CN109728155A - Circuit board, ultraviolet LED curing light source and the method for preparing circuit board - Google Patents
Circuit board, ultraviolet LED curing light source and the method for preparing circuit board Download PDFInfo
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- CN109728155A CN109728155A CN201910010554.2A CN201910010554A CN109728155A CN 109728155 A CN109728155 A CN 109728155A CN 201910010554 A CN201910010554 A CN 201910010554A CN 109728155 A CN109728155 A CN 109728155A
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- metal layer
- circuit board
- heat pipe
- insulating substrate
- layer
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 147
- 239000002184 metal Substances 0.000 claims abstract description 147
- 239000000758 substrate Substances 0.000 claims abstract description 101
- 239000000463 material Substances 0.000 claims abstract description 22
- 238000007731 hot pressing Methods 0.000 claims abstract description 13
- 230000003647 oxidation Effects 0.000 claims description 24
- 238000007254 oxidation reaction Methods 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 abstract description 34
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 239000007787 solid Substances 0.000 abstract description 2
- 238000001723 curing Methods 0.000 description 21
- 239000011324 bead Substances 0.000 description 18
- 238000010586 diagram Methods 0.000 description 18
- 238000001816 cooling Methods 0.000 description 6
- 238000013007 heat curing Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000001351 cycling effect Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000004837 Ultraviolet (UV) light curing adhesive Substances 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Structure Of Printed Boards (AREA)
Abstract
The present invention provides a kind of circuit board, ultraviolet LED curing light source and the methods for preparing circuit board；The circuit board includes: insulating substrate；Heat pipe is arranged in insulating substrate, and runs through insulating substrate on the thickness direction of insulating substrate；Patterned metal layer comprising be formed in the thermal land of heat pipe upper surface at least partially, and at least part of the patterned metal layer is extended to the upper surface of heat pipe by the upper surface of insulating substrate；Heat radiating metallic layer covers the lower surface of heat pipe, and the lower surface of insulating substrate is extended to from the lower surface of heat pipe；Ultraviolet LED curing light source includes the circuit board and the hot linked ultraviolet LED luminescent device of thermal land with the circuit board.Circuit board and ultraviolet LED curing light source have excellent heat dissipation performance, long service life and thermal stability and of good reliability.The present invention by hot pressing there is the method for semi-solid preparation binding material piece heat pipe to be fixed in insulating substrate, at low cost and fixed reliable.
Description
Technical field
The present invention relates to a kind of circuit boards and preparation method thereof using embedded heat pipe heat radiation, further relate to include the circuit board
Ultraviolet LED curing light source.
Background technique
UV uv equipment using ultraviolet light (usually 200-450nm) irradiating ultraviolet light curing materials (such as glue or
Ink) so that it is generated polymerization reaction to solidify, there is very extensive application in industries such as printing, coatings.Traditional UV light
For curing apparatus using UV mercury lamp as light source, power consumption is big, and needs to configure exhaust apparatus because UV mercury lamp generates ozone, causes to set
Standby overall operation is at high cost.Since LED (light emitting diode) has low power consumption, long-life, miniaturization, lightweight and is free of mercury
The advantages that ingredient, in recent years, ultraviolet LED curing light source, have substituted the use of UV mercury lamp on UV uv equipment more and more.
Ultraviolet LED curing light source typically comprises the ultraviolet LED luminescent device (example of circuit board and installation on the board
Such as ultraviolet LED lamp bead or chip), ultraviolet LED luminescent device can distribute amount of heat during the work time, and this requires the circuits
There is plate excellent heat dissipation performance to avoid ultraviolet LED from sending out to improve the working performance and service life of ultraviolet LED luminescent device
Optical device occurs " dead lamp " phenomenon because of overheat.
It, can be embedding in the insulating substrate of the circuit board as the common measures taken for improving organic material heat dissipation for circuit board performance
Enter the heat-conducting metal of such as aluminium or copper.Urgently it is expected that ultraviolet LED is solid but with the fast development of UV-curing technology, in industry
Changing light source has stronger exposure intensity, and heat-conducting metal is embedded in insulating substrate and has been difficult to meet well industry to circuit board
The requirement of heat dissipation performance.
Summary of the invention
The first object of the present invention is to provide a kind of circuit board with excellent heat dissipation property.
It is a further object of the present invention to provide a kind of ultraviolet LED curing light sources including foregoing circuit plate.
Another object of the present invention is to provide a kind of method for preparing foregoing circuit plate at low cost.
