CN107623986A - Cooling circuit board and the method for preparing cooling circuit board - Google Patents
Cooling circuit board and the method for preparing cooling circuit board Download PDFInfo
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- CN107623986A CN107623986A CN201710949408.7A CN201710949408A CN107623986A CN 107623986 A CN107623986 A CN 107623986A CN 201710949408 A CN201710949408 A CN 201710949408A CN 107623986 A CN107623986 A CN 107623986A
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Abstract
The invention provides a kind of cooling circuit board and the method for preparing cooling circuit board, in one embodiment, cooling circuit board includes：Substrate, there is the first metal layer for being formed thereon surface and form the second metal layer in its lower surface, the first metal layer is formed as conductive pattern layer；Radiator, set in a substrate and run through the substrate, the radiator includes metal body, forms the first thermally conductive insulating layer in metal body upper surface, the 3rd metal level formed in the first thermally conductive insulating layer, forms the 4th metal level of the second thermally conductive insulating layer and formation in the second thermally conductive insulating layer in metal body lower surface；The flush with outer surface of the first metal layer and the 3rd metal level is set, and the flush with outer surface of second metal layer and the 4th metal level is set.The cooling circuit board of the present invention not only has good proof voltage and heat dispersion concurrently, and cost is low, thermal reliability is good.
Description
Technical field
The present invention relates to a kind of cooling circuit board and the method for preparing cooling circuit board；It is in particular it relates to a kind of
It is inlaid with cooling circuit board of radiator and preparation method thereof.
Background technology
Semiconductor devices, such as LED（Light emitting diode）, IGCT, GTO（Gate level turn-off thyristor）、MOSFET（Electricity
Field of force effect transistor）、GTR（Power transistor）、IGBT（Igbt）With Power Diode Pumped etc., worked
Relatively large number of heat would generally be discharged in journey, to ensure its service behaviour and service life, it is desirable to carry such semiconductor device
The circuit board of part has good heat dispersion.
U.S. Patent application US 20090301765A1 disclose a kind of printed circuit board (PCB), and the circuit board has at least one
Through hole, heat dissipation element is provided with the through hole, heater members are arranged on the heat dissipation element, quickly to be dissipated by the heat dissipation element
Heat.Wherein, the heat dissipation element can be metal heat sink or ceramic heat-dissipating part.
Although this cooling circuit board has preferable heat dispersion, following defect be present：Metal heat sink can be notable
Reduce the proof voltage energy of circuit board；Ceramic heat-dissipating part then causes cost higher, it is not easy to it is subjected to, and ceramic heat-dissipating
Part is difficult to effectively be combined with circuit board, is easily come off after the cold cycling of fewer number from circuit board, causes its thermostabilization
Property is not good enough.
The content of the invention
In view of the shortcomings of the prior art, the main object of the present invention be to provide it is a kind of not only have concurrently good proof voltage and dissipate
Hot property, and cooling circuit board that cost is low, thermal reliability is good and preparation method thereof.
In order to realize above-mentioned main purpose, one aspect of the present invention provides a kind of cooling circuit board, and it includes：
Substrate, there is the first metal layer for being formed thereon surface and form the second metal layer in its lower surface；Wherein, first
Metal level is formed as the first conductive pattern layer；
Radiator, set in a substrate and run through the substrate；Wherein, radiator includes metal body, formed on metal body
First thermally conductive insulating layer on surface, the 3rd metal level formed in the first thermally conductive insulating layer, formed in metal body lower surface
The second thermally conductive insulating layer and form the 4th metal level in the second thermally conductive insulating layer；
Wherein, the flush with outer surface of the first metal layer and the 3rd metal level is set, the appearance of second metal layer and the 4th metal level
Face is concordantly set.
In above-mentioned technical proposal, second metal layer can be patterning or non-patterned metal level.Preferably, the second metal
Layer is formed as the second conductive pattern layer；Wherein, the second conductive pattern layer can electrically connect with the first conductive pattern layer.
In above-mentioned technical proposal, the 3rd metal level both can be the pattern metal that part covers the first thermally conductive insulating layer
Layer or the non-patterned metal level that the first thermally conductive insulating layer is completely covered.
In order to realize above-mentioned main purpose, another aspect provides a kind of cooling circuit board, and it includes：
Substrate, there is the second metal layer of the first metal layer for being formed thereon surface and formation in its lower surface；
Radiator, set in a substrate and run through the substrate；Wherein, radiator includes metal body, formed on metal body
First thermally conductive insulating layer on surface, the 3rd metal level formed in the first thermally conductive insulating layer, formed in metal body lower surface
The second thermally conductive insulating layer and form the 4th metal level in the second thermally conductive insulating layer；
Wherein, the upper surface of cooling circuit board is formed with fifth metal layer, fifth metal layer and the first metal layer and the 3rd metal
The outer surface of layer is connected；The lower surface of cooling circuit board formed with the 6th metal level, the 6th metal level and second metal layer and
The outer surface of 4th metal level is connected；
And wherein, the first metal layer, the 3rd metal level and fifth metal layer are collectively forming as the first conductive pattern layer.
