CN111901963A - Method for forming welding pad on LED carrier plate - Google Patents
Method for forming welding pad on LED carrier plate Download PDFInfo
- Publication number
- CN111901963A CN111901963A CN201910366797.XA CN201910366797A CN111901963A CN 111901963 A CN111901963 A CN 111901963A CN 201910366797 A CN201910366797 A CN 201910366797A CN 111901963 A CN111901963 A CN 111901963A
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- CN
- China
- Prior art keywords
- region
- layer
- pole
- substrate
- windowing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 229910000679 solder Inorganic materials 0.000 claims abstract description 25
- 238000010147 laser engraving Methods 0.000 claims abstract description 7
- 229920002120 photoresistant polymer Polymers 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a method for forming a welding pad on a light-emitting diode carrier plate, which comprises the following steps: forming the circuit layer on the substrate, wherein the circuit layer is provided with at least one windowing corresponding area, the circuit layer completely covers the substrate below the windowing corresponding area, the windowing corresponding area is composed of a P pole welding pad, an N pole welding pad and a connecting part positioned between the P, N pole welding pads, and the P, N pole welding pads are not in direct contact with each other; covering a solder mask layer on the substrate and the circuit layer; using a laser engraving machine to emit at least one laser beam toward the position of the solder mask layer corresponding to the at least one windowing corresponding region, thereby forming at least one laser window, so that the P, N electrode bonding pad and the connecting part are not covered by the solder mask layer in the laser window any more; and removing the connecting portion to make the P, N pole pads electrically independent from each other.
Description
Technical Field
The present invention relates to a method for manufacturing a circuit board, and more particularly, to a method for forming a bonding pad on a light emitting diode carrier.
Background
The prior art led carrier includes a substrate, a circuit layer and a solder mask layer, wherein the solder mask layer covers the substrate and the circuit layer, and the solder mask layer has a plurality of windows exposing a portion of the circuit layer, so that surface mount components such as leds can be mounted on the carrier. In the past, a circuit layer of a light emitting diode carrier plate is pre-formed with a bonding pad for electrical connection of a light emitting diode chip, and then a solder mask layer is covered on the circuit layer, and then a laser engraving machine is used for windowing on a circuit board so as to expose the bonding pad.
However, as shown in fig. 1, in the prior art, not only the solder mask layer is burned through but also the substrate 10 between the pads is partially burned away while the laser is opened, which may cause the reliability of the led carrier to be lowered, and in the case of the substrate being a multi-layer board, the burned-away portion of the substrate may cause the dielectric between the layers to be damaged, which may cause the yield to be lowered.
Disclosure of Invention
Accordingly, the present invention is directed to a method for preventing local substrate burning during a laser windowing process of a light emitting diode carrier.
In order to achieve the above and other objects, the present invention provides a method for forming a bonding pad on a light emitting diode carrier, comprising the steps of:
forming the circuit layer on the substrate, wherein the circuit layer is provided with at least one windowing corresponding area, the circuit layer completely covers the substrate below the windowing corresponding area, the windowing corresponding area is composed of a P pole welding pad, an N pole welding pad and a connecting part positioned between the P, N pole welding pads, and the P, N pole welding pads are not in direct contact with each other;
covering a solder mask layer on the substrate and the circuit layer;
using a laser engraving machine to emit at least one laser beam toward the position of the solder mask layer corresponding to the at least one windowing corresponding region, thereby forming at least one laser window, so that the P, N electrode bonding pad and the connecting part are not covered by the solder mask layer in the laser window any more; and
the connection is removed, making the P, N pole pads electrically independent from each other.
Through the technical means, when the laser engraving machine emits laser beams, the windowing corresponding area is completely covered by the circuit layer, so that the energy of the laser beams cannot penetrate through the substrate, and when the subsequent connecting part is removed, the original thickness and the smooth surface of the substrate area between the P, N-pole welding pads can still be maintained, and the better reliability of the carrier plate can be kept.
Other effects and embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a prior art LED carrier after a laser windowing process;
fig. 2 to 10 are schematic views illustrating a process according to an embodiment of the invention.
