JP2018101661A - Mounting substrate and heat generating component mounting module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat generating component mounting module in which deformation and damage in a heat dissipation post and a substrate do not occur when the heat dissipation post is held by the substrate, and a mounting substrate used for the heat generating component mounting module.SOLUTION: A heat generating component mounting module 1 is characterized by including: a mounting substrate 10 which includes a substrate 110 having a through hole 113 at a position, in plan view, where a heat generating component 150 is mounted and which includes a heat dissipation post 120 held in the through hole 113 of the substrate 110, the heat dissipation post 120 being characterized in that a male screw part 122 formed to an insertion part 121 inserted into the through hole 113 is held in the through hole 113 while being screwed in a female screw part 114 of the through hole 113; and the heat generating component 150 to be mounted on a surface of the mounting substrate 10.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a mounting board and a heat generating component mounting module.

  2. Description of the Related Art Conventionally, a heat generating component mounting module in which a heat generating component such as a power semiconductor is mounted on a mounting substrate is known (for example, see Patent Document 1).

  As shown in FIG. 8, the conventional heat generating component mounting module 901 is bonded to a mounting substrate 915 including a substrate 910 and a heat dissipation column 920 press-fitted into a through hole 913 of the substrate 910, and solder 970 to the mounting substrate 915. A heat generating component 950 such as a power semiconductor element and a heat sink 960 are provided. The through hole 913 of the substrate 910 is formed at a position corresponding to the planar view position of the heat generating component 950 mounted on the substrate 910. The heat sink 960 is joined to the substrate 910 with solder 980.

JP 2009-170493 A

In the conventional heat generating component mounting module 901, the heat generated by the heat generating component 950 is dissipated to the outside from the back surface of the heat sink 960 via the heat dissipation column 920 and the heat sink 960, so that the heat generating component mounting module is excellent in heat dissipation. (See FIG. 8).
However, since the heat-dissipating column 920 is press-fitted into the through-hole 913 of the substrate 910, a strong pressure is applied to the heat-dissipating column 920 and the substrate 910 during the press-fitting. For this reason, the heat dissipating column 920 and the substrate 910 have a risk of deformation and damage. Accordingly, there is a problem that heat generated by the heat generating component 950 is prevented from being radiated to the outside through the heat dissipation column 920, and the heat generating component 950 is hardly mounted on the substrate 910.

  The present invention has been made in view of the above circumstances, and a heat-generating component mounting module that does not cause deformation and damage to the heat-dissipating column and the substrate when the heat-dissipating column is held on the substrate, and a mounting substrate used for the heat-generating component mounting module The purpose is to provide.

[1] A mounting board of the present invention is a mounting board on which a heat generating component is mounted on the front surface or the back surface, and has a through hole at a planar view position on which the heat generating component is mounted; A heat-dissipating column that is held in the through-hole, and the heat-dissipating column includes the through-hole in a state in which a male screw portion formed in an insertion portion that is inserted into the through-hole is screwed into a female screw portion of the through-hole. It is characterized by being held in.

[2] In the mounting substrate of the present invention, the heat dissipation column has a lower end (end portion in a direction from the front surface of the substrate toward the back surface) protruding from the back surface of the substrate. Is preferred.

[3] In the mounting board of the present invention, it is preferable that the female screw portion is formed on an inner wall of the through hole.

[4] In the mounting board of the present invention, it is preferable that the female screw portion is formed on a female screw member fixed to the through hole.

[5] In the mounting substrate of the present invention, the heat dissipating column is a cap formed on a lower end side (an end side in a direction from the front surface of the substrate toward the back surface) that is an end portion on the back surface side from the insertion portion. It is preferable that the cross-sectional area of the cap part is wider than the cross-sectional area of the insertion part.

[6] In the mounting substrate of the present invention, the cross-sectional area of the heat dissipating column is from the upper end (the end in the direction from the back surface of the substrate toward the surface) as the end portion on the front surface side to the end portion on the back surface side. It is preferable to have a structure that widens stepwise toward a certain lower end (an end in a direction from the front surface to the back surface of the substrate).

[7] In the mounting substrate of the present invention, it is preferable that a cross-sectional area of the cap portion of the heat dissipation column has a structure that continuously increases toward the lower end of the heat dissipation column.

[8] In the mounting substrate of the present invention, it is preferable that the heat dissipation column is bonded to the substrate via a bonding material.

[9] The heat generating component mounting module of the present invention includes the mounting substrate according to any one of [1] to [8] and a heat generating component mounted on the surface of the mounting substrate. To do.

[10] In the heat generating component mounting module according to the present invention, the heat dissipating sheet further disposed on the lower surface side of the heat dissipating column so as to be in contact with the lower surface of the heat dissipating column (the end surface in the direction from the front surface to the back surface of the substrate). It is preferable to provide.

[11] In the heat generating component mounting module of the present invention, the heat dissipating fins disposed on the lower surface side of the heat dissipating sheet so as to be in contact with the lower surface of the heat dissipating sheet (the end surface in the direction from the front surface to the back surface of the substrate) It is preferable to provide.

  According to the mounting substrate of the present invention, the heat dissipation column is held in a state where the heat dissipation column is screwed into the through-hole (the male screw portion and the female screw portion are screw-engaged) by a simple operation of rotating the heat dissipation column about its axis. Is possible. For this reason, it is not necessary to apply a strong pressure to the heat dissipation strut and the substrate as in the case where the conventional heat dissipation support is press-fitted into the through hole, and deformation and breakage of the heat dissipation strut and the substrate can be avoided. Therefore, the heat generated by the heat generating component can be released to the outside with high efficiency through the heat dissipation column. In addition, since a board without deformation and breakage can be used, it becomes possible to mount the heat generating component on the board in a proper posture without any difficulty.

