KR20120033039A - The radiant heat circuit board and the method for manufacturing the same - Google Patents

Abstract

PURPOSE: A heat radiation circuit board and a manufacturing method thereof are provided to improve heat radiation efficiency by directly transmitting heat from a heating device to a metal plate. CONSTITUTION: A metal plate(10) includes a metal protrusion(11) mounting a heating device(60). An insulation layer(20) is formed on the metal plate. A lateral insulation layer(30) is formed near the metal protrusion. A plurality of circuit patterns(40) are formed on the insulation layer. A solder(50) is formed on the metal protrusion.

Description

The radiant heat circuit board and the method for manufacturing the same

The present invention relates to a heat radiation circuit board and a manufacturing method thereof.

The circuit board includes a circuit pattern on an electrically insulating substrate, and is a substrate for mounting electronic components or the like.

Such an electronic component may be a heating element, for example a light emitting diode (LED) or the like, which emits severe heat. Emission heat from the heat generating element raises the temperature of the circuit board, causing problems in malfunction and reliability of the heat generating element.

In order to solve the problem caused by the heat of heat, a heat radiation circuit board is proposed as shown in FIG. 1.

1 is a cross-sectional view of a conventional circuit board.

Referring to FIG. 1, a conventional heat dissipation circuit board 1 includes a metal plate 2, an insulating layer 3, a circuit pattern 4, and a heating element mounting unit 5.

In the conventional heat dissipation circuit board 1 as described above, heat emitted from the mounted heat generating element is not transmitted to the metal plate 2 used for heat dissipation due to the interference of the insulating layer 3.

The embodiment provides a heat dissipation circuit board having a new structure and a method of manufacturing the same.

The embodiment provides a heat dissipation circuit board having improved thermal efficiency and electrical insulation and a method of manufacturing the same.

An embodiment of the present invention provides a heat dissipation circuit board on which a heating element is mounted, comprising: a metal plate including a metal protrusion, an insulating layer formed on the metal plate to expose the metal protrusion, and having a solid component impregnated with an insulating resin; And a side insulating layer extending from the layer and surrounding the side surface of the metal protrusion, and a circuit pattern formed on the insulating layer.

Meanwhile, the method of manufacturing a heat dissipation circuit board according to the embodiment may include forming a metal plate including a metal protrusion with respect to the original plate, exposing the metal protrusion on the metal plate and having a width wider than the width of the metal protrusion. Forming a prepreg in which a solid component is impregnated in the resin to have an opening, forming a copper foil layer having a second opening having a width equal to the opening on the prepreg, and opening the prepreg and the copper foil layer. Pressing to fill the first and second openings to form a side insulating layer surrounding the metal protrusion.

According to the present invention, by using a metal plate including a metal protrusion below the mounting pad, the heat dissipation efficiency is increased by directly transferring heat emitted from the heating element to the metal plate. In addition, a side insulating layer may be formed to surround side surfaces of the metal protrusions to ensure electrical insulation between the metal protrusions and the adjacent circuit patterns.

In addition, since the upper surface of the metal protrusions is not covered by the lower insulating layer, the metal protrusions may function as mounting pads of the heating element, thereby securing an adhesive area with the solder.

1 is a cross-sectional view of a conventional heat dissipation circuit board.
2 is a cross-sectional view of a heat radiation circuit board according to a first embodiment of the present invention.
3 to 9 are cross-sectional views illustrating a first method for manufacturing the heat dissipation circuit board of FIG. 2.
10 to 16 are cross-sectional views illustrating a second method for manufacturing the heat dissipation circuit board of FIG. 2.
17 is a cross-sectional view of a heat radiation circuit board according to a second embodiment of the present invention.
18 is a cross-sectional view showing an application example of the first embodiment of the present invention.
19A is a top view photograph of the control group for the present invention, and FIG. 19B is a top view photograph of the heat dissipation circuit board of FIG. 2.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .

Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. On the contrary, when a part is "just above" another part, there is no other part in the middle.