In order to realize the first above-mentioned purpose, one aspect of the present invention provides a kind of circuit board comprising insulation base
Plate, and:
Heat pipe is arranged in insulating substrate, and runs through insulating substrate on the thickness direction of insulating substrate；
Patterned metal layer comprising be formed in the thermal land of heat pipe upper surface at least partially；Wherein, patterned gold
At least part for belonging to layer is extended to the upper surface of heat pipe by the upper surface of insulating substrate；
Heat radiating metallic layer covers the lower surface of heat pipe, and the lower surface of insulating substrate is extended to from the lower surface of heat pipe.
Such as the thermal coefficient of the heat-conducting metal of aluminium and copper can only achieve 102The order of magnitude of W/ (mK), and heat pipe is led
Hot coefficient is up to 105The order of magnitude of W/ (mK), significantly larger than heat-conducting metal.In the present invention, it is embedded in insulating substrate in thickness
Degree side extends upward through the heat pipe of insulating substrate, and heat caused by heating device is conducted by thermal land to heat pipe, and heat pipe is again
Heat is quickly transferred to heat radiating metallic layer, so that circuit board has excellent heat dissipation performance.
In the present invention, at least part of patterned metal layer is extended to the upper table of heat pipe by the upper surface of insulating substrate
Face, heat radiating metallic layer extend to the lower surface of insulating substrate from the lower surface of heat pipe, so that heat pipe is securely fixed in insulation
In substrate, heat pipe is not easy to be detached from out of insulating substrate due to cold cycling, so that circuit board has splendid thermal stability and can
By property, long service life.
A kind of specific embodiment according to the present invention, heat pipe are aluminothermy pipe or copper heat pipe；Thermal land is by the upper of heat pipe
Surface extends to the upper surface of insulating substrate, and the conductive pattern in patterned metal layer is then made only in the upper table of insulating substrate
Face.
Preferably, patterned metal layer includes the first metal layer for being formed in insulating substrate upper surface, the first metal of connection
The second metal layer of layer and heat pipe；Heat radiating metallic layer includes the third metal layer for being formed in insulating substrate lower surface, connection third
4th metal layer of metal layer and heat pipe.
Another specific embodiment according to the present invention, heat pipe is aluminothermy pipe, and the aluminothermy pipe has surface disposed thereon
At least one layer first connect metal layer and positioned at its lower surface at least one layer second connection metal layer.Wherein, first connects
Metal layer is connect for enhancing the binding force between patterned metal layer and heat pipe, the second connection metal layer is for enhancing heat radiating metal
Binding force between layer and heat pipe.
Another specific embodiment according to the present invention, heat pipe are aluminothermy pipe；The aluminothermy pipe has surface disposed thereon
First anode oxidation insulating layer and second plate oxidation insulating layer positioned at its lower surface.The setting of anodic oxide coating on the one hand can
To improve the proof voltage energy of circuit board, on the other hand make the conductive pattern (such as conductive welding disk) in patterned metal layer can
To be formed in aluminothermy pipe upper surface, convenient for the miniaturization of circuit board.
Preferably, which further includes that at least one layer first being formed on first anode oxidation insulating layer connects metal
Layer and at least one layer second being formed on second plate oxidation insulating layer connect metal layer.First connection metal layer is for enhancing
Binding force between patterned metal layer and heat pipe, the second connection metal layer are used to enhance the knot between heat radiating metallic layer and heat pipe
With joint efforts.
As a kind of more preferable embodiment of the invention, patterned metal layer further includes being arranged in pairs in thermal land phase
The upper surface of aluminothermy pipe is formed in at least part of the conductive welding disk of two sides, and conductive welding disk.In the preferred embodiment
In, positive terminal pad and negative terminal pad, equally can be by heats caused by heating device other than being used to be electrically connected heating device
Conduction further increases the radiating efficiency of circuit board to heat pipe；On the other hand, positive terminal pad and negative terminal pad are arranged in heat pipe
On, it may additionally facilitate the miniaturization for realizing circuit board.
As another more preferable embodiment of the invention, patterned metal layer includes being formed in insulating substrate upper surface
The second metal layer of the first metal layer, connection the first metal layer and the first connection metal layer；Heat radiating metallic layer includes being formed in absolutely
The third metal layer of edge base lower surface, the 4th metal layer for connecting third metal layer and the second connection metal layer.
Yet another embodiment according to the present invention, insulating substrate include at least two layers of insulating medium layer, adjacent insulation
Pass through sticky material bonding connection between dielectric layer；Heat pipe adhesion is also fixed in insulating substrate by the sticky material.
