KR100827310B1 - Printed Circuit Board and the method of manufacturing thereof - Google Patents

Abstract

Disclosed are a printed circuit board and a method of manufacturing the same. (a) providing a first bump layer in which the first bump is formed; (b) providing a second bump layer having a second bump having a receiving groove into which the first bump can be inserted; (c) a method of manufacturing a printed circuit board comprising disposing the first bump layer and the second bump layer on both sides of the insulating layer and compressing the first bump layer so as to be inserted into the receiving groove. It is possible to provide a printed circuit board and a method of manufacturing the same, which can be improved, fine line is implemented, and a process can be shortened.

Printed Circuit Boards, Bumps

Description

Printed Circuit Board and the method of manufacturing thereof

1 is a flow chart showing a printed circuit board manufacturing method according to an embodiment of the present invention.

Figure 2 is a cross-sectional view showing a printed circuit board manufacturing method according to an embodiment of the present invention.

Figure 3 is a flow chart showing a printed circuit board manufacturing method according to another embodiment of the present invention.

Figure 4 is a cross-sectional view showing a printed circuit board manufacturing method according to another embodiment of the present invention.

5 is a cross-sectional view of a printed circuit board according to a preferred embodiment of the present invention.

Figure 6 is a cross-sectional view showing the shape of the printed circuit board bump in accordance with a preferred embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

102: first metal layer 108: second metal layer

103: first bump 107: second bump

106: receiving groove 105: insulating layer

104: first bump layer 110: second bump layer

102 ', 108': Circuit pattern

201: first carrier layer 209: second carrier layer

202: first circuit pattern 208: second circuit pattern

203: first bump 207: second bump

206: receiving groove 205: insulating layer

204: First bump layer 210: Second bump layer

302 (a) and 302 (b): first circuit pattern

308 (a) and 308 (b): second circuit pattern

305: insulation layer

303: first bump 307: second bump

The present invention relates to a printed circuit board and a method of manufacturing the same.

In general, a printed circuit board drills a via hole on a core board such as a copper clad laminate (CCL) by mechanical drilling, etc., and adds an additive or subtractive method to the surface of the core board to form an inner layer circuit. To form. Next, a surface treatment and an insulating layer such as Resin Coated Copper (RCC) are laminated, and via holes are formed by laser drilling for interlayer electrical connection of the circuit pattern, and the surface of the via holes are plated, followed by an outer layer circuit on the surface of the laminated substrate. It is prepared by forming a.

Recently, due to the development of miniaturized and integrated electronic components, a technique for improving the performance of a high density interconnection (HDI) substrate applied with interlayer electrical conduction of a circuit pattern and microcircuit wiring for high density of a printed circuit board is required. In order to simplify the process and to manufacture multilayer printed circuit boards quickly and inexpensively by batch lamination, a method of connecting using bumps has been developed among methods of connecting without using a CNC drill process.

However, the conventional method using a metal bump (metal bump) is to place the molten material between the two metals in order to electrically connect the metals in the process of making bumps and connecting with the other layer, by melting and connecting them by heat There is a problem that heat resistance may not be good because of re-melting.

The present invention provides a printed circuit board and a method of manufacturing the same, which can reduce a process process using bumps and improve reliability.

According to one aspect of the invention, (a) providing a first bump layer is formed a first bump; (b) providing a second bump layer having a second bump having a receiving groove into which the first bump can be inserted; (c) disposing the first bump layer and the second bump layer on both sides of the insulating layer, and then compressing the first bump layer to insert the first bump into the receiving groove.

The method may further include forming a hole corresponding to the first bump and the second bump in the insulating layer in step (c).

In order to improve the electrical connection between the bumps, at least one of the first bump or the second bump may be coated with at least one material of silver, platinum, and gold on the surface thereof.

The first bump layer includes a first metal layer having a first bump formed thereon, and the second bump layer includes a second metal layer having a second bump formed thereon, and after step (c), at least one of the first metal layer and the second metal layer It is possible to manufacture a printed circuit board by a method further comprising the step (d) of forming a circuit pattern, wherein the metal layer may use a surface-roughening treatment of the surface in contact with the insulator.

The first bump layer includes a first carrier layer on which a first circuit pattern is formed, and the second bump layer includes a second carrier layer on which a second circuit pattern is formed, and after step (c), the first carrier layer and the A method of manufacturing a printed circuit board is provided, further comprising the step (d) of removing the second carrier layer, wherein the metal layer may use a surface-roughening treatment of the surface contacting the insulator. .