  Further, according to the mounting substrate of the present invention, since the heat dissipating strut has the male screw portion screwed into the female screw portion of the through hole, adjusting the rotation angle of the heat dissipating strut at the time of screwing allows heat dissipation to the through hole. It becomes possible to finely adjust the height of the column. For this reason, the bottom surface of the heat generating component mounted on the board can be brought into contact with the upper end of the heat radiating column in an appropriate pressure state, and heat generated by the heat generating component can be efficiently generated without damaging the heat generating component. It becomes possible to discharge to the outside through the heat dissipation column.

  Further, according to the mounting substrate of the present invention, the heat dissipation column can be removed from the substrate after the male screw portion of the heat dissipation column is held in a state of being screwed into the female screw portion of the through hole of the substrate. For this reason, even after the heat radiating support is held on the substrate, replacement with another heat radiating support becomes easy. For example, it can be replaced with another heat radiating support using a material having a heat radiation characteristic suitable for the heat generation state of the heat generating component and an appropriate cost. Alternatively, it is possible to recycle the heat dissipation strut by removing the heat dissipation strut held in the through hole of one mounting substrate and attaching the heat dissipation strut to the through hole of another mounting substrate.

  According to the heat generating component mounting module of the present invention, the effect of the mounting board described above is obtained.

It is a figure which shows the mounting substrate 10 which concerns on Embodiment 1. FIG. It is a figure which shows the heat generating component mounting module 1 which concerns on Embodiment 1. FIG. It is a figure which shows the process of manufacturing the mounting substrate 10 and the heat-emitting component mounting module 1 which concern on Embodiment 1. FIG. It is a figure which shows the process of manufacturing the mounting board | substrate 10a which concerns on Embodiment 2, and the heat-emitting component mounting module 1a. It is a figure which shows the process of manufacturing the mounting board | substrate 10b which concerns on Embodiment 3, and the heat-emitting component mounting module 1b. It is sectional drawing which shows the heat-emitting component mounting module 1c containing the mounting substrate 10c which concerns on Embodiment 4. FIG. It is sectional drawing which shows the heat-emitting component mounting module 1d containing the mounting substrate 10d which concerns on Embodiment 5. FIG. It is sectional drawing which shows the heat-emitting component mounting module 901 containing the conventional mounting board | substrate 915. FIG.

  Hereinafter, a heating component mounting module and a mounting substrate used in the heating component mounting module of the present invention will be described based on the embodiments shown in the drawings.

[Embodiment 1]
1. Configuration of Mounting Board and Heating Component Mounting Module in Embodiment 1 FIG. 1 is a diagram showing a mounting board 10 according to Embodiment 1. FIG. 2 is a view showing the heat generating component mounting module 1 according to the first embodiment. FIG. 3 is a diagram illustrating a process of manufacturing the mounting substrate 10 and the heat generating component mounting module 1 according to the first embodiment. 3A is a cross-sectional view of the substrate 110 and the heat radiating support 120 before the heat radiating support 120 is held in the through hole 113 of the substrate 110 according to the first embodiment, and FIG. 3B is a mounting according to the first embodiment. FIG. 3C is a cross-sectional view of the substrate 10, FIG. 3C is a cross-sectional view of the heat generating component mounting module 1 according to the first embodiment, and FIG. 3D is a heat dissipation sheet 200 in the heat generating component mounting module 1 according to the first embodiment. FIG. 3E is a cross-sectional view of the heat generating component mounting module 1 and the heat radiating sheet 200 in a state where the heat radiating sheet 200 and the heat radiating fins 300 are disposed in the heat generating component mounting module 1 according to the first embodiment. 2 is a cross-sectional view of the heat generating component mounting module 1, the heat radiation sheet 200, and the heat radiation fin 300. FIG.

  The mounting substrate 10 according to the first embodiment includes a substrate 110 and a heat dissipation column 120 as shown in FIGS. 1 and 3B.

  As shown in FIG. 3A, the substrate 110 includes a front surface 111 and a back surface 112 on which the heat generating component 150 is mounted, and a through-hole penetrating the front surface 111 and the back surface 112 at a plan view position on which the heat generating component 150 is mounted. 113 and a recessed step portion 115 formed on the back surface 112 side of the through-hole 113. An internal thread 114 is formed on the inner wall of the through hole 113. Further, a wiring pattern (not shown) to which the connection terminal 151 of the heat generating component 150 is bonded is disposed on the surface 111 of the substrate 110. The wiring pattern may be disposed on the back surface 112 in addition to the front surface 111. The substrate 110 is formed from a synthetic resin, but may be formed from other insulating materials.

  As shown in FIG. 3A, the heat dissipating column 120 is integrally formed with an insertion portion 121 that protrudes to the center of the tip, a middle step portion 123 that is larger in diameter than the insertion portion 121, and a cap portion 124 that is larger in diameter than the middle step portion 123. ing. Therefore, the cap portion 124 is formed on the lower end side (the end portion side in the direction from the front surface 111 of the substrate 11 toward the rear surface 112) that is the end portion on the back surface 112 side of the insertion portion 121 in the heat dissipation column 120. . A male screw part 122 is formed on the outer periphery of the insertion part 121. The plan view shape of the middle stage portion 123 and the cap portion 124 of the heat dissipation column 120 is circular, but may be non-circular. The heat dissipating column 120 is made of a metal having good heat conduction such as copper, aluminum, or ceramic.

  As shown in FIGS. 1 and 3B, the mounting substrate 10 penetrates in a state where the insertion portion 121 of the heat radiating support 120 is inserted into the through hole 113 of the substrate 110 and the male screw portion 122 is screwed into the female screw portion 114. It is held in the hole 113. In this case, the upper end (the end in the direction from the back surface 112 of the substrate 110 toward the front surface 111) of the insertion portion 121 of the heat radiating column 120 is set to the same height as the front surface 111 of the substrate 110. This same height can be achieved by the middle step 123 of the heat dissipation column 120 hitting the depression step 115 of the substrate 110 and / or the cap portion 124 hitting the back surface 112 of the substrate 110. In addition, the lower end of the cap portion 124, which is the lower end (end portion in the direction from the front surface 111 of the substrate 110 toward the rear surface 112), which is the end portion on the back surface 112 side of the heat radiating support 120, extends downward from the back surface 112 of the substrate 110. It protrudes.