The present invention provides a circuit board for forming the side insulating layer of the metal projection by using the resin flow of the insulating layer in the heat radiation circuit board including the metal projection.

Hereinafter, a heat dissipation circuit board according to a first embodiment of the present invention will be described with reference to FIGS. 2 to 9.

2 is a cross-sectional view of a heat radiation circuit board according to a first embodiment of the present invention.

2, the heat dissipation circuit board 100 according to the first embodiment of the present invention is formed on the metal plate 10, the insulating layer 20 and the insulating layer 20 formed on the metal plate 10. Circuit pattern 40 to be included.

The metal plate 10 may be one of alloys including copper, aluminum, nickel, gold, platinum, or the like having good thermal conductivity.

The metal plate 10 includes a metal protrusion 11 for mounting the heat generating element 60.

The metal protrusion 11 extends from the metal plate 10 and protrudes vertically, and has a first width so as to have a predetermined area in which a solder 50 for mounting the heating element 60 may be located. d1) and formed.

An insulating layer 20 is formed on the metal plate 10.

The insulating layer 20 includes an epoxy resin having a low thermal conductivity (about 0.2 to 0.4 W / mk). Alternatively, the insulating layer 20 may include a polyimide resin having a relatively high thermal conductivity.

The insulating layer 20 may be formed by curing a prepreg formed by impregnating the resin with a solid component 21 such as reinforcing fiber, glass fiber, or filler.

The side insulating layer 30 surrounding the side surface of the metal protrusion 11 is formed at a predetermined thickness Δd in an area adjacent to the metal protrusion 11.

In this case, the side insulating layer 30 may be formed to have a different thickness Δd based on the metal protrusion 11.

The side insulating layer 30 extends from the insulating layer 20 and is formed at the same height as the height of the metal protrusion 11, and does not include the solid component 21 of the insulating layer 20. It is made of only resin.

As shown in FIG. 2, the side insulating layer 30 is formed of a resin and has a predetermined thickness Δd so as to surround the metal protrusion 11 and have a second width d2 greater than the first width d1. The insulating layer 20 extends from the side insulating layer 30 and includes both the solid component 21 and the resin on the plane of the metal plate 10.

In this case, the distance from the solid component 21 of the insulating layer 20 to the side insulating layer 30 satisfies about 100 μm or less.

The insulation layer 20 may be formed to have the same thickness as the height of the metal protrusion 11, and as shown in FIG. 2, the insulation layer 20 may be formed to have a thickness smaller than the height of the metal protrusion 11 to be lower than the side insulation layer 30. Can be formed.

A plurality of circuit patterns 40 are formed on the insulating layer 20.

The circuit pattern 40 is formed by patterning a conductive layer stacked on the insulating layer 20, and may be lower than the metal protrusion 11.

The circuit pattern 40 is formed of a material having high electrical conductivity and low resistance, and may be formed by patterning a copper foil, which is a thin copper layer, as a conductive layer.

The circuit pattern 40 may be silver or aluminum plated with a thin copper layer as a seed layer.

On the other hand, the metal protrusion 11 of the metal plate 10 is a heating element mounting pad, the solder 50 for mounting on the metal protrusion 11 is formed, the heating element (on the solder 50) 60) is formed.

The solder 50 may be formed by applying a flexible or lead-free solder (50) cream on the metal protrusions 11, mounting the heat generating element 60, and heat treatment.

The heating element 60, for example, a light emitting element such as a light emitting diode package on the metal protrusion 11 may be electrically connected to the circuit pattern 40 by bonding the wire 65. On the other hand, the heating element 60 may be mounted by flip chip bonding.

In this way, the upper surface of the metal protrusion 11 is exposed to the outside by the insulating layer 20 and used as a mounting pad of the heating element 60, thereby forming a lower mounting plate without forming a separate mounting pad ( Direct connection with 10) is possible, so heat dissipation is improved.

