements and comprises an evaporation chamber 2; the evaporation chamber is arranged opposite to the heat dissipation end of the electronic element; the evaporation chamber 2 is also communicated with a filling pipeline 1;
a heat dissipating component; the heat dissipation component is communicated with the evaporation chamber 2 through a steam conduit 3 and a condensation conduit 7; the heat dissipation assembly is obliquely arranged;
a mounting plate 8; the fan is fixedly arranged on the mounting plate 8; the mounting plate 8 is fixedly connected with the heat dissipation assembly; the fan is arranged opposite to the heat dissipation assembly.
The heat dissipation component comprises flat condensation pipes 5, fins 4, a liquid collecting pipe 6 and a gas collecting pipe 9; the condenser flat tubes 5 are arranged in a plurality and are distributed at equal intervals; a plurality of fluid channels are arranged in the flat condensing tubes 5; two ends of the flat condenser pipe 5 are respectively arranged on the liquid collecting pipe 6 and the gas collecting pipe 9; the liquid collecting pipe 6 is arranged below the gas collecting pipe 9 and is parallel to the gas collecting pipe 9; the fins 4 are arranged between the outer side walls of any two adjacent condenser flat tubes 5.
One side of the liquid collecting pipe 6 is communicated with a condensing conduit 7; one side of the gas collecting pipe 9 is communicated with a steam guide pipe 3; the steam conduit 3 and the condensing conduit 7 are respectively arranged at two sides of the flat condensing pipe 5.
The top of one side of the evaporation chamber 2 is communicated with a steam conduit 3, and the bottom of the side of the evaporation chamber 2 is also communicated with a filling pipeline 1; the filling pipeline 1 is communicated with the refrigeration box; the other side bottom of the evaporation chamber 2 is communicated with a condensation duct 7.
The liquid collecting pipe 6 and the gas collecting pipe 9 are both of square structures, and a fluid channel and a gas channel which are communicated with the flat condensing pipe 5 are respectively arranged in the liquid collecting pipe 6 and the gas collecting pipe 9; the fluid channel in the liquid collecting pipe 6 is communicated with the condensing conduit 7; the gas channel in the gas collecting pipe 9 is communicated with the steam conduit 3.
An arc-shaped groove 10 is arranged in the evaporation chamber 2.
Furthermore, the arc-shaped groove is arranged on one side of the evaporation chamber, and is inwards sunken to form an arc-shaped groove 10.
A gas-collecting hydrophobic coating 13 is coated in the liquid collecting pipe 6 and is used for preventing the working medium from being condensed and adhered on the gas-collecting hydrophobic coating to influence the heat transfer performance; the inclined groove 14 is arranged in the gas collecting pipe 9, so that the influence of capillary force and gravity is increased, and the condensed working medium can quickly flow back to the evaporation chamber 2 for cycle work.
Further, the liquid collecting pipe 6 is of a cubic structure, and a gas collecting hydrophobic coating 13 is laid on the inner wall of the liquid collecting pipe; the gas collecting pipe 9 is provided with an inclined groove 14, and the included angle between the inclined groove 14 and the edge of the gas collecting pipe 9 is 20-30 degrees.
The inner wall of the steam conduit 3 is coated with a steam hydrophobic coating 11 for ensuring that a steam working medium can flow rapidly; an inner groove 12 is arranged in the condensing conduit 7, so that the capillary force of liquid backflow is increased, and the working medium can be enabled to quickly flow back to the evaporation chamber 2.
Further, the steam conduit 3 is a cylindrical structure, and the inner wall of the steam conduit is laid with a steam hydrophobic coating 11; an inner groove 12 is arranged in the condensing duct 7, and the inner groove 12 is completely arranged on the inner wall of the condensing duct 7.
The flat condenser tubes 5 are obliquely arranged, and the included angle between the flat condenser tubes 5 and the horizontal plane is 58-62 degrees; the distance between the adjacent condenser flat tubes 5 is 7.4mm-7.8 mm;
the thickness of the fin 4 is 0.08mm-0.12 mm; the distance between adjacent fins 4 is 2.4mm-2.8 mm.
The top end and the bottom end of the mounting plate 8 are respectively fixedly connected with the corner of the gas collecting pipe 9 and the corner of the liquid collecting pipe 6; the mounting plate 8 is arranged below the flat condenser tube 5, and the fan is limited between the mounting plate 8 and the flat condenser tube 5.
In one embodiment of the invention, the fill conduit 1 directs a condensing agent, which may be a gas condensing agent, into the vapor chamber 2; the steam conduit 3, the filling conduit 1 and the condensing conduit 7 are arranged, so that the refrigerant flows more smoothly after being evaporated, and the flow resistance of the steam is reduced.
In one embodiment of the invention, the flat condenser tube 5 is in a harmonica tube structure, and an internal circulation channel allows steam to pass through, so that a larger contact area between a steam refrigerant and the flat condenser tube is ensured, and the steam refrigerant is further cooled and condensed into the liquid collecting tube 6 by virtue of the fins 4; after being condensed in the first condensing pipe 6, the condensed liquid flows back to the evaporation chamber 2 through a condensing conduit 7 for recycling.