According to a kind of embodiment of the present invention, second metal layer, the 4th metal level and the 6th common shape of metal level
Thermal diffusion disk into the second conductive pattern layer and with the second conductive pattern layer electric insulation；Wherein, the second conductive pattern layer is formed
In the lower surface of substrate, thermal diffusion disk is extended to the lower surface of substrate by the lower surface of radiator.
In the present invention, metal body is preferably aluminium, and the first thermally conductive insulating layer and the second thermally conductive insulating layer can pass through aluminium sun
Pole aoxidizes and formed.Wherein, the thickness of the first thermally conductive insulating layer and the second thermally conductive insulating layer can be controlled as 10 microns extremely
100 microns, preferably 20 microns to 70 microns, more preferably 25 microns to 50 microns.
In order to realize above-mentioned main purpose, another aspect of the invention provides a kind of method for preparing cooling circuit board,
Comprise the following steps：
There is provided substrate, the substrate have through substrate mounting hole, formed upper surface of base plate the first metal layer, formed in base
The second metal layer of plate lower surface and the semi-solid preparation insulating barrier between upper surface of base plate and lower surface；
Radiator is provided, the radiator includes the first thermally conductive insulating layer of metal body, formation in metal body upper surface, formation
The second thermally conductive insulating layer and formation of the 3rd metal level, formation in metal body lower surface in the first thermally conductive insulating layer
The 4th metal level in the second thermally conductive insulating layer；
Radiator is placed into the mounting hole of substrate；
Hot-press base plate and radiator so that the flush with outer surface of the first metal layer and the 3rd metal level set, second metal layer and
The flush with outer surface of 4th metal level is set.
According to a kind of embodiment of the present invention, in the above method, it is conductive that the first metal layer can be formed as first
Patterned layer.
Preferably, in the above method, second metal layer is formed as the second conductive pattern layer.
According to another embodiment of the present invention, after hot-press base plate and radiator, the first metal layer is carried out
Graphical treatment is to form the first conductive pattern layer.
Preferably, in the above method, processing is patterned to second metal layer to form the second conductive pattern layer.
According to the yet another embodiment of the present invention, after hot-press base plate and radiator, in the upper table of cooling circuit board
Face forms fifth metal layer, and fifth metal layer is connected with the outer surface of the first metal layer and the 3rd metal level；In radiating circuit
The lower surface of plate forms the 6th metal level, and the 6th metal level is connected with the outer surface of second metal layer and the 4th metal level；Its
In, processing is patterned to the first metal layer, the 3rd metal level and fifth metal layer and forms the first conductive pattern layer.
Preferably, in the above method, to second metal layer, the 4th metal level and the 6th metal level be patterned processing and
Form the second conductive pattern layer and the thermal diffusion disk with the second conductive pattern layer electric insulation；Wherein, the second conductive pattern layer shape
The lower surface of substrate is extended to by the lower surface of radiator into the lower surface of substrate, thermal diffusion disk.
In the above method, metal body is preferably aluminium, and the first thermally conductive insulating layer and the second thermally conductive insulating layer can pass through aluminium
Anodic oxidation and formed.In the present invention, " aluminium " includes metal simple-substance aluminium and aluminium alloy.
It should be noted that in the present invention, each metal level can be the metal level of single material or by a variety of
The complex metal layer that different metal lamination sets and formed.
In the present invention, radiator includes the first thermally conductive insulating layer of metal body, formation in metal body upper surface, formation
The second thermally conductive insulating layer and formation of the 3rd metal level, formation in metal body lower surface in the first thermally conductive insulating layer
The 4th metal level in the second thermally conductive insulating layer, it is such the advantages of be：First, the first thermally conductive insulating layer and the second heat conduction are exhausted
The setting of edge layer enables cooling circuit board to have good proof voltage；Secondly, radiator includes having good thermal conductivity energy
The metal body of power, not only excellent heat dissipation performance, and cost is low；Again, have between metal body and the solidification insulating barrier of substrate
There is good binding ability so that cooling circuit board has good heat endurance.
The present invention is described in further detail with reference to the accompanying drawings and detailed description.
