CN114615788A - Circuit board with heat dissipation block and manufacturing method thereof - Google Patents
Circuit board with heat dissipation block and manufacturing method thereof Download PDFInfo
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- CN114615788A CN114615788A CN202011443597.9A CN202011443597A CN114615788A CN 114615788 A CN114615788 A CN 114615788A CN 202011443597 A CN202011443597 A CN 202011443597A CN 114615788 A CN114615788 A CN 114615788A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A circuit board having a heat slug, comprising: the circuit board comprises a circuit substrate, a through hole and a circuit board, wherein the through hole penetrates through the circuit substrate along a first direction, the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part; the heat dissipation block is accommodated in the second part; the first fixing piece comprises a first connecting part and a first head part which is connected to one end of the first connecting part and arranged in a T shape with the first connecting part, the first connecting part is connected with the radiating block, the first head part is positioned in the first part, and the width of the first head part is larger than that of the second part; the second fixing piece comprises a second connecting portion and a second head portion which is connected to one end of the second connecting portion and arranged in a T shape with the second connecting portion, the second head portion is located in the third portion, the width of the second head portion is larger than that of the second portion, and the second connecting portion is connected with the radiating block. The invention also relates to a manufacturing method of the circuit board with the heat dissipation block.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a circuit board with a heat dissipation block and a manufacturing method thereof.
Background
Due to the rapid development of circuit boards, the application of the circuit boards is also more and more extensive. Among them, due to the development trends of high integration, miniaturization, etc., electronic products have higher and higher packaging density of electronic components and higher power consumption. The corresponding heat dissipation requirements for multilayer circuit boards are also increasing. In the prior art, heat dissipation is generally performed by embedding a heat conducting metal block at a position where heat dissipation is required. The heat-conducting metal block and the circuit board are usually fixed through overflow glue of the prepreg, so the heat dissipation method has special requirements on the prepreg, and the prepreg with a thicker glue overflow effect is usually required to meet the fixing requirements.
Disclosure of Invention
Accordingly, the present invention provides a circuit board with a heat slug, which does not require a semi-cured sheet to fix the heat slug.
A manufacturing method of the circuit board with the heat dissipation block is further provided.
A circuit board having a heat slug, comprising: the through hole penetrates through the circuit substrate along a first direction, the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part; the heat dissipation block is accommodated in the second part; the first fixing piece comprises a first connecting part and a first head part which is connected to one end of the first connecting part and arranged in a T shape with the first connecting part, the first connecting part is connected with the heat dissipation block, the first head part is positioned in the first part, and the width of the first head part is larger than that of the second part; the second fixing piece comprises a second connecting portion and a second head portion connected to one end of the second connecting portion and arranged in a T shape with the second connecting portion, the second head portion is located in the third portion, the width of the second head portion is larger than that of the second portion, and the second connecting portion is connected with the radiating block.
A circuit board having a heat slug, comprising: the through hole penetrates through the circuit substrate along a first direction, the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part; the radiating block comprises a first radiating part and a second radiating part connected to one end of the first radiating part, the width of the second radiating part is larger than that of the first radiating part, the first radiating part is positioned in the second part, the width of the second radiating part is larger than that of the second part, and the second radiating part is positioned in the first part; the fixing piece comprises a connecting portion and a head portion connected to one end of the connecting portion and arranged in a T shape with the connecting portion, the head portion is located in the third portion, the width of the head portion is larger than that of the second portion, and the connecting portion is connected with the first heat dissipation portion.
A manufacturing method of a circuit board with a heat dissipation block comprises the following steps:
providing a circuit substrate, and forming a through hole penetrating through the circuit substrate along a first direction, wherein the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part;
providing a first fixing piece, wherein the first fixing piece comprises a first connecting part and a first head part which is connected to one end of the first connecting part and arranged in a T shape with the first connecting part, the first connecting part is connected with a radiating block, the radiating block is placed in the second part from the first part, and the width of the first head part is larger than that of the second part; and
providing a second fixing piece, wherein the second fixing piece comprises a second connecting portion and a second head portion, the second head portion is connected to one end of the second connecting portion and arranged in a T shape with the second connecting portion, the second head portion is located in the third portion, the width of the second head portion is larger than that of the second portion, and the second connecting portion is connected with the radiating block.
