JPH022655A - Cooling method/device for integrated circuit package - Google Patents

Cooling method/device for integrated circuit package

Info

Publication number
JPH022655A
JPH022655A JP63321855A JP32185588A JPH022655A JP H022655 A JPH022655 A JP H022655A JP 63321855 A JP63321855 A JP 63321855A JP 32185588 A JP32185588 A JP 32185588A JP H022655 A JPH022655 A JP H022655A
Authority
JP
Japan
Prior art keywords
substrate
integrated circuit
circuit package
soldering
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63321855A
Inventor
Rene Septfons
Original Assignee
Alcatel Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR8717920A priority Critical patent/FR2625038B1/en
Application filed by Alcatel Nv filed Critical Alcatel Nv
Publication of JPH022655A publication Critical patent/JPH022655A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 and H01L51/00, e.g. forming hybrid circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06Thermal details
    • H05K2201/066Heatsink mounted on the surface of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09572Solder filled plated through-hole in the final product
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10727Leadless chip carrier [LCC], e.g. chip-modules for cards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10969Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/0455PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • Y02P70/60Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control
    • Y02P70/613Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control involving the assembly of several electronic elements
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Abstract

PURPOSE: To make soldering between the external connection pad of an integrated circuit package and the conductive path of a substrate to be certain and to use the substrate as a heat radiation body, by soldering the base of the integrated circuit package on the upper surface of the substrate, and soldering a specified peg on the lower surface of the substrate. CONSTITUTION: A thin plating coating area 24 for soldering is provided on the external surface of the base of an integrated circuit package 14. Two tin plating coating areas 32 and 33 which are mutually connected through a coating through hole 31 are provided on both faces of a substrate 10. The base of the integrated circuit package 14 is soldered on the upper surface of the substrate 10 so that the tin plating coating areas 24 and 32 face each other, and a peg 40 is soldered on the lower face of the substrate 10. The peg 40 has a solder plating surface 41 and it has a hole constituted of a passage whose one end terminates at a capillary tube 42 opened into the tin plating coating surface 41 and whose other end terminates by a solder reception part 43. The passage absorbs excessive solder with the base of the integrated circuit package 14 of the substrate 10 via the coating through hole 31.
JP63321855A 1987-12-22 1988-12-20 Cooling method/device for integrated circuit package Pending JPH022655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8717920A FR2625038B1 (en) 1987-12-22 1987-12-22 Method and device for cooling an integrated circuit package

Publications (1)

Publication Number Publication Date
JPH022655A true JPH022655A (en) 1990-01-08

Family

ID=9358156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63321855A Pending JPH022655A (en) 1987-12-22 1988-12-20 Cooling method/device for integrated circuit package

Country Status (6)

Country Link
US (1) US4924352A (en)
EP (1) EP0321899B1 (en)
JP (1) JPH022655A (en)
CA (1) CA1278878C (en)
DE (2) DE3853413T2 (en)
FR (1) FR2625038B1 (en)