In order to realize above-mentioned another object, another aspect provides a kind of ultraviolet LED curing light source, packets
Include above-mentioned any one circuit board and ultraviolet LED luminescent device, the thermal land of the ultraviolet LED luminescent device and the circuit board
It is thermally connected.
In order to realize that above-mentioned a further object, another aspect of the invention provide a kind of method for preparing circuit board,
Include the following steps:
S11: heat pipe being placed into the through hole of stacking insulating substrate, and stacking insulating substrate is situated between including at least two layers insulation
Matter layer and the sticky material piece for being arranged between insulating medium layer and being in semi-cured state；
S13: hot-pressing processing is carried out to stacking insulating substrate, heat pipe is made to be fixed to insulating substrate；
S15: metal layer is formed in the upper and lower surfaces of circuit board；Wherein, the metal layer of circuit board lower surface covers heat pipe
Lower surface, and extend to from the lower surface of heat pipe the lower surface of insulating substrate；
S17: being patterned etching to the metal layer of circuit board upper surface, obtain include thermal land pattern metal
Layer；Wherein, at least part of thermal land is formed in the upper surface of heat pipe, and at least part of patterned metal layer is by exhausted
The upper surface of edge substrate extends to the upper surface of heat pipe.
In preparation method of the invention, heat is realized while preparing insulating substrate using thermo-compression lamination insulating substrate technique
Fixation of the pipe in insulating substrate, heat pipe are fixed reliable, simple process and at low cost.Also, at least the one of patterned metal layer
Part is extended to the upper surface of heat pipe by the upper surface of insulating substrate, and heat radiating metallic layer extends to insulation base from the lower surface of heat pipe
The lower surface of plate, so that heat pipe is securely fixed in insulating substrate, heat pipe is not easy due to cold cycling out of insulating substrate
It is detached from, so that circuit board has splendid thermal stability and reliability, long service life.
A kind of specific embodiment according to the present invention, in step S11, the upper surface of insulating substrate has the first metal
The lower surface of layer, insulating substrate has third metal layer；In step S15, is formed in the upper surface of circuit board and cover and connect the
The second metal layer of one metal layer and heat pipe forms in the lower surface of circuit board and covers and connect the of third metal layer and heat pipe
Four belong to layer.
Preferably, heat pipe is aluminothermy pipe, and aluminothermy pipe has the first anode oxidation insulating layer on surface disposed thereon and is located at
The second plate oxidation insulating layer of its lower surface；It is highly preferred that patterned metal layer further includes being arranged in pairs in thermal land phase
The upper surface of aluminothermy pipe is formed in at least part of the conductive welding disk of two sides, and conductive welding disk.
In order to illustrate more clearly of the object, technical solutions and advantages of the present invention, with reference to the accompanying drawing and specific embodiment party
The present invention is described in further detail for formula.
It should be noted that different piece in attached drawing may not be with phase in order to clearly illustrate structure to be expressed
Describe in proportion, therefore, unless explicitly stated otherwise, otherwise content expressed by attached drawing is not constituted to the size of each part, ratio pass
The limitation of system.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of circuit board embodiment 1 of the present invention；
Fig. 2 is to show the structure that heat pipe is placed into stacking insulating substrate through hole in 1 preparation method of circuit board embodiment
It is intended to；
Fig. 3 be in 1 preparation method of circuit board embodiment hot pressing and grinding insulating substrate after structural schematic diagram；
Fig. 4 is the structural representation in 1 preparation method of circuit board embodiment on circuit boards, after lower surface covering metal layer
Figure；
Fig. 5 is that surface etches the knot after forming patterned metal layer on circuit boards in 1 preparation method of circuit board embodiment
Structure schematic diagram；
Fig. 6 is the structural schematic diagram of ultraviolet LED curing light source embodiment 1 of the present invention；
Fig. 7 is the structural schematic diagram of circuit board embodiment 2 of the present invention；
Fig. 8 is the structural schematic diagram of ultraviolet LED curing light source embodiment 2 of the present invention；
Fig. 9 is the structural schematic diagram of circuit board embodiment 3 of the present invention；
Figure 10 is to show the structure that heat pipe is placed into stacking insulating substrate through hole in 3 preparation method of circuit board embodiment
It is intended to；
Figure 11 be in 3 preparation method of circuit board embodiment hot pressing and grinding circuit board after structural schematic diagram；
Figure 12 is the structural representation in 3 preparation method of circuit board embodiment on circuit boards, after the metal plating layer of lower surface
Figure；
Figure 13 is that surface etches the knot after forming patterned metal layer on circuit boards in 3 preparation method of circuit board embodiment
Structure schematic diagram；
Figure 14 is the structural schematic diagram of ultraviolet LED curing light source embodiment 3 of the present invention；
Figure 15 is the structural schematic diagram of circuit board embodiment 4 of the present invention；
Figure 16 is the structural schematic diagram of circuit board embodiment 5 of the present invention；
Figure 17 is the structural schematic diagram of ultraviolet LED curing light source embodiment 5 of the present invention.
