CN109714885A - Composite radiating type circuit board, ultraviolet light curing mold group and preparation method thereof - Google Patents
Composite radiating type circuit board, ultraviolet light curing mold group and preparation method thereof Download PDFInfo
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- CN109714885A CN109714885A CN201910140593.4A CN201910140593A CN109714885A CN 109714885 A CN109714885 A CN 109714885A CN 201910140593 A CN201910140593 A CN 201910140593A CN 109714885 A CN109714885 A CN 109714885A
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- insulating substrate
- heat pipe
- dissipating part
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Abstract
The present invention provides a kind of composite radiating type circuit board, ultraviolet light curing mold group and preparation method thereof, which includes insulating substrate and the conductive pattern for being formed in the insulating substrate upper surface；The heat pipe for being exposed to its lower surface and the metallic heat dissipating part for exposing surface thereon are equipped in insulating substrate, metallic heat dissipating part is connect with heat pipe, and the lower surface flush of heat pipe and insulating substrate；The lower face side of insulating substrate and heat pipe is provided with graphene cooling fin, and passes through conducting adhesive piece bonding connection between insulating substrate and graphene cooling fin and between heat pipe and graphene cooling fin.The ultraviolet light curing mold group includes the ultraviolet LED luminescent device for being thermally connected with metallic heat dissipating part and being electrically connected with conductive pattern；In preparation method embodiment, passes through heat pressing process and make insulating substrate and heat pipe is fixed in insulating substrate simultaneously, simple process and fixed reliable.The present invention carries out composite radiating by a variety of sinking paths, reaches splendid heat dissipation performance.
Description
Technical field
Ultraviolet light curing mold group the present invention relates to a kind of circuit board, including the circuit board and preparation method thereof.
Background technique
Ultraviolet light solidification equipment utilization ultraviolet light (usually 200-450nm) irradiating ultraviolet light curing materials (such as glue
Or ink) it is made to generate polymerization reaction and solidify, there is very extensive application in industries such as printing, coatings.Traditional is ultraviolet
For uv equipment using ultraviolet light mercury lamp as light source, power consumption is big, and needs to configure exhaust because ultraviolet light mercury lamp generates ozone
Device causes equipment overall operation at high cost.LED (light emitting diode) have low power consumption, the long-life, miniaturization, lightweight and
The advantages that without mercury ingredient, in recent years, ultraviolet LED light source, have substituted the use of ultraviolet light mercury lamp in UV light more and more
Change in equipment.
Ultraviolet LED light source is usually mounted in ultraviolet light curing apparatus in the form of ultraviolet light curing mold group, the ultraviolet light
Curing mold group includes the ultraviolet LED luminescent device (such as ultraviolet LED lamp bead or chip) of circuit board and installation on the board.
Ultraviolet LED luminescent device can distribute amount of heat during the work time, therefore it is required that the circuit board has excellent heat dissipation performance,
To improve the working performance and service life of ultraviolet LED luminescent device, ultraviolet LED luminescent device is avoided to occur because of overheat " dead
Lamp " phenomenon.
It, can be in the circuit as the common measures taken for improving the organic material heat dissipation for circuit board performance such as FR-4 circuit board
The heat-conducting metal of such as aluminium or copper is embedded in the insulating substrate of plate；Furthermore it is also possible to be embedded in the insulating substrate of the circuit board
Ceramic heat-dissipating body.Urgently it is expected that ultraviolet light curing mold group has more but with the fast development of UV-curing technology, in industry
Strong exposure intensity, is individually embedded in heat-conducting metal in insulating substrate or ceramics have been difficult to meet well industry and have dissipated to circuit board
The requirement of hot property.
Summary of the invention
The first object of the present invention is to provide a kind of circuit board with excellent heat dispersion performance.
The ultraviolet light curing mold group with excellent heat dispersion performance that it is a further object of the present invention to provide a kind of.
Another object of the present invention is to provide a kind of method for preparing the circuit board with excellent heat dispersion performance at low cost.
In order to realize the first above-mentioned purpose, the present invention provides a kind of composite radiating type circuit boards, including insulating substrate
With the conductive pattern for being formed in insulating substrate upper surface；Wherein, be provided in insulating substrate be exposed to its lower surface heat pipe and
Expose the metallic heat dissipating part on surface thereon, metallic heat dissipating part is connect with heat pipe, and the lower surface of heat pipe and insulating substrate is mutual
Concordantly；The lower face side of insulating substrate and heat pipe is provided with graphene cooling fin, and between insulating substrate and graphene cooling fin
And pass through conducting adhesive piece bonding connection between heat pipe and graphene cooling fin.