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US5043845A (en) * 1989-10-16 1991-08-27 Eastman Kodak Company High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact
US5058265A (en) * 1990-05-10 1991-10-22 Rockwell International Corporation Method for packaging a board of electronic components
JP3018554B2 (en) * 1991-04-25 2000-03-13 株式会社日立製作所 Semiconductor module and method of manufacturing the same
US5280409A (en) * 1992-10-09 1994-01-18 Sun Microsystems, Inc. Heat sink and cover for tab integrated circuits
US6205654B1 (en) * 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5313099A (en) * 1993-03-04 1994-05-17 Square Head, Inc. Heat sink assembly for solid state devices
WO1994029900A1 (en) * 1993-06-09 1994-12-22 Lykat Corporation Heat dissipative means for integrated circuit chip package
US5467251A (en) * 1993-10-08 1995-11-14 Northern Telecom Limited Printed circuit boards and heat sink structures
WO1996008037A1 (en) * 1994-09-06 1996-03-14 Sheldahl, Inc. Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture
US5784256A (en) * 1994-09-14 1998-07-21 Kabushiki Kaisha Toshiba Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board
US5581443A (en) * 1994-09-14 1996-12-03 Kabushiki Kaisha Toshiba Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure
US5719749A (en) * 1994-09-26 1998-02-17 Sheldahl, Inc. Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
US5646826A (en) * 1995-01-26 1997-07-08 Northern Telecom Limited Printed circuit board and heat sink arrangement
US5514907A (en) * 1995-03-21 1996-05-07 Simple Technology Incorporated Apparatus for stacking semiconductor chips
EP0751562B1 (en) * 1995-06-27 2001-07-18 Braun GmbH Thermally conducting fastening of an electronic power device to a printed circuit board with a heat dissipator
DE69728153D1 (en) 1997-12-16 2004-04-22 St Microelectronics Srl Printed circuit board arrangement consisting of a power semiconductor component packed in a plastic housing, the internal heat sink of which is soldered to an external heat sink
US6235991B1 (en) * 1998-06-30 2001-05-22 Lucent Technologies Inc. Recessed mechanical fasteners for circuit boards
US6674163B1 (en) * 1998-08-18 2004-01-06 Oki Electric Industry Co., Ltd. Package structure for a semiconductor device
JP3602968B2 (en) * 1998-08-18 2004-12-15 沖電気工業株式会社 Semiconductor device and substrate connection structure thereof
EP1014767A1 (en) * 1998-12-23 2000-06-28 Lucent Technologies Inc. Thermal stress relief for surface mount components using via filling
GB2345576A (en) * 1999-01-05 2000-07-12 Ericsson Telefon Ab L M Heat-sink of ICs and method of mounting to PCBs
US6294742B1 (en) * 1999-07-27 2001-09-25 Agilent Technologies, Inc. Apparatus and method for adapting surface mount solder pad for heat sink function
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
JP3573034B2 (en) * 1999-11-17 2004-10-06 日本電気株式会社 Multilayer printed wiring board and its heat dissipation structure
US6304451B1 (en) 1999-12-01 2001-10-16 Tyco Electronics Logistics Ag Reverse mount heat sink assembly
GB9929800D0 (en) * 1999-12-17 2000-02-09 Pace Micro Tech Plc Heat dissipation in electrical apparatus
US6293331B1 (en) 2000-08-11 2001-09-25 Tyco Electronics Logistics Ag Vibration and shock resistant heat sink assembly
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US6343012B1 (en) 2000-11-13 2002-01-29 Tyco Electronics Logistis Ag Heat dissipation device with threaded fan module
US6462408B1 (en) * 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
US6879486B1 (en) 2002-02-14 2005-04-12 Mercury Computer Systems, Inc. Central inlet circuit board assembly
US6661657B1 (en) 2002-02-14 2003-12-09 Mercury Computer Systems, Inc. Circuit board assembly for use in a central inlet chassis configuration
US6690575B1 (en) 2002-02-14 2004-02-10 Mercury Computer Systems, Inc. Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies
US6697255B1 (en) 2002-02-14 2004-02-24 Mercury Computer Systems, Inc. Circuit board assembly with integrated shaping and control of flow resistance curve
US6759588B1 (en) 2002-02-14 2004-07-06 Mercury Computer Systems, Inc. Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover
US6781831B1 (en) 2002-02-14 2004-08-24 Mercury Computer Systems, Inc. Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers
US6683787B1 (en) 2002-02-14 2004-01-27 Mercury Computer Systems, Inc. Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
US7461690B2 (en) 2005-09-27 2008-12-09 Delphi Technologies, Inc. Optimally shaped spreader plate for electronics cooling assembly
DE102007037297A1 (en) * 2007-08-07 2009-02-19 Continental Automotive Gmbh Circuit carrier structure with improved heat dissipation
US8248803B2 (en) * 2010-03-31 2012-08-21 Hong Kong Applied Science and Technology Research Institute Company Limited Semiconductor package and method of manufacturing the same
US8929077B2 (en) 2012-01-02 2015-01-06 Tem Products Inc. Thermal connector
FR2999864A1 (en) * 2012-12-19 2014-06-20 Valeo Systemes Thermiques Cooling device for printed circuit board
CH708881B1 (en) * 2013-11-20 2017-06-15 Besi Switzerland Ag Continuous furnace for substrates, which are equipped with components, and Die Bonder.

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EP0180730B1 (en) * 1984-10-31 1989-05-17 Contraves Ag Arrangement for the tension compensation and the heat dissipation of an electronic component

Also Published As

Publication number Publication date
EP0321899B1 (en) 1995-03-22
US4924352A (en) 1990-05-08
EP0321899A1 (en) 1989-06-28
FR2625038B1 (en) 1990-08-17
DE3853413D1 (en) 1995-04-27
CA1278878C (en) 1991-01-08
FR2625038A1 (en) 1989-06-23
DE3853413T2 (en) 1995-09-21

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