CN108684136A - One kind burying copper billet heat-radiating substrate and preparation method thereof - Google Patents
One kind burying copper billet heat-radiating substrate and preparation method thereof Download PDFInfo
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- CN108684136A CN108684136A CN201810495741.XA CN201810495741A CN108684136A CN 108684136 A CN108684136 A CN 108684136A CN 201810495741 A CN201810495741 A CN 201810495741A CN 108684136 A CN108684136 A CN 108684136A
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- copper billet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract
The invention discloses one kind burying copper billet heat-radiating substrate, including substrate body, and substrate body, which offers, buries copper billet straight slot, buries and is provided with heat dissipation copper billet in copper billet straight slot, the surface for the copper billet that radiates and the flush of heat-radiating substrate.In a substrate setting heat dissipation copper billet, and radiate copper billet top and bottom be both exposed to outside substrate so that the heat-radiating substrate become two-side radiation structure, with tradition be only capable of single side heat dissipation bury copper billet pcb board compared with, improve radiating efficiency.Also disclose a kind of method for making and burying copper billet heat-radiating substrate, two-sided exposed heat dissipation copper billet is made using the method etched twice, by first press make again bottom heat radiation copper billet processing method improve heat dissipation copper billet dimensional accuracy, the mode pressed twice bonds copper billet, solve copper billet easily deviate, loosen, problems of crack, improve the processing efficiency of copper billet and the stability of quality.
Description
Technical field
The invention belongs to printed circuit board production technical field, it is related to a kind of circuit board substrate and preparation method thereof, specifically
Say that being related to one kind burying copper billet heat-radiating substrate and preparation method thereof in ground.
Background technology
As electronic device is constantly to intelligent, miniaturization and portability development, such as smart mobile phone dual camera, intelligent vehicle
Lamp etc. it is universal, the power density of electronic device is increasing, the electric energy that electronic device is consumed at work, except being partly used for
It does outside useful work, is largely converted to heat, these heats make element internal temperature rise rapidly, such as not in time dissipate heat
Hair, electronic component is persistently overheating to be led to quality decline, influence stability in use and service life, can also cause to print when serious
Board failure processed even damages.
Therefore, for the big electronic component of calorific value, corresponding heat dissipation design need to be carried out, currently, being typically employed in printing
The method of cutting and embedding/embedment copper billet is to improve the thermal diffusivity of printed circuit board, solve the heat dissipation of printed circuit board between circuit board
Also there are a variety of methods for burying copper billet in the prior art in problem, and copper is buried as Chinese patent CN204217201U discloses one kind
Block heat dissipation PCB construction, and disclose following technical solution：It includes pcb board, copper billet that this, which buries copper billet heat dissipation PCB construction, and copper billet wraps again
Pedestal is included, the upper surface of pedestal has protruded out boss, and copper billet is made to form step-like structure.Chinese patent literature CN104797085B
It discloses a kind of circuit board and buries copper billet blind slot production method, use electricity of the photoresist protection without open-blind slot after exposure
Blind slot is made using the method for etching in road plate part, and since etch process processing uniformity is good, blind slot wall surface is smooth, solves
The problem of traditional numeric-control machine processing blind slot bottom is also easy to produce milling cutter print.Integral heat sink effect is still bad.Chinese patent text
It offers CN107592725A and discloses a kind of method for burying copper billet on high multilayer board, realize and bury the primary of copper coin
Molding.But said program is the mode of single side heat dissipation, integral heat sink is still bad.In addition, in the prior art bury copper
Block or copper protruding plate, which are big by the way that made from CNC milling machine or laser cutting, there are copper protruding plate height tolerances, quality is unstable asks
Topic easily influences the heat dissipation effect of electronic component, and the existing method low production efficiency for burying copper billet.
Invention content
For this purpose, the present invention exactly will solve above-mentioned technical problem, to propose one kind can two-side radiation, radiating efficiency it is high,
Radiator structure quality stability it is good bury copper billet heat-radiating substrate and preparation method thereof.
In order to solve the above technical problems, the technical scheme is that：
The present invention provides one kind and burying copper billet heat-radiating substrate, and the heat-radiating substrate includes substrate body, and the substrate body is opened
Equipped with copper billet straight slot is buried, described bury is provided with heat dissipation copper billet in copper billet straight slot, the surface of the heat dissipation copper billet and the heat dissipation base
The flush of plate.