According to another aspect of the invention, the insulating layer; A first circuit pattern formed on one surface of the insulating layer; A second circuit pattern formed on the other surface of the insulating layer; A first bump extending from the first circuit pattern and penetrating the insulating layer; A second bump extending from the second circuit pattern and penetrating the insulating layer, wherein the second bump is formed with a receiving groove into which the first bump can be fitted so that the first circuit pattern and the second circuit pattern are electrically connected to each other. A printed circuit board is provided which can be interconnected. In this case, the first bump may be formed in at least one fin shape.

Other aspects, features, and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

Hereinafter, a preferred embodiment of a printed circuit board and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings, in the description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals. And duplicate description thereof will be omitted.

First, a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 and 2.

FIG. 1 is a flowchart illustrating a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention, wherein two bump layers and an insulating layer formed of bumps and metal layers are aligned and compressed to correspond to the first bumps and the second bumps. Disclosed is a step of manufacturing a printed circuit board.

2 is a cross-sectional view illustrating a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention, and schematically illustrates a process of forming a printed circuit board by crimping according to the flowchart of FIG. 1. Referring to FIG. 2, the first bump layer 104 including the first metal layer 102 and the first bump 103, the insulating layer 105, the second metal layer 108 and the second bump 107 are formed. 2 bump layer 110 and receiving groove 106 are shown.

Step S11 is a step of providing the first bump layer 104 including the first metal layer 102 having the first bump 103 formed on one surface thereof.

As the first metal layer 102 and the second metal layer 108 to implement a circuit pattern for transmitting an electrical signal, a metal having good electrical conductivity is used, and a representative example may include a copper plate. The first bump layer 104 or the second bump layer 110 may be manufactured using a mold by integrally forming the bumps 103 and 107 and the metal layers 102 and 108 or forming bumps using an inkjet method on the metal layer. It can manufacture by a method etc.

Step S12 is a step of providing a second bump layer 110 including a second metal layer 108 on which a second bump 107 having a receiving groove 106 corresponding to the first bump 103 is formed. .

The second bump 107 is characterized in that it has a receiving groove 106 of the shape that the first bump 103 can be fitted, the shape of the receiving groove 106 is variously modified according to the shape of the first bump. This is possible.

On the other hand, in order to further improve the reliability of the electrical fastening between the bumps, the surface of the first bump 103 and the second bump 107, the surface treatment, that is, the plating may be performed with a metal having good electrical conductivity. In general, in view of the use of copper as a bump material, plating may be performed with silver (Ag), platinum (Pt), gold (Au), or the like having better electrical conductivity.

Step S13 is a step of forming holes corresponding to the first bump 103 and the second bump 107 in the insulating layer 105 in advance. If the hole is formed in advance, the position can be more accurately matched at the time of fastening, and the reliability of the fastening between bumps can be increased. This step S13 may be performed by drilling, as well as may be performed through various methods as necessary.

In addition, the reliability of the coupling may be improved by surface roughening the contact surfaces of the first metal layer 102, the second metal layer 108, and the insulating layer 105. Surface roughening means roughening a surface for the purpose of increasing frictional force.

Step S14 is a step of aligning the first bump layer 104, the insulating layer 105, and the second bump layer 110 in order. The first bumps 103 and the second bumps 107 are aligned so as to be fitted into the receiving grooves 106 formed in the second bumps 107. FIG. 2A illustrates a state in which the first bumps 103 and the second bumps 107 are aligned to be aligned.

Step S15 is a step of compressing the first bump layer 104 and the second bump layer 110 so that the first bump 103 is fitted into the receiving groove 106 of the second bump. The first bumps 103 aligned through step S14 may be inserted into the receiving grooves 106 of the second bumps 107 by pressing. At this time, since the insulating layer 105 is interposed between the first bump layer 104 and the second bump layer 110, both the first bump 103 and the second bump 107 penetrate the insulating layer 105. The second bump 107 and the first bump 103 inserted into the second bump 107 are electrically connected to form a via hole of the printed circuit board. 2B illustrates a cross-sectional view in which via holes are formed by combining the first bump 103 and the second bump 107.

In operation S16, the circuit patterns 102 ′ and 108 ′ are formed on the first metal layer 102 and the second metal layer 108. The circuit pattern is formed so that the user can send and receive electrical signals as intended. The circuit pattern may be formed through exposure and etching, and may also be formed through plating or an inkjet method. FIG. 2C shows a printed circuit board on which circuit patterns 102 'and 108' are formed by step S16.

Next, a method of manufacturing a printed circuit board according to another exemplary embodiment of the present invention will be described with reference to FIGS. 3 and 4.

3 is a flowchart illustrating a method of manufacturing a printed circuit board according to another exemplary embodiment of the present invention, wherein bump layers 204 and 210 and an insulating layer including bumps 203 and 207 and carrier layers 201 and 209 having circuit patterns 202 and 208 are formed. A step of manufacturing a printed circuit board is shown by pressing 205 to align the first bump 203 and the second bump 207 so as to correspond to each other.