Brief description of the drawings
Fig. 1 is the structural representation of cooling circuit board embodiment 1 of the present invention；
Fig. 2 is the structural representation using the heater members module embodiments of cooling circuit board embodiment 1 of the present invention；
Fig. 3 is the schematic diagram that substrate step is provided in the preparation method for represent cooling circuit board embodiment 1；
Fig. 4 is the schematic diagram for representing to provide radiator step in cooling circuit board preparation method of the present invention；
Fig. 5 is that radiator is placed into showing for step in substrate mounting holes in the preparation method for represent cooling circuit board embodiment 1
It is intended to；
Fig. 6 be cooling circuit board embodiment 1 preparation method in after heat-press step cooling circuit board structural representation；
Fig. 7 be cooling circuit board embodiment 1 preparation method in after grinding steps cooling circuit board structural representation；
Fig. 8 is the structural representation of cooling circuit board embodiment 2 of the present invention；
Fig. 9 is the structural representation using the heater members module embodiments of cooling circuit board embodiment 2 of the present invention；
Figure 10 is the schematic diagram that substrate step is provided in the preparation method for represent cooling circuit board embodiment 2；
Figure 11 is that radiator is placed into showing for step in substrate mounting holes in the preparation method for represent cooling circuit board embodiment 2
It is intended to；
Figure 12 be cooling circuit board embodiment 2 preparation method in after heat-press step cooling circuit board structural representation；
Figure 13 is to form cooling circuit board after fifth metal layer and the 6th metal level in the preparation method of cooling circuit board embodiment 1
Structural representation；
Figure 14 is the structural representation of cooling circuit board embodiment 3 of the present invention；
Figure 15 is the structural representation using the flip chip type heater members module embodiments of cooling circuit board embodiment 3 of the present invention；
Figure 16 is the structural representation of cooling circuit board embodiment 4 of the present invention；
Figure 17 is the structural representation of cooling circuit board embodiment 5 of the present invention.
Embodiment
Embodiment 1
Fig. 1 is the structural representation of cooling circuit board embodiment 1.As shown in figure 1, the cooling circuit board includes substrate 10 and set
In substrate 10 and through the radiator 20 of substrate 10, wherein：
It is exhausted that substrate 10 includes the first insulating substrate 111, the second insulating substrate 121 and the first insulating substrate 111 and second of connection
The solidification insulating barrier 13 of edge base material 121, solidification insulating barrier 13 are also bonding with the side of radiator 20.Wherein, the first insulation base
Surface of the material 111 away from solidification insulating barrier 13（The upper surface of substrate 10）With the first metal layer 112, the shape of the first metal layer 112
As including the first conductive pattern layer of positive terminal pad 113 and negative terminal pad 114.Second insulating substrate 121 is away from solidification insulation
The surface of layer 13（The lower surface of substrate 10）With second metal layer 122.The upper surface of cooling circuit board is formed with patterning
Solder mask 30.
Radiator 20 includes the first thermally conductive insulating layer 221 of metal body 21, formation in the upper surface of metal body 21, formation
The 3rd metal level 231 in the first thermally conductive insulating layer 221, form the second thermally conductive insulating layer in the lower surface of metal body 21
222 and form the 4th metal level 232 in the second thermally conductive insulating layer 222.Wherein, the metal of the first metal layer 112 and the 3rd
The thickness of layer 231 is substantially the same, and the flush with outer surface of the two is set（It is micro- that the difference in height of the two outer surface is preferably shorter than 50
Rice, more preferably less than 30 microns, it is still further preferred that less than 10 microns）；The thickness base of the metal level 232 of second metal layer 122 and the 4th
It is identical in sheet, and the flush with outer surface of the two is set.The thickness of first thermally conductive insulating layer 221 and the second thermally conductive insulating layer 222 is
About 35 microns.The cross section of radiator 20（Parallel to the section of circuit plate thickness direction）Can be circle, rectangle, ellipse
Etc. any regular shape, or any non-regular shape.
Fig. 2 is the structural representation of the heater members module of cooling circuit board in Application Example 1.As shown in Fig. 2 for example
LED heater members 40 are welded and fixed to the upper surface of radiator 20, and are electrically connected by gold thread 41 with positive terminal pad 113, lead to
Gold thread 42 is crossed to electrically connect with negative terminal pad 114.So, heater members 40 can by with its hot linked radiator 20 and quick
Radiating.
Although only showing that circuit board includes a radiator 20 in embodiment 1, the upper surface of radiator 20 only placed one
Individual heater members 40, it is understood that by selecting the radiator 20 of suitable dimension and/or for different types of heating element
Part, in other embodiments of the invention, multiple heater members, and each cooling circuit board can be placed on each radiator 20
There can be multiple radiators 20.