  In addition, the cross-sectional area K of the cap portion 124 of the heat dissipation column 120 is formed wider than the cross-sectional area S of the insertion portion 121. For this reason, when the heat generating component 150 is mounted on the mounting substrate 10, the heat generated by the heat generating component 150 is conducted to the upper end of the insertion portion 121 of the heat radiating column 120 and then immediately conducted to the lower end side of the heat radiating column 120. Is done. At this time, the heat generated by the heat generating component 150 is smoothly conducted through the cap portion 124 formed on the lower end side of the heat radiating column 120 and having a large cross-sectional area. Therefore, it is possible to efficiently dissipate the heat generated by the heat generating component 150 to the outside over a long period of time. The cross-sectional area means a cut surface when the heat radiation support 120 is cut in parallel with the front surface 111 or the back surface 112 of the substrate 110.

  Further, the cross-sectional area C of the middle step portion 123 is formed wider than the cross-sectional area S of the insertion portion 121, and the cross-sectional area K of the cap portion 124 is formed wider than the cross-sectional area C of the middle step portion 123. For this reason, the relationship between the cross-sectional areas K, C, and S is K> C> S. Therefore, the cross-sectional area of the heat dissipation column 120 is from the upper end of the insertion portion 121 which is the upper end (end portion in the direction from the back surface 112 of the substrate 110 to the surface 111) that is the end portion on the surface 111 side of the heat dissipation column 120. The heat dissipating column 120 has a structure that widens stepwise toward the lower end of the cap portion 124 as a lower end (end in the direction from the front surface 111 to the rear surface 112 of the substrate 110) that is an end portion on the back surface 112 side. . For this reason, the heat generated by the heat generating component 150 is smoothly and smoothly conducted through the stepped portion of the heat dissipation column 120. For this reason, it is possible to efficiently radiate the heat generated by the heat generating component 150 to the outside over a long period of time.

  In order to efficiently dissipate the heat generated by the heat generating component 150 to the outside, it is preferable to set as follows. That is, in the structure portion widened in a staircase shape of the heat dissipation column 120, the outer end portion at the upper end of each step portion, that is, the outer end portion 121a at the upper end of the insertion portion 121, the outer end portion 123a at the upper end of the middle step portion 123, and The connecting line m connecting the outer end portions 124a at the upper end of the cap portion 124 connects the axis n of the heat dissipation column 120 (in FIG. 1, the center point of the insertion portion 121 in plan view and the center point of the cap portion 124 in plan view). Α is preferably 45 ° ± 20 °, more preferably 45 ° ± 10 °, and most preferably 45 °. When the connecting line is a curve, the midpoint on the curve between the outer end 121a of the insertion portion 121 corresponding to the uppermost end and the outer end 124a of the cap portion 124 corresponding to the lowermost end. Α ′ is preferably 45 ° ± 20 °, more preferably 45 ° ± 10 °, and most preferably 45 °, where α ′ is an angle at which the tangent line intersects the axis n. .

  As shown in FIG. 2 and FIG. 3C, the heat generating component mounting module 1 has a heat generating component 150 mounted on the surface 111 of the mounting substrate 10 (substrate 110). The heat generating component 150 is arranged at a plan view position of the through hole 113 of the substrate 110, and the connection terminal 151 is joined to a wiring pattern formed in advance on the surface 111 of the substrate 110 by solder. The heat generating component 150 is exemplified by a power semiconductor element that is resin-sealed and the connection terminal 151 protrudes. The heat generating component 150 may be an electronic device other than the power semiconductor element, and indicates an electronic component that generates heat during use.

  The bottom surface of the heat generating component 150 is in close contact with the surface 111 of the substrate 110, and is in close contact with the upper end surface of the insertion portion 121 of the heat dissipation column 120. For this reason, the heat generated by the heat generating component 150 is quickly radiated to the outside via the heat radiating column 120.

  As shown in FIG. 3D, the heat generating component mounting module 1 further includes a heat radiating sheet 200, which can further improve the heat dissipation to the outside.

  The heat dissipating sheet 200 is formed on the cap portion 124 which is the lower surface side of the heat dissipating column 120 so as to be in contact with the lower surface of each cap portion 124 which is the lower surface of the heat dissipating column 120 (the end surface in the direction from the front surface 111 to the back surface 112 of the substrate 110). It is arranged on the lower surface side. The heat dissipating sheet 200 is joined to the cap portion 124 while being pressed against the lower surface of the cap portion 124. Since the heat radiation sheet 200 has flexibility, the pressing forms a raised portion 201 that rises upward on the outer periphery of the cap portion 124 of the heat radiation column 120. Therefore, the heat dissipation sheet 200 contacts the lower surface of the cap portion 124 and also contacts the outer periphery of the cap portion 124 by the raised portion 201, so that the contact area with the heat dissipation column 120 is widened. For this reason, the heat dissipation sheet 200 can easily release the heat conducted through the heat dissipation support 120 to the outside. In addition, the heat radiating sheet 200 is composed of, for example, silicone as a main component, and has insulating properties, heat radiating properties, and flexibility.

  As shown in FIGS. 3D and 3E, the heat dissipation sheet 200 is disposed on the lower surface side of the heat generating component mounting module 1 and on the lower surface side of the adjacent heat generating component mounting module 1. The heat dissipation sheet is connected. However, the heat dissipating sheet may be disposed only on the lower side of one heat generating component mounting module 1. In this case, the heat radiating sheet disposed below the adjacent heat generating component mounting module 1 is separate from the heat radiating sheet disposed only below the one heat generating component mounting module 1.

  As shown in FIG. 3 (e), the heat generating component mounting module 1 is provided with a heat radiating fin 300 with respect to the heat generating component mounting module shown in FIG. can do.