4 is a cross-sectional view illustrating a printed circuit board forming process by pressing according to the flowchart of FIG. 3. Referring to FIG. 4, the first bump layer 204, the insulating layer 205, and the second carrier layer 209 in which the first circuit pattern 202 and the first bump 203 are formed in the first carrier layer 201. The second bump layer 210 composed of the second circuit pattern 208 and the second bump 207 and the receiving groove 206 formed in the second bump 207 are shown.

Step S21 is a step of providing the first bump layer 204 in which the first circuit pattern 202 and the first bump 203 are formed in the first carrier layer 201. At this time, the first carrier layer 201 and the second carrier layer 209 serve as a carrier for transferring the first circuit pattern 202 and the first circuit pattern 208 previously formed in the insulating layer. The carrier film may be used as the carrier layer, or a metal material such as a nickel layer may be used.

In operation S22, a second bump layer 210 including a second bump 207 having a receiving groove 206 corresponding to the first bump 203 and a second circuit pattern 208 may be provided. The second bump 107 is characterized in that it has a receiving groove 106 of the shape that the first bump 103 can be fitted, the shape of the receiving groove 106 according to the shape of the first bump 203 Various modifications are possible.

In this case, in order to further increase the electrical connectivity, the surface of the first bump 203 and the second bump 207 may be surface treated, that is, plated with a metal having good electrical conductivity. In general, copper is used as a bump material, and the electrical connection of the connection portion can be improved by plating with silver (Ag), platinum (Pt), gold (Au), etc. having better electrical conductivity.

Step S23 is a step of forming holes corresponding to the first bump 203 and the second bump 207 in the insulating layer 205 in advance. By forming a hole in advance, the position at the time of fastening can be matched more accurately, and the reliability of fastening between bumps can be improved. This step S23 may be performed through drilling, as well as may be performed through various methods as necessary.

Moreover, the reliability of fastening can be improved by surface roughening the contact surface with the insulating layer of bump. Surface roughening means roughening a surface for the purpose of increasing frictional force.

Step S24 is a step of aligning the first bump layer 204, the insulating layer 206, and the second bump layer 210 in order. The first bump 203 and the second bump 207 are aligned to be aligned so that the first bump 203 can be accommodated in the receiving groove 206 formed in the second bump 207. FIG. 4A illustrates a cross section aligned in position so that the first bump 203 can be inserted into the second bump 207.

Step S25 is a step of compressing the first bump layer 204 and the second bump layer 210 so that the first bump 203 is accommodated in the receiving groove 206 of the second bump. The first bumps 203 aligned through the step S24 may be accommodated in the accommodation grooves 206 of the second bumps 201 by pressing. At this time, since the insulating layer 205 is interposed between the first bump layer 204 and the second bump layer 210, both the first bump 203 and the second bump 207 pass through the insulating layer 205. The second bump 207 and the first bump 203 inserted into the second bump are electrically connected to each other to form a via hole of the printed circuit board. 3B illustrates a cross-sectional view of a printed circuit board in which via holes are formed in the insulating layer 205 by fastening the first bump 203 and the second bump 207. Referring to FIGS. 3B and 3C, the first circuit pattern 202 and the second circuit pattern 208 are partially buried in the insulating layer 205 due to compression, thereby reducing the thickness of the entire substrate. have.

Step S26 is removing the first carrier layer 201 and the second carrier layer 209. In the case where the first carrier layer 201 and the second carrier layer 209 are carrier films, the first carrier layer 201 and the second carrier layer 209 may be removed. In the case of the metal, only the carrier layer is removed through etching, and the first circuit pattern 202 and the second circuit pattern 208 are left buried in the insulating layer 205. The second carrier layer 209 may be removed. By removing the first carrier layer 201 and the second carrier layer 209 in this manner, a circuit pattern can be formed on the insulator 205. 4C illustrates a printed circuit board on which the first carrier layer 201 and the second carrier layer 209 are removed and the first circuit pattern 202 and the second circuit pattern 208 are exposed.

Next, a printed circuit board according to an embodiment of the present invention will be described with reference to FIGS. 5 and 6.

5 is a cross-sectional view illustrating a printed circuit board according to an exemplary embodiment of the present invention. Referring to FIG. 5A, the first circuit pattern 302 (a) formed on one surface of the insulating layer 305 and the first bump 303 extending therefrom and penetrating the insulating layer 305 are insulated from each other. The second circuit pattern 308 (a) formed on the other surface of the layer 305 and the second bumps extending therefrom to penetrate the insulating layer 305 and having receiving grooves corresponding to the first bumps 303 are formed. Shown is a printed circuit board formed by combining 307.