Preferably, the substrate body be arranged by stacked above one another top layer copper foil, top layer light core plate, layer of prepreg,
Bottom light core plate and bottom copper foil composition, it is described heat dissipation copper billet top and bottom respectively with the top layer copper foil, bottom copper foil
Concordant setting.
Preferably, the thickness of top layer light core plate, bottom light core plate is 0.11-0.15mm, the thickness of the heat dissipation copper billet
Resin content for 0.5-0.8mm, the layer of prepreg is 68-75%.
Preferably, the substrate body surface is additionally provided with pad cell, the pad cell is by four the first pads
It is formed with second pad, insulating layer is provided between first pad and the second pad.
Preferably, the length of first pad is 1.4-1.5mm, and width 1.25-1.35mm, second pad
Length be 2.7-2.8mm, width 1.35-1.45mm, the spacing between adjacent pad is 0.4-0.45mm, the copper of the pad
Layer thickness is 35-50 μm.
The method for burying copper billet heat-radiating substrate is made the present invention also provides a kind of comprising following steps：
S1, top layer light core plate, the first prepreg, the second prepreg, bottom light core plate and thick copper billet are provided, according to pre-
If radiating copper block size opened on top layer light core plate, prepreg and bottom light core plate and bury copper billet straight slot；
S2, dry film is pasted in thick copper billet top surface bottom surface；
S3, an egative film for exposure is provided, the egative film has shading region and transparent area, the transparent area size and institute
The size fit for burying copper billet straight slot is stated, egative film is placed in the thick copper billet top surface, exposure-processed makes thick copper billet by burying copper billet straight slot
The part of exposing is exposed, and the non-exposed area in thick copper billet is blocked in shading region, which does not expose；
S4, the dry film that exposure position does not occur is removed, exposes the copper face at the top of thick copper billet, etching removal unexposed portion
Copper billet, obtain size and burying the moderate copper billet of copper billet slot；
S5, top layer light core plate, the stacking of the first prepreg are arranged, and thick copper billet is positioned over and is buried in copper billet straight slot, into
Row pressing obtains dual platen, the copper face at the top of the thickness copper billet and the top light core plate either flush；
S6, dry film is pasted on the two sides of the dual platen, and an egative film for exposure is provided, the egative film has shading
Area and transparent area, the size fit of the transparent area size and the storage tank, exposure-processed make thick copper billet by burying copper billet straight slot
The part of exposing is exposed, and the non-exposed area in thick copper billet is blocked in shading region, which does not expose；；
The dry film that S7, removal do not expose, exposes the bottom copper face of thick copper billet, and the copper unless exposed area is removed in etching
Block obtains to bottom surface and protrudes from the heat dissipation copper billet on the first prepreg surface；
S8, the second prepreg and bottom light core plate are overlapped, and the bottom of thick copper billet is placed in and is buried in copper billet straight slot, pressed
It is combined into heat-radiating substrate, keeps the bottom surface of the thick copper billet concordant with the bottom light core plate surface.
Preferably, further including the steps that making pad cell on the heat-radiating substrate surface：Top surface core plate and bottom surface core
Plate is opened inlays pressing after storage tank with heat dissipation copper billet, excessive glue is cut after pressing, copper coating simultaneously etches obtained pad cell.
Preferably, the thickness copper billet is the T-type structure that top is narrow, bottom is wide.
Preferably, the heat dissipation copper billet is not more than 5*5mm by the surface size for burying the exposing of copper billet straight slot.
Preferably, the heat dissipation copper billet is 1.5*1.5mm by the surface size for burying the exposing of copper billet straight slot.