  The heat radiating fins 300 are disposed on the lower surface side of the heat radiating sheet 200 so as to be in contact with the lower surface of the heat radiating sheet 200 (the end surface in the direction from the front surface 111 to the back surface 112 of the substrate 110), and are joined to the lower surface of the heat radiating sheet 200. It is arranged. Since the radiating fin 300 includes a large number of fins 301 directed downward, the contact surface area with the outside becomes wider. For this reason, the heat radiating fins 300 easily release the heat conducted through the heat radiating columns 120 and the heat radiating sheet 200 from the outside. In addition, the radiation fin 300 is comprised from metal with favorable heat conductivity, such as copper, aluminum, or a ceramic, for example.

  The heat radiating fin 300 connects a heat radiating fin disposed below the heat generating component mounting module 1 and a heat radiating fin disposed below the adjacent heat generating component mounting module 1. However, the heat radiating fins may be arranged only on the lower side of one heating component mounting module 1. In that case, the heat dissipating fins disposed below the adjacent heat generating component mounting module 1 are separate from the heat dissipating fins disposed only below the one heat generating component mounting module 1.

2. Manufacturing Method of Mounting Board and Heating Component Mounting Module in Embodiment 1 The mounting board 10 and the heating component mounting module 1 according to Embodiment 1 can be manufactured by the manufacturing method shown below.

  The manufacturing method of the mounting substrate 10 according to the first embodiment includes a “substrate and heat dissipation column creation step” and a “heat dissipation column holding step on the substrate”. The method for manufacturing the heat generating component mounting module 1 in the first embodiment uses the mounting substrate 10 obtained by the method for manufacturing the mounting substrate 10 and includes a “heating component mounting step”. Hereinafter, each process will be described in detail.

(1) Production Step of Substrate and Heat Dissipation First, as shown in FIG. 3A, a substrate 110 is produced. The material of the substrate 110 is a synthetic resin plate, and a copper foil is bonded to the surface 111. Using this material, a plurality of recess steps 115 are formed by machining at predetermined locations on the back surface 112, and a through hole 113 is drilled in the center of each recess step 115 in plan view. Next, the copper foil on the surface 111 is etched to form a wiring pattern having a predetermined shape. Thereafter, when a female screw tool is screwed into the inner wall of the through hole 113 to form the female screw portion 114, the substrate 110 is obtained. The through hole 113 is formed at a planar view position corresponding to the center position of the heat generating component 150 to be mounted on the surface 111 of the substrate 110 later.

  Next, as shown in FIG. The material of the heat dissipating column 120 is a metal having good thermal conductivity such as copper, aluminum, or ceramic. The material is machined to form the insertion portion 121, the middle step portion 123, and the cap portion 124. After that, when the male screw part 122 is formed by screwing the male screw tool into the insertion part 121, the heat dissipating column 120 is obtained. In addition, when the planar view shape of the cap part 124 is a perfect circle, the heat dissipation support 120 can be machined with a lathe. However, when the planar view shape of the cap part 124 is non-circular, only the cap part 124 is pressed. Apply.

(2) Step of holding heat dissipation strut to substrate Next, as shown in FIG. 3B, the insertion portion 121 of the heat dissipation strut 120 is inserted into the through hole 113 of the substrate 110, and the male screw portion 122 of the heat dissipation strut 120 is connected to the substrate. Screw into the female threaded portion 114 of 110. In this screwing, the upper surface of the middle step portion 123 of the radiating support column 120 comes into contact with the lower surface of the recessed step portion 115 of the substrate 110, or in addition, the upper surface of the cap portion 124 of the radiating support column 120 contacts the back surface 112 of the substrate 110. It is done until it hits. In this way, the mounting substrate 10 is obtained.

(3) Heating Component Mounting Step Next, as shown in FIG. 3C, the mounting substrate 10 obtained by the “substrate and heat dissipation column creation step” and the “heat dissipation column holding step on the substrate” is added to the heating substrate. 150 is implemented. The heat generating component 150 is placed on the surface 112 of the mounting substrate 10 so that the bottom surface thereof covers the through hole 113 of the substrate 110. Subsequently, the connection terminal 151 of the heat generating component 150 is joined to the conductive pattern of the substrate 110 by soldering, and thus the heat generating component mounting module 1 is obtained.

  Further, as shown in FIG. 3D, the heat radiation sheet 200 is installed on the lower surface side of the heat radiation column 120 so as to be in contact with the lower surface of the heat radiation column 120 of the heat generating component mounting module 1. The heat radiating sheet 200 is bonded to the lower surface of the heat radiating column 120 with an adhesive while being pressed from below. For this reason, the raised portion 201 is formed on the outer peripheral side of the cap portion 124 of the heat dissipation column 120 due to the flexibility of the heat dissipation sheet 200.

  Further, as shown in FIG. 3 (e), the radiating fins 300 are installed on the lower surface side of the heat radiating sheet 200 so as to be in contact with the lower surface of the heat radiating sheet 200 joined to the lower surface of the heat generating component mounting module 1. The heat radiating fins 300 are bonded to the lower surface of the heat radiating sheet 200 from below with an adhesive.

3. Effects obtained by the mounting substrate and the heat-generating component mounting module according to the first embodiment According to the mounting substrate 10 according to the first embodiment, the heat radiating column 120 is mounted on the substrate by a simple operation of rotating the heat radiating column 120 around the rotation axis. 110 can be held in the through hole 113. For this reason, it is not necessary to apply a strong pressure to the heat dissipation strut and the substrate as in the case where the conventional heat dissipation support is press-fitted into the through hole, and deformation and breakage of the heat dissipation strut and the substrate can be avoided. Therefore, the heat generated by the heat generating component 150 can be released to the outside through the heat dissipation column 120 with high efficiency. In addition, since the substrate 110 that is not deformed or damaged can be used, the heat generating component 150 can be mounted on the substrate 110 in a proper posture without overloading.