A manufacturing method of a circuit board with a heat dissipation block comprises the following steps:
providing a circuit substrate, and forming a through hole penetrating through the circuit substrate along a first direction, wherein the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part;
providing a heat dissipation block, wherein the heat dissipation block comprises a first heat dissipation part and a second heat dissipation part connected to one end of the first heat dissipation part, and the width of the second heat dissipation part is larger than that of the first heat dissipation part;
placing the heat dissipation block in the through hole from the first portion, the first heat dissipation part being located in the second portion, the second heat dissipation part being located in the first portion, and the second heat dissipation part having a width greater than a width of the second portion; and
providing a fixing piece, wherein the fixing piece comprises a connecting part and a head part which is connected to one end of the connecting part and is arranged in a T shape with the connecting part, the head part is positioned in the third part, the width of the head part is larger than that of the second part, and the connecting part is connected with the radiating block.
The circuit board with the radiating block and the manufacturing method thereof provided by the invention have the advantages that the radiating block is accommodated in the through hole with the stepped hole, and the radiating block is locked in the circuit substrate through the matching of the stepped surface and the head part of the fixing piece or the stepped surface of the radiating block, so that the radiating block is not required to be fixed in the circuit substrate through a glue material.
Drawings
Fig. 1 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of the circuit board shown in fig. 1 with a through hole.
FIG. 3 is a schematic cross-sectional view of a heat slug according to an embodiment of the present application.
Fig. 4 is a schematic cross-sectional view of the heat slug shown in fig. 3 attached to a first fixture and placed in the through hole shown in fig. 2.
Fig. 5 is a schematic cross-sectional view of a circuit board with a heat slug according to an embodiment of the present application.
FIG. 6 is a schematic cross-sectional view of a heat slug according to an embodiment of the present application.
Fig. 7 is a schematic cross-sectional view of the heat slug shown in fig. 6 positioned within the through-hole shown in fig. 2.
Fig. 8 is a schematic cross-sectional view of a circuit board with a heat slug according to an embodiment of the present application.
Description of the main elements
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following embodiments, features of the embodiments may be combined with each other without conflict.
Referring to fig. 1 to 5, a first embodiment of the present application provides a method for manufacturing a circuit board 100a having a heat sink, which includes the following steps:
in step S11, referring to fig. 1, a circuit substrate 30 is provided. The circuit substrate 30 includes a dielectric layer 31 and at least one wiring layer 33.
The circuit substrate 30 may be a single-layer circuit substrate, a double-layer circuit substrate or a multi-layer circuit substrate. In the present embodiment, the circuit board 30 is a multilayer circuit board including a dielectric layer 31, and a first circuit layer 331, a second circuit layer 332, a third circuit layer 333, and a fourth circuit layer 334 which are stacked and spaced in this order in the thickness direction of the dielectric layer 31. The first circuit layer 331 and the fourth circuit layer 334 are disposed on two opposite sides of the dielectric layer 31, and the second circuit layer 332 and the third circuit layer 333 are embedded in the dielectric layer 31.
In step S12, referring to fig. 2, a through hole 40 is formed in the circuit substrate 30, and the through hole 40 penetrates through the circuit substrate 30 along the thickness direction of the dielectric layer 31. The through hole 40 is a stepped hole, is shaped like an i, and includes a first portion 411, a second portion 412, and a third portion 413 connected in sequence along the thickness direction of the dielectric layer 31. In a direction perpendicular to the thickness direction of the dielectric layer 31, the width of the second portion 412 is smaller than the width of the first portion 411 and smaller than the width of the third portion 413, so that a first step surface 401 is formed between the sidewall of the first portion 411 and the sidewall of the second portion 412, and a second step surface 403 is formed between the sidewall of the third portion 413 and the sidewall of the second portion 412.