In addition, by forming a side insulating layer 30 surrounding the side surface of the metal protrusion 11 from the insulating layer 20, it is possible to ensure electrical insulation between the metal protrusion 11 and the adjacent circuit pattern 40. have.

Hereinafter, a method of manufacturing the heat dissipation circuit board of FIG. 2 will be described with reference to FIGS. 3 to 16.

3 to 9 are cross-sectional views illustrating a first method for manufacturing the heat dissipation circuit board of FIG. 2.

First, a metal disc 10a is prepared as shown in FIG. 3, and a metal protrusion 11 and a metal plate 10 are formed on the disc 10a as shown in FIG. 4.

In this case, the metal disc 10a may be one of alloys including copper, aluminum, nickel, gold, platinum, and the like having good thermal conductivity.

The metal protrusion 11 has a first width d1, and the metal disc 10a may be formed by a predetermined molding through a rolling process, or may be formed by etching the metal disc 10a.

In this case, the height of the metal protrusion 11 is formed to be equal to or greater than the thickness of the insulating layer 20 in consideration of the thickness of the insulating layer 20 to be formed later.

Next, as shown in FIG. 5, an insulating layer 20 is formed on the metal plate 10.

The insulating layer 20 may be formed by applying a prepreg in which a solid component 21 such as tempered glass, glass glass, or filler is impregnated into a resin such as an epoxy resin, on the metal plate 10.

In this case, the prepreg is formed to have an opening 20a exposing the metal protrusion 11.

The opening 20a is formed to have a second width d2 greater than the first width d1 of the metal protrusion 11, and a distance from the side surface of the opening 20a to the metal protrusion 11. (Δd) satisfies the following equation.

[Equation]

Δd = (d2-d1) / 2

The separation distance Δd is the metal protrusion as the resin of the prepreg flows toward the metal protrusion 11 by thermocompression when the laminate structure including the copper foil layer 45 is thermocompressed on the prepreg. It is equal to the thickness of the side insulating layer 30 formed surrounding the side of (11).

In this case, the prepreg may be formed to have a different distance Δd from the metal protrusion 11 according to the difference when the opening 20a of the prepreg and the metal protrusion 11 are aligned.

On the other hand, the second width (d2) of the opening (20a) may have a size of at least 30 times or more with respect to the thickness of the prepreg, and may vary according to the temperature and pressure of the thermocompression bonding.

Next, the copper foil layer 45 is prepared as shown in FIG. 6.

The copper foil layer 45 of FIG. 6 is formed to have the copper foil opening part 45a.

That is, the copper foil layer 45 includes the copper foil opening 45a formed to have a second width d2 equal to the width of the opening 20a of the insulating layer 20.

The copper foil opening 45a may be formed by physical processing, and may be formed by drilling or laser processing.

Next, as shown in FIG. 7, the copper foil opening 45a is positioned on the insulating layer 20 while aligning the copper foil opening 45a to expose the metal protrusion 11 protruding above the insulating layer 20. Integrate by thermal compression.

Therefore, the thickness of the insulating layer 20 is formed to be equal to or lower than the height of the metal protrusion 11.

At this time, the prepreg constituting the insulating layer 20 is cured by thermocompression bonding of the copper foil layer 45 and the metal plate 10, and resin is moved from the prepreg toward the metal protrusion 11 by pressure during thermocompression bonding. By filling, resin fills the opening portion 20a and the copper foil opening portion 45a of the insulating layer 20.

The resin of the prepreg is cured to fill the opening 20a of the insulating layer 20 and the opening 45a of the copper foil layer 45, thereby extending from the insulating layer 20 and surrounding the metal protrusion 11. The side insulating layer 30 is formed, and the insulating layer 20 other than the side insulating layer 30 is cured by mixing the resin and the solid component 21.

