CN114258192A - Circuit board with high reflectivity and manufacturing method thereof - Google Patents
Circuit board with high reflectivity and manufacturing method thereof Download PDFInfo
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- CN114258192A CN114258192A CN202011009995.XA CN202011009995A CN114258192A CN 114258192 A CN114258192 A CN 114258192A CN 202011009995 A CN202011009995 A CN 202011009995A CN 114258192 A CN114258192 A CN 114258192A
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- 238000002310 reflectometry Methods 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 18
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 239000003365 glass fiber Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 11
- 238000009713 electroplating Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims 2
- 239000000463 material Substances 0.000 description 14
- 238000007747 plating Methods 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- -1 polyethylene terephthalate Polymers 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 4
- 239000011112 polyethylene naphthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a circuit board with high reflectivity, which comprises an inner layer circuit board, a substrate with high reflectivity, a first insulating layer, a first circuit layer, a second insulating layer and a second circuit layer. The inner layer circuit board is provided with a first opening, and the substrate with high reflectivity is fixed in the first opening. The first insulating layer is stacked on one side of the inner-layer circuit board and provided with a second opening corresponding to the first opening, and at least part of the substrate with high reflectivity is exposed out of the second opening. The first circuit layer is positioned on one side of the first insulating layer, which is deviated from the inner-layer circuit board, and comprises a plurality of connecting pads arranged on the substrate with high reflectivity. The second insulating layer is stacked on the other side of the inner-layer circuit board. The second circuit layer is located on one side, away from the inner circuit board, of the second insulating layer. The invention also provides a manufacturing method of the circuit board with high reflectivity.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a circuit board with high reflectivity and a manufacturing method thereof.
Background
In the manufacture of the mini LED backlight plate, an LED lamp is arranged on a component printing area of a circuit board through a surface mounting technology. The higher the reflectivity of the circuit board is, the higher the light emitting efficiency of the LED lamp is. The reflectivity of the circuit board is generally improved by covering the surface of the circuit board with a solder mask layer with high reflectivity. However, the dielectric layer used for adding layers in the printing area at present has low reflectivity, and cannot achieve the effect of consistent reflectivity with the external solder mask, thereby affecting the luminous efficiency and the luminous uniformity of the mini LED backlight plate.
Disclosure of Invention
Accordingly, there is a need for a circuit board with high reflectivity and a method for fabricating the same.
One embodiment of the invention provides a circuit board with high reflectivity, which comprises an inner-layer circuit board, a substrate with high reflectivity, a first insulating layer, a first circuit layer, a second insulating layer and a second circuit layer. The inner layer circuit board is provided with a first opening, and the substrate with high reflectivity is fixed in the first opening. The first insulating layer is stacked on one side of the inner-layer circuit board and provided with a second opening corresponding to the first opening, and at least part of the substrate with high reflectivity is exposed out of the second opening. The first circuit layer is positioned on one side of the first insulating layer, which is deviated from the inner-layer circuit board, and comprises a plurality of connecting pads arranged on the substrate with high reflectivity. The second insulating layer is stacked on the other side of the inner-layer circuit board. The second circuit layer is located on one side, away from the inner circuit board, of the second insulating layer.
An embodiment of the present invention provides a method for manufacturing a circuit board with high reflectivity, including the following steps: providing an inner-layer circuit board, wherein the inner-layer circuit board is provided with a first opening; fixing a substrate with high reflectivity in the first opening, and respectively pressing the first substrate and the second substrate on two opposite surfaces of the inner-layer circuit board to obtain a laminated structure; and respectively forming a first circuit layer and a second circuit layer on two opposite surfaces of the laminated structure, wherein the first circuit layer comprises a plurality of connecting pads, and the connecting pads are positioned on the substrate with high reflectivity.
In the circuit board with high reflectivity provided by the embodiment of the invention, the connecting pad for connecting the light-emitting element is arranged on the substrate with high reflectivity, so that the reflectivity of the position is improved, and the light-emitting efficiency of the light-emitting element is improved.
Drawings
Fig. 1 is a cross-sectional view of an inner layer circuit board according to an embodiment of the present invention.
Fig. 2 is a sectional view of the inner-layer wiring board shown in fig. 1 after a first substrate and a second substrate are provided above and below the inner-layer wiring board, respectively.
Fig. 3 is a cross-sectional view of a laminated structure formed by pressing the structures shown in fig. 2 together.
Fig. 4 is a cross-sectional view after forming a conductive via on the laminated structure shown in fig. 3.
Fig. 5 is a cross-sectional view after forming an outer layer wire on the structure shown in fig. 4.