By above technical scheme as it can be seen that circuit board of the invention uses metallic heat dissipating part, heat pipe and graphene cooling fin
Etc. a variety of composite radiating approach；It is thermally connected in use, such as ultraviolet LED luminescent device and metallic heat dissipating part are formed, ultraviolet LED hair
Generated heat is conducted by metallic heat dissipating part to heat pipe in the optical device course of work, and further by heat pipe and conducting adhesive piece
It quickly conducts to graphene cooling fin.Wherein, heat pipe and graphene cooling fin have the heat-sinking capability much higher than metal and ceramics,
So that the heat dissipation performance of circuit board is significantly improved.Further, heat pipe is arranged in insulating substrate, and under heat pipe
Surface is covered by conducting adhesive piece and graphene cooling fin, so that heat pipe is embedded in inside circuit board completely, therefore heat pipe is not
Can be contacted with air, avoid because of heat pipe contacted with air aoxidize caused by heat dissipation performance decline.
The upper surface flush of a kind of specific embodiment according to the present invention, metallic heat dissipating part and conductive pattern.As a result,
Convenient for the heat sink and electrode of such as ultraviolet LED lamp bead is welded on metallic heat dissipating part and conductive pattern with high reliability respectively.
Another specific embodiment according to the present invention, the top of metallic heat dissipating part have covering metallic heat dissipating part and extend
To the thermally conductive weld pad of insulating substrate upper surface, the upper surface flush of thermally conductive weld pad and conductive pattern.
In above-mentioned technical proposal, thermally conductive weld pad, the size and shape of thermally conductive weld pad are covered at the top of metallic heat dissipating part
Can according to such as ultraviolet LED luminescent device to be mounted concrete type and specification and neatly adjust, to improve electricity
The versatility of road plate.
Another specific embodiment according to the present invention, conductive pattern include being arranged in pairs and being located at metallic heat dissipating part
The positive terminal pad and negative terminal pad of opposite sides.
In one particular embodiment of the present invention, multiple metallic heat dissipating parts are provided on heat pipe, conductive pattern includes into
To the positive terminal pad and negative terminal pad for being arranged and being located at each metallic heat dissipating part opposite sides.
Another specific embodiment according to the present invention, insulating substrate include multilayer insulation plate, multilayer insulation plate it
Between by binding material bonding connection, and heat pipe is fixed in insulating substrate by binding material adhesion.
In order to realize above-mentioned another object, the present invention also provides a kind of ultraviolet light curing mold groups comprising institute as above
Any one the composite radiating type circuit board stated and the ultraviolet LED luminescent device being arranged on the composite radiating type circuit board；Its
In, ultraviolet LED luminescent device and metallic heat dissipating part are thermally connected, and are electrically connected with conductive pattern.
By above technical scheme as it can be seen that ultraviolet light curing mold group of the invention include using metallic heat dissipating part, heat pipe and
The circuit board of a variety of composite radiating approach such as graphene cooling fin；Generated heat in the ultraviolet LED luminescent device course of work
It is conducted by metallic heat dissipating part to heat pipe, and is quickly conducted by heat pipe and conducting adhesive piece to graphene cooling fin, heat dissipation performance pole
It is good.Further, heat pipe will not be contacted with air, avoid because of heat pipe contacted with air aoxidize caused by heat dissipation performance
Decline.
In order to realize above-mentioned a further object, the present invention also provides a kind of method for preparing ultraviolet light curing mold group,
Include the steps that making circuit board S1 and ultraviolet LED luminescent device is arranged to the step S2 on circuit board；Wherein, step S1
Include:
S101: heat pipe is provided, and prepares metallic heat dissipating part on heat pipe；
S103: insulating substrate laminated body is provided, which includes the multilayer insulation plate stacked from bottom to top
Material, the semi-solid preparation bonding sheet being arranged between multilayer insulation plate and the surface copper for being formed in top layer's insulating sheet material upper surface
Layers of foil, and the insulating substrate laminated body has the step through-hole for accommodating heat pipe and metallic heat dissipating part；
S105: hot pressing insulating substrate laminated body and the insulating substrate for obtaining embedded heat pipe and metallic heat dissipating part, and to insulation
The upper and lower surfaces of substrate are ground；Wherein, the upper surface flush of metallic heat dissipating part and surface copper foil layer, heat pipe and insulation
The lower surface flush of substrate；
S107: graphene cooling fin is bonded in the lower face side of heat pipe and insulating substrate using conducting adhesive piece；
S109: pattern etch process is carried out to surface copper foil layer, obtains conductive pattern；
And wherein, step S2 include: so that ultraviolet LED luminescent device and metallic heat dissipating part are formed is thermally connected, and with lead
Electrograph shape forms electrical connection.