In this case, as shown in FIG. 7, when a part of the resin 30a covers the upper surface of the metal protrusion 11 and the upper surface of the copper foil layer 45, the upper surface of the metal protrusion 11 and the copper foil layer 45 as shown in FIG. 8. ) The resin is removed to expose the top surface. The process of exposing the upper surface of the metal protrusion 11 and the copper foil layer 45 may be performed through a desmear process for removing the smear of the insulating layer 20.

Next, as shown in FIG. 9, the copper foil layer 45 is etched to form a predetermined circuit pattern 40, and the circuit pattern 40 may be plated with silver or aluminum.

In the heat dissipation circuit board 100 formed as shown in FIG. 9, the metal protrusion 11 directly exposing the insulating layer 20 and directly connected to the lower metal plate 10 functions as a mounting pad of the heating element 60. As a result, the heat emitted from the heat generating element 60 is transferred directly to the metal plate 10, thereby increasing the thermal efficiency.

In this structure, when the heat dissipation circuit board 100 is manufactured, the insulating layer 20 is formed to have an opening 20a larger than the metal protrusion 11, and then the resin of the insulating layer 20 flows by side by thermal compression to form side insulation. Layer 30 may be formed.

Therefore, the electrical insulation between the metal protrusion 11 and the adjacent circuit pattern 40 is ensured by the side insulating layer 30.

The heat dissipation circuit board 100 is used as a light source for a backlight or a light source for lighting, and in particular, when mounting a light emitting diode package having a large heat emission and using the same for a backlight light source or an illumination light source, the heat radiated from the light emitting diode package is used. The upper surface area of the metal protrusions 11 discharged to the outside through the metal protrusions 11 is secured to increase heat dissipation and adhesiveness, and insulation is secured by the side insulating layer 30 to increase reliability.

Meanwhile, the heat dissipation circuit board 100 of FIG. 2 may also be formed by a method different from those of FIGS. 3 to 9.

Hereinafter, another method of manufacturing the heat dissipation circuit board of FIG. 2 will be described with reference to FIGS. 10 to 16.

First, a metal disc 10a is prepared as shown in FIG. 10, and a metal protrusion 11 and a metal plate 10 are formed on the disc 10a as shown in FIG. 11.

In this case, the metal disc 10a may be one of alloys including copper, aluminum, nickel, gold, platinum, and the like having good thermal conductivity.

The metal protrusions 11 may be formed by forming a metal disc 10a by a predetermined molding through a rolling process, or by etching the metal disc 10a.

In this case, the height of the metal protrusion 11 is formed to be equal to or greater than the thickness of the insulating layer 20 in consideration of the thickness of the insulating layer 20 to be formed later.

Next, as shown in FIG. 12, an insulating layer 20 including the copper foil layer 45 is prepared.

The structure of the insulating layer 20 including the copper foil layer 45 may be a conventional cupper clad laminate (CCL). Alternatively, the insulating layer 20 may be formed by applying the insulating layer 20 in a paste state on the copper foil layer 45. have.

The insulating layer 20 may be a prepreg in which tempered glass, glass glass, or filler is impregnated with a resin such as an epoxy resin.

In this case, the prepreg is formed to have an opening 20a exposing the metal protrusion 11, and the copper foil layer 45 also includes a copper foil opening 45a aligned with the opening 20a. The opening 20a and the copper foil opening 45a may be formed through chemical etching or laser etching, or may be formed through physical processing, for example, punching.

The openings 20a and the copper foil openings 45a are formed to have a second width d2 greater than the first width d1 of the metal protrusion 11, and the metals are formed from side surfaces of the openings 20a and 45a. The separation distance Δd to the projection 11 satisfies the following equation.

[Equation]

Δd = (d2-d1) / 2

The separation distance Δd is such that when the laminated structure is thermally compressed with the insulating plate 10, the resin of the prepreg flows toward the metal protrusion 11 by thermocompression, and thus the side surface of the metal protrusion 11 is removed. It is equal to the width of the side insulating layer 30 formed surrounding.

On the other hand, the second width (d2) of the opening (20a) may have a size of at least 30 times or more with respect to the thickness of the prepreg, and may vary according to the temperature and pressure of the thermocompression bonding.