The above technical solution of the present invention has the following advantages over the prior art：
(1) of the present invention to bury copper billet heat-radiating substrate, the heat-radiating substrate includes substrate body, and the substrate body is opened
Equipped with copper billet straight slot is buried, described bury is provided with heat dissipation copper billet in copper billet straight slot, the surface of the heat dissipation copper billet and the heat dissipation base
The flush of plate.Setting heat dissipation copper billet in a substrate, and the top and bottom for the copper billet that radiates are both exposed to outside substrate so that
The heat-radiating substrate become two-side radiation structure, with tradition be only capable of single side heat dissipation bury copper billet pcb board compared with, improve heat dissipation effect
Rate, be it is a kind of it is high heat dissipation, heat conduction substrate.And by radiating, copper billet is connected, and eliminates the via hole design of substrate,
Better heat-radiation effect.
(2) production method of the present invention for burying copper billet heat-radiating substrate is made two-sided outer of the method etching twice
The top of the heat dissipation copper billet of dew, the copper billet that radiates directly is made by etching, and bottom is by top layer light core plate and the first prepreg
Lamination be combined into after dual platen etch again it is obtained, then by bottom light core plate and the second prepreg pressing to get with two-sided exposed
Heat dissipation copper billet heat-radiating substrate.It is this first press make again bottom heat radiation copper billet processing method improve heat dissipation copper billet ruler
Very little precision, the mode pressed twice bond copper billet, solve copper billet easily deviate, loosen, problems of crack, improve copper billet plus
The stability of work efficiency rate and quality.
Description of the drawings
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is the structural schematic diagram for burying copper billet heat-radiating substrate described in the embodiment of the present invention；
Fig. 2 is the schematic diagram for burying pad cell in copper billet heat-radiating substrate described in the embodiment of the present invention；
Fig. 3 is the schematic diagram of the thick copper billet described in step 1 in production method described in the embodiment of the present invention 4；
Fig. 4 is the semi-finished product schematic diagram that step S5 is obtained in production method described in the embodiment of the present invention 4；
Fig. 5 is the semi-finished product schematic diagram that step S7 is obtained in production method described in the embodiment of the present invention 4.
Reference numeral is expressed as in figure：1- heat dissipation copper billets；2- top layer copper foils；3- top layer light core plates；The first prepregs of 4-；
The second prepregs of 5-；6- bottom light core plates；7- bottom copper foils；8- pad cells；The first pads of 81- 81；The second pads of 82-；
83- insulating layers.
Specific implementation mode
Embodiment 1
The present embodiment provides one kind burying copper billet heat-radiating substrate, as shown in Figure 1, the heat-radiating substrate includes substrate body, institute
It states to offer in substrate body and buries copper billet straight slot, described bury is provided with heat dissipation copper billet 1 in copper billet straight slot, the heat dissipation copper billet 1 is
Cuboid copper billet, top and bottom are concordant with the top and bottom of heat-radiating substrate respectively so that the top surface and bottom of heat dissipation copper billet 1
Face is exposed in environment, and heat dissipation effect is more preferable.
Specifically, from top to bottom, the substrate body is arranged by stacked above one another top layer copper foil 2, top layer light core plate 3, half
Cure lamella (layer of prepreg is two layers, from top to bottom respectively the first prepreg 4, the second prepreg 5), bottom
Light core plate 6 and bottom copper foil 7 form, the top and bottom of the heat dissipation copper billet 1 respectively with the top layer copper foil layer 2, bottom copper
Layers of foil 7 is concordantly arranged.Wherein, the top layer light core plate 3, bottom light core plate 6 thickness be 0.11mm, the heat dissipation copper billet 1
Thickness is 0.5mm, and the resin content of layer of prepreg is 68%.
Further, the substrate body surface is additionally provided with pad cell 8, and the pad cell is by four the first pads
81 and second pad 82 composition, the first pad 81 and the second pad 82 are set to same plane, and as shown in Fig. 2, four
First pad 81 is set to the quadrangle of the second pad 82, and is provided with insulating layer between first pad and the second pad
83, it is located between two first pads 81 of the same side with gap, the spacing in the gap is 0.4mm, wherein the first pad
81 length is 1.4mm, and the length of width 1.25mm, second pad are 2.7mm, width 1.35mm, the pad
Copper layer thickness be 35 μm.
Embodiment 2
The present embodiment provides one kind burying copper billet heat-radiating substrate, as shown in Figure 1, the heat-radiating substrate includes substrate body, institute
It states to offer in substrate body and buries copper billet straight slot, described bury is provided with heat dissipation copper billet 1 in copper billet straight slot, the heat dissipation copper billet 1 is
Cuboid copper billet, top and bottom are concordant with the top and bottom of heat-radiating substrate respectively so that the top surface and bottom of heat dissipation copper billet 1
Face is exposed in environment, and heat dissipation effect is more preferable.