Fig. 6 is a cross-sectional view after forming a connection pad on the structure shown in fig. 5.
Fig. 7 is a cross-sectional view of the structure shown in fig. 6 after a solder mask layer is formed thereon.
Description of the main elements
Inner layer wiring board 10
Insulating layer 11
Inner layer wiring layer 13
Laminated structure 70
First insulating layer 51
Epoxy resin 513
Second insulating layer 61
Projecting part 33
Second electroplated layer 84
Connecting pad 815
Solder resist layer 90
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Referring to fig. 1 to 7, a method for manufacturing a circuit board with high reflectivity according to an embodiment of the present invention includes the following steps:
in step S1, please refer to fig. 1, an inner layer circuit board 10 is provided.
The inner layer circuit board 10 includes an insulating layer 11 and two inner layer circuit layers 13 disposed on two opposite surfaces of the insulating layer 11. One of the inner circuit layers 13 has a first opening 131, and the insulating layer 11 is exposed from the first opening 131.
The material of the insulating layer 11 may be, but is not limited to, Prepreg (preprg, PP) containing glass fiber and epoxy resin, polyimide, polyethylene terephthalate, or polyethylene naphthalate. In the present embodiment, the insulating layer 11 is made of a prepreg containing glass fibers and epoxy resin.
The material of the inner circuit layer 13 may be, but is not limited to, a metal, such as copper, silver, or an alloy thereof. In this embodiment, the material of the inner layer circuit layer 13 is copper.
In this embodiment, step S1 specifically includes the following steps:
providing a double-sided copper-clad plate, wherein the double-sided copper-clad plate comprises an insulating layer 11 and two copper layers arranged on two opposite surfaces of the insulating layer 11;
and (3) carrying out punching, metallization treatment and image transfer processes on the double-sided copper-clad plate to obtain the inner-layer circuit board 10.
In step S2, referring to fig. 2 and fig. 3, a substrate 30 with high reflectivity is fixed in the first opening 131, and the first substrate 50 and the second substrate 60 are respectively pressed on two opposite surfaces of the inner layer circuit board 10, so as to obtain a stacked structure 70. The substrate 30 having high reflectivity is buried in the laminated structure 70.
The first substrate 50 faces the substrate 30 having high reflectivity. The first substrate 50 includes a first insulating layer 51 and a first metal layer 53 that are laminated. The first insulating layer 51 defines a second opening 511 corresponding to the first opening 131. The first insulating layer 51 covers one inner circuit layer 13, and at least a portion of the substrate 30 with high reflectivity is exposed from the second opening 511. The first metal layer 53 covers the first insulating layer 51 and the substrate 30 having a high reflectivity.
The second substrate 60 includes a second insulating layer 61 and a second metal layer 63 which are stacked. The second insulating layer 61 covers the other inner wiring layer 13 and is connected to the insulating layer 11.
The first insulating layer 51 and the second insulating layer 61 may be made of, but not limited to, Prepreg (Prepreg, PP) including glass fiber and epoxy resin, polyimide, polyethylene terephthalate, or polyethylene naphthalate. In the present embodiment, the material of the first insulating layer 51 is a prepreg including glass fibers 512 and an epoxy resin 513. The material of the first metal layer 53 and the second metal layer 63 may be, but not limited to, copper, silver, or an alloy thereof. In this embodiment, the first metal layer 53 and the second metal layer 63 are both made of copper.
The substrate 30 having a high reflectance is substantially in an inverted T shape, and includes a plate portion 31 and a protrusion 33 formed at one side of the plate portion 31. The plate body portion 31 is accommodated in the first opening 131. The size of the plate body 31 matches the size of the first opening 131, and the edge of the plate body 31 contacts the side wall of the first opening 131. In this embodiment, the thickness of the plate body portion 31 is the same as the depth of the first opening 131, so that the surface of the plate body portion 31 facing away from the insulating layer 11 is flush with the surface of the inner wiring layer 13 having the first opening 131 facing away from the insulating layer 11.
The protrusion 33 has a size matching the size of the second opening 511, so that the protrusion 33 can pass through the second opening 511 when press-fitting. The protrusion 33 includes a mounting surface 331 facing away from the plate portion 31. The edge of the protrusion 33 is spaced from the edge of the plate body 31 by a predetermined distance to form a dam structure 32 for blocking the melted epoxy resin from overflowing to the mounting surface 331 of the protrusion 33 when the first insulating layer 51 is laminated. After the lamination, the first insulating layer 51 covers an inner circuit layer 13, and the glass fiber 512 does not contact the substrate 30 with high reflectivity, and the epoxy 513 fills the dam structure 32. The surface of the first insulating layer 51 facing away from the inner wiring layer 13 is flush with the mounting surface 331 of the protrusion 33.