In order to realize above-mentioned a further object, the present invention also provides another kind prepare ultraviolet light curing mold group method,
Include the steps that making circuit board S1 and ultraviolet LED luminescent device is arranged to the step S2 on circuit board；Wherein, step S1
Include:
S101: heat pipe is provided；
S103: heat pipe is embedded in insulating substrate；Wherein, the insulating substrate have the first main surface for being oppositely arranged and
First main surface of the second main surface, insulating substrate has surface copper foil layer, and one of surface of heat pipe is exposed to insulation base
Second main surface of plate, and the second main surface flush of the exposed surface of heat pipe and insulating substrate；
S105: being drilled with from the first main surface side of insulating substrate so that heat pipe expose blind hole, and pass through screen printing dataller
Skill prints metal paste in the blind hole internal thread, then metal paste is made to be solidified to form metallic heat dissipating part；Wherein, metallic heat dissipating part
With the outer surface flush of surface copper foil layer；
S107: the stone of heat pipe and insulating substrate is covered in the second main surface side bonding of insulating substrate using conducting adhesive piece
Black alkene cooling fin；
S109: pattern etch process is carried out to surface copper foil layer, obtains conductive pattern；
And wherein, step S2 include: so that ultraviolet LED luminescent device and metallic heat dissipating part are formed is thermally connected, and with lead
Electrograph shape forms electrical connection.
As the preferred embodiment of the present invention, above-mentioned preparation method further includes after step S105 and in step S109
Before, the step of surface copper foil layer and metallic heat dissipating part surface form copper clad layers；In step S109, to surface copper foil layer and cover
Layers of copper carries out pattern etch process, obtains conductive pattern and thermally conductive weld pad, which simultaneously extends to
The upper surface of insulating substrate.
Ultraviolet light curing mold group preparation method of the invention has the advantages that at low cost, and heat pipe and metal may be implemented and dissipate
Hot body being reliably fixed in insulating substrate.
In order to illustrate more clearly of the object, technical solutions and advantages of the present invention, with reference to the accompanying drawing and specific embodiment party
The present invention is described in further detail for formula.
It should be noted that different piece in attached drawing may not be with phase in order to clearly illustrate structure to be expressed
Describe in proportion, therefore, unless explicitly stated otherwise, otherwise content expressed by attached drawing is not constituted to the size of each part, ratio pass
The limitation of system.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of ultraviolet light curing mold group embodiment 1 of the present invention；
Fig. 2 is the structural schematic diagram for forming metallic heat dissipating part in 1 preparation method of circuit board embodiment of the present invention on heat pipe；
Fig. 3 is that heat pipe and metallic heat dissipating part are placed into dielectric substrate layer in 1 preparation method of circuit board embodiment of the present invention
Structural schematic diagram in the step through-hole of stack；
Fig. 4 is that hot pressing obtains the insulation of embedded heat pipe and metallic heat dissipating part in 1 preparation method of circuit board embodiment of the present invention
The structural schematic diagram of substrate；
Fig. 5 is to dissipate in 1 preparation method of circuit board embodiment of the present invention in insulating substrate and heat pipe lower surface setting graphene
The structural schematic diagram of backing；
Fig. 6 is that the structure after carrying out Etching in 1 preparation method of circuit board embodiment of the present invention to surface copper foil layer is shown
It is intended to；
Fig. 7 is the structural schematic diagram of circuit board embodiment 1 of the present invention；
Fig. 8 is the overlooking structure diagram of circuit board embodiment 1 of the present invention；
Fig. 9 is the structural schematic diagram of circuit board embodiment 2 of the present invention；
Figure 10 is to be formed to cover copper on metallic heat dissipating part and surface copper foil layer in 2 preparation method of circuit board embodiment of the present invention
The structural schematic diagram of layer；
Figure 11 is after carrying out Etching to surface copper foil layer and copper clad layers in 2 preparation method of circuit board embodiment of the present invention
Structural schematic diagram；
Figure 12 is the structural schematic diagram of ultraviolet light curing mold group embodiment 3 of the present invention；
Figure 13 is that heat pipe is placed into insulating substrate laminated body blind hole in 3 preparation method of circuit board embodiment of the present invention
Structural schematic diagram；
Figure 14 is that the structure for the insulating substrate that hot pressing obtains embedded heat pipe in 3 preparation method of circuit board embodiment of the present invention is shown
It is intended to；
Figure 15 be drilled on insulating substrate in 3 preparation method of circuit board embodiment of the present invention it is blind for accommodating metal paste
The structural schematic diagram in hole；
Figure 16 is the knot for preparing metallic heat dissipating part in 3 preparation method of circuit board embodiment of the present invention in metal paste blind hole
Structure schematic diagram；
Figure 17 is to dissipate in 3 preparation method of circuit board embodiment of the present invention in insulating substrate and heat pipe lower surface setting graphene
The structural schematic diagram of backing；
Figure 18 is that the structure after carrying out Etching in 3 preparation method of circuit board embodiment of the present invention to surface copper foil layer is shown
It is intended to；
Figure 19 is the structural schematic diagram of circuit board embodiment 3 of the present invention；
Figure 20 is the structural schematic diagram of ultraviolet light curing mold group embodiment 4 of the present invention；
Figure 21 is to be formed to cover copper on metallic heat dissipating part and surface copper foil layer in 4 preparation method of circuit board embodiment of the present invention
Structural schematic diagram after layer；
Figure 22 is after carrying out Etching to surface copper foil layer and copper clad layers in 4 preparation method of circuit board embodiment of the present invention
Structural schematic diagram；
Figure 23 is the structure in 4 preparation method of circuit board embodiment of the present invention after insulating substrate upper surface forms solder mask
Schematic diagram.