Specific embodiment
Circuit board, circuit board preparation method and ultraviolet LED curing light source embodiment 1
Referring to Fig. 1, circuit board embodiment 1 of the present invention includes insulating substrate 10 and the heat pipe 20 being arranged in insulating substrate 10
(it is aluminothermy pipe or copper heat pipe), heat pipe 20 runs through insulating substrate 10 on the thickness direction of insulating substrate 10；Insulating substrate 10
There is patterned metal layer 30 with the upper surface of heat pipe 20, solder mask 50 partly covers patterned metal layer 30 and exposes pattern
Change thermal land 31, positive terminal pad 321 and the negative terminal pad 322 in metal layer 30.Positive terminal pad 321 and negative terminal pad 322 are
Conductive welding disk, the two are arranged in pairs in the opposite sides of thermal land 31.Thermal land 31 is prolonged by the upper surface of insulating substrate 10
The upper surface for extending to heat pipe 20, the conducting wire including positive terminal pad 321 and negative terminal pad 322 are then made only in insulation base
The upper surface of plate 10.
The lower surface of insulating substrate 10 and heat pipe 20 has heat radiating metallic layer 40, following table of the heat radiating metallic layer 40 from heat pipe 20
Face extends to the lower surface of insulating substrate 10, and covers the lower surface of insulating substrate 10 and heat pipe 20.Heat in heat pipe 40 can
It is diffused to outside circuit board by heat radiating metallic layer 40 (such as circuit board connected radiator).
Insulating substrate 10 includes the insulating medium layer 11 of two layers of such as FR4 substrate, is passed through between two layers of insulating medium layer 11
Such as 12 bonding connection of heat cure sticky material of prepreg.Heat cure sticky material 12 has package 20 lateral surface of heat pipe
Sticky part 121, by heat pipe 20 adhesion be fixed in insulating substrate 10.Be readily appreciated that, the present invention it is (not shown) other
In embodiment, circuit board can also include the inner layer conductive route being arranged in inside insulating substrate 10；Insulating substrate 10 can wrap
Three layers or more of insulating medium layer 11 is included, can be bonded and be connected by heat cure sticky material 12 between adjacent insulating medium layer 11
It connects.
Hereinafter, the preparation method embodiment in conjunction with Fig. 1 to 5 pairs of circuit board embodiment 1 is illustrated.
Firstly, referring to Fig. 2, the preparation of circuit board embodiment 1 includes that heat pipe 20 is placed into running through for insulating substrate 10
Step in hole 112, insulating substrate 10 are in the state of stacking but non-hot pressing in the step comprising the insulation being stacked is situated between
Matter layer 11 and the sticky material 12 (such as prepreg) for being arranged between insulating medium layer 11 and being in semi-cured state.
The preparation of circuit board embodiment 1 further includes the steps that, to the progress hot pressing of insulating substrate 10, which to glue
Material 12 be cured reaction and insulating medium layer 11 of adhering, sticky material 12 also flow to through hole in hot pressing
Heat pipe 20 is fixed to by the space not occupied by heat pipe 20 in 112, the sticky material 121 flowed in through hole 112 after solidifying
Insulating substrate 10；After hot pressing, the upper and lower surfaces of grinding gained circuit board, flow to 20 surface of heat pipe with removal as needed
Sticky material and the surface smoothness for improving circuit board, obtained board structure of circuit are as shown in Figure 3.
As shown in figure 4, the preparation of circuit board embodiment 1 further includes the step in the upper and lower surfaces formation metal layer of circuit board
Suddenly；The step forms metal layer 30 in the upper surface of circuit board, forms metal layer 40 in the lower surface of circuit board.30 He of metal layer
Metal layer 40 can be formed for example by following technique: the upper and lower surfaces first with PVD process in circuit board form bottom copper
Layer is then formed in the layers of copper of bottom using electroplating technology and thickeies layers of copper, to obtain metal layer 30 and metal layer 40.
As shown in figure 5, the preparation of circuit board embodiment 1 further includes the steps that being patterned etching to metal layer 30.It should
Etching step forms the patterned metal layer 30 including thermal land 31, positive terminal pad 321 and negative terminal pad 322.Metal layer 40
Etching process can not then be made.