In step S13, please refer to fig. 3, a heat sink 50 is provided. The heat dissipation block 50 includes a first surface 501 and a second surface 503 opposite to each other, and a first mounting hole 51 is formed by recessing from the first surface 501 to the second surface 503, and a second mounting hole 53 is formed by recessing from the second surface 503 to the first surface 501.
The inner wall of the first mounting hole 51 may be provided with a first internal thread 511, and the inner wall of the second mounting hole 53 may be provided with a second internal thread 531.
In the present embodiment, the heat dissipation block 50 is made of a metal material or an alloy material having good thermal conductivity, and is made of, for example, a copper block, a gold block, a silver block, or the like. In some embodiments, the heat dissipation block 50 may also be made of other materials with high thermal conductivity.
In the present embodiment, each of the first mounting hole 51 and the second mounting hole 53 is a blind hole. In some embodiments, the first mounting hole 51 may also communicate with the second mounting hole 53.
Step S14, referring to fig. 4, providing a first fixing element 61 including a first connecting portion 612 and a first head 614 connected to one end of the first connecting portion 612 and disposed in a T-shape with the first connecting portion 612, fitting and fixing the first connecting portion 612 and the first mounting hole 51, and placing the heat dissipation block 50 connected to the first fixing element 61 in the second portion 412 from the first portion 411, wherein the width of the first head 614 is greater than the width of the second portion 412.
In this embodiment, the first connection portion 612 is provided with a first external thread 615, and the first external thread 615 and the first internal thread 511 are matched with each other to fix the first fixing member 61 and the heat dissipation block 50.
The first head 614 is located at the first portion 411. Preferably, the thickness of the first head 614 is less than or equal to the depth of the first portion 411.
Step S15, please refer to fig. 5, a second fixing element 63 is provided, which includes a second connection portion 632 and a second head portion 634 connected to one end of the second connection portion 632 and disposed in a T-shape with the second connection portion 632, and the second connection portion 632 is fixed to the second mounting hole 53 in a matching manner, wherein the width of the second head portion 634 is greater than the width of the second portion 412, so as to lock the heat sink 50 in the circuit substrate 30.
Preferably, the thickness of the heat slug 50 is smaller than or equal to the depth of the second portion 412, the first head 614 abuts against the first step surface 401, and the second head 634 abuts against the second step surface 403, so as to lock the heat slug 50 and the circuit substrate 30, and prevent the heat slug 50 from moving relative to the circuit substrate 30.
In this embodiment, a second external thread 635 is disposed on the second connecting portion 632, and the second external thread 635 and the second internal thread 531 cooperate with each other to fix the second fixing member 63 and the heat dissipation block 50.
The second head 634 is located at the third portion 413. Preferably, the thickness of the second head 634 is less than or equal to the depth of the third portion 413.
Preferably, the first fixing member 61 and the second fixing member 63 are made of a material having good thermal conductivity.
Referring to fig. 6 to 8, a second embodiment of the present application provides a method for manufacturing a circuit board 100b having a heat sink, which includes the following steps:
in step S21, please refer to fig. 6, a heat sink 50a is provided. The heat sink 50a includes a first heat sink member 55 and a second heat sink member 56 connected to one end of the first heat sink member 55, and the second heat sink member 56 has a width greater than that of the first heat sink member 55 so that a third step surface 57 is formed between the circumferential surface of the first heat sink member 55 and the circumferential surface of the second heat sink member 56. The surface of the first heat sink member 55 facing away from the second heat sink member 56 is recessed toward the second heat sink member 56 to form a mounting hole 51 a.
The inner wall of the mounting hole 51a may be provided with an internal thread 511 a.
The width of the second heat sink member 56 is greater than the width of the second portion 412 and less than or equal to the width of the first portion 411.
The heat dissipation block 50a is made of a metal material or an alloy material having good thermal conductivity, such as a copper block, a gold block, or a silver block. In some embodiments, the heat dissipation block 50a may also be made of other materials with high thermal conductivity.
In this embodiment, the mounting hole 51a is a blind hole. In some embodiments, the mounting hole 51a may also be a through hole.