Specifically, from top to bottom, the substrate body is arranged by stacked above one another top layer copper foil 2, top layer light core plate 3, half
Cure lamella (layer of prepreg is two layers, from top to bottom respectively the first prepreg 4, the second prepreg 5), bottom
Light core plate 6 and bottom copper foil 7 form, the top and bottom of the heat dissipation copper billet 1 respectively with the top layer copper foil layer 2, bottom copper
Layers of foil 7 is concordantly arranged.Wherein, the top layer light core plate 3, bottom light core plate 6 thickness be 0.15mm, the heat dissipation copper billet 1
Thickness is 0.8mm, and the resin content of layer of prepreg is 75%.
Further the substrate body surface is additionally provided with pad cell 8, and the pad cell is by four the first pads
81 and second pad 82 composition, the first pad 81 and the second pad 82 are set to same plane, and as shown in Fig. 2, four
First pad 81 is set to the quadrangle of the second pad 82, and is provided with insulating layer between first pad and the second pad
83, it is located between two first pads 81 of the same side with gap, the spacing in the gap is 0.45mm.Wherein, the first weldering
The length of disk 81 is 1.5mm, and the length of width 1.35mm, second pad are 2.8mm, width 1.45mm, the weldering
The copper layer thickness of disk is 50 μm.
Embodiment 3
The present embodiment provides one kind burying copper billet heat-radiating substrate, as shown in Figure 1, the heat-radiating substrate includes substrate body, institute
It states to offer in substrate body and buries copper billet straight slot, described bury is provided with heat dissipation copper billet 1 in copper billet straight slot, the heat dissipation copper billet 1 is
Cuboid copper billet, top and bottom are concordant with the top and bottom of heat-radiating substrate respectively so that the top surface and bottom of heat dissipation copper billet 1
Face is exposed in environment, and heat dissipation effect is more preferable.
Specifically, from top to bottom, the substrate body is arranged by stacked above one another top layer copper foil 2, top layer light core plate 3, half
Cure lamella (layer of prepreg is two layers, from top to bottom respectively the first prepreg 4, the second prepreg 5), bottom
Light core plate 6 and bottom copper foil 7 form, the top and bottom of the heat dissipation copper billet 1 respectively with the top layer copper foil layer 2, bottom copper
Layers of foil 7 is concordantly arranged.Wherein, the top layer light core plate 3, bottom light core plate 6 thickness be 0.13mm, the heat dissipation copper billet 1
Thickness is 0.6mm, and the resin content of layer of prepreg is 70%.
Further, the substrate body surface is additionally provided with pad cell 8, and the pad cell is by four the first pads
81 and second pad 82 composition, the first pad 81 and the second pad 82 are set to same plane, and as shown in Fig. 2, four
First pad 81 is set to the quadrangle of the second pad 82, and is provided with insulating layer between first pad and the second pad
83, it is located between two first pads 81 of the same side with gap, the spacing in the gap is 0.42mm.Wherein, the first weldering
The length of disk 81 is 1.45mm, and the length of width 1.3mm, second pad are 2.75mm, width 1.4mm, the weldering
The copper layer thickness of disk is 40 μm.
Embodiment 4
The present embodiment provides a kind of methods for burying copper billet heat-radiating substrate made described in embodiment 1-3 comprising following step
Suddenly：
S1, offer are covered with the top layer light core plate 3 (i.e. top layer core plate) of top layer copper foil 2, the first prepreg 4, the second half consolidate
Change piece 5, the bottom light core plate 6 (i.e. bottom core plate) for being covered with bottom copper foil 7 and thickness copper billet, sawing sheet to be cut into thick copper billet suitable
The size of symphysis production, according to preset 1 size of heat dissipation copper billet in top layer core plate, the first prepreg 4,5 and of the second prepreg
It is opened on bottom core plate 6 and buries copper billet straight slot.
S2, dry film is pasted in thick copper billet top surface, bottom surface, the dry film is photosensitive resist dry film.