Referring again to Fig. 1, the preparation of circuit board embodiment 1 further includes making solder mask 50 in the upper surface of circuit board
Step.
Fig. 6 schematically describes the structure of ultraviolet LED curing light source embodiment 1.As shown in fig. 6, ultraviolet LED curing light source
Embodiment 1 includes circuit board embodiment 1 and ultraviolet LED lamp bead 100, heat sink 101 and thermal land 31 of ultraviolet LED lamp bead 100
It is thermally connected, the positive electrode 102 and negative electrode 103 of ultraviolet LED lamp bead 100 are electrically connected with positive terminal pad 321 and negative terminal pad 322 respectively
It connects.Generated heat is by heat sink 101 conduction to thermal land 31 when the work of ultraviolet LED lamp bead 100, and through heat pipe 20 and dissipates
Metal layer 40 and rapid cooling.
In the other embodiments of ultraviolet LED curing light source of the present invention, it can be arranged on thermal land 31 with its heat even
The UV LED chip connect, and UV LED chip will be electrically connected to positive terminal pad 321 and negative terminal pad 322 using gold thread, so
The package lens for forming encapsulation UV LED chip and gold thread on circuit boards afterwards, to form ultraviolet LED curing light source.
Circuit board, circuit board preparation method and ultraviolet LED photocuring mould group embodiment 2
Fig. 7 is the structural schematic diagram of circuit board embodiment 2, as shown in fig. 7, the difference of circuit board embodiment 2 and embodiment 1
Be: heat pipe 20 is aluminothermy pipe, and the upper surface of the aluminothermy pipe has first anode oxidation insulating layer 21, and lower surface has second
Anodic oxidation insulating layer 22；Thermal land 31 is arranged in the upper surface of heat pipe 20, positive terminal pad 321 and negative terminal pad 322 then by
The upper surface of insulating substrate 10 extends to the upper surface of heat pipe 20.
Wherein, first anode oxidation insulating layer 21 and second plate oxidation insulating layer 22 pass through the upper and lower table to aluminothermy pipe
Face carries out anodized and is formed, and thickness can be 10 microns to 50 microns, such as about 30 microns.In addition to need to be to heat
Pipe carries out outside anodized, and the preparation method of circuit board embodiment 2 is referred to the preparation side of foregoing circuit plate embodiment 1
Method carries out.
Fig. 8 is the structural schematic diagram of ultraviolet LED curing light source embodiment 2, as shown in figure 8, ultraviolet LED curing light source is implemented
Example 2 includes circuit board embodiment 2 and ultraviolet LED lamp bead 100, and heat sink the 101 of ultraviolet LED lamp bead 100 connect with 31 heat of thermal land
It connects, the positive electrode 102 and negative electrode 103 of ultraviolet LED lamp bead 100 are electrically connected with positive terminal pad 321 and negative terminal pad 322 respectively.
Generated heat is by heat sink 101 conduction to thermal land 31 when the work of ultraviolet LED lamp bead 100, and through heat pipe 20 and radiates
Metal layer 40 and rapid cooling；Meanwhile the heat when work of ultraviolet LED lamp bead 100, in positive terminal pad 321 and negative terminal pad 322
It can also heat pipe 20 and heat radiating metallic layer 40 and rapid cooling.
Circuit board, circuit board preparation method and ultraviolet LED photocuring mould group embodiment 3
Referring to Fig. 9, circuit board embodiment 3 of the present invention includes insulating substrate 10 and the heat pipe being arranged in insulating substrate 10
20, heat pipe 20 is copper heat pipe, and heat pipe 20 runs through insulating substrate 10 on the thickness direction of insulating substrate 10；The upper table of circuit board
Face has patterned metal layer 30, and patterned metal layer 30 includes the first metal layer 301 for being formed in 10 upper surface of insulating substrate
And the second metal layer 302 of connection the first metal layer 301 and heat pipe 20.
Solder mask 50 partly covers patterned metal layer 30 and exposes the thermal land 31 in patterned metal layer 30, just
Pole pad 321 and negative terminal pad 322.Positive terminal pad 321 and negative terminal pad 322 are conductive welding disk, and the two is arranged in pairs in thermally conductive
The opposite sides of pad 31.Thermal land 31 is extended to the upper surface of heat pipe 20, including anode by the upper surface of insulating substrate 10
Conducting wire including pad 321 and negative terminal pad 322 is then made only in the upper surface of insulating substrate 10.