Description of the symbols
10 substrate 20 circuit layer
21 copper foil 22 windowing corresponding region
23: P-pole pad 24: N-pole pad
25 connecting part 30 welding-proof layer
31 laser window 40 photoresist layer
40A, 40B, 40C region
Detailed Description
The following embodiments illustrate one method of forming a bonding pad on a light emitting diode carrier according to the present invention, which includes the following steps:
first, referring to fig. 2 to 4, a circuit layer 20 is formed on a substrate 10: selecting a single-sided board or a double-sided board as a substrate, namely selecting the substrate 10 with a copper foil 21 formed on one side or both sides in advance according to requirements, then plating a layer of copper on the copper foil 21 to increase the thickness of the copper layer (as shown in figure 3), and then imaging the copper foil and the plated copper by using a circuit image transfer technology to form a circuit layer 20 (as shown in figure 4); the substrate 10 may be a Flexible Printed Circuit (FPC) substrate or a hard Printed Circuit Board (PCB) substrate; for example, the substrate 10 may be, but is not limited to, a polyethylene terephthalate (PET) or other polyester film, a polyimide film, a polyamideimide film, a polypropylene film, a polystyrene film, or a combination thereof; the circuit layer 20 has at least one windowing corresponding region 22, the circuit layer 20 completely covers the substrate 10 thereunder in the windowing corresponding region 22, the windowing corresponding region 22 is composed of a P pole pad 23, an N pole pad 24 and a connecting part 25 positioned between the P, N pole pads, and the P, N pole pads 23 and 24 are not in direct contact with each other; in the application fields of backlight modules, led displays and the like, a led carrier usually carries a large number of led chips, the number of pairs of P, N pads is also increased according to the number of the led chips, and the profile of the P, N pad can be determined according to the requirement;
next, as shown in fig. 5, the substrate 10 and the circuit layer 20 are covered with the solder mask layer 30, and the corresponding window area 22 is also covered with the solder mask layer 30; in a possible embodiment, the material of the solder mask layer 30 is, for example, a two-part solder mask ink (double liquid type solder mask ink) of the thermosetting or photo-setting solder mask ink type or a semi-cured dry film thereof, the components of which include, for example, a solder mask, a colorant, a diluent, and a Hardener (hardner); in a possible embodiment, the solder mask layer is laminated on the substrate and the circuit layer in the form of a semi-cured dry film, and is subsequently cured by thermal curing and/or photo-curing; in other possible embodiments, the solder mask layer is formed by screen printing and coating on the substrate and the circuit layer, and then curing by thermal curing and/or photo curing;
next, as shown in fig. 6, a laser engraving machine is used to emit at least one laser beam toward the position of the solder mask layer 30 corresponding to the at least one corresponding windowing region 22, so as to form at least one laser window 31, such that the P, N electrode pads 23 and 24 and the connecting portion 25 are not covered by the solder mask layer 30 in the laser window 31; the laser window 31 may have any predetermined profile, such as a circular profile;
finally, as shown in fig. 7 to 10, the connecting portion 25 is removed, so that the P, N pole pads 23 and 24 are electrically independent from each other; to remove the connection portion 25, a photoresist layer 40 may be laminated on the windowing corresponding region 22 (as shown in fig. 7), the photoresist layer 40 is exposed (through a photomask), depending on the positive or negative developing characteristics of the developing solution, the region 40A of the photoresist layer 40 corresponding to the connection portion 25 may be one of the exposed region and the unexposed region, and the regions 40B and 40C of the photoresist layer 40 corresponding to the P, N pole pads 23 and 24 may be the other of the exposed region and the unexposed region, the photoresist layer 40 in the region 40A is removed by the developing solution to expose the connection portion 25 (as shown in fig. 8), the connection portion 25 not covered by the photoresist layer 40 is removed by dry etching or wet etching to make the P, N pole pads 23 and 24 electrically independent from each other (as shown in fig. 9), and finally the photoresist layer 40 in the regions 40B and 40C is removed to obtain a structure having a pair of electrically independent P, N pole pads 23 and 23, 24 (fig. 10).
Through the technical means, when the laser engraving machine emits laser beams, the windowing corresponding area is completely covered by the circuit layer, so that the energy of the laser beams cannot penetrate through the substrate, and when the subsequent connecting part is removed, the original thickness and the smooth surface of the substrate area between the P, N-pole welding pads can still be maintained, and the better reliability of the carrier plate can be kept.
The above-described embodiments and/or implementations are only for illustrating the preferred embodiments and/or implementations of the present technology, and are not intended to limit the implementations of the present technology in any way, and those skilled in the art can make many modifications or changes without departing from the scope of the technology disclosed in the present disclosure, but should be construed as technology or implementations that are substantially the same as the present technology.
Claims (3)
1. A method for forming a bonding pad on a light emitting diode carrier is characterized by comprising the following steps:
forming the circuit layer on the substrate, wherein the circuit layer is provided with at least one windowing corresponding area, the circuit layer completely covers the substrate below the windowing corresponding area, the windowing corresponding area is composed of a P pole welding pad, an N pole welding pad and a connecting part positioned between the P, N pole welding pads, and the P, N pole welding pads are not in direct contact with each other;
covering a solder mask layer on the substrate and the circuit layer;
using a laser engraving machine to emit at least one laser beam toward the position of the solder mask layer corresponding to the at least one windowing corresponding region, thereby forming at least one laser window, so that the P, N electrode bonding pad and the connecting part are not covered by the solder mask layer in the laser window any more; and
the connection is removed, making the P, N pole pads electrically independent from each other.