Specific embodiment
Composite radiating type circuit board, ultraviolet light curing mold group and preparation method thereof embodiment 1
Referring to Fig. 1, the ultraviolet light curing mold group of embodiment 1 includes composite radiating type circuit board as shown in Figure 7 and sets
Set the ultraviolet LED lamp bead 100 on the composite radiating type circuit board；Wherein, which includes insulating substrate
10, it is formed in the conductive pattern 20 of 10 upper surface of insulating substrate, is formed in 10 upper surface of insulating substrate and part covers conductive pattern
The solder mask 50 of shape 20, the heat pipe 30 for being arranged in insulating substrate 10 and being exposed to 10 lower surface of insulating substrate and setting exist
Insulating substrate 10 is interior and is exposed to the metallic heat dissipating part 31 of 10 upper surface of insulating substrate；Heat pipe 30 is copper heat pipe, metallic heat dissipating part
31 be thermally conductive copper post.
Specifically, the insulating sheet material 11 of insulating substrate 10 including multilayer such as FR-4 plate, between multilayer insulation plate 11
By 12 bonding connection of binding material, and binding material 12 is still around the side of heat pipe 30 and metallic heat dissipating part 31 and glues the two
Be fixed in insulating substrate 10.Metallic heat dissipating part 31 is connect with heat pipe 30, and metallic heat dissipating part 31 and conductive pattern 20 is upper
The lower surface flush with each other of surface flush, heat pipe 30 and insulating substrate 10.Metallic heat dissipating part 31 and heat pipe 30 are in step-like point
Cloth, to be conducive to more reliably be fixed in insulating substrate 10.
The lower face side of insulating substrate 10 and heat pipe 30 is provided with the graphene heat dissipation of covering insulating substrate 10 and heat pipe 30
Piece 40, and glued between insulating substrate 10 and graphene cooling fin 40 and by thermally conductive between heat pipe 30 and graphene cooling fin 40
41 bonding connection of sheeting.Wherein, conducting adhesive piece 41 can be for example sticky heat-conducting silica gel sheet, thermohardening type conducting adhesive piece,
Its thermal coefficient is preferably greater than 2W/ (mK), more preferably higher than 5W/ (mK).On the basis of meeting adhesion strength, lead
The thickness of hot sticky sheeting 41 can be set thin as much as possible.In this way, even if conducting adhesive piece 41 has than heat pipe 30 and graphite
The low thermal coefficient of alkene cooling fin 40, thermal resistance also can be smaller, so that heat can rapidly be conducted by heat pipe 30 to graphene
Cooling fin 40.
Conductive pattern 20 includes being arranged in pairs and being located at the positive terminal pad 21 of 31 opposite sides of metallic heat dissipating part and bear
Pole pad 22；Solder mask 50 is formed in 10 upper surface of insulating substrate, and exposes positive terminal pad 21 and negative terminal pad 22.Ultraviolet LED
Lamp bead 100 has positive electrode 101, negative electrode 102 and positioned there between heat sink 103, positive electrode 101 and negative electrode 102
It is respectively welded to positive terminal pad 21 and negative terminal pad 22, heat sink 103 are soldered to metallic heat dissipating part 31.
In embodiment 1, the preparation method of ultraviolet light curing mold group includes the steps that making circuit board S1 and by ultraviolet LED
Lamp bead is welded to the step S2 on circuit board；Wherein, the step S1 for making circuit board includes:
S101: as shown in Fig. 2, providing heat pipe 30, and the method for copper post is formed in heat pipe by welding copper post or plating
Metallic heat dissipating part 31 is prepared on 30；
S103: as shown in figure 3, providing insulating substrate laminated body 10 ', insulating substrate laminated body 10 ' includes folding from bottom to top
The multilayer insulation plate 11 put, the semi-solid preparation bonding sheet 12 ' being arranged between multilayer insulation plate 11 and it is formed in top layer
The surface copper foil layer 20 ' of 11 upper surface of insulating sheet material, insulating substrate laminated body 10 ', which has, accommodates heat pipe 30 and metallic heat dissipating part 31
Step through-hole 13；
S105: hot pressing insulating substrate laminated body 10 ' and the insulating substrate 10 for obtaining embedded heat pipe 30 and metallic heat dissipating part 31,
And the upper and lower surfaces of insulating substrate 10 are ground；Specifically, by heat-press step, semi-solid preparation bonding sheet 12 ' is cured
Reaction forms the binding material 12 of cure states, and binding material fills the gap in step through-hole 13 and dissipates heat pipe 30 and metal
Hot body 31 is fixed in insulating substrate 10.The upper and lower surfaces of insulating substrate 10 are ground, can remove in hot pressing and flow
It moves to the binding material of 31 exposed surface of heat pipe 30 and metallic heat dissipating part, and improves the exposed table of heat pipe 30 and metallic heat dissipating part 31
The planarization in face and 10 surface of insulating substrate.By step S105, as shown in figure 4, metallic heat dissipating part 31 and surface copper foil layer 20 '
Upper surface flush, the lower surface flush of heat pipe 30 and insulating substrate 10；
S107: as shown in figure 5, bonding graphite in the lower face side of heat pipe 30 and insulating substrate 10 using conducting adhesive piece 41
Alkene cooling fin 40；
S109: as shown in fig. 6, carrying out pattern etch process to surface copper foil layer 20 ', conductive pattern 20 is obtained；
S111: as shown in fig. 7, forming solder mask 50 in the upper surface of insulating substrate 10, the covering of 50 part of solder mask is conductive
Figure 20, and expose positive terminal pad 21, negative terminal pad 22 and metallic heat dissipating part 31.
