JP2905299B2 - Heat dissipation structure and heat sink mounting method - Google Patents
Heat dissipation structure and heat sink mounting methodInfo
- Publication number
- JP2905299B2 JP2905299B2 JP3673191A JP3673191A JP2905299B2 JP 2905299 B2 JP2905299 B2 JP 2905299B2 JP 3673191 A JP3673191 A JP 3673191A JP 3673191 A JP3673191 A JP 3673191A JP 2905299 B2 JP2905299 B2 JP 2905299B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- heat
- heat radiating
- radiating plate
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は放熱板を用いて発熱部品
の放熱を行う放熱構造、および放熱板の実装方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating structure for radiating heat from a heat-generating component using a heat radiating plate, and a method of mounting the heat radiating plate.
【０００２】[0002]
【従来の技術】発熱部品を放熱する場合、通常放熱板を
用いて発熱部品の放熱を行う構造がよくとられている。
かかる従来の放熱構造としては、ハイブリッドＩＣ等の
発熱部品に放熱板をハンダ付けまたはボンド付け等によ
り取り付けた構造が一般的である。2. Description of the Related Art When heat is dissipated from a heat-generating component, a structure for dissipating heat from the heat-generating component using a heat radiating plate is often used.
As such a conventional heat radiating structure, a structure in which a heat radiating plate is attached to a heat generating component such as a hybrid IC by soldering or bonding is common.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
放熱構造ではプリント基板への部品の実装が完了した後
に、放熱板を取り付ける必要があるため、手作業または
放熱板用専用実装機による放熱板の実装工程がそれ専用
に必要となり、コストの増加を招いていた。However, in the conventional heat dissipating structure, it is necessary to attach the heat dissipating plate after the components have been mounted on the printed circuit board. A dedicated mounting process is required, resulting in an increase in cost.
【０００４】また、放熱板は、比較的大型であり、その
実装用のスペースも必要とすることから、放熱板の実装
場所に制約を受ける。Further, since the heat sink is relatively large and requires a space for mounting the heat sink, there is a limitation on a mounting place of the heat sink.
【０００５】本発明は、かかる従来の問題点を解決する
もので、工数の削減がはかれ、任意の場所に実装が可能
な放熱構造及び放熱板の実装方法の提供を目的とする。An object of the present invention is to solve such a conventional problem, and an object of the present invention is to provide a heat radiation structure and a method of mounting a heat radiation plate, which can reduce the number of steps and can be mounted at any place.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するた
め、本発明は、チップ部品が実装された基板にチップ部
品の放熱を行う放熱板を設ける放熱構造において、チッ
プ部品と同じ寸法規格に形成されたチップ型放熱板を発
熱部品の近傍に配置した放熱構造を特徴とする。また、
本発明は、基板にチップ部品と該チップ部品を放熱する
放熱板とを実装する実装方法において、放熱板をチップ
部品と同一の寸法規格に形成し、該放熱板をチップ部品
と同じ実装工程で発熱部品の近傍に配置する放熱板の実
装方法を特徴とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a heat radiating structure in which a heat radiating plate for radiating heat of a chip component is provided on a substrate on which the chip component is mounted. The heat radiation structure is characterized in that the chip type heat radiating plate is arranged near the heat generating component. Also,
The present invention provides a mounting method for mounting a chip component and a heat radiating plate for radiating the chip component on a substrate, wherein the heat radiating plate is formed to the same dimensional standard as the chip component, and the heat radiating plate is formed in the same mounting process as the chip component. The method is characterized by a mounting method of a heat radiating plate arranged near the heat generating component.
【０００７】[0007]
【作用】本発明によれば、チップ型放熱板がチップ部品
と同じ寸法規格に形成されるため、チップ型放熱板はチ
ップ部品と同一工程で、しかも任意の場所にプリント基
板へ実装することができる。According to the present invention, since the chip-type heat radiator is formed to the same dimensional standard as the chip component, the chip-type heat radiator can be mounted on the printed circuit board in the same process as the chip component and at an arbitrary place. it can.