In one embodiment of the present invention, the flat condenser tube 5 is inclined at an angle with respect to the horizontal plane, so that the flow of the liquefied refrigerant is driven by gravity and steam power.
In one embodiment of the invention, the liquid collecting pipe 6 is internally provided with a flow channel, so that the liquefaction of the refrigerant and the collection of the liquefied refrigerant are facilitated, and a small opening is formed at the joint of the liquid collecting pipe 6 and the flat condensing pipe 5, so that the flat condensing pipe 5 and the liquid collecting pipe 6 can be conveniently welded; the purpose of the collecting line 9 is to introduce the evaporation gas and the gaseous refrigerant into the flat condenser tube 5.
When the heat generating surface of the electronic element is tightly attached to the evaporation chamber, the heat generated by the element is transferred to the refrigerant in the evaporation chamber 2, the refrigerant is gasified to absorb heat, the gasified steam-state refrigerant enters each flat condensing tube 5 along the steam guide pipe 4 through the gas collecting pipe 9 to be liquefied, the liquefied refrigerant flows into the liquid collecting pipe 6 under the push of gravity and steam power, then the refrigerant flows back to the evaporation chamber 2 through the condensing guide pipe 7 under the push of two forces, then the whole process is circulated, the heat generated by the element is discharged to the external environment through phase change, and in the whole process, the fan installed on the installation plate 8 continuously works, so that the heat can be better conducted out by enhancing the heat dissipation effect.
As shown in the figure, the heat-generating component high-dimensional radiator driven by steam power and gravity has certain inclination angle instead of being completely vertical, so that the heat-generating component high-dimensional radiator is applicable to different heat-generating component placing positions, and can flow back to an evaporation chamber more quickly after condensation of a gaseous refrigerant due to the promotion of the steam power and the gravity in the flowing process, so that the overall effect is better. Further, the condenser flat tube 5 that the slope was placed has bigger cold area than other with the radiator of size, and the intensive heat dissipation that can be better like this, radiator fan's locating place also has certain angle moreover, and son can prevent to a certain extent deposition on the radiator like this, has prolonged the life of radiator.
In the working process, if the heat generating power of the electronic element is low, the cooling fan is in a closed state, and passive cooling is realized; if the heat generating power is too high, the heat radiation fan is continuously opened to realize forced convection, so that the heat transfer is enhanced, and the heat radiation effect of the heat radiator is enhanced.
Further, the flat evaporating pipes 5 are harmonica pipes, so that the flat evaporating pipes have larger contact areas with the steam refrigerant, and the plurality of harmonica pipes are arranged at certain intervals to increase the flow of the steam refrigerant in the flat evaporating pipes, so that the heat dissipation performance of the radiator is improved.
The flat condenser tube 5 group is not vertically arranged, but has a certain included angle with the horizontal plane, so that the condensed refrigerant can flow in the flat condenser tube not completely depending on gravity, but under the double pushing of steam power and gravity, and the inclined design can also enable the loop heat pipe radiator to be applicable to different practical situations, so that the application range of the loop heat pipe radiator is wider.
In one embodiment of the invention, the distribution of the fins in the heat pipe radiator, the spacing and the number of the fins are the optimal arrangement conditions obtained through simulation, so that the radiator has the optimal radiating effect under the structure;
specifically, the condenser flat tube 5 has the dimensions of 160mm in length, 30.3mm in width, 2.5mm in thickness and 60 degrees in inclination angle with the horizontal plane; the distance between the condenser flat tubes 5 is 7.5 mm; the number of the roots is 22.
The thickness of the fins 4 is 0.1mm, and the distance is 2.7 mm;
the size of the liquid collecting pipe 6 is 212.5mm in length, 10mm in width, 35mm in height and 1.5mm in wall thickness;
the evaporator 2 has the following dimensions: the length is 90mm, the width is 20mm, the height is 50mm, and a flow channel is arranged in the device;
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience in describing the present invention, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements of the technical solutions of the present invention can be made by those skilled in the art without departing from the spirit of the present invention, and the technical solutions of the present invention are within the scope of the present invention defined by the claims.
Claims (10)
1. Steam power and gravity driven high dimension radiator of heat production components and parts for electronic component, its characterized in that includes: an evaporation chamber (2); the evaporation chamber (2) is arranged right opposite to the heat dissipation end of the electronic element; the evaporation chamber (2) is also communicated with a filling pipeline (1);
a heat dissipating component; the heat dissipation assembly is communicated with the evaporation chamber (2) through a steam conduit (3) and a condensation conduit (7); the heat dissipation assembly is obliquely arranged;
a mounting plate (8); the fan is fixedly arranged on the mounting plate (8); the mounting plate (8) is fixedly connected with the heat dissipation assembly; the fan is opposite to the heat dissipation assembly.