Next, as shown in FIG. 13, the opening 20a and the copper foil opening 45a of the insulating layer 20 are thermally compressed and integrated while being aligned to expose the metal protrusion 11.

At this time, the prepreg constituting the insulating layer 20 is cured by thermocompression bonding of the insulating layer 20 and the metal plate 10, and resin flows from the prepreg toward the metal protrusion 11. The opening part 20a of the 20 and the said copper foil opening part 45a are filled.

The resin is cured in a state in which the opening 20a of the insulating layer 20 is filled, thereby forming a side insulating layer 30 extending from the insulating layer 20 and surrounding the metal protrusions 11. The insulating layer 20 other than the layer 30 mixes and hardens resin and the solid component 21.

At this time, when a part 30a of the resin of the side insulating layer 30 covers the upper surface of the metal protrusion 11 as shown in FIG. 13, the resin is removed to expose the upper surface of the metal protrusion 11 as shown in FIG. 14. As a result, the height of the side insulating layer 30 and the height of the metal protrusion 11 are formed to be the same.

The process of exposing the upper surface of the metal protrusion 11 may be performed through a desmear process for removing the smear of the insulating layer 20.

Next, as shown in FIG. 15, the copper foil layer 45 on the insulating layer 20 is etched in a predetermined pattern to form a circuit pattern 40, and the upper surface of the metal protrusion 11 exposed as shown in FIG. 16. The solder 50 cream is applied to the heat treatment, and the heat generating element 60 may be mounted and heat treated as shown in FIG. 2.

The heat dissipation circuit board 100 formed as shown in FIG. 16 exposes the insulating layer 20 and the metal protrusions 11 directly connected to the lower metal plate 10 function as mounting pads of the heating element 60. As a result, the heat emitted from the heat generating element 60 is transferred directly to the metal plate 10, thereby increasing the thermal efficiency.

Hereinafter, a heat dissipation circuit board according to a second embodiment of the present invention will be described with reference to FIG. 17.

17 is a cross-sectional view of a heat radiation circuit board according to a second embodiment of the present invention.

Referring to FIG. 17, the heat dissipation circuit board 200 according to the second embodiment of the present invention may include a metal plate 10, an adhesive layer 15 formed on the metal plate 10, and an insulation layer formed on the adhesive layer 15. A circuit pattern 40 formed over the layer 20.

The metal plate 10 may be one of alloys including copper, aluminum, nickel, gold, platinum, or the like having good thermal conductivity.

The metal plate 10 includes a metal protrusion 11 for mounting the heat generating element 60.

The metal protrusion 11 extends from the metal plate 10 and protrudes vertically, and has a first width so as to have a predetermined area in which a solder 50 for mounting the heating element 60 may be located. d1) and formed.

An adhesive layer 15 is formed on the metal plate 10.

The adhesive layer 15 is to increase the adhesive force between the metal protrusions 11 protruding from the metal plate 10 and the solder 50, and an alloy including copper, which is a good adhesive force with the solder 50, is preferable. For example, it may be a plating layer obtained by plating the metal plate 10 with an alloy containing copper or nickel.

The insulating layer 20 is stacked on the adhesive layer 15 of the metal plate 10.

The insulating layer 20 includes an epoxy-based insulating resin having a low thermal conductivity (about 0.2 to 0.4 W / mk). Alternatively, the insulating layer 20 may include a polyimide resin having a relatively high thermal conductivity.

The insulating layer 20 may be formed by curing a prepreg formed by impregnating the resin with a solid component 21 such as reinforcing fiber, glass fiber, or filler.

At this time, the side insulating layer including only the resin, not including the solid component 21, extending from the insulating layer 20 in the region proximate to the metal protrusion 11 and surrounding the metal protrusion 11. 30 is formed.

The side insulating layer 30 is formed at the same height as the height of the metal protrusion 11.

The circuit pattern 40 is formed by patterning a conductive layer stacked on the insulating layer 20.