The lower surface of circuit board has heat radiating metallic layer 40, and heat radiating metallic layer 40 includes being formed in insulating substrate lower surface
Third metal layer 41 and the 4th metal layer 42 for covering and connecting third metal layer 41 and heat pipe 20.Heat in heat pipe 40 can
It is diffused to outside circuit board by heat radiating metallic layer 40 (such as circuit board connected radiator).
Insulating substrate 10 includes the insulating medium layer 11 of two layers of such as FR4 substrate, is passed through between two layers of insulating medium layer 11
Such as 12 bonding connection of heat cure sticky material of prepreg.Heat cure sticky material 12 has package 20 lateral surface of heat pipe
Sticky part 121, by heat pipe 20 adhesion be fixed in insulating substrate 10.
Hereinafter, the preparation method in conjunction with Fig. 9 to 13 pairs of circuit board embodiment 3 is illustrated.
Firstly, referring to Figure 10, the preparation of circuit board embodiment 3 includes that heat pipe 20 is placed into running through for insulating substrate 10
Step in hole 112；Insulating substrate 10 is in the state of stacking but non-hot pressing in the step comprising the insulation being stacked is situated between
Matter layer 11 (such as FR4 substrate) and the 12 (example of sticky material for being arranged between insulating medium layer 11 and being in semi-cured state
Such as prepreg).And wherein, the upper surface of insulating substrate 10 is covered with the first metal layer 301 of such as layers of copper, and lower surface is covered with
Such as the third metal layer 41 of layers of copper.
The preparation of circuit board embodiment 3 further includes the steps that, to the progress hot pressing of insulating substrate 10, which to glue
Material 12 be cured reaction and insulating medium layer 11 of adhering, sticky material 12 also flow to through hole in hot pressing
Heat pipe 20 is fixed to by the space not occupied by heat pipe 20 in 112, the sticky material 121 flowed in through hole 112 after solidifying
Insulating substrate 10.
After hot pressing, the upper and lower surfaces of circuit board are ground as needed, flow to the viscous of 20 surface of heat pipe to remove
Material and improve the surface smoothness of circuit board, obtained board structure of circuit is as shown in figure 11.
As shown in figure 12, the preparation of circuit board embodiment 3 further includes the step in the upper and lower surfaces formation metal layer of circuit board
Suddenly；The step forms second metal layer 302 in the upper surface of circuit board, forms the 4th metal layer 42 in the lower surface of circuit board.
Second metal layer 302 and the 4th metal layer 42 can be formed for example by following technique: first with electroless copper plating technique in electricity
The upper and lower surfaces of road plate form bottom layers of copper, are then formed in the layers of copper of bottom using electroplating technology and thicken layers of copper, to obtain second
Metal layer 302 and the 4th metal layer 42.
As shown in figure 13, the preparation of circuit board embodiment 1 further include to the first metal layer 301 and second metal layer 302 into
The step of row patterned etch.The etching step forms the figure including thermal land 31, positive terminal pad 321 and negative terminal pad 322
Case metal layer 30.Third metal layer 41 and the 4th metal layer 42 can not then make etching process, and the two constitutes heat radiating metallic layer
40。
Referring again to Fig. 9, the preparation of circuit board embodiment 3 further includes making solder mask 50 in the upper surface of circuit board
Step.
Figure 14 schematically describes the structure of ultraviolet LED curing light source embodiment 3.As shown in figure 14, ultraviolet LED solidifies light
Source embodiment 3 includes circuit board embodiment 3 and ultraviolet LED lamp bead 100, and heat sink the 101 of ultraviolet LED lamp bead 100 and thermal land
31 are thermally connected, and the positive electrode 102 and negative electrode 103 of ultraviolet LED lamp bead 100 are electric with positive terminal pad 321 and negative terminal pad 322 respectively
Connection.Generated heat is conducted by heat sink 101 to thermal land 31 when the work of ultraviolet LED lamp bead 100, and through 20 He of heat pipe
Heat radiating metallic layer 40 and rapid cooling.
Circuit board and preparation method thereof embodiment 4
Figure 15 is the structural schematic diagram of circuit board embodiment 4, as shown in figure 15, the area of circuit board embodiment 4 and embodiment 3
Be not: heat pipe 20 is aluminothermy pipe, and the upper surface of the aluminothermy pipe has the first connection metal layer 221, and lower surface has second
Connect metal layer 222.Specifically, the first connection metal layer 221 and the second connection metal layer 222 are for example including nickel layer and covering nickel
The layers of copper or zinc layers of layer and the layers of copper of covering zinc layers (i.e. layers of copper is in outermost).First connection metal layer 221 and the second connection
The binding force of heat pipe 20 Yu second metal layer 302 and the 4th metal layer 42 can be enhanced in metal layer 222.