It wherein, include: so that ultraviolet LED lamp bead 100 by the step S2 that ultraviolet LED lamp bead 100 is welded on circuit board
Positive electrode 101 and negative electrode 102 are welded to connect with positive terminal pad 21 and negative terminal pad 22 respectively, and make ultraviolet LED lamp bead 100
Heat sink 103 with metallic heat dissipating part 31 be welded to connect.
The preparation method of the present embodiment dissipates heat pipe 30 and metal while making insulating substrate 10 using heat pressing process
Hot body 31 is fixed in insulating substrate 10, has simple production process, at low cost and heat pipe 30 and 31 fixation of metallic heat dissipating part can
By the advantages of.
It should be noted that step S107 need to only be carried out after step S105, such as can also be in step S109
Or step S107 is carried out after step S111 again.In addition, multiple radiators 31 can be set on heat pipe 30 in embodiment 1.Figure
8 be the top view of composite radiating type circuit board in embodiment 1, as shown in figure 8, heat pipe 30 is along the longitudinal direction of composite radiating type circuit board
Extend, multiple metallic heat dissipating parts 31 along its longitudinal array distribution are provided on heat pipe 30, conductive pattern 20 includes being arranged in pairs
And it is located at the positive terminal pad 21 and negative terminal pad 22 of each 31 opposite sides of metallic heat dissipating part.
Composite radiating type circuit board, ultraviolet light curing mold group and preparation method thereof embodiment 2
Fig. 9 is the structural schematic diagram of circuit board in embodiment 2, as shown in figure 9, the structure of embodiment 2 and embodiment 1 is distinguished
Be only that: the top of metallic heat dissipating part 31 has covering metallic heat dissipating part 31 and extends to table on insulating substrate 10 in embodiment 2
The thermally conductive weld pad 23 in face, the upper surface flush of thermally conductive weld pad 23 and conductive pattern 20, solder mask 50 are formed in insulating substrate 10
Upper surface and expose positive terminal pad 21, negative terminal pad 22 and thermally conductive weld pad 23.Correspondingly, ultraviolet light curing mold group embodiment 2
In, the heat sink and thermally conductive weld pad 23 of ultraviolet LED lamp bead is welded to connect.
Ultraviolet light curing mold group preparation method in embodiment 2 the difference from embodiment 1 is that, make the step S1 of circuit board
Further include that following step S108 (please referring to Figure 10) is carried out after step S107: for example, by successively carry out electroless copper and
Copper plating process forms copper clad layers 120 ' in surface copper foil layer 20 ' and 31 surface of metallic heat dissipating part；As shown in figure 11, step S109
In, pattern etch process is carried out to surface copper foil layer 20 ' and copper clad layers 120 ', obtains conductive pattern 20 and thermally conductive weld pad 23.It will
The step S2 that ultraviolet LED lamp bead 100 is welded on circuit board includes: positive electrode 101 and negative electricity so that ultraviolet LED lamp bead 100
Pole 102 is welded to connect with positive terminal pad 21 and negative terminal pad 22 respectively, and make heat sink the 103 of ultraviolet LED lamp bead 100 with it is thermally conductive
Weld pad 23 is welded to connect.