Illustrated below in conjunction with the preparation method of cooling circuit board in Fig. 3 to 7 pairs of embodiment 1.
As shown in figure 3, the step of preparation method of cooling circuit board includes providing substrate 10 in embodiment 1.In the step,
The second single-side coated copper plate 12, prepreg 13 ' and the first single-side coated copper plate 11 are stacked gradually on direction from lower to upper.Its
In, prepreg 13 ' has through hole 131；First single-side coated copper plate 11 includes the first insulating substrate 111, the first metal layer 112
With through hole 113, the first metal layer 112 is formed on the first surface of the insulating substrate 111 away from prepreg 13 ', and in advance
Be formed as pattern conductive line layer by etching process；Second single-side coated copper plate 12 includes the second insulating substrate 121, second
Metal level 122 and through hole 123, second metal layer 122 are formed on the second surface of the insulating substrate 121 away from prepreg 13 '
On；The aperture of through hole 131 is more than the aperture of through hole 113 and 123, and the axial centre of three is mutually aligned setting, with shape
Into the mounting hole through substrate 10.In the present invention, the type of copper-clad plate can not be restricted, can be such as FR-4 copper-clad plates
Or the various copper-clad plates such as BT resin base copper-clad plates.
As shown in figure 4, the step of preparation method of cooling circuit board includes providing radiator 20 in embodiment 1.The present invention
In, radiator 20 can be obtained by being cut to the heat sink 20 ' with large-size.Wherein, heat sink 20 ' can be with
It is prepared as follows：A metal body 21 is provided, metal body 21 can be aluminium sheet；Two-sided anode is carried out to metal body 21
Oxidation processes, to form the first thermally conductive insulating layer 221 in the upper surface of metal body 21, formed in the lower surface of metal body 21
Second thermally conductive insulating layer 222；The 3rd metal level 231 is formed on the surface of the first thermally conductive insulating layer 221, in the second thermally conductive insulating layer
222 surface forms the 4th metal level 232.Wherein, the 3rd metal level 231 and the 4th metal level 232 can be included in away from gold
Belong to the transition link layer sequentially formed on the direction of body 21（Such as with the titanium layer of PVD formation, layers of chrome etc.）, bottom layers of copper
（Such as formed with PVD）With thickening layers of copper（Such as formed with electroplating technology）.
With continued reference to Fig. 4, resulting radiator 20 includes metal body 21, formed in the upper table of metal body 21 after cutting
First thermally conductive insulating layer 221 in face, the 3rd metal level 231 formed in the first thermally conductive insulating layer 221, formed in metal body
Fourth metal level 232 of the second thermally conductive insulating layer 222 and formation of lower surface in the second thermally conductive insulating layer.Wherein it is possible to
Heat sink 20 ' is cut by the way of laser cutting or machine cuts.
As shown in figure 5, the preparation method of cooling circuit board includes the peace that radiator 20 is placed into substrate 10 in embodiment 1
Fill the step in hole.As seen from Figure 5, in this step, the thickness of substrate 10 be more than radiator 20 height, and substrate 10 and dissipate
There is clearance G between hot body 20.
The preparation method of cooling circuit board also includes the step of hot-press base plate 10 and radiator 20 in embodiment 1.Hot pressing bag
Include and apply pressure on the upper and lower surface of substrate 10 and radiator 20, and it is heated simultaneously.In the case where heating pressurized conditions,
The thickness of substrate 10 reduces, until the flush with outer surface of the metal level 231 of the first metal layer 112 and the 3rd is set, second metal layer
122 and the 4th metal level 232 flush with outer surface set.Meanwhile hot-press base plate 10 causes prepreg 13 ' in the first insulation base
The two solidification insulating barrier 13 being fixedly connected is formed such that between the insulating substrate 121 of material 111 and second, and in prepreg 13 '
Resin flowed in hot pressing and fill the clearance G between substrate 10 and radiator 20 so that substrate 10 and radiator 20
Between form a fixed connection.
As shown in fig. 6, after hot pressing, the resin in prepreg 13 ' may flow to substrate 10 and radiator 20
Upper and lower surface.Correspondingly, the preparation method of cooling circuit board also includes removing the upper and lower surface tree of cooling circuit board in embodiment 1
The step of fat.In embodiment 1, simultaneously or successively the upper and lower surface of cooling circuit board is ground, substrate is flowed to remove
10 and the resin 132 on the surface of circuit board 20, obtain circuit board as shown in Figure 7.In other embodiments, solidified resin 132 can
To pass through other method（Such as chemistry removing glue method）Remove.It is readily appreciated that, if controlled in heat-press step in prepreg 13 '
Resin portion or fill clearance G just, then in embodiment 1 preparation method of cooling circuit board include remove radiating circuit
The step of plate upper and lower surface resin.