Wherein, the first connection metal layer 221 and the second connection metal layer 222 can be formed for example, by electroplating technology,
Thickness can be 5 microns to 30 microns, such as about 10 microns.In addition to the first connection metal layer need to be formed in heat pipe upper and lower surface
221 and second connect outside metal layer 222, and the preparation method of circuit board embodiment 2 is referred to the system of foregoing circuit plate embodiment 3
Preparation Method carries out.
Circuit board, circuit board preparation method and ultraviolet LED photocuring mould group embodiment 5
Figure 16 is the structural schematic diagram of circuit board embodiment 5, as shown in figure 16, the area of circuit board embodiment 5 and embodiment 4
Be not: the upper surface of aluminothermy pipe 20 has first anode oxidation insulating layer 211 and is formed in first anode oxidation insulating layer 211
On the first connection metal layer 221, the lower surface of aluminothermy pipe 20 has second plate oxidation insulating layer 212 and is formed in the second sun
The second connection metal layer 222 on pole oxidation insulating layer 212；The upper surface of heat pipe 20, positive terminal pad 321 is arranged in thermal land
The upper surface of heat pipe 20 is then extended to by the upper surface of insulating substrate 10 with negative terminal pad 322.
Wherein, first anode oxidation insulating layer 211 and second plate oxidation insulating layer 212 pass through to the upper and lower of aluminothermy pipe
Surface carries out anodized and is formed, and thickness can be 10 microns to 50 microns, such as about 30 microns.First connection
Metal layer 221 and the second connection metal layer 222 for example include the titanium layer of covering respective anode oxidation insulating layer, covering titanium layer
Layers of copper；First connection metal layer 221 and the second connection metal layer 222 can be formed for example, by PVD process, and thickness can be
5 microns to 30 microns, such as about 10 microns.
In addition to need to heat pipe upper and lower surface successively formed anodic oxidation insulating layer and connection metal layer other than, circuit board embodiment
The preparation method that 5 preparation method is equally referred to foregoing circuit plate embodiment 3 carries out.
Figure 17 is the structural schematic diagram of ultraviolet LED curing light source embodiment 5, and as shown in figure 17, ultraviolet LED curing light source is real
Applying example 5 includes circuit board embodiment 5 and ultraviolet LED lamp bead 100, and heat sink the 101 of ultraviolet LED lamp bead 100 are hot with thermal land 31
Connection, the positive electrode 102 and negative electrode 103 of ultraviolet LED lamp bead 100 are electrically connected with positive terminal pad 321 and negative terminal pad 322 respectively
It connects.Generated heat is by heat sink 101 conduction to thermal land 31 when the work of ultraviolet LED lamp bead 100, and through heat pipe 20 and dissipates
Metal layer 40 and rapid cooling；Meanwhile the heat in positive terminal pad 321 and negative terminal pad 322 can also heat pipe 20 and heat dissipation gold
Belong to layer 40 and rapid cooling.
Although depicting the present invention above by preferred embodiment, but it is to be understood that, those of ordinary skill in the art
It is not departing from invention scope of the invention, it is all according to being improved on an equal basis made by the present invention, it should be protection scope of the present invention institute
Cover.
Claims (10)
1. a kind of circuit board, including insulating substrate, it is characterised in that:
Heat pipe is arranged in the insulating substrate, and runs through the insulating substrate on the thickness direction of the insulating substrate；
Patterned metal layer comprising be formed in the thermal land of the heat pipe upper surface at least partially；Wherein, the pattern
At least part for changing metal layer is extended to the upper surface of the heat pipe by the upper surface of the insulating substrate；
Heat radiating metallic layer covers the lower surface of the heat pipe, and extends to the insulating substrate from the lower surface of the heat pipe
Lower surface.
2. circuit board as described in claim 1, it is characterised in that: the heat pipe is aluminothermy pipe or copper heat pipe；It is described thermally conductive
Pad is extended to the upper surface of the insulating substrate, the conductive pattern in the patterned metal layer by the upper surface of the heat pipe
Then it is made only in the upper surface of the insulating substrate.
3. circuit board as claimed in claim 2, it is characterised in that: the patterned metal layer includes being formed in the insulation base
The first metal layer of plate upper surface, the second metal layer for connecting the first metal layer and the heat pipe；The heat radiating metallic layer
Including being formed in the third metal layer of the insulating substrate lower surface, connecting the 4th gold medal of the third metal layer and the heat pipe
Belong to layer.