Composite radiating type circuit board, ultraviolet light curing mold group and preparation method thereof embodiment 3
Please refer to Figure 12, the ultraviolet light curing mold group of embodiment 3 include composite radiating type circuit board as shown in figure 19 and
Ultraviolet LED lamp bead 100 on the composite radiating type circuit board is set；Wherein, which includes insulation base
Plate 10, the conductive pattern 20 for being formed in 10 upper surface of insulating substrate are formed in 10 upper surface of insulating substrate and part covering conduction
The solder mask 50 of figure 20, the heat pipe 30 for being arranged in insulating substrate 10 and being exposed to 10 lower surface of insulating substrate and setting
In insulating substrate 10 and it is exposed to the metallic heat dissipating part 131 of 10 upper surface of insulating substrate.Heat pipe 30 be copper heat pipe or aluminothermy pipe,
Metallic heat dissipating part 131 is to be formed by solid-state radiator after such as copper slurry or the metal paste of silver paste solidify.
Specifically, the insulating sheet material 11 of insulating substrate 10 including multilayer such as FR-4 plate, between multilayer insulation plate 11
By 12 bonding connection of binding material, and binding material 12 is still around the side of heat pipe 30 and the adhesion of heat pipe 30 is fixed on insulation
In substrate 10, metallic heat dissipating part 131 is then directly connected to the insulating sheet material 11 positioned at its side.Metallic heat dissipating part 131 and heat pipe
30 connections, and the upper surface flush of metallic heat dissipating part 131 and conductive pattern 20, the lower surface phase of heat pipe 30 and insulating substrate 10
It is mutually concordant.Metallic heat dissipating part 131 and heat pipe 30 are in step-like distribution, to be conducive to more reliably be fixed in insulating substrate 10.
The lower face side of insulating substrate 10 and heat pipe 30 is provided with the graphene heat dissipation of covering insulating substrate 10 and heat pipe 30
Piece 40, and glued between insulating substrate 10 and graphene cooling fin 40 and by thermally conductive between heat pipe 30 and graphene cooling fin 40
41 bonding connection of sheeting.Conductive pattern 20 includes the anode weldering for being arranged in pairs and being located at 131 opposite sides of metallic heat dissipating part
Disk 21 and negative terminal pad 22；Solder mask 50 is formed in 10 upper surface of insulating substrate, and exposes positive terminal pad 21 and negative terminal pad 22.
Ultraviolet LED lamp bead 100 has a positive electrode 101, negative electrode 102 and positioned there between heat sink 103, positive electrode 101 and negative
Electrode 102 is respectively welded to positive terminal pad 21 and negative terminal pad 22, and heat sink 103 are soldered to metallic heat dissipating part 131.
In embodiment 3, the preparation method of ultraviolet light curing mold group includes the steps that making circuit board S1 and by ultraviolet LED
Lamp bead 100 is welded to the step S2 on the circuit board；Wherein, the step S1 for making circuit board includes:
S101: heat pipe 30 is provided；
S103: heat pipe 30 is embedded in insulating substrate 10；
Specifically, step S103 include again it is following step by step: firstly, as shown in figure 13, insulating substrate laminated body is provided
10 ', insulating substrate laminated body 10 ' include the multilayer insulation plate 11 that stacks from bottom to top and setting multilayer insulation plate 11 it
Between semi-solid preparation bonding sheet 12 ', the first main surface of insulating substrate laminated body 10 ' has surface copper foil layer 20 ', dielectric substrate layer
Second main surface of stack 10 ' offers the blind hole 101 for accommodating heat pipe 30；Then, hot pressing insulating substrate laminated body 10 ', so that
Semi-solid preparation bonding sheet 12 ' is cured the binding material 12 that reaction forms cure states, and binding material 12 is filled in blind hole 101
Gap and heat pipe 30 is fixed in insulating substrate 10, obtain the insulating substrate 10 of embedded heat pipe 30；Then, to insulating substrate 10
The second main surface ground, to remove the binding material for flowing to 30 exposed surface of heat pipe in hot pressing, and improve heat
The exposed surface of pipe 30 and the planarization on 10 surface of insulating substrate.As a result, as shown in figure 14, gained insulating substrate 10 has opposite
First main surface of the first main surface and the second main surface being arranged, insulating substrate 10 has surface copper foil layer 20 ', heat pipe 30
One of surface is exposed to the second main surface of insulating substrate 10, and the second of the exposed surface of heat pipe 30 and insulating substrate 10
Main surface flush；
S105: it as shown in figure 15, is drilled with from the first main surface side of insulating substrate 10 so that the blind hole that heat pipe 30 exposes
102, and by the silk-screen printing technique metal paste that silk-screen such as silver paste or copper are starched in blind hole, then make metal paste solid
Change and forms metallic heat dissipating part 131；Wherein, as shown in figure 16, the outer surface phase of metallic heat dissipating part 131 and surface copper foil layer 20 '
Concordantly；
S107: as shown in figure 17, the second main surface side using conducting adhesive piece 41 in insulating substrate 10 bonds cover heating
The graphene cooling fin 40 of pipe 30 and insulating substrate 10；
S109: as shown in figure 18, pattern etch process is carried out to surface copper foil layer 20 ', to obtain conductive pattern 20；
S111: as shown in figure 19, solder mask 50 is formed in the upper surface of insulating substrate 10, the covering of 50 part of solder mask is conductive
Figure 20, and expose positive terminal pad 21, negative terminal pad 22 and metallic heat dissipating part 131.