Step S22, referring to fig. 7, providing the circuit substrate 30 with the through hole 40, and placing the heat dissipation block 50a in the through hole 40 from the first portion 411, wherein the first heat dissipation portion 55 is located in the second portion 412, and the width of the second heat dissipation portion 56 is greater than the width of the second portion 412.
The second heat sink member 56 is located in the first portion 411. Preferably, the thickness of the second heat sink member 56 is less than or equal to the depth of the first portion 411.
Step S23, please refer to fig. 8, a fixing member 64 including a connecting portion 642 and a head portion 644 connected to one end of the connecting portion 642 and disposed in a T-shape with the connecting portion 642 is provided, and the connecting portion 642 is fixed to the mounting hole 51a in a fitting manner, wherein a width of the head portion 644 is greater than a width of the second portion 412, so as to lock the heat slug 50 in the circuit substrate 30.
Preferably, the thickness of the first heat sink member 55 is smaller than or equal to the depth of the second portion 412, the third step surface 57 abuts against the first step surface 401, and the head portion 644 abuts against the second step surface 403, so as to lock the heat sink 50 and the circuit substrate 30, and prevent the heat sink 50 from moving relative to the circuit substrate 30.
In this embodiment, an external thread 645 is provided on the connecting portion 642, and the external thread 645 cooperates with the internal thread 511a to fix the fixing member 64 and the heat dissipating block 50.
The head 644 is located in the third portion 413. Preferably, the thickness of the head 644 is less than or equal to the depth of the third portion 413.
Preferably, the fixing member 64 is made of a material with good thermal conductivity.
Referring to fig. 5, a circuit board 100a with a heat slug according to a first embodiment of the present application includes a circuit substrate 30, a heat slug 50, a first fixing element 61 and a second fixing element 63. A through hole 40 penetrates the circuit substrate 30 along a first direction, and the through hole 40 includes a first portion 411, a second portion 412 and a third portion 413 which are sequentially connected along the first direction. In a direction perpendicular to the first direction, a width of the second portion 412 is smaller than a width of the first portion 411 and smaller than a width of the third portion 413, such that a first step surface 401 is formed between a side wall of the first portion 411 and a side wall of the second portion 412, and a second step surface 403 is formed between a side wall of the third portion 413 and a side wall of the second portion 412.
The heat dissipation block 50 includes a first surface 501 and a second surface 503 opposite to each other, and a first mounting hole 51 is formed by recessing from the first surface 501 to the second surface 503, and a second mounting hole 53 is formed by recessing from the second surface 503 to the first surface 501. The heat slug 50 is located in the second portion 412. The first surface 501 faces away from the third portion 413 and the second surface 503 faces away from the first portion 411.
The first fixing member 61 includes a first connecting portion 612 and a first head portion 614 connected to one end of the first connecting portion 612 and disposed in a T-shape with the first connecting portion 612. The second fixing member 63 includes a second connecting portion 632 and a second head portion 634 connected to one end of the second connecting portion 632 and disposed in a T-shape with the second connecting portion 632. The first connecting portion 612 is fixed to the first mounting hole 51, and the second connecting portion 632 is fixed to the second mounting hole 53. The first head portion 614 has a width greater than the width of the second portion 412, and the second head portion 634 has a width greater than the width of the second portion 412, thereby locking the heat slug 50 in the circuit substrate 30.
Preferably, the thickness of the heat slug 50 is smaller than or equal to the depth of the second portion 412, the first head 614 abuts against the first step surface 401, and the second head 634 abuts against the second step surface 403, so as to lock the heat slug 50 and the circuit substrate 30, and prevent the heat slug 50 from moving relative to the circuit substrate 30.
Preferably, the thickness of the first head 614 is less than or equal to the depth of the first portion 411. The thickness of the second head 634 is less than or equal to the depth of the third portion 413.
The inner wall of the first mounting hole 51 may be provided with a first internal thread 511, the first connection portion 612 may be provided with a first external thread 615, and the first external thread 615 and the first internal thread 511 are matched with each other to fix the first fixing member 61 and the heat dissipation block 50. The inner wall of the second mounting hole 53 may be provided with a second internal thread 531, the second connecting portion 632 may be provided with a second external thread 635, and the second external thread 635 and the second internal thread 531 cooperate with each other to fix the second fixing member 63 and the heat dissipation block 50.