Referring again to Fig. 1, the preparation method of cooling circuit board is additionally included in the upper surface formation resistance of circuit board in embodiment 1
The step of layer 30.Wherein, the area of positive terminal pad 113 and negative terminal pad 114 in corresponding to the first metal layer 112 of solder mask 30
Domain windowing is set.In the case of the resin portion filling clearance G in prepreg 13 ' is controlled in heat-press step, solder mask 30
The clearance G filled not in heat-press step by resin can be filled well.
In method described above, the first metal layer 112 is to be formed as the first conductive pattern before substrate 10 is provided
Pattern layer.It is readily appreciated that, can not be to the first metal layer before the step of substrate 10 is provided in the other method of the present invention
112 are etched patterned process, but after the step of removing cooling circuit board upper and lower surface resin 132 or heat-press step
Afterwards, formed before the step of solder mask 30, the first metal layer 112 is etched, so as to form the first conductive pattern layer.
In addition, in other cooling circuit board embodiments of the present invention, it is conductive that second metal layer 122 can be formed as second
Patterned layer；Correspondingly, the preparation method of the cooling circuit board also includes being etched and formation figure second metal layer 122
The step of case conducting wire.
Embodiment 2
Fig. 8 is the structural representation of cooling circuit board embodiment 2.With reference to shown in Fig. 4 and Fig. 8, the cooling circuit board includes substrate
100 and it is arranged in substrate 100 and through the radiator 20 of substrate 100, wherein：
Substrate 100 includes the first insulating substrate 1101, the second insulating substrate 1201 and the first insulating substrate 1101 of connection and the
The solidification insulating barrier 130 of two insulating substrates 1201, solidification insulating barrier 130 are also bonding with the side of radiator 20.Wherein, first
Surface of the insulating substrate 1101 away from solidification insulating barrier 130（The upper surface of substrate 100）With the first metal layer 1102.Second is exhausted
Surface of the edge base material 1201 away from solidification insulating barrier 130（The lower surface of substrate 100）With second metal layer 1202.
Radiator 20 includes the first thermally conductive insulating layer 221 of metal body 21, formation in the upper surface of metal body 21, formation
The 3rd metal level 231 in the first thermally conductive insulating layer 221, form the second thermally conductive insulating layer in the lower surface of metal body 21
222 and form the 4th metal level 232 in the second thermally conductive insulating layer 222.Wherein, the gold medal of the first metal layer 1102 and the 3rd
The thickness of category layer 231 is substantially the same, and the flush with outer surface of the two is set；The metal level 232 of second metal layer 1202 and the 4th
Thickness it is substantially the same, and the two flush with outer surface set.First thermally conductive insulating layer 221 and the second thermally conductive insulating layer 222
Thickness be about 35 microns.
The upper surface of cooling circuit board is formed with fifth metal layer 1401, fifth metal layer 1401 and the first metal layer 1102
It is connected with the outer surface of the 3rd metal level 231；The lower surface of cooling circuit board is formed with the 6th metal level 1402, the 6th metal
Layer 1402 is connected with the outer surface of the metal level 232 of second metal layer 1202 and the 4th.Wherein, the first metal layer the 1102, the 3rd
It is the first conductive pattern for including positive terminal pad 1501 and negative terminal pad 1502 that metal level 231 and fifth metal layer 1401, which are collectively forming,
Pattern layer and thermal land 1503.Wherein, thermal land 1503 is formed in the upper surface of radiator 20, positive terminal pad 1501 and negative
Pole pad 1502 is formed on the substrate 100.
6th metal level 1402 is without graphical treatment and the lower surface of cooling circuit board is completely covered, due to the 6th metal
Layer 1402 has the surface areas more than the 4th metal level 232, therefore heat is after radiator 20 is transferred to the 6th metal level 1402,
It can distribute to outside circuit board, reach than cooling circuit board more preferably radiating effect in embodiment 1 more quickly.
Fig. 9 is the structural representation using the heater members module embodiments of cooling circuit board embodiment 2.Referring to Fig. 9, example
Heater members 40 such as LED are welded and fixed to thermal land 1503, and are electrically connected by gold thread 41 with positive terminal pad 1501, pass through
Gold thread 42 electrically connects with negative terminal pad 1502.So, heater members 40 can by with its hot linked radiator 20 and quick
Radiating.
The preparation method entered below with reference to cooling circuit board in Figure 10 to 13 pairs of embodiment 2 illustrates.