It wherein, include: so that ultraviolet LED lamp bead 100 by the step S2 that ultraviolet LED lamp bead 100 is welded on circuit board
Positive electrode 101 and negative electrode 102 are welded to connect with positive terminal pad 21 and negative terminal pad 22 respectively, and make ultraviolet LED lamp bead 100
Heat sink 103 with metallic heat dissipating part 131 be welded to connect.
Heat pipe 30 is fixed on insulation while making insulating substrate 10 using heat pressing process by the preparation method of embodiment 3
In substrate 10, have the advantages that production process is simple, the fixation of at low cost and heat pipe 30 is reliable.
Composite radiating type circuit board, ultraviolet light curing mold group and preparation method thereof embodiment 4
Figure 20 is the structural schematic diagram of ultraviolet light curing mold group in embodiment 4 comprising UV LED chip 200, such as Figure 23
Shown in composite radiating type circuit board embodiment 4 and package lens 300；In conjunction with shown in Figure 20 and 23, embodiment 4 and embodiment 3
Structure difference be: there is covering metallic heat dissipating part 131 and to extend to insulation at the top of metallic heat dissipating part 131 in embodiment 4
The thermally conductive weld pad 23 of 10 upper surface of substrate, the upper surface flush of thermally conductive weld pad 23 and conductive pattern 20；UV LED chip 200
It is arranged on thermally conductive weld pad 23, and is electrically connected by gold thread 201 with positive terminal pad 21, passes through 22 electricity of gold thread 202 and negative terminal pad
Connection, package lens 300 encapsulate UV LED chip 200, gold thread 201 and gold thread 202 wherein.
Ultraviolet light curing mold group preparation method and the difference of embodiment 3 are in embodiment 4, make the step S1 of circuit board
Further include that following step S108 (please referring to Figure 21) is carried out after step S107: for example, by successively carry out electroless copper and
Copper plating process forms copper clad layers 120 ' in surface copper foil layer 20 ' and 131 surface of metallic heat dissipating part；As shown in figure 22, step
In S109, pattern etch process is carried out to surface copper foil layer 20 ' and copper clad layers 120 ', obtains including positive terminal pad 21 and cathode weldering
The conductive pattern 20 and thermally conductive weld pad 23 of disk 22.
Ultraviolet light curing mold group preparation method further includes that UV LED chip 200 is arranged onto circuit board in embodiment 4
The step S2 and 300 step S3 for forming package lens.Wherein, step S3 include: UV LED chip 100 is fixed to it is thermally conductive
Weld pad 23, and being electrically connected UV LED chip 100 with positive terminal pad 21 using gold thread 201, using gold thread 202 by ultraviolet LED core
Piece 100 is electrically connected with negative terminal pad 22.
It is readily appreciated that, in present invention other embodiments (not shown), composite radiating type circuit board can also include setting
Inner layer conductive route inside insulating substrate 10.In addition, though being not shown in the figure, but conductive pattern 20 can also include exposing
In solder mask 50 and for connecting the conductive terminal of outer lead.
Although depicting the present invention above by preferred embodiment, but it is to be understood that, those of ordinary skill in the art
It is not departing from invention scope of the invention, it is all according to being improved on an equal basis made by the present invention, it should be protection scope of the present invention institute
Cover.
Claims (10)
1. a kind of composite radiating type circuit board, including insulating substrate and the conductive pattern for being formed in the insulating substrate upper surface；
It is characterized by: being provided with the heat pipe for being exposed to its lower surface in the insulating substrate and exposing the heat dissipation metal on surface thereon
Body, the metallic heat dissipating part are connect with the heat pipe, and the lower surface flush of the heat pipe and the insulating substrate；It is described exhausted
The lower face side of edge substrate and the heat pipe is provided with graphene cooling fin, and the insulating substrate and the graphene cooling fin
Between and the heat pipe and the graphene cooling fin between pass through conducting adhesive piece bonding connection.
2. composite radiating type circuit board as described in claim 1, it is characterised in that: the metallic heat dissipating part and the conductive pattern
The upper surface flush of shape.
3. composite radiating type circuit board as described in claim 1, it is characterised in that: the top of the metallic heat dissipating part, which has, to be covered
It covers the metallic heat dissipating part and extends to the thermally conductive weld pad of the insulating substrate upper surface, the thermally conductive weld pad and the conductive pattern
The upper surface flush of shape.
4. composite radiating type circuit board as described in claim 1, it is characterised in that: the insulating substrate includes multilayer insulation plate
Material, by binding material bonding connection between the multilayer insulation plate, and the heat pipe is adhered by the binding material and is fixed
In the insulating substrate.