4. circuit board as described in claim 1, it is characterised in that: the heat pipe is aluminothermy pipe；The aluminothermy pipe has position
At least one layer first on surface connects metal layer thereon and at least one layer second positioned at its lower surface connects metal layer.
5. circuit board as described in claim 1, it is characterised in that: the heat pipe is aluminothermy pipe；The aluminothermy pipe has position
The first anode oxidation insulating layer on surface and the second plate oxidation insulating layer positioned at its lower surface thereon；Preferably, described
Aluminothermy pipe further includes that at least one layer first being formed on the first anode oxidation insulating layer connects metal layer and is formed in institute
At least one layer second stated on second plate oxidation insulating layer connects metal layer；Preferably, the patterned metal layer further includes
Be arranged in pairs in the conductive welding disk of the thermal land opposite sides, and at least part of the conductive welding disk be formed in it is described
The upper surface of aluminothermy pipe.
6. circuit board as described in claim 4 or 5, it is characterised in that: the patterned metal layer is described exhausted including being formed in
The first metal layer of edge upper surface of base plate, the second metal layer for connecting the first metal layer and the first connection metal layer；
The heat radiating metallic layer includes the third metal layer for being formed in the insulating substrate lower surface, the connection third metal layer and institute
State the 4th metal layer of the second connection metal layer.
7. circuit board as described in claim 1, it is characterised in that: the insulating substrate includes at least two layers of insulating medium layer,
Pass through sticky material bonding connection between adjacent insulating medium layer；Heat pipe adhesion is also fixed on described by the sticky material
In insulating substrate.
8. a kind of ultraviolet LED curing light source, it is characterised in that: including as described in any one of claims 1 to 7 circuit board and
Ultraviolet LED luminescent device, the ultraviolet LED luminescent device and the thermal land are thermally connected.
9. a kind of method for preparing circuit board, it is characterised in that include the following steps:
S11: heat pipe being placed into the through hole of stacking insulating substrate, and the stacking insulating substrate is situated between including at least two layers insulation
Matter layer and the sticky material piece for being arranged between insulating medium layer and being in semi-cured state；
S13: hot-pressing processing is carried out to the stacking insulating substrate, the heat pipe is made to be fixed to insulating substrate；
S15: metal layer is formed in the upper and lower surfaces of circuit board；Wherein, the metal layer of circuit board lower surface covers the heat pipe
Lower surface, and extend to from the lower surface of the heat pipe lower surface of the insulating substrate；
S17: being patterned etching to the metal layer of circuit board upper surface, obtain include thermal land patterned metal layer；
Wherein, at least part of the thermal land is formed in the upper surface of the heat pipe, and the patterned metal layer is at least
A part is extended to the upper surface of the heat pipe by the upper surface of the insulating substrate.
10. method as claimed in claim 9, it is characterised in that:
In step S11, the upper surface of the insulating substrate has the first metal layer, and the lower surface of the insulating substrate has third
Metal layer；
In step S15, the second gold medal for covering and connecting the first metal layer and the heat pipe is formed in the upper surface of circuit board
Belong to layer, forms the 4th metal layer for covering and connecting the third metal layer and the heat pipe in the lower surface of circuit board；
Preferably, the heat pipe be aluminothermy pipe, the aluminothermy pipe have surface disposed thereon first anode oxidation insulating layer and
Second plate oxidation insulating layer positioned at its lower surface；It is highly preferred that the patterned metal layer further includes being arranged in pairs in institute
The conductive welding disk of thermal land opposite sides is stated, and at least part of the conductive welding disk is formed in the upper table of the aluminothermy pipe
Face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910010554.2A CN109728155A (en) | 2019-01-07 | 2019-01-07 | Circuit board, ultraviolet LED curing light source and the method for preparing circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910010554.2A CN109728155A (en) | 2019-01-07 | 2019-01-07 | Circuit board, ultraviolet LED curing light source and the method for preparing circuit board |
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| CN201910010554.2A Pending CN109728155A (en) | 2019-01-07 | 2019-01-07 | Circuit board, ultraviolet LED curing light source and the method for preparing circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113224516A (en) * | 2020-02-04 | 2021-08-06 | 大唐移动通信设备有限公司 | Active antenna array |
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| WO2021155731A1 (en) * | 2020-02-04 | 2021-08-12 | 大唐移动通信设备有限公司 | Active antenna array |
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