As shown in Figure 10, the step of preparation method of cooling circuit board includes providing substrate 100 in embodiment 2.The step
In, the second single-side coated copper plate 120, prepreg 130 ' and the first single-side coated copper plate 110 are stacked gradually from lower to upper.Wherein, half
Cured sheets 130 ' have through hole 1301；First single-side coated copper plate 110 includes the first insulating substrate 1101, the first metal layer 1102
With through hole 1103, the first metal layer 1102 is formed on the first surface of the insulating substrate 1101 away from prepreg 130 '；The
Two single-side coated copper plates 120 include the second insulating substrate 1201, second metal layer 1202 and through hole 1203, and second metal layer
1202 form on the second surface of the insulating substrate 1201 away from prepreg 130 '；The aperture of through hole 1301 is more than through hole
1103 and 1203 aperture, and the axial centre of three is mutually aligned setting, to form the mounting hole through substrate 100.
The step of preparation method of cooling circuit board includes providing radiator 20 in embodiment 2.The step can be found in above-mentioned
To the detailed description of the offer step of radiator 20 in embodiment 1, will not be repeated here.
As shown in figure 11, the preparation method of cooling circuit board includes radiator 20 being placed into substrate 100 in embodiment 2
Step in mounting hole.As seen from Figure 5, in this step, the thickness of substrate 100 is more than the height of radiator 20, and substrate 100
There is gap between radiator 20.
The preparation method of cooling circuit board includes the step of hot-press base plate 100 and radiator 20 in embodiment 2.Such as Figure 12 institutes
Show, after hot pressing, the resin in prepreg 130 ' may flow to the upper and lower surface of substrate 100 and radiator 20.Accordingly
Ground, the step of preparation method of cooling circuit board also includes removing upper and lower surface resin 1302 of cooling circuit board in embodiment 2.
It is readily appreciated that, if controlling the resin in prepreg 130 ' to fill clearance G just in heat-press step, is dissipated in embodiment 2
The step of preparation method of heater circuit plate does not include removing cooling circuit board upper and lower surface resin.Hot pressing and removal in embodiment 2
The upper and lower step of surface resin 1302 of cooling circuit board can be found in the detailed description in above-described embodiment 1, will not be repeated here.
As shown in figure 13, the preparation method of cooling circuit board is included in the upper surface of cooling circuit board and formed in embodiment 2
Fifth metal layer 1401, cooling circuit board lower surface formed the 6th metal level 1402 the step of.Wherein, fifth metal layer
The upper surface of 1401 covering boards is simultaneously connected with the outer surface of the metal level 231 of the first metal layer 1102 and the 3rd；6th gold medal
Belong to the lower surface of the covering board of layer 1402 and be connected with the outer surface of the metal level 232 of second metal layer 1202 and the 4th.Its
In, the metal level 1402 of fifth metal layer 1401 and the 6th can be formed by the following method：First, using electroless copper plating method in electricity
The surface of road plate forms bottom layers of copper；Then, formed by galvanoplastic in the layers of copper of bottom and thicken layers of copper, it is thick so as to reach predetermined copper.
Review Fig. 8, the preparation method of cooling circuit board includes etching the first metal layer 1102, the 3rd metal in embodiment 2
The step of layer 231 and fifth metal layer 1401, include positive terminal pad 1501 so as to be formed in the upper surface of cooling circuit board and bear
The first conductive pattern layer and thermal land 1503 of pole pad 1502.Wherein, thermal land forms the upper table in radiator 20
Face, positive terminal pad 1501 and negative terminal pad 1502 are formed on the substrate 100.It is readily appreciated that, positive terminal pad 1501, negative terminal pad
1502 and the position of thermal land 1503 can flexibly set, only need to be formed between thermal land 1503 and radiator 20
Good thermal conductive contact；For example, positive terminal pad 1501 and negative terminal pad 1502 can be extended to by the upper surface of substrate 100 it is scattered
The hot upper surface of body 20, thermal land 1503 can completely or partially cover the upper surface of radiator 20.
With continued reference to Fig. 8, the preparation method of cooling circuit board is included in the upper surface formation welding resistance of circuit board in embodiment 2
The step of layer 160.Wherein, solder mask 160 is in the area corresponding to positive terminal pad 1501, negative terminal pad 1502 and thermal land 1503
Domain windowing is set.
Embodiment 3
Figure 14 is the structural representation of cooling circuit board embodiment 3.As shown in figure 14, the difference of embodiment 3 and embodiment 2 exists
In：
The first metal layer 1102, the 3rd metal level 231 and fifth metal layer 1401 are etched, so as to be formed in the upper surface of circuit board
The first conductive pattern layer including positive terminal pad 1501 and negative terminal pad 1502.Wherein, the part formation of positive terminal pad 1501
In the upper surface of substrate 100, another part is formed in the upper surface of radiator 20；Similarly, a part for negative terminal pad 1502
Formed and formed in the upper surface of substrate 100, another part in the upper surface of radiator 20.