  Further, according to the mounting substrate 10 of the first embodiment, since the heat radiating column 120 has the male screw portion 122 screwed to the female screw portion 114 of the through hole 113, the rotation angle of the heat radiating column 120 at the time of screwing is adjusted. This makes it possible to finely adjust the height of the heat dissipation column 120 with respect to the through hole 113. For this reason, the bottom surface of the heat generating component 150 mounted on the substrate 110 and the upper end of the heat dissipation column 120 can be brought into contact with each other at an appropriate pressure, and the heat generating component 150 is generated without damaging the heat generating component 150. Heat can be released to the outside through the heat dissipation column 120 with high efficiency.

  In addition, according to the mounting substrate 10 of the first embodiment, the heat dissipation column 120 can be removed from the substrate 110 after the male screw portion 122 of the heat dissipation column 120 is held in a state of being screwed into the through hole 113 of the substrate 110. It becomes. For this reason, even after the heat radiating support 120 is held on the substrate 110, replacement with another heat radiating support becomes easy. For example, it is possible to replace the heat dissipating column with another heat dissipating column using a material having a heat dissipating characteristic suitable for the heat generation state of the heat generating component 150 and an appropriate cost. Alternatively, it is possible to recycle the heat dissipation column by removing the heat dissipation column 120 held in the through hole 113 of one mounting substrate 10 and attaching the heat dissipation column 120 to the through hole 113 of the other mounting substrate 10. It becomes.

  Further, according to the mounting substrate 10 of the first embodiment, the heat dissipation column 120 has the lower end on the back surface 112 side (the end portion in the direction from the front surface 111 of the substrate 110 toward the back surface 112) protruding from the back surface 112 of the substrate 110. Therefore, the surface area of the portion of the heat dissipation column 120 that comes into contact with the outside is increased. For this reason, the heat generated by the heat generating component 150 can be efficiently radiated to the outside.

  Further, according to the mounting substrate 10 of the first embodiment, since the lower end of the heat radiating column 120 protrudes from the back surface 112 of the substrate 110, when the male screw portion 122 of the heat radiating column 120 is screwed into the female screw portion 114 of the through hole 113, Alternatively, when the male screw portion 122 is unscrewed from the female screw portion 114, the portion of the heat dissipation column 120 protruding from the back surface 112 of the substrate 110 can be gripped by a screwdriver or manually. For this reason, the screwing and unscrewing operations of the heat dissipating column 120 are facilitated. In addition, when the part which protrudes from the back surface 112 of the board | substrate 110 in the thermal radiation support | pillar 120 is a planar view shape, it will be easy to hold | grip with a screwdriver or manual operation, and it will become easy to screw in and unscrew.

  Moreover, according to the mounting substrate 10 of Embodiment 1, since the internal thread part 114 is formed in the inner wall of the through-hole 113, screw members other than the board | substrate 110 are unnecessary, and it can reduce manufacturing cost.

  Further, according to the mounting substrate 10 of the first embodiment, the heat dissipation column 120 includes the cap portion 124 formed on the lower end side from the insertion portion 121, and the cross-sectional area of the cap portion 124 is wider than the cross-sectional area of the insertion portion 121. Therefore, the heat generated by the heat generating component 150 is transmitted to the upper end of the insertion portion 121 of the heat radiating column 120 and then immediately conducted to the lower end side of the heat radiating column 120. Therefore, it is possible to efficiently dissipate the heat generated by the heat generating component 150 to the outside over a long period of time.

  Further, according to the mounting substrate 10 of the first embodiment, the cross-sectional area of the heat radiating support 120 is the end in the direction from the back surface 112 to the front surface 111 of the substrate 110 in the direction from the top surface 111 to the back surface 112. Since it has a structure that widens stepwise toward the lower end that is the end, the heat generated by the heat generating component 150 is transferred to the upper end of the insertion portion 121 of the heat radiating column 120 and then immediately on the lower side of the heat radiating column 120. Conducted by At this time, the heat generated by the heat generating component 150 is smoothly conducted through the stepped portion having a wide cross-sectional area from the upper end to the lower end of the heat dissipation column 120. For this reason, it is possible to efficiently radiate the heat generated by the heat generating component 150 to the outside over a long period of time.

  According to the heat generating component mounting module 1 of the first embodiment, the effect of the mounting substrate 10 described above is obtained.

  In addition, according to the heat generating component mounting module 1 of the first embodiment, after performing preparatory work such as circuit pattern formation, solder printing, or mounting of the heat generating component 150 on the substrate 110, the heat dissipating column 120 is mounted on the substrate 110. 110 can be held. In that case, the preparatory work can be carried out freely without being obstructed by the heat dissipating column 120.

  In addition, according to the heat generating component mounting module 1 of the first embodiment, the heat radiation support 120 can be held on the substrate 110 after the preparation work is performed. It can be released. In that case, the heat generated by the heat generating component 150 can be released to the outside with high efficiency through the heat dissipation column 120 over a long period of time.

  Further, according to the heat generating component mounting module 1 of the first embodiment, since the heat radiating support 120 is held on the substrate 110, the heat generating component 150 is formed at a higher density than the case where the heat radiating support is not held on the substrate. It is possible to implement it. In other words, when the heat radiating support 120 is not held on the substrate 110, it is necessary to radiate the heat generated by the heat generating component 150 from the heat generating component 150. Therefore, the outer dimensions of the heat generating component 150 are increased or the same heat generating component is used. There was a need to mount 150 in parallel with two or three. For this reason, the mounting area of the heat generating component 150 has increased. On the other hand, according to the heat generating component mounting module 1 of the first embodiment, the heat generated by the heat generating component 150 is radiated to the outside through the heat radiating support 120, so that the outer dimensions of the heat generating component 150 can be reduced. There is no need to mount many heat generating components 150 in parallel. For this reason, the area of the board required for mounting the heat generating component 150 may be reduced, and therefore, the heat generating component 150 can be mounted on the substrate 110 with high density.

  Further, according to the heat generating component mounting module 1 of the first embodiment, since the heat dissipating sheet 200 is further provided on the lower surface side of the heat dissipating column 120 so as to be in contact with the lower surface of the heat dissipating column 120, the heat generated by the heat generating component 150 is provided. Can be radiated to the outside with high efficiency by the heat radiation sheet 200 via the heat radiation support column 120.