On the other hand, the metal protrusion 11 of the metal plate 10 is a heating element mounting pad, the solder 50 for mounting on the metal protrusion 11 is formed, the heating element (on the solder 50) Not shown) is formed.

The solder 50 may be formed by applying a flexible or lead-free solder (50) cream on the metal protrusions 11, mounting the heat generating element (not shown), and then performing heat treatment.

The heat generating element, for example, a light emitting element such as a light emitting diode package on the metal protrusion 11 may be electrically connected to the circuit pattern 40 by wire bonding. On the other hand, the heating element 60 may be mounted by flip chip bonding.

As such, the upper surface of the metal protrusion 11 is exposed to the outside and used as a mounting pad of the heating element 60, so that a direct connection with the metal plate 10 is possible without forming a separate mounting pad. Heat dissipation becomes high.

In addition, a circuit adjacent to the metal protrusion 11 is formed by forming a side insulating layer 30 in which the solid component 21 is not formed in an area extending from the insulating layer 20 and surrounding the metal protrusion 11. Insulation between patterns can be ensured.

In addition, the adhesive layer 15 may be formed on the metal protrusion 11 by plating to secure adhesion to the solder 50.

It is apparent that the heat dissipation circuit board shown in FIG. 17 can also be manufactured by the method described with reference to FIGS. 3 to 16.

As such, the heat dissipation circuit board of the present invention compensates for errors that may occur in the manufacturing process to secure insulation between the metal protrusions and the adjacent circuit patterns.

Hereinafter, a heat dissipation circuit board to which the present invention is applied will be described with reference to FIG. 18.

18 is a cross-sectional view illustrating an application example of the heat dissipation circuit board of FIG. 2.

Referring to FIG. 18, the heat dissipation circuit board 200 according to the present invention includes a metal plate 110 and a circuit pattern 140 formed on the insulating layer 120 formed on the metal plate 110. The configuration is as shown in FIG.

The insulating layer 120 may be formed by curing a prepreg formed by impregnating the resin with a solid component 121 such as reinforcing fiber, glass fiber, or filler.

In this case, the insulating layer 120 extends from the insulating layer 120 to a region adjacent to the metal protrusion 111 to surround the metal protrusion 111 and does not include the solid component 21 and includes only the resin. 130 is formed.

The side insulating layer 130 is formed at the same height as the height of the metal protrusion 111.

On the other hand, the metal protrusion 111 of the metal plate 110 is a heating element 160 mounting pad, the solder 150 for mounting on the metal protrusion 111 or the circuit pattern 140 is formed, The heating element 160 is formed on the solder 150.

In this case, the heat dissipation circuit board 200 of FIG. 18 may have different steps between left and right sides of the metal protrusions 111 due to processing variations when the insulating plate 110 is processed.

The manufacturing process of the heat dissipation circuit board 200 of FIG. 18 is as follows.

The copper foil layer for forming the prepreg of the insulating layer 120 and the circuit pattern 140 is thermally compressed with the insulating plate 110 as shown in FIGS. 3 to 16 to form openings of the insulating layer 120 and the copper foil layer. The side insulating layer 130 is formed by filling with resin of the prepreg.

At this time, when the steps are different from each other, the thickness of the insulating layer 120 is formed differently by thermocompression so that the height of the insulating layer 120 is kept constant. Next, when the resin covering the metal protrusion 111 and the copper foil layer is removed and the copper foil layer is etched to form the circuit pattern 140, the circuit patterns 140 may be formed at the same height on both sides.

Therefore, when the circuit patterns 140 on both sides have different heights, when the solder 150 is formed and the heating element 160 is attached, the force acts asymmetrically to prevent the incomplete attachment process. have.

In addition, despite the process variation, the heights of the circuit patterns 140 and the metal protrusions 111 are the same, so that the insulation between the metal protrusions 111 and the adjacent circuit patterns 140 by the side insulating layer 130 is maintained. Can be secured.