5. composite radiating type circuit board as described in claim 1, it is characterised in that: the conductive pattern includes being arranged in pairs in
The positive terminal pad and negative terminal pad of the metallic heat dissipating part opposite sides.
6. composite radiating type circuit board as described in claim 1, it is characterised in that: be provided with multiple gold on the heat pipe
Belong to radiator, the conductive pattern includes the positive terminal pad and cathode for being arranged in pairs in each metallic heat dissipating part opposite sides
Pad.
7. a kind of ultraviolet light curing mold group, it is characterised in that including composite radiating type electricity such as claimed in any one of claims 1 to 6
Road plate and the ultraviolet LED luminescent device being arranged on the composite radiating type circuit board；Wherein, the ultraviolet LED luminescent device
It is thermally connected with the metallic heat dissipating part, and is electrically connected with the conductive pattern.
8. a kind of method for preparing ultraviolet light curing mold group, include the steps that making circuit board S1 and by ultraviolet LED photophore
Part is arranged to the step S2 on the circuit board；It is characterized in that, the step S1 includes:
S101: heat pipe is provided, and prepares metallic heat dissipating part on the heat pipe；
S103: provide insulating substrate laminated body, the insulating substrate laminated body include the multilayer insulation plate stacked from bottom to top,
Semi-solid preparation bonding sheet between the multilayer insulation plate is set and is formed in the surface copper of top layer's insulating sheet material upper surface
Layers of foil, and the insulating substrate laminated body has the step through-hole for accommodating the heat pipe and the metallic heat dissipating part；
S105: insulating substrate laminated body described in hot pressing and the insulating substrate for obtaining embedding the heat pipe and the metallic heat dissipating part,
And the upper and lower surfaces of the insulating substrate are ground；Wherein, the upper table of the metallic heat dissipating part and the surface copper foil layer
The lower surface flush of face flush, the heat pipe and the insulating substrate；
S107: graphene cooling fin is bonded in the lower face side of the heat pipe and the insulating substrate using conducting adhesive piece；
S109: pattern etch process is carried out to the surface copper foil layer, obtains conductive pattern；
Wherein, the step S2 include: so that the ultraviolet LED luminescent device and the metallic heat dissipating part are formed is thermally connected, and
It is electrically connected with conductive pattern formation.
9. a kind of method for preparing ultraviolet light curing mold group, include the steps that making circuit board S1 and by ultraviolet LED photophore
Part is arranged to the step S2 on the circuit board；It is characterized in that, the step S1 includes:
S101: heat pipe is provided；
S103: the heat pipe is embedded in insulating substrate；Wherein, the insulating substrate has the first main surface being oppositely arranged
With the second main surface, the first main surface of the insulating substrate has surface copper foil layer, and one of surface of the heat pipe is revealed
For the second main surface of the insulating substrate, and the second main surface phase of the exposed surface of the heat pipe and the insulating substrate
Concordantly；
S105: being drilled with from the first main surface side of the insulating substrate so that the blind hole that the heat pipe exposes, and passes through screen printing
Dataller's skill prints metal paste in the blind hole internal thread, and the metal paste is then made to be solidified to form metallic heat dissipating part；Wherein,
The outer surface flush of the metallic heat dissipating part and the surface copper foil layer；
S107: the second main surface side bonding using conducting adhesive piece in the insulating substrate covers the heat pipe and the insulation
The graphene cooling fin of substrate；
S109: pattern etch process is carried out to the surface copper foil layer, obtains conductive pattern；
Wherein, the step S2 include: so that the ultraviolet LED luminescent device and the metallic heat dissipating part are formed is thermally connected, and
It is electrically connected with conductive pattern formation.
10. preparing the method for ultraviolet light curing mold group as described in claim 8 or 9, it is characterised in that further include: in step S105
Later and before step S109, in the step of forming copper clad layers on the surface copper foil layer and the metallic heat dissipating part；Step
In S109, pattern etch process is carried out to the surface copper foil layer and the copper clad layers, obtains conductive pattern and thermally conductive weld pad, institute
Thermally conductive weld pad is stated to cover the metallic heat dissipating part and extend to the surface of the insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910140593.4A CN109714885A (en) | 2019-02-26 | 2019-02-26 | Composite radiating type circuit board, ultraviolet light curing mold group and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910140593.4A CN109714885A (en) | 2019-02-26 | 2019-02-26 | Composite radiating type circuit board, ultraviolet light curing mold group and preparation method thereof |
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|---|---|
| CN109714885A true CN109714885A (en) | 2019-05-03 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113260137A (en) * | 2021-05-12 | 2021-08-13 | 苏州悉智科技有限公司 | Printed circuit board, circuit board assembly and power supply device |
-
2019
- 2019-02-26 CN CN201910140593.4A patent/CN109714885A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113260137A (en) * | 2021-05-12 | 2021-08-13 | 苏州悉智科技有限公司 | Printed circuit board, circuit board assembly and power supply device |
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