【０００８】[0008]
【実施例】図１は本発明に係るチップ型放熱板の一例を
示す図であり、１枚の金属板１を鋸歯状に折り曲げて表
面積を大きくし、その中央部上面にチップ実装機で吸着
可能に平面状に形成された吸着部３を固定し、これら金
属板１と吸着部３とを金属性の台座４上に固定すること
で、チップ型放熱板１を構成する。１枚の金属板２で吸
着部３も形成すれば、吸着部３は金属板が折り返されて
二重に重なることから、より強固になる。金属板２はそ
の両側面５および６を除いて、外側および内側ともディ
ップハンダ付け時にハンダが付着しないようレジストが
塗布される。従って、側面５および６がハンダ付け可能
面となり、ハンダ付けを行った後もチップ型放熱板１の
表面積が小さくなることはない。尚、チップ型放熱板１
をリフロー加熱により、ハンダ付けする場合は、前記レ
ジストは不要である。FIG. 1 is a view showing an example of a chip-type heat radiating plate according to the present invention. One metal plate 1 is bent in a sawtooth shape to increase the surface area, and the upper surface of the central portion is adsorbed by a chip mounting machine. The chip-type heat radiating plate 1 is configured by fixing the suction unit 3 formed as possible as a planar shape and fixing the metal plate 1 and the suction unit 3 on the metal base 4. If the attraction part 3 is also formed by one metal plate 2, the attraction part 3 becomes stronger because the metal plate is folded and double overlapped. A resist is applied to the metal plate 2 so as to prevent solder from adhering to the outside and inside of the metal plate 2 except for both side surfaces 5 and 6 at the time of dip soldering. Therefore, the side surfaces 5 and 6 become solderable surfaces, and the surface area of the chip-type heat sink 1 does not decrease even after soldering. In addition, chip type heat sink 1
When soldering is performed by reflow heating, the resist is unnecessary.
【０００９】このチップ型放熱板１はチップ部品と同一
の寸法規格に形成されており、例えばｌ１＝２mm、ｎｌ
＝１．２５mm、あるいはｌ１＝３．２mm、ｎ１＝２．５
mm等に設定される。The chip-type heat sink 1 is formed to the same dimensional standard as the chip component, for example, 11 = 2 mm, nl
= 1.25 mm, or l1 = 3.2 mm, n1 = 2.5
It is set to mm.
【００１０】図２は本発明に係るチップ型放熱板の他の
例を示す図であり、１枚の金属板１２を図示のように箱
型に形成し、表面積を大きくすることで、チップ型放熱
板１１を構成する。チップ型放熱板１１上面である吸着
面１３はチップ実装機で吸着可能に平面状に形成されて
いる。金属板１２はその両側面１５および１６を除い
て、外側および内側ともディップハンダ付け時にハンダ
が付着しないようレジストが塗布される。従って、側面
１５および１６がハンダ付け可能面となり、ハンダ付け
を行った後もチップ型放熱板１１の表面積が小さくなる
ことはない。尚、チップ型放熱板１１をリフロー加熱に
よりハンダ付けする場合は、前記レジストは不要であ
る。FIG. 2 is a view showing another example of a chip-type heat radiating plate according to the present invention. One metal plate 12 is formed in a box shape as shown in FIG. The radiator plate 11 is configured. The suction surface 13, which is the upper surface of the chip-type heat radiating plate 11, is formed in a flat shape so that it can be suctioned by a chip mounting machine. A resist is applied to the metal plate 12 so that no solder adheres to the outside and inside of the metal plate 12 except for both side surfaces 15 and 16 during the dip soldering. Therefore, the side surfaces 15 and 16 become solderable surfaces, and the surface area of the chip-type heat radiating plate 11 does not decrease after soldering. When the chip type heat sink 11 is soldered by reflow heating, the resist is unnecessary.