The material of the substrate 30 having high reflectivity may be, but is not limited to, ceramic. In some embodiments, the substrate 30 having high reflectivity has a reflectivity of 92% to 97%.
In step S3, referring to fig. 4 to fig. 6, a first circuit layer 81 and a second circuit layer 83 are respectively formed on two opposite surfaces of the laminated structure 70. The first circuit layer 81 includes a plurality of circuit patterns 813 and a plurality of connection pads 815, and the plurality of circuit patterns 813 are located on the first insulating layer 51. The plurality of connection pads 815 are located on the mounting surface 331 and electrically connected to the plurality of circuit patterns 813. The second wiring layer 83 is located on the second insulating layer 61. The connection pads 815 are used to electrically connect electronic components, such as light emitting elements.
In the present embodiment, step S3 specifically includes the following steps S31 to S33.
Step S31, forming a through hole (not shown) on the laminated structure 70, and electroplating the laminated structure 70 to form a first plating layer 82, a second plating layer 84, and a conductive via 74, the conductive via 74 connecting the first plating layer 82, the second plating layer 84, and the two inner layer wiring layers 13. The first plating layer 82 covers a side of the first metal layer 53 facing away from the second metal layer 63, and the second plating layer 84 covers a side of the second metal layer 63 facing away from the first metal layer 53. The conductive vias 74 are formed by plating the vias.
The through-holes penetrate through both opposite surfaces of the laminated structure 70. The through holes may be formed by, but are not limited to, laser or mechanical drilling. The number of the through holes can be set according to actual needs. In this embodiment, the number of the through holes is two, and the two through holes are located at both sides of the substrate 30 having high reflectivity.
The material used for electroplating may be, but is not limited to, copper, silver, or alloys thereof. In this embodiment, the material used for plating is copper.
In step S32, the first plating layer 82 and the first metal layer 53 are etched to form a plurality of wiring patterns 813, and the second plating layer 84 and the second metal layer 63 are etched to form a second wiring layer 83. The mounting surface 331 is exposed outside the plurality of circuit patterns 813.
In step S33, a plurality of connection pads 815 are formed on the mounting surface 331. The plurality of bonding pads 815 may be formed using a conventional semi-additive process (MSAP). In this embodiment, the bonding pad 815 is made of copper.
In step S4, referring to fig. 7, a solder resist layer 90 is formed on the outer sides of the first circuit layer 81 and the second circuit layer 83, and the mounting surface 331 is exposed outside the solder resist layer 90. A plurality of connection pads 815 located on the mounting surface 331 are used to connect with the light emitting device 200.
The solder resist layer 90 covers the exposed surfaces of the plurality of wiring patterns 813, the first insulating layer 51, the second wiring layer 83, and the second insulating layer 61, and fills the conductive holes 74. The solder resist layer 90 may be formed by a conventional photolithography technique using a material having a high reflectivity. In some embodiments, the reflectivity of the solder mask layer 90 is 92% to 95%.
Referring to fig. 7, a circuit board 100 with high reflectivity according to an embodiment of the present invention includes an inner circuit board 10, a substrate 30 with high reflectivity, a first insulating layer 51, a first circuit layer 81, a second insulating layer 61, and a second circuit layer 83. The inner layer circuit board 10 is provided with a first opening 131, and the substrate 30 with high reflectivity is fixed in the first opening 131. The first insulating layer 51 is stacked on one side of the inner wiring board 10. The first insulating layer 51 defines a second opening 511 corresponding to the first opening 131, and at least a portion of the substrate 30 with high reflectivity is exposed from the second opening 511. The first circuit layer 81 is located on a side of the first insulating layer 51 away from the inner wiring board 10, and includes a plurality of connection pads 815 disposed on the substrate 30 with high reflectivity. The second insulating layer 61 is stacked on the other side of the inner-layer circuit board 10, and the second circuit layer 83 is located on one side of the second insulating layer 61 departing from the inner-layer circuit board 10.
The inner layer circuit board 10 includes an insulating layer 11 and two inner layer circuit layers 13 disposed on two opposite surfaces of the insulating layer 11. One of the inner circuit layers 13 has a first opening 131, and the insulating layer 11 is exposed from the first opening 131.
The material of the insulating layer 11 may be, but is not limited to, Prepreg (preprg, PP) containing glass fiber and epoxy resin, polyimide, polyethylene terephthalate, or polyethylene naphthalate. In the present embodiment, the insulating layer 11 is made of a prepreg containing glass fibers and epoxy resin.