The circuit board with heat slug 100b of the second embodiment of the present application differs from the circuit board with heat slug 100a of the first embodiment in that: the heat sink 50a includes a first heat sink member 55 and a second heat sink member 56 connecting one end of the first heat sink member 55, and the second heat sink member 56 has a width greater than that of the first heat sink member 55 so that a third step surface 57 is formed between the circumferential surface of the first heat sink member 55 and the circumferential surface of the second heat sink member 56. The surface of the first heat sink member 55 facing away from the second heat sink member 56 is recessed toward the second heat sink member 56 to form a mounting hole 51 a. The first heat sink member 55 is positioned in the second portion 412, and the second heat sink member 56 has a width larger than that of the second portion 412 in the first portion 411. The fixing member 64 includes a connecting portion 642 and a head portion 644 connected to one end of the connecting portion 642 and disposed in a T-shape with the connecting portion 642, the connecting portion 642 is fixed to the mounting hole 51a in a fitting manner, and the head portion 644 has a width larger than that of the second portion 412 and is located in the third portion 413.
Preferably, the thickness of the first heat sink member 55 is smaller than or equal to the depth of the second portion 412, the third step surface 57 abuts against the first step surface 401, and the head portion 644 abuts against the second step surface 403, so as to lock the heat sink 50a and the circuit substrate 30, and prevent the heat sink 50a from moving relative to the circuit substrate 30.
Preferably, the thickness of the head 644 is less than or equal to the depth of the third portion 413, and the thickness of the second heat sink 56 is less than or equal to the depth of the first portion 411.
The inner wall of the mounting hole 51a may be provided with an internal thread 511 a. The connecting portion 642 may be provided with an external thread 645, and the external thread 645 is matched with the internal thread 511a to fix the fixing member 64 and the heat dissipation block 50.
The circuit board with the radiating block and the manufacturing method thereof provided by the invention have the advantages that the radiating block is accommodated in the through hole with the stepped hole, and the radiating block is locked in the circuit substrate through the matching of the stepped surface and the head part of the fixing piece or the stepped surface of the radiating block, so that the radiating block is not required to be fixed in the circuit substrate through a glue material.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A circuit board having a heat slug, comprising:
the through hole penetrates through the circuit substrate along a first direction, the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part;
the heat dissipation block is accommodated in the second part, and the thickness of the heat dissipation block is smaller than or equal to the depth of the second part;
the first fixing piece comprises a first connecting part and a first head part which is connected to one end of the first connecting part and arranged in a T shape with the first connecting part, the first connecting part is connected with the heat dissipation block, the first head part is positioned in the first part, and the width of the first head part is larger than that of the second part;
the second fixing piece comprises a second connecting portion and a second head portion which is connected to one end of the second connecting portion and arranged in a T shape with the second connecting portion, the second head portion is located in the third portion, the width of the second head portion is larger than that of the second portion, the second connecting portion is connected with the heat dissipation block, the first head portion abuts against a first step surface between the second portion and the first portion, and the second head portion abuts against a second step surface between the second portion and the third portion.
2. The circuit board with the heat dissipation block as claimed in claim 1, wherein a first mounting hole and a second mounting hole are respectively formed at two opposite sides of the heat dissipation block, a first internal thread is formed on an inner wall of the first mounting hole, a second internal thread is formed on an inner wall of the second mounting hole, a first external thread is formed on the first connecting portion, a second external thread is formed on the second connecting portion, the first external thread of the first connecting portion is matched and fixed with the first internal thread of the first mounting hole, and the second external thread of the second connecting portion is matched and fixed with the second internal thread of the second mounting hole.