S3, a work egative film that processing is exposed for exposure machine is provided, the work egative film is with shading region and thoroughly
Light area, the transparent area size is with the size fit for burying copper billet straight slot (for thick copper billet is exposed in copper billet copper slot by burying
Surface expose), exposure-processed, make thick copper billet by bury copper billet straight slot exposing part exposed, shading region is blocked in thick copper
The non-exposed area of block, the region do not expose.
S4, the dry film that exposure position does not occur is removed, exposes the copper face at the top of thick copper billet, etching removal unexposed portion
Copper billet, obtain size and burying the moderate copper billet of copper billet slot.
S5, top layer core plate, the first prepreg 4 are stacked, high temperature resistant protection is pasted on 4 surface of the first prepreg
Film (protective film is in the position windowing corresponding to copper billet), and thick copper billet is positioned over and is buried in copper billet straight slot, it is pressed, is obtained
To dual platen, the copper face at the top of the thickness copper billet and the top core plate either flush, as shown in Figure 4.
S6, dry film is pasted on the two sides of the dual platen, and an egative film for exposure is provided, the egative film has shading
Area and transparent area, the transparent area size are adapted to the size of the storage tank and position, and exposure-processed makes thick copper billet by burying copper
The part that block straight slot exposes is exposed, and the non-exposed area in thick copper billet is blocked in shading region, which does not expose.
The dry film that S7, removal do not expose, exposes the bottom copper face of thick copper billet, and the copper unless exposed area is removed in etching
Block obtains to bottom surface and protrudes from the heat dissipation copper billet 1 on the first prepreg surface, as shown in Figure 5.
S8, the second prepreg and bottom light core plate are overlapped, and the bottom of thick copper billet is placed in and is buried in copper billet straight slot, pressed
It is combined into heat-radiating substrate, keeps the bottom surface of the thick copper billet concordant with the bottom light core plate surface.
Then pad cell is made on substrate body surface：Respectively by top surface core plate and bottom surface core plate open after storage tank with dissipate
Hot copper billet 1 inlays pressing, and excessive glue is cut after pressing, and pad then is made in top surface core plate, the copper coating of bottom surface core plate and etching
Unit.
As shown in figure 3, the thickness copper billet is the inverted T-type structure that top is narrow, bottom is wide, short side is top surface, and long side is bottom
Face.Finally obtained heat dissipation copper billet 1 is not more than 5*5mm by the surface size for burying the exposing of copper billet straight slot, is 1.5* in the present embodiment
1.5mm。
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (10)
1. one kind burying copper billet heat-radiating substrate, which is characterized in that the heat-radiating substrate includes substrate body, and the substrate body opens up
Copper billet straight slot is buried, described bury is provided with heat dissipation copper billet in copper billet straight slot, the surface of the heat dissipation copper billet and the heat-radiating substrate
Flush.
2. according to claim 1 bury copper billet heat-radiating substrate, which is characterized in that the substrate body is arranged by stacked above one another
Top layer copper foil, top layer light core plate, layer of prepreg, bottom light core plate and bottom copper foil composition, it is described heat dissipation copper billet top surface
With bottom surface respectively with the top layer copper foil, bottom copper foil is concordant is arranged.
3. according to claim 2 bury copper billet heat-radiating substrate, which is characterized in that top layer light core plate, bottom light core plate thickness
Degree is 0.11-0.15mm, and the thickness of the heat dissipation copper billet is 0.5-0.8mm, and the resin content of the layer of prepreg is 68-
75%.
4. according to claim 3 bury copper billet heat-radiating substrate, which is characterized in that the substrate body surface is additionally provided with weldering
Disk unit, the pad cell are made of four the first pads and second pad and are set between first pad and the second pad
It is equipped with insulating layer.
5. according to claim 4 bury copper billet heat-radiating substrate, which is characterized in that the length of first pad is 1.4-
1.5mm, width 1.25-1.35mm, the length of second pad are 2.7-2.8mm, width 1.35-1.45mm, adjacent
Spacing between pad is 0.4-0.45mm, and the copper layer thickness of the pad is 35-50 μm.