  Further, according to the heat generating component mounting module 1 of the first embodiment, since the heat dissipating fins 300 are further provided on the lower surface side of the heat dissipating sheet 200 so as to be in contact with the lower surface of the heat dissipating sheet 200, the heat generated by the heat generating component 150 is provided. Can be radiated from the outside with high efficiency by the heat radiating sheet 200 and the heat radiating fins 300 via the heat radiating support 120.

[Embodiment 2]
FIG. 4 is a diagram illustrating a process of manufacturing the mounting board 10a and the heat generating component mounting module 1a according to the second embodiment. 4A is a cross-sectional view of the substrate 110a and the female screw member 170 before the female screw member 170 is fixed to the through hole 113a of the substrate 110a according to the second embodiment, and FIG. 4B is a substrate according to the second embodiment. FIG. 4C is a cross-sectional view of the substrate 110a and the heat dissipation column 120 before holding the heat dissipation column 120 on 110a, FIG. 4C is a cross-sectional view of the mounting substrate 110a according to the second embodiment, and FIG. 2 is a cross-sectional view of a heat generating component mounting module 1a according to FIG.

  The mounting substrate 10a and the heat generating component mounting module 1a according to the second embodiment have basically the same configurations as the mounting substrate 10 and the heat generating component mounting module 1 according to the first embodiment, but the configuration of the female screw portion of the substrate is different. That is, in the mounting substrate 10a and the substrate 110a of the heat generating component mounting module 1a according to the second embodiment, the female screw portion 114a is formed in the female screw member 170 as shown in FIG. The female screw member 170 is fixed to the through hole 113a of the substrate 110a.

  The female screw member 170 is made of a metal having good conductivity such as copper, aluminum, or ceramic, and a female screw portion 114a is formed on the inner wall thereof. The female screw member 170 is inserted into the through hole 113a of the substrate 110a and fixed with an adhesive. Alternatively, the female screw member 170 may be fixed by being press-fitted into the through hole 113a of the substrate 110a.

  As shown in FIG. 4C, the mounting substrate 10a according to the second embodiment has the insertion portion 121 of the heat dissipation column 120 inserted into the through hole 113a of the substrate 110a, and the male screw formed in the insertion portion 121 at that time. The portion 122 is screwed into the female screw portion 114a of the female screw member 170 fixed to the through hole 113a of the substrate 110a, so that the heat dissipation column 120 is held in the through hole 113a.

  As shown in FIG. 4D, the heat generating component mounting module 1a according to the second embodiment includes a mounting substrate 10a and a heat generating component 150 mounted on the surface 111a of the mounting substrate 10a.

  According to the mounting substrate 10a and the heat generating component mounting module 1a according to the second embodiment, the female screw portion 114a is formed on the female screw member 170 fixed to the through hole 113a, and therefore the female screw member 170 is made of a material different from that of the substrate 110a. Can be created. For this reason, the internal thread member 170 can be formed from an optimal material in terms of both strength and cost. Therefore, when the female screw member 170 is formed of a metal material, the strength of the female screw member 170 is sufficiently strong even if the substrate 110a is formed of a synthetic resin, so that highly reliable screwing can be realized. Moreover, since the female screw member 170 is a metal having a high thermal conductivity, it is possible to promote the heat radiated from the heat generating component 150 to the outside.

[Embodiment 3]
FIG. 5 is a diagram illustrating a process of manufacturing the mounting board 10b and the heat generating component mounting module 1b according to the third embodiment. FIG. 5A is a cross-sectional view of the substrate 110b and the heat dissipation column 120b before holding the heat dissipation column 120b according to the third embodiment, and FIG. 5B is a cross-sectional view of the mounting substrate 10b according to the third embodiment. FIG. 5C is a cross-sectional view of the heat generating component mounting module 1b according to the third embodiment.

  The mounting board 10b and the heat generating component mounting module 1b according to the third embodiment have basically the same configuration as the mounting board 10 and the heat generating component mounting module 1 according to the first embodiment, but the cap portion of the heat dissipation column and the depression of the board. The configuration of the step is different. That is, in the mounting substrate 10b and the heat-generating component mounting module 1b according to the third embodiment, the cross-sectional area of the cap portion 124b in the heat dissipation column 120b is the lower end of the heat dissipation column 120b (the end in the direction from the front surface 111b of the substrate 110b to the back surface 112b Part) is continuously widened. Further, the recessed step portion 115b of the substrate 110b is formed to have a width on the back surface 112b side wider than the front surface 111b side along the cross-sectional shape of the cap portion 124b.

  According to the mounting substrate 10b and the heat generating component mounting module 1b according to the third embodiment, the heat generated by the heat generating component 150 is transmitted to the upper end of the insertion portion 121b of the heat radiating column 120b, and then immediately to the cap portion 124b on the lower end side. Conducted. This heat is smoothly conducted through the cap portion 124b having a structure in which the cross-sectional area continuously increases toward the lower end. For this reason, it is possible to efficiently radiate the heat generated by the heat generating component 150 to the outside over a long period of time.

  In order to dissipate the heat generated by the heat generating component 150 to the outside more efficiently, the portion where the cross-sectional area of the cap portion 124b is continuously widened is the upper end (from the back surface 112b of the substrate 110b in the cap portion 124b). The connecting line p connecting the outer end portion 124ba and the lower end outer end portion 124bb in the direction toward the surface 111b) is the axis q of the heat dissipation column 120b (the center of the insertion portion 121b in plan view in FIG. 4B). Β is preferably 45 ° ± 20 °, more preferably 45 ° ± 10 °, where β is an angle that intersects an axis that connects the point and the center point of the cap portion 124b in plan view). 45 degrees is most preferable. When the connecting line is a curve, the angle at which the tangent at the midpoint on the curve formed between the outer end 124ba at the upper end and the outer end 124bb at the lower end intersects the axis q. When β ′, β ′ is preferably 45 ° ± 20 °, more preferably 45 ° ± 10 °, and most preferably 45 °.