2. The steam-powered and gravity-driven high-dimensional heat radiator for heat-generating components and parts as claimed in claim 1, wherein: the heat dissipation assembly comprises flat condensation pipes (5), fins (4), a liquid collecting pipe (6) and a gas collecting pipe (9); the condenser flat tubes (5) are arranged in a plurality of equal intervals; a plurality of fluid channels are arranged in the flat condenser tube (5); two ends of the flat condensing pipe (5) are respectively arranged on the liquid collecting pipe (6) and the gas collecting pipe (9); the liquid collecting pipe (6) is arranged below the gas collecting pipe (9) and is parallel to the gas collecting pipe (9); the fins (4) are arranged between the outer side walls of any two adjacent condenser flat tubes (5).
3. The steam-powered and gravity-driven high-dimensional heat sink for heat-generating components according to claim 2, wherein: one side of the liquid collecting pipe (6) is communicated with the condensing conduit (7); one side of the gas collecting pipe (9) is communicated with the steam guide pipe (3); the steam guide pipe (3) and the condensing guide pipe (7) are respectively arranged on two sides of the flat condensing pipe (5).
4. The steam-powered and gravity-driven high-dimensional heat radiator for heat-generating components and parts as claimed in claim 1, wherein: the top of one side of the evaporation chamber (2) is communicated with the steam conduit (3), and the bottom of the side of the evaporation chamber (2) is also communicated with the filling pipeline (1); the filling pipeline (1) is communicated with the refrigeration box; the bottom of the other side of the evaporation chamber (2) is communicated with the condensation duct (7).
5. The steam-powered and gravity-driven high-dimensional heat radiator for heat-generating components according to claim 4, wherein: an arc groove (10) is arranged in the evaporation chamber (2).
6. The steam-powered and gravity-driven high-dimensional heat sink for heat-generating components according to claim 3, wherein: the liquid collecting pipe (6) and the gas collecting pipe (9) are of square structures, and a fluid channel and a gas channel which are communicated with the flat condenser pipe (5) are respectively arranged in the liquid collecting pipe (6) and the gas collecting pipe (9); the fluid channel in the liquid collecting pipe (6) is communicated with the condensing conduit (7); and a gas channel in the gas collecting pipe (9) is communicated with the steam conduit (3).
7. The steam-powered and gravity-driven high-dimensional heat sink for heat-generating components according to claim 6, wherein: a gas-collecting hydrophobic coating (13) is coated in the liquid collecting pipe (6) and is used for preventing the working medium from being condensed and adhered on the gas-collecting hydrophobic coating to influence the heat transfer performance; an inclined groove (14) is formed in the gas collecting pipe (9), so that the influence of capillary force and gravity is increased, and the condensed working medium can quickly flow back to the evaporation chamber (2) to perform circulating work.
8. The steam powered and gravity driven high-dimensional heat sink for heat generating components as claimed in claim 7, wherein: the inner wall of the steam conduit (3) is coated with a steam hydrophobic coating (11) for ensuring that a steam working medium can flow rapidly; an inner groove (12) is formed in the condensation guide pipe (7), so that the capillary force of liquid backflow is increased, and the working medium can quickly flow back to the evaporation chamber (2).
9. The steam-powered and gravity-driven high-dimensional heat radiator for heat-generating components according to claim 3, wherein: the flat condenser tubes (5) are obliquely arranged, and the included angle between the flat condenser tubes (5) and the horizontal plane is 58-62 degrees; the distance between the adjacent flat condenser tubes (5) is 7.4mm-7.8 mm;
the thickness of the fin (4) is 0.08mm-0.12 mm; the distance between the adjacent fins (4) is 2.4mm-2.8 mm.
10. The steam-powered and gravity-driven high-dimensional heat sink for heat-generating components according to claim 2, wherein: the top end and the bottom end of the mounting plate (8) are respectively fixedly connected with the corner of the gas collecting pipe (9) and the corner of the liquid collecting pipe (6); the mounting plate (8) is arranged below the flat condenser tube (5), and the fan is limited between the mounting plate (8) and the flat condenser tube (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210375937.1A CN114641190A (en) | 2022-04-11 | 2022-04-11 | High-dimensional radiator for heat-generating component driven by steam power and gravity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210375937.1A CN114641190A (en) | 2022-04-11 | 2022-04-11 | High-dimensional radiator for heat-generating component driven by steam power and gravity |
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| CN114641190A true CN114641190A (en) | 2022-06-17 |
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| CN202210375937.1A Pending CN114641190A (en) | 2022-04-11 | 2022-04-11 | High-dimensional radiator for heat-generating component driven by steam power and gravity |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115426852A (en) * | 2022-09-26 | 2022-12-02 | 深圳见炬科技有限公司 | Split type high dimension radiator system of communication base station |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN1801483A (en) * | 2005-11-18 | 2006-07-12 | 华南理工大学 | Capillary pump cooler with micro-groove wing structure and its manufacturing method |
| CN109819635A (en) * | 2019-03-15 | 2019-05-28 | 深圳智焓热传科技有限公司 | Radiator |
| CN111486734A (en) * | 2020-04-01 | 2020-08-04 | 浙江理工大学 | Vapor chamber and manufacturing method thereof |
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| CN115426852A (en) * | 2022-09-26 | 2022-12-02 | 深圳见炬科技有限公司 | Split type high dimension radiator system of communication base station |
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