6. a kind of making the method as described in any one in claim 1-5 for burying copper billet heat-radiating substrate, which is characterized in that including such as
Lower step：
S1, top layer core plate, the first prepreg, the second prepreg, bottom core plate and thick copper billet are provided, according to preset heat dissipation
Copper billet size is opened on top layer core plate, prepreg and bottom core plate and buries copper billet straight slot；
S2, dry film is pasted in thick copper billet top surface bottom surface；
S3, an egative film for exposure is provided, there is the egative film shading region and transparent area, the transparent area size to be buried with described
Egative film is placed in the thick copper billet top surface by the size fit of copper billet straight slot, and exposure-processed makes thick copper billet be exposed by burying copper billet straight slot
Part exposed, the non-exposed area in thick copper billet is blocked in shading region, which does not expose；
S4, the dry film that exposure position does not occur is removed, exposes the copper face at the top of thick copper billet, the copper of etching removal unexposed portion
Block obtains size and buries the moderate copper billet of copper billet slot；
S5, top layer core plate, the stacking of the first prepreg are arranged, and thick copper billet are positioned over and is buried in copper billet straight slot, pressed,
Obtain dual platen, the copper face at the top of the thickness copper billet and the top core plate either flush；
S6, paste dry film on the two sides of the dual platen, and an egative film for exposure be provided, the egative film have shading region and
Transparent area, the size fit of the transparent area size and the storage tank, exposure-processed make thick copper billet be exposed by burying copper billet straight slot
Part exposed, the non-exposed area in thick copper billet is blocked in shading region, which does not expose；；
The dry film that S7, removal do not expose, exposes the bottom copper face of thick copper billet, and etching is removed the copper billet unless exposed area, obtained
The heat dissipation copper billet on the first prepreg surface is protruded to bottom surface；
S8, the second prepreg and bottom core plate are overlapped, and the bottom of thick copper billet is placed in and is buried in copper billet straight slot, it is scattered to press
Hot substrate keeps the bottom surface of the thick copper billet concordant with the bottom core plate surface.
7. the method for burying copper billet heat-radiating substrate described in making according to claim 6, which is characterized in that further include described
Heat-radiating substrate surface makes the step of pad cell：Top surface core plate and bottom surface core plate are opened inlays pressure after storage tank with heat dissipation copper billet
It closes, excessive glue is cut after pressing, copper coating simultaneously etches obtained pad cell.
8. the method for burying copper billet heat-radiating substrate described in making according to claim 7, which is characterized in that it is described thickness copper billet be
The T-type structure that top is narrow, bottom is wide.
9. the method for burying copper billet heat-radiating substrate described in making according to claim 8, which is characterized in that the heat dissipation copper billet
Surface size by burying the exposing of copper billet straight slot is not more than 5*5mm.
10. the method for burying copper billet heat-radiating substrate described in making according to claim 9, which is characterized in that the radiating copper
Block is 1.5*1.5mm by the surface size for burying the exposing of copper billet straight slot.
Priority Applications (1)
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| CN201810495741.XA CN108684136B (en) | 2018-05-22 | 2018-05-22 | copper block embedded heat dissipation substrate and manufacturing method thereof |
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|---|---|---|---|
| CN201810495741.XA CN108684136B (en) | 2018-05-22 | 2018-05-22 | copper block embedded heat dissipation substrate and manufacturing method thereof |
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| CN108684136A true CN108684136A (en) | 2018-10-19 |
| CN108684136B CN108684136B (en) | 2019-12-06 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111295053A (en) * | 2020-03-31 | 2020-06-16 | 生益电子股份有限公司 | PCB (printed circuit board) with embedded heat conductor and preparation method thereof |
| CN113677108A (en) * | 2021-08-16 | 2021-11-19 | 上海美维电子有限公司 | Manufacturing method of embedded copper block |
| CN114126187A (en) * | 2020-08-26 | 2022-03-01 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with embedded heat dissipation structure and manufacturing method thereof |
| CN114615788A (en) * | 2020-12-08 | 2022-06-10 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with heat dissipation block and manufacturing method thereof |
| CN114641132A (en) * | 2022-05-17 | 2022-06-17 | 四川英创力电子科技股份有限公司 | Printed circuit board with copper block partially embedded and processing method thereof |
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