The material of the inner circuit layer 13 may be, but is not limited to, a metal, such as copper, silver, or an alloy thereof. In this embodiment, the material of the inner layer circuit layer 13 is copper.
The first insulating layer 51 covers one inner wiring layer 13. The first insulating layer 51 has a second opening 511. The second insulating layer 61 covers the other inner wiring layer 13 and is connected to the insulating layer 11.
The first insulating layer 51 and the second insulating layer 61 may be made of, but not limited to, Prepreg (Prepreg, PP) including glass fiber and epoxy resin, polyimide, polyethylene terephthalate, or polyethylene naphthalate. In this embodiment, the first insulating layer 51 includes glass fibers 512 and an epoxy resin 513.
The substrate 30 having a high reflectance is substantially in an inverted T shape, and includes a plate portion 31 and a protrusion 33 formed at one side of the plate portion 31. The plate body portion 31 is accommodated in the first opening 131. The size of the plate body 31 matches the size of the first opening 131, and the edge of the plate body 31 contacts the side wall of the first opening 131. In this embodiment, the thickness of the plate body portion 31 is the same as the depth of the first opening 131, so that the surface of the plate body portion 31 facing away from the insulating layer 11 is flush with the surface of the inner wiring layer 13 having the first opening 131 facing away from the insulating layer 11.
The protrusion 33 has a size matching the size of the second opening 511, so that the protrusion 33 can pass through the second opening 511 when press-fitting. The protrusion 33 includes a mounting surface 331 facing away from the plate portion 31. The edge of the protrusion 33 is spaced from the edge of the plate body 31 by a predetermined distance to form a dam structure 32 for blocking the melted epoxy resin from overflowing to the mounting surface 331 of the protrusion 33 when the first insulating layer 51 is laminated. The glass fiber 512 is not in contact with the substrate 30 having high reflectivity, and the epoxy 513 fills the dam structure 32. The surface of the first insulating layer 51 facing away from the inner wiring layer 13 is flush with the mounting surface 331 of the protrusion 33.
The material of the substrate 30 having high reflectivity may be, but is not limited to, ceramic. In some embodiments, the substrate 30 having high reflectivity has a reflectivity of 92% to 97%.
The first circuit layer 81 further includes a plurality of circuit patterns 813, the plurality of circuit patterns 813 are located on the first insulating layer 51, and the mounting surface 331 is exposed outside the plurality of circuit patterns 813.
The plurality of connection pads 815 are located on the mounting surface 331 and electrically connected to the plurality of circuit patterns 813. In this embodiment, the bonding pad 815 is made of copper.
In some embodiments, the circuit board 100 with high reflectivity further includes a conductive via 74, the conductive via 74 electrically connecting the first plating layer 82, the second plating layer 84 and the two inner wiring layers 13.
In some embodiments, the circuit board 100 with high reflectivity further includes a solder mask layer 90. The solder resist layer 90 is provided on the outer sides of the first circuit layer 81 and the second circuit layer 83, and the mounting surface 331 is exposed to the outside of the solder resist layer 90. A plurality of connection pads 815 located on the mounting surface 331 are used to connect with the light emitting device 200.
The solder resist layer 90 covers the exposed surfaces of the plurality of wiring patterns 813, the first insulating layer 51, the second wiring layer 83, and the second insulating layer 61, and fills the conductive holes 74. The solder resist layer 90 may be formed by a conventional photolithography technique using a material having a high reflectivity. In some embodiments, the reflectivity of the solder mask layer 90 is 92% to 95%.
In the circuit board 100 with high reflectivity according to the embodiment of the present invention, the connection pad 815 for connecting the light emitting device 200 is disposed on the substrate 30 with high reflectivity, so as to improve the reflectivity of the connection pad, thereby improving the light emitting efficiency of the light emitting device 200. And the reflectivity of the substrate 30 with high reflectivity is approximately consistent with the reflectivity of the solder mask 90, so as to improve the uniformity of the light output of the light-emitting element 200.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention.
Claims (10)
1. A circuit board with high reflectivity is characterized by comprising
The inner-layer circuit board is provided with a first opening;
a substrate having a high reflectivity, the substrate having a high reflectivity being fixed in the first opening;
the first insulating layer is stacked on one side of the inner-layer circuit board and provided with a second opening corresponding to the first opening, and at least part of the substrate with high reflectivity is exposed out of the second opening;
the first circuit layer is positioned on one side, away from the inner-layer circuit board, of the first insulating layer and comprises a plurality of connecting pads arranged on the substrate with high reflectivity;
the second insulating layer is stacked on the other side of the inner-layer circuit board; and
and the second circuit layer is positioned on one side of the second insulating layer, which deviates from the inner-layer circuit board.