Hereinafter, the effects of the heat radiation circuit board according to the present invention will be described with reference to FIGS. 19A and 19B.

19a is a photograph of the control group for the present invention, and FIG. 19b is a photograph of the top surface of the heat dissipation circuit board of FIG. 2.

FIG. 19A shows that, unlike the heat dissipation circuit board of the present invention, an insulating prepreg is applied to a metal plate on which metal protrusions are formed, and the openings exposing the metal protrusions have a width equal to the width of the metal protrusions, and a post-process. The upper surface in the case of not performing this is shown.

When there is no free space between the opening and the metal protrusion as in the heat dissipation circuit board of FIG. 19A, when the prepreg is thermally compressed, the resin of the prepreg rises through the metal protrusion to reduce the exposed area of the metal protrusion.

On the other hand, when the insulating layer 20 is formed such that the heat dissipation circuit board 100 of FIG. 2 has an opening 20a wider than the width of the metal protrusion 11, the thermal compression of the insulating layer 20 is performed. Later, while forming the side insulating layer 30 on the side of the metal projection 11, by exposing the upper surface of the metal projection 11 by a post-process to ensure the area of the metal projection 11 as shown in Figure 18b You can check it.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

Heat Dissipation Circuit Board 100, 200
Metal plate 10
Circuit pattern 40
Metal turning 11
Heating element 60
Insulation layer 20
Side insulation layer 30

Claims (15)

In a heat radiation circuit board for mounting a heat generating element,
Metal plate containing metal protrusions,
An insulating layer formed on the metal plate to expose the metal protrusions and having a solid component impregnated in the insulating resin;
A side insulating layer extending from the insulating layer and formed to surround a side surface of the metal protrusion;
A heat radiation circuit board comprising a circuit pattern formed on the insulating layer. The method of claim 1,
And the side insulating layer extends from the insulating layer and surrounds the metal protrusion and is formed of the resin only. The method of claim 2,
The side insulation layer is a heat radiation circuit board having the same height as the height of the metal projection. The method of claim 1,
The solid component is a heat radiation circuit board comprising a reinforcing fiber, glass fiber or filler. The method of claim 1,
The circuit pattern is a heat radiation circuit board having the same height as the metal projection. The method of claim 1,
And a solder for mounting the heat generating element on the metal protrusion. The method of claim 1,
A heat dissipation circuit board having different thicknesses of the metal plate around the metal protrusions. The method of claim 1,
A heat dissipation circuit board having different thicknesses of the insulation layer around the metal protrusions. Forming a metal plate comprising metal protrusions with respect to the metal disc,
Forming a prepreg in which a solid component is impregnated in the resin to expose the metal protrusions on the metal plate and have a first opening having a width wider than the width of the metal protrusions;
Forming a copper foil layer having a second opening having the same width as the opening on the prepreg, and
And thermally compressing the prepreg and the copper foil layer to fill the first and second openings to form a side insulating layer surrounding the metal protrusions. 10. The method of claim 9,
And the side insulating layer is formed by filling the first and second openings with resin flowing from the prepreg by the thermocompression bonding. The method of claim 10,
The manufacturing method of the heat dissipation circuit board,
And patterning the copper foil layer formed on the insulating layer to form a circuit pattern. 10. The method of claim 9,
The solid component is a method of manufacturing a heat radiation circuit board comprising a reinforcing fiber, glass fiber or filler. 10. The method of claim 9,
Forming the side insulating layer,
And thermally compressing the prepreg, and removing the resin covering the top surface of the metal protrusion to expose the top surface of the metal protrusion. 10. The method of claim 9,
And forming a solder for mounting a heating element on an upper surface of the metal protrusion. 10. The method of claim 9,
Forming the prepreg and the copper foil layer,
Forming the first opening and the second opening in the laminated structure of the prepreg and the copper foil layer, and
Forming the laminated structure on the metal plate
Method for manufacturing a heat radiation circuit board comprising a.

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