Cooling circuit board in embodiment 3 is particularly suitable for the installation of flip type semiconductor heater members.Figure 15 is application
The structural representation of the flip chip type heater members module embodiments of cooling circuit board embodiment 3；As shown in figure 15, such as flip chip type
The flip chip type heater members of LED chip are directly welded in positive terminal pad 1501 and negative terminal pad 1502, are led with realizing with first
The electrical connection of electrograph pattern layer and thermally coupled with radiator 20.
Embodiment 4
Figure 16 is the structural representation of cooling circuit board embodiment 4.As shown in figure 16, the difference of embodiment 4 and embodiment 2 exists
In：
First, second metal layer 1202, the 4th metal level 232 and the 6th metal level 1402 are collectively forming as the second conductive pattern layer
1602 and with the second conductive pattern layer 1602 electric insulation thermal diffusion disk 1601；Wherein, the second conductive pattern layer 1602 is formed
In the lower surface of substrate 100, thermal diffusion disk 1601 is extended to the lower surface of substrate 100 by the lower surface of radiator 20.Correspondingly,
The preparation method of cooling circuit board embodiment 4 also includes etching second metal layer 1202, the 4th metal level 232 and the 6th metal level
1402 the step of.
Secondly, the first insulating substrate 1101 adjacent to solidification insulating barrier 130 surface formed with the 3rd conductive pattern layer
1104, the second insulating substrate 1201 adjacent to solidification insulating barrier 130 surface formed with the 4th conductive pattern layer 1204.3rd leads
The conductive pattern layer 1204 of electrograph pattern layer 1104 and the 4th is the internal layer circuit of cooling circuit board, the making of this internal layer circuit, no
Be the ordinary skill in the art with the attachment structure between conductive pattern layer and corresponding manufacture craft, omit herein to its
Describe in detail.
In embodiment 4, due to thermal diffusion disk 1601 have more than the 4th metal level 232 cooling surface area, therefore with reality
The circuit board for applying example 1 is compared, and the circuit board of embodiment 4 has the radiating effect of enhancing；Simultaneously as second metal layer 1202,
4th metal level 232 and the 6th metal level 1402 are collectively forming as the second conductive pattern layer 1602, therefore the circuit board of embodiment 4
Compared with the circuit board of embodiment 2, it is possible to achieve increasingly complex conducting wire design, using upper more flexible.
Embodiment 5
Figure 17 is the structural representation of cooling circuit board embodiment 5.As shown in figure 17, the difference of embodiment 5 and embodiment 2 exists
In：
The first metal layer 1102, the 3rd metal level 231 and fifth metal layer 1401 are etched, so as in the upper surface shape of radiator 20
Into the first conductive pattern layer including multi-group electrode pad, wherein every group of electrode pad includes positive terminal pad 1501 and negative terminal pad
1502.So, multiple heater members can be placed on each radiator 20.
It should be readily apparent to one skilled in the art that unless mutually exclusive situation be present, above-mentioned each embodiment can phase
Mutually combination and/or replacement.For example, the 3rd metal level 231 can be etched in embodiment 1, to form patterning knot
Structure.
It is readily appreciated that, in present invention other embodiment (not shown), cooling circuit board can be formed as such as six laminates
（There are six layers of conductive circuit layer）, eight laminates（There are six layers of conductive circuit layer）Deng other multilayer circuit boards；Correspondingly,
In the offer substrate step of its preparation method, it can be laminated more than two layers（Such as three layers or four layers）Copper-clad plate, and in phase
One or more layers prepreg is set between adjacent copper-clad plate, this be those skilled in the art can show under the teachings of the present invention and
What easy insight was realized.
Although the present invention is disclosed above with specific embodiment, the scope that the present invention is implemented is not limited to.Any
The those of ordinary skill in field, it is when a little improvement can be made, i.e., every according to this hair in the invention scope for not departing from the present invention
Bright done equal improvement, should be protection scope of the present invention and is covered.
Claims (10)
1. a kind of cooling circuit board, including：
Substrate, there is the first metal layer for being formed thereon surface and form the second metal layer in its lower surface；Wherein, it is described
The first metal layer is formed as the first conductive pattern layer；
Radiator, it is arranged in the substrate and runs through the substrate；Wherein, the radiator includes metal body, formed
First thermally conductive insulating layer of the metal body upper surface, the 3rd metal level formed in first thermally conductive insulating layer, shape
Into the 4th gold medal in the second thermally conductive insulating layer of the metal body lower surface and formation in second thermally conductive insulating layer
Belong to layer；
Wherein, the flush with outer surface of the first metal layer and the 3rd metal level is set, the second metal layer and described
The flush with outer surface of 4th metal level is set.