2. The circuit board with high reflectivity according to claim 1, wherein the substrate with high reflectivity comprises a board body portion and a protrusion portion formed at one side of the board body portion, the board body portion is received in the first opening, and the protrusion portion is exposed from the second opening.
3. The circuit board with high reflectivity according to claim 2, wherein the edges of the protrusions are spaced a predetermined distance from the edges of the board body to form a column of dam structures, the first insulating layer includes glass fibers and epoxy resin, the epoxy resin fills the column of dam structures, and the glass fibers do not contact the substrate with high reflectivity.
4. The circuit board with high reflectivity according to claim 1, wherein the circuit board with high reflectivity further comprises a solder resist layer disposed outside the first circuit layer, the substrate with high reflectivity being exposed outside the solder resist layer.
5. The circuit board of claim 1, wherein the inner circuit board comprises an insulating layer and two inner circuit layers disposed on two opposite surfaces of the insulating layer, wherein one of the inner circuit layers has a first opening, and the insulating layer is exposed from the first opening.
6. A method for manufacturing a circuit board with high reflectivity is characterized by comprising the following steps:
providing an inner-layer circuit board, wherein the inner-layer circuit board is provided with a first opening;
fixing a substrate with high reflectivity in the first opening, and respectively pressing the first substrate and the second substrate on two opposite surfaces of the inner-layer circuit board to obtain a laminated structure;
and respectively forming a first circuit layer and a second circuit layer on two opposite surfaces of the laminated structure, wherein the first circuit layer comprises a plurality of connecting pads, and the connecting pads are positioned on the substrate with high reflectivity.
7. The method for manufacturing a circuit board with high reflectivity according to claim 6, wherein the first substrate includes a first insulating layer and a first metal layer which are stacked, the first insulating layer covers one side of the inner-layer circuit board and is provided with a second opening corresponding to the first opening, at least a part of the substrate with high reflectivity is exposed from the second opening, and the first metal layer covers the first insulating layer and the substrate with high reflectivity; the second substrate comprises a second insulating layer and a second metal layer which are stacked, and the second insulating layer covers the other side of the inner-layer circuit board.
8. The method for manufacturing a circuit board with high reflectivity according to claim 7, wherein the substrate with high reflectivity comprises a board body portion and a protrusion portion formed on one side of the board body portion, the board body portion is received in the first opening, and the protrusion portion is exposed from the second opening.
9. The method of manufacturing a circuit board having high reflectivity according to claim 8, wherein the edge of the protrusion is spaced apart from the edge of the board body by a predetermined distance to form a dam structure, the first insulating layer includes glass fibers and epoxy resin, the epoxy resin fills the dam structure, and the glass fibers do not contact the substrate having high reflectivity.
10. The method for manufacturing a circuit board having high reflectance according to claim 7, wherein the step of forming the first wiring layer and the second wiring layer on the opposite surfaces of the laminated structure, respectively, comprises:
forming a through hole on the laminated structure, and electroplating the laminated structure to form a first electroplating layer, a second electroplating layer and a conductive hole, wherein the conductive hole is connected with the first electroplating layer and the second electroplating layer;
etching the first electroplating layer and the first metal layer to form a plurality of circuit patterns, etching the second electroplating layer and the second metal layer to form a second circuit layer, and exposing at least part of the substrate with high reflectivity outside the plurality of circuit patterns;
a plurality of connection pads are formed on the exposed substrate having high reflectivity.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011009995.XA CN114258192B (en) | 2020-09-23 | 2020-09-23 | Circuit board with high reflectivity and manufacturing method thereof |
| US17/036,574 US11317506B2 (en) | 2020-06-24 | 2020-09-29 | Circuit board with high light reflectivity and method for manufacturing the same |
| US17/701,865 US11696393B2 (en) | 2020-06-24 | 2022-03-23 | Method for manufacturing circuit board with high light reflectivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011009995.XA CN114258192B (en) | 2020-09-23 | 2020-09-23 | Circuit board with high reflectivity and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN114258192A true CN114258192A (en) | 2022-03-29 |
| CN114258192B CN114258192B (en) | 2024-10-15 |
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| CN202011009995.XA Active CN114258192B (en) | 2020-06-24 | 2020-09-23 | Circuit board with high reflectivity and manufacturing method thereof |
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