[Embodiment 4]
FIG. 6 is a cross-sectional view showing a heat generating component mounting module 1c including a mounting substrate 10c according to the fourth embodiment.

  The mounting board 10c and the heat generating component mounting module 1c according to the fourth embodiment basically have the same configuration as the mounting board 10 and the heat generating component mounting module 1 according to the first embodiment, but the heat dissipation column 120c is joined to the board 110c. Is different.

  The heat dissipating column 120c is bonded to the back surface 112c of the substrate 110c through the bonding material 180 in the cap portion 124c. The bonding material 180 may be, for example, an epoxy resin adhesive, solder, or other material. The bonding material 180 is applied to a predetermined portion of the back surface 112c of the substrate 110c or the back surface of the cap portion 124c of the heat radiation column 120c, and is cured by being left standing or heated.

  According to the mounting substrate 10c and the heat-generating component mounting module 1c according to the fourth embodiment, the heat dissipation column 120c is securely bonded to the substrate 110c via the bonding material 180, and therefore, the screw of the heat dissipation column 120c is loosened with respect to the substrate 110c. Can be prevented in advance. Accordingly, the height dimension of the upper end of the heat dissipation column 120c with respect to the bottom surface of the heat generating component 150 or the protruding size of the lower end of the heat dissipation column 120c with respect to the back surface 112c of the substrate 110c can be stabilized. It is possible to efficiently dissipate heat to the outside.

[Embodiment 5]
FIG. 7 is a cross-sectional view showing a heat generating component mounting module 1d including a mounting substrate 10d according to the fifth embodiment.

  The mounting substrate 10d and the heat generating component mounting module 1d according to the fifth embodiment basically have the same configuration as the mounting substrate 10 and the heat generating component mounting module 1 according to the first embodiment, but the structure of the heat dissipation column 120d and the substrate 110d is the same. Different.

  As shown in FIG. 7, the heat dissipating column 120 d includes an insertion portion 121 d and a cap portion 124 d that are inserted into the through hole 113 d of the substrate 110 d, but has a middle step portion 123 of the heat dissipating column 120 of the first embodiment. Absent. Further, the heat dissipating column 120d is held in the through hole 113d by inserting the insertion portion 121d into the through hole 113d and screwing the male screw portion 122d into the female screw portion 114d formed on the inner wall of the through hole 113d. On the back surface 112d of the substrate 110d, there is no hollow step 115 formed in the substrate 1 of the first embodiment, and it is flat. For this reason, in a state where the insertion portion 121d of the heat dissipation column 120d is held in the through hole 113d, the cap portion 124d abuts on the back surface 112d of the substrate 110d, and the position of the heat dissipation column 120d in the height direction is determined.

  According to the mounting substrate 10d and the heat-generating component mounting module 1d according to the fifth embodiment, the heat-dissipating column 120d does not have the middle stage portion 123 unlike the heat-dissipating column 120 of the first embodiment, and thus can be manufactured easily and at a low cost. It becomes possible. Moreover, since the board | substrate 110d does not have the hollow step part 115 like the board | substrate 110 of Embodiment 1, it becomes easy to manufacture and can be manufactured at low cost.

  As mentioned above, although this invention was demonstrated based on said each embodiment, this invention is not limited to said embodiment. The present invention can be implemented in various ways without departing from the spirit of the invention. For example, the following modifications are possible.

(1) In each of the above embodiments, the lower end of the heat radiating column is projected from the back surface of the substrate, but the lower end may not be projected from the back surface of the substrate. That is, the lower end of the radiating column may be the same height as the back surface of the substrate, and the lower end of the radiating column may be recessed on the front side from the back surface of the substrate.

(2) In Embodiments 1 and 2, the heat dissipating column 120 is configured in a three-step staircase including the insertion portion 121, the middle step portion 123, and the cap portion 124. It may be configured.

(3) In the first and second embodiments, the heat dissipating column 120 is configured in a stepped shape having the insertion portion 121, the middle step portion 123, and the cap portion 124. A structure in which the cross-sectional area is continuously widened toward the lower end, like the cap portion 124b of the heat dissipation column 120b of the third embodiment, may be employed for the stepped portion.

(4) In each of the above embodiments, the heat dissipation column has the cap portion formed on the lower end side from the insertion portion, but the cap portion may not be formed. In that case, the heat dissipating struts are formed to have substantially the same diameter from the leading end to the lower end of the insertion portion as the upper end.

(5) In each of the above embodiments, the lower end of the heat dissipating column is flat on the back side, but the external thread of the heat dissipating column is screwed to the internal thread of the through hole of the substrate on the lower end. A plus-shaped groove or a minus-shaped groove may be formed as the engagement groove of the tool to be performed.

(6) In each of the above embodiments, the heat dissipating column has the male screw portion formed from the upper end to the lower end of the insertion portion, but the male screw portion is not formed near the upper end of the insertion portion, and somewhat from the upper end to the lower end side. It may be formed on the lower end side from the moved position.

(7) In each of the above-described embodiments, the manufacturing method according to the heat-generating component mounting module manufactures a board and a heat-dissipating column (“process for creating a substrate and a heat-dissipating column”), and holds the heat-dissipating column on the substrate (“to the substrate” The heat-dissipating column holding step ”) and mounting the heat-generating component on the mounting substrate holding the heat-dissipating column (“ heating component mounting step ”) were performed in this order to obtain a heat-generating component mounting module. However, the manufacturing method of the heat generating component mounting module according to the present invention can adopt a manufacturing method other than the manufacturing method in each of the above embodiments. As an example of a manufacturing method other than the manufacturing method in each of the above embodiments, a substrate and a heat dissipation column are manufactured ("Process for creating a substrate and a heat dissipation column"), and a heating component is mounted on the substrate to manufacture a heating component mounting substrate. ("Heat-generating component mounting board manufacturing process"), and hold the heat-dissipating struts in the through holes formed in the board of the heat-generating component mounting board ("Heat-dissipating strut mounting process on the heat-generating component mounting board") in this order. The heat generating component mounting module is obtained.