2. The method of claim 1, wherein removing the connecting portion comprises: laminating a photoresist layer in the at least one windowing corresponding region, and exposing the photoresist layer, wherein the region of the photoresist layer corresponding to the connecting portion is one of an exposed region and an unexposed region, and the region of the photoresist layer corresponding to the P, N electrode bonding pad is the other of the exposed region and the unexposed region; the photoresist layer is removed in the area corresponding to the connecting portion to expose the connecting portion, then the connecting portion is removed by etching, and finally the photoresist layer is removed in the area corresponding to the P, N pole bonding pad.
3. The method according to claim 2, wherein the photoresist layer is removed by a developing solution in a region corresponding to the connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910366797.XA CN111901963B (en) | 2019-05-05 | 2019-05-05 | Method for forming welding pad on LED carrier plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910366797.XA CN111901963B (en) | 2019-05-05 | 2019-05-05 | Method for forming welding pad on LED carrier plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111901963A true CN111901963A (en) | 2020-11-06 |
| CN111901963B CN111901963B (en) | 2022-01-04 |
Family
ID=73169081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910366797.XA Active CN111901963B (en) | 2019-05-05 | 2019-05-05 | Method for forming welding pad on LED carrier plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111901963B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114430615A (en) * | 2022-01-20 | 2022-05-03 | 重庆惠科金渝光电科技有限公司 | Manufacturing method of circuit board, circuit board and storage medium |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030203170A1 (en) * | 1997-01-10 | 2003-10-30 | Masaru Takada | Printed wiring board and method of manufacturing the same |
| CN1524026A (en) * | 2001-07-06 | 2004-08-25 | ���Ǽ��Ź�˾ | System and method for integrating optical layers in a PCB for inter-board communications |
| CN101296570A (en) * | 2007-04-25 | 2008-10-29 | 富葵精密组件(深圳)有限公司 | Circuit board and production method thereof |
| US20110108876A1 (en) * | 2009-11-09 | 2011-05-12 | Lee-Sheng Yen | Pad structure and manufacturing method thereof |
| CN102376587A (en) * | 2010-08-24 | 2012-03-14 | 旭德科技股份有限公司 | Manufacturing method of encapsulating carrier plate |
| JP2014192205A (en) * | 2013-03-26 | 2014-10-06 | Ibiden Co Ltd | Wiring board and method for manufacturing the same |
| CN107623986A (en) * | 2017-10-12 | 2018-01-23 | 许明杰 | Cooling circuit board and the method for preparing cooling circuit board |
| CN208768331U (en) * | 2018-07-05 | 2019-04-19 | 同泰电子科技股份有限公司 | Circuit board structure for forming connecting terminal by limiting opening window through solder mask |
-
2019
- 2019-05-05 CN CN201910366797.XA patent/CN111901963B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030203170A1 (en) * | 1997-01-10 | 2003-10-30 | Masaru Takada | Printed wiring board and method of manufacturing the same |
| CN1524026A (en) * | 2001-07-06 | 2004-08-25 | ���Ǽ��Ź�˾ | System and method for integrating optical layers in a PCB for inter-board communications |
| CN101296570A (en) * | 2007-04-25 | 2008-10-29 | 富葵精密组件(深圳)有限公司 | Circuit board and production method thereof |
| US20110108876A1 (en) * | 2009-11-09 | 2011-05-12 | Lee-Sheng Yen | Pad structure and manufacturing method thereof |
| CN102376587A (en) * | 2010-08-24 | 2012-03-14 | 旭德科技股份有限公司 | Manufacturing method of encapsulating carrier plate |
| JP2014192205A (en) * | 2013-03-26 | 2014-10-06 | Ibiden Co Ltd | Wiring board and method for manufacturing the same |
| CN107623986A (en) * | 2017-10-12 | 2018-01-23 | 许明杰 | Cooling circuit board and the method for preparing cooling circuit board |
| CN208768331U (en) * | 2018-07-05 | 2019-04-19 | 同泰电子科技股份有限公司 | Circuit board structure for forming connecting terminal by limiting opening window through solder mask |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114430615A (en) * | 2022-01-20 | 2022-05-03 | 重庆惠科金渝光电科技有限公司 | Manufacturing method of circuit board, circuit board and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111901963B (en) | 2022-01-04 |
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