2. cooling circuit board as claimed in claim 1, wherein, the second metal layer is formed as the second conductive pattern layer.
3. a kind of cooling circuit board, including：
Substrate, there is the second metal layer of the first metal layer for being formed thereon surface and formation in its lower surface；
Radiator, it is arranged in the substrate and runs through the substrate；Wherein, the radiator includes metal body, formed
First thermally conductive insulating layer of the metal body upper surface, the 3rd metal level formed in first thermally conductive insulating layer, shape
Into the 4th gold medal in the second thermally conductive insulating layer of the metal body lower surface and formation in second thermally conductive insulating layer
Belong to layer；
Wherein, the upper surface of the cooling circuit board is formed with fifth metal layer, the fifth metal layer and first metal
Layer is connected with the outer surface of the 3rd metal level；The lower surface of the cooling circuit board is described formed with the 6th metal level
6th metal level is connected with the outer surface of the second metal layer and the 4th metal level；
And wherein, the first metal layer, the 3rd metal level and the fifth metal layer are collectively forming conductive for first
Patterned layer.
4. cooling circuit board as claimed in claim 3, wherein, the second metal layer, the 4th metal level and described
Six metal levels are collectively forming the thermal diffusion disk for the second conductive pattern layer and with second conductive pattern layer electric insulation；And
Wherein, second conductive pattern layer is formed in the lower surface of the substrate, the thermal diffusion disk by the radiator following table
Face extends to the lower surface of the substrate.
5. the cooling circuit board as described in any one of Claims 1-4, wherein, the metal body is aluminium, first heat conduction
Insulating barrier and second thermally conductive insulating layer are formed by alumilite process.
6. a kind of method for preparing cooling circuit board, comprises the following steps：
Substrate is provided, the substrate has the mounting hole through the substrate, forms first metal on surface on the substrate
Layer, formed in the second metal layer of the base lower surface and partly consolidating between the upper surface of base plate and lower surface
Change insulating barrier；
There is provided radiator, the radiator include metal body, formed the metal body upper surface the first heat conductive insulating
Layer, form the 3rd metal level in first thermally conductive insulating layer, form the second heat conduction in the metal body lower surface
The 4th metal level of insulating barrier and formation in second thermally conductive insulating layer；
The radiator is placed into the mounting hole of the substrate；
Substrate described in hot pressing and the radiator so that the flush with outer surface of the first metal layer and the 3rd metal level is set
Put, the flush with outer surface of the second metal layer and the 4th metal level is set.
7. method as claimed in claim 6, wherein, the first metal layer is formed as the first conductive pattern layer；Preferably, institute
State second metal layer and be formed as the second conductive pattern layer.
8. method as claimed in claim 6, wherein, after substrate described in hot pressing and the radiator, to first gold medal
Category layer is patterned processing to form the first conductive pattern layer；Second metal layer described in preferred pair is patterned processing with shape
Into the second conductive pattern layer.
9. method as claimed in claim 6, further comprising the steps of：
After substrate described in hot pressing and the radiator, fifth metal layer is formed in the upper surface of the cooling circuit board, it is described
Fifth metal layer is connected with the outer surface of the first metal layer and the 3rd metal level；Under the cooling circuit board
Surface forms the 6th metal level, and the 6th metal level is connected with the outer surface of the second metal layer and the 4th metal level
Connect；
Processing is patterned to the first metal layer, the 3rd metal level and the fifth metal layer and forms first and leads
Electrograph pattern layer；
Preferably, the second metal layer, the 4th metal level and the 6th metal level are patterned and handled and shape
Thermal diffusion disk into the second conductive pattern layer and with second conductive pattern layer electric insulation；Wherein, second conductive pattern
Pattern layer is formed and extended in the lower surface of the substrate, the thermal diffusion disk by the lower surface of the radiator under the substrate
Surface.
10. the method as described in any one of claim 6 to 9, wherein, the metal body is aluminium, first heat conductive insulating
Layer and second thermally conductive insulating layer are formed by alumilite process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710949408.7A CN107623986A (en) | 2017-10-12 | 2017-10-12 | Cooling circuit board and the method for preparing cooling circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710949408.7A CN107623986A (en) | 2017-10-12 | 2017-10-12 | Cooling circuit board and the method for preparing cooling circuit board |
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| CN107623986A true CN107623986A (en) | 2018-01-23 |
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| CN201710949408.7A Pending CN107623986A (en) | 2017-10-12 | 2017-10-12 | Cooling circuit board and the method for preparing cooling circuit board |
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