Figure 5 (b) is a cross-sectional view showing another preferred embodiment of a printed circuit board by bump fastening. The circuit patterns 302 (b) and 308 (b) are recessed with the insulating layer 305, so that the overall thickness of the substrate is thin, and the first circuit pattern 302 (b) and the second circuit pattern 308 (b) ) Peeling becomes difficult.

The insulating layer 305 serves to electrically separate both sides of the printed circuit board, and one surface and the other surface of the insulating layer 305 are electrically connected by bumps. Unlike a printed circuit board using bumps according to the prior art, the printed circuit board according to the present embodiment forms bumps both above and below, and is engaged with each other so that the fastening strength is higher than that of the cross-section bumps. When connecting with the side, the error that can not be connected can be minimized.

6 is a cross-sectional view illustrating the shape of a bump of a printed circuit board according to an exemplary embodiment of the present invention. An embodiment of the coupling between the first bump and the corresponding second bump composed of several unit bumps to securely fasten the bumps is shown.

Referring to (a) of FIG. 6, the bump is composed of nine 3 × 3 cylindrical cylindrical pins, four of which are formed at the corners and at the center of the first bump layer (104 or 4 of FIG. 2). The second bump 307 (a) formed as the first bump 303 (a) of 204 and the remaining four cylindrical fins are formed in the second bump layer (110 in FIG. 2 or 210 in FIG. 4). An embodiment of the bump that can be fitted to each other is characterized in that) is presented.

Referring to (b) of FIG. 6, the bump is the first bump 403 (b) in which the fin at the corner portion is formed in the first bump layer 104 or 204 among the nine pins having a 3 × 3 square pillar shape. And the remaining four quadrangular pins are second bumps 407 (b) formed in the second bump layers 110 or 210, and embodiments of bumps that can be fitted to each other are provided.

Referring to FIGS. 6C and 6D, the first bumps 403 (c) and 403 (d) formed on the first bump layer 104 or 204 may have four or five cylindrical pins. The bumps that can be engaged and fastened by forming the second bumps 407 (c) and 407 (d) having an indefinite cross shape in the form of being fitted thereto are formed in the second bump layers 110 or 210. Presented.

According to the embodiment of the above-described fastening structure between bumps, the contact resistance can be lowered, and the contact strength can be increased by increasing the contact area.

Although the technical idea of the present invention has been described in detail according to the above-described embodiment, the above-described embodiment is for the purpose of description and not of limitation, and a person of ordinary skill in the art of the present invention It will be understood that various embodiments are possible within the scope.

The present invention can provide a printed circuit board and a method of manufacturing the same, which improves reliability, advantageously realizes fine lines, and can reduce a process.

Claims (9)

 (a) providing a first bump layer in which the first bump is formed;  (b) providing a second bump layer having a second bump having a receiving groove into which the first bump can be inserted; (c) disposing the first bump layer and the second bump layer on both sides of the insulating layer and compressing the first bump layer and the second bump layer so as to be inserted into the receiving groove; Printed circuit board manufacturing method comprising a. The method of claim 1, The method of manufacturing the printed circuit board further comprises the step of forming a hole corresponding to the first bump and the second bump in the insulating layer in the step (c). The method of claim 1, At least one of the first bump and the second bump is coated on at least one material of silver, platinum, and gold on a surface thereof. The method of claim 1, The first bump layer includes a first metal layer on which the first bump is formed, The second bump layer includes a second metal layer on which the second bump is formed, And (d) forming a circuit pattern on at least one of the first metal layer and the second metal layer after the step (c). The method of claim 1, The first bump layer includes a first carrier layer on which a first circuit pattern is formed, and the second bump layer includes a second carrier layer on a second circuit pattern, And removing (d) the first carrier layer and the second carrier layer after step (c). The method of claim 4, wherein The surface of the first metal layer is in contact with the insulating layer is a manufacturing method of the printed circuit board, characterized in that the surface roughening (surface-roughening) treatment. The method of claim 5, The first bump has a surface-roughening treatment of the surface in contact with the insulating layer. Insulating layer; A first circuit pattern formed on one surface of the insulating layer; A second circuit pattern formed on the other surface of the insulating layer; And A first bump extending from the first circuit pattern and penetrating the insulating layer; And a second bump extending from the second circuit pattern and penetrating the insulating layer, wherein the first bump is formed with a receiving groove into which the first bump can be fitted. Printed circuit board, characterized in that the two circuit patterns can be electrically interconnected. The method of claim 8, The first bump is a printed circuit board, characterized in that composed of a plurality of pin shapes.

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