3. A circuit board having a heat slug, comprising:
the through hole penetrates through the circuit substrate along a first direction, the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part;
the radiating block comprises a first radiating part and a second radiating part connected to one end of the first radiating part, the width of the second radiating part is larger than that of the first radiating part, the first radiating part is positioned in the second part, the width of the second radiating part is larger than that of the second part, the second radiating part is positioned in the first part, and the thickness of the first radiating part is smaller than or equal to the depth of the second part;
the fixing piece comprises a connecting part and a head part which is connected to one end of the connecting part and arranged in a T shape with the connecting part, the head part is located in the third part, the width of the head part is larger than that of the second part, the connecting part is connected with the first heat dissipation part, the second heat dissipation part abuts against a first step surface between the second part and the first part, and the head part abuts against a second step surface between the second part and the third part.
4. The circuit board with the heat dissipation block as recited in claim 3, wherein an end of the first heat dissipation portion facing away from the second heat dissipation portion is provided with a mounting hole with internal threads, and the connecting portion is provided with external threads and is fixed in fit with the internal threads of the mounting hole.
5. A manufacturing method of a circuit board with a heat dissipation block comprises the following steps:
providing a circuit substrate, and forming a through hole penetrating through the circuit substrate along a first direction, wherein the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part;
providing a first fixing piece, wherein the first fixing piece comprises a first connecting part and a first head part which is connected to one end of the first connecting part and arranged in a T shape with the first connecting part, the first connecting part is connected with a radiating block, the radiating block is placed in the second part from the first part, the width of the first head part is larger than that of the second part, and the thickness of the radiating block is smaller than or equal to the depth of the second part; and
providing a second fixing piece, wherein the second fixing piece comprises a second connecting portion and a second head portion which is connected to one end of the second connecting portion and arranged in a T shape with the second connecting portion, the second head portion is located in the third portion, the width of the second head portion is larger than that of the second portion, the second connecting portion is connected with the heat dissipation block, the first head portion abuts against a first step surface between the second portion and the first portion, and the second head portion abuts against a second step surface between the second portion and the third portion.
6. The method according to claim 5, wherein the heat slug includes a first surface and a second surface opposite to each other, and a first mounting hole having a first internal thread is formed by recessing from the first surface toward the second surface, and a second mounting hole having a second internal thread is formed by recessing from the second surface toward the first surface, the first connection portion has a first external thread, the first external thread and the first internal thread cooperate to fix the first fixing member and the heat slug, the second connection portion has a second external thread, and the second external thread and the second internal thread cooperate to fix the second fixing member and the heat slug.
7. A manufacturing method of a circuit board with a heat dissipation block comprises the following steps:
providing a circuit substrate, and forming a through hole penetrating through the circuit substrate along a first direction, wherein the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part;
providing a heat dissipation block, wherein the heat dissipation block comprises a first heat dissipation part and a second heat dissipation part connected to one end of the first heat dissipation part, and the width of the second heat dissipation part is larger than that of the first heat dissipation part;
placing the heat dissipation block in the through hole from the first part, wherein the first heat dissipation part is positioned in the second part, the second heat dissipation part is positioned in the first part, the width of the second heat dissipation part is larger than that of the second part, and the thickness of the first heat dissipation part is smaller than or equal to the depth of the second part; and
providing a fixing piece, wherein the fixing piece comprises a connecting part and a head part which is connected to one end of the connecting part and arranged in a T shape with the connecting part, the head part is positioned in the third part, the width of the head part is larger than that of the second part, the connecting part is connected with the heat dissipation block, the second heat dissipation part abuts against a first step surface between the second part and the first part, and the head part abuts against a second step surface between the second part and the third part.
8. The method for manufacturing a circuit board having a heat sink as claimed in claim 7, wherein a surface of the first heat sink portion facing away from the second heat sink portion is recessed toward the second heat sink portion to form a mounting hole having internal threads, the connecting portion has external threads, and the internal threads and the external threads cooperate to fix the fixing element and the heat sink.
Priority Applications (1)
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| CN202011443597.9A CN114615788A (en) | 2020-12-08 | 2020-12-08 | Circuit board with heat dissipation block and manufacturing method thereof |
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| CN202011443597.9A CN114615788A (en) | 2020-12-08 | 2020-12-08 | Circuit board with heat dissipation block and manufacturing method thereof |
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