  According to the heat generating component mounting module manufactured by the manufacturing method of the above example, after performing preparatory work such as circuit pattern formation, solder printing, or mounting of the heat generating component on the substrate, the heat dissipating column is mounted on the substrate. It becomes possible to hold. For this reason, the said preparatory work can be implemented freely, without being interrupted by the thermal radiation support | pillar. In particular, when manufacturing a heat-generating component mounting module in which a heat dissipation column protrudes from the back surface of the mounting substrate, the preparatory work can be performed on a substrate (substrate on the back surface flat state) before holding the heat dissipation column. Become. Therefore, high efficiency and high reliability of the preparatory work can be achieved.

  In addition, according to the heat generating component mounting module manufactured by the manufacturing method of the above example, since the heat radiation support can be held on the substrate after the preparation work is performed, the heat radiation support is adversely affected by the preparation work. It is possible to be released from. For this reason, the heat-dissipating strut can be freed from being subjected to contact with chemicals in preparation work, contamination due to heating and pressurization, corrosion, strength deterioration, and damage. Therefore, the heat generated by the heat-generating component can be released to the outside with high efficiency over a long period of time.

(8) In the first embodiment, the heat dissipation sheet includes the heat dissipation sheet that contacts the lower surface of the heat dissipation column, and further includes the heat dissipation fin that contacts the lower surface of the heat dissipation sheet. A metal heat radiating member may be provided. This heat radiating member has a depression on the upper surface so that the outer peripheral surface and the lower surface of the lower end of the heat radiating column of the heat generating mounting module are in contact with each other.

(9) In Embodiments 2 to 5 above, there is no member in contact with the lower surface of the heat dissipation column of the heat-generating mounting module. However, as in Embodiment 1, the heat dissipation sheet in contact with the lower surface of the heat dissipation column, and this You may further provide the radiation fin which touches the lower surface of a thermal radiation sheet. Alternatively, instead of the heat-dissipating sheet and the heat-dissipating fins, a metal heat-dissipating member having a recess on the upper surface which is in contact with the outer peripheral surface and the lower surface of the lower end of the heat-dissipating column may be provided.

(10) In each of the above embodiments, the electronic component mounted on the mounting board is only the heat-generating component, but it is also possible to mount an electronic component such as a capacitor that hardly generates heat.

(11) In each of the above embodiments, the heat-generating component mounted on the mounting board is resin-sealed, but a heat-generating component that is not resin-sealed may be mounted.

(12) In each of the above embodiments, the heat generating component is mounted on the front surface of the substrate. However, the heat generating component may be mounted on the back surface together with the front surface of the substrate. In that case, you may form the wiring pattern connected with the connection terminal of a heat-emitting component also on the back surface of a board | substrate.

  1, 1a, 1b, 1c, 1d, 901 ... heating component mounting module, 10, 10a, 10b, 10c, 10d, 915 ... mounting board, 110, 110a, 110b, 110c, 110d, 910 ... board, 111, 111a, 111b, 111c, 111d ... front surface, 112, 112a, 112b, 112c, 112d ... back surface, 113, 113a, 113b, 113d, 913 ... through hole, 114, 114a, 114b, 114d ... female thread, 115, 115b ... hollow step , 120, 120b, 120c, 120d, 920... Radiating support, 121, 121b, 121d... Insertion part, 122, 122b, 122d... Male screw part, 123 .. middle stage part, 124, 124b, 124d. ... Heat components, 151 ... Connecting terminals, 170 ... Female thread parts 180 ... bonding material, 200 ... heat-radiating sheet, 300 ... heat radiating fins, 960 ... heat sink, 970,980 ... Solder

Claims (11)

A mounting substrate on which heat generating components are mounted on the front surface and the back surface,
A substrate having a through hole in a plan view position on which the heat generating component is mounted;
A heat dissipating column held in the through hole of the substrate,
The mounting board, wherein the heat-dissipating column is held in the through hole in a state where a male screw portion formed in an insertion portion inserted into the through hole is screwed into a female screw portion of the through hole. The mounting board according to claim 1,
The mounting substrate according to claim 1, wherein a lower end, which is an end portion on the back surface side, of the heat dissipating column protrudes from the back surface of the substrate. In the mounting substrate according to claim 1 or 2,
The mounting board, wherein the female thread portion is formed on an inner wall of the through hole. In the mounting substrate according to claim 1 or 2,
The mounting board, wherein the female screw portion is formed in a female screw member fixed to the through hole. The mounting substrate according to any one of claims 1 to 4,
The heat dissipating column has a cap portion formed on a lower end side that is an end portion on the back surface side from the insertion portion, and the cross-sectional area of the cap portion is wider than the cross-sectional area of the insertion portion. substrate. The mounting substrate according to any one of claims 1 to 5,
The mounting substrate having a structure in which a cross-sectional area of the heat-dissipating column has a stepped shape from an upper end that is an end portion on the front surface side toward a lower end that is an end portion on the back surface side. The mounting board according to claim 5,
The mounting board having a structure in which a cross-sectional area of the cap portion of the heat dissipating column is continuously widened toward the lower end of the heat dissipating column. A mounting substrate according to any one of claims 1 to 7,
The mounting substrate, wherein the heat dissipation column is bonded to the substrate via a bonding material.   A heating component mounting module comprising: the mounting substrate according to claim 1; and a heating component mounted on the surface of the mounting substrate. The heat generating component mounting module according to claim 9,
A heat generating component mounting module, further comprising a heat radiating sheet disposed on a lower surface side of the heat radiating column so as to be in contact with a lower surface of the heat radiating column. The heating component mounting module according to claim 10,
A heat generating component mounting module, further comprising heat dissipating fins disposed on the lower surface side of the heat dissipating sheet so as to contact the lower surface of the heat dissipating sheet.