【００１１】このチップ型放熱板１１もチップ部品と同
一の寸法規格に形成されており、例えばｌ２＝２mm、ｎ
２＝１．２５mm、あるいはｌ２＝３．２mm、ｎ２＝２．
５mm等に設定される。The chip-type heat radiating plate 11 is also formed to the same dimensional standard as the chip component, for example, l2 = 2 mm, n
2 = 1.25 mm, or l2 = 3.2 mm, n2 = 2.
It is set to 5 mm.
【００１２】尚、チップ型放熱板の形状は図１および図
２に限定されるものではなく、チップ部品と同一の寸法
規格に形成され、表面積が大きくしかもチップ実装機で
吸着可能な面を有するものであればいかなる形状であっ
てもよい。The shape of the chip-type heat radiating plate is not limited to FIGS. 1 and 2, but is formed to the same dimensional standard as the chip component, has a large surface area, and has a surface that can be adsorbed by the chip mounting machine. Any shape may be used.
【００１３】図３は本発明の放熱構造の一実施例を示す
図であり、プリント基板２６の一面にはチップ状の発熱
部品２２、２３、２４、２５が実装されてハンダ２７に
よりハンダ付け固定される。またプリント基板２６の他
面にはこれらチップ状の発熱部品と対向する位置、また
はその近傍に図１、図２に示したようなチップ型放熱板
１、１１、２１が実装されてハンダ２７によりハンダ付
け固定される。これらチップ状の発熱部品とチップ型放
熱板はチップ実装機により真空吸着され、同一の実装工
程でプリント基板２６に実装される。尚、チップ型放熱
板１、１１、２１をチップ実装機により真空吸着する場
合は、前述の平面上に形成された吸着部あるいは吸着面
をもって吸着し、プリント基板に実装される。FIG. 3 is a view showing an embodiment of a heat radiation structure according to the present invention. Heat generating components 22, 23, 24 and 25 in the form of chips are mounted on one surface of a printed circuit board 26 and soldered and fixed by solder 27. Is done. On the other surface of the printed circuit board 26, chip-type heat radiating plates 1, 11, and 21 as shown in FIGS. Soldered and fixed. The chip-shaped heat-generating component and the chip-type heat radiating plate are vacuum-sucked by a chip mounting machine and mounted on the printed circuit board 26 in the same mounting process. When the chip-type radiating plates 1, 11, and 21 are vacuum-adsorbed by a chip mounting machine, the chip-type heat radiating plates 1, 11, and 21 are adsorbed by an adsorbing portion or an adsorbing surface formed on the above-mentioned plane, and are mounted on a printed circuit board.
【００１４】以上の構成により、チップ状の発熱部品２
２乃至２５が発する熱はプリント基板２６を介してチッ
プ型放熱板１、１１、２１に伝わり放熱される。もし放
熱効果が少ない場合は、チップ型放熱板を１つの発熱部
品に対してその近傍に複数配置すればよい。With the above configuration, the chip-shaped heat generating component 2
The heat generated by 2 to 25 is transmitted to the chip-type heat radiating plates 1, 11 and 21 via the printed circuit board 26 and is radiated. If the heat radiation effect is small, a plurality of chip-type heat radiation plates may be arranged near one heat-generating component.
【００１５】図４は本発明の放熱構造の他の実施例を示
す図であり、チップ状の発熱部品３２はプリント基板に
形成されたランド３３上にハンダ３６によりハンダ付け
固定される。ランド３３には図示せぬ金属筐体に接続さ
れているアースパターン３５が接続されるが、その途中
に方形状のランド３４が形成され、このランド３４上に
チップ型放熱板３１がハンダ３６によりハンダ付け固定
される。これらチップ状の発熱部品３２とチップ型放熱
板３１は図３の実施例と同様、チップ実装機により真空
吸着され、同一の実装工程でプリント基板２６に実装さ
れる。FIG. 4 is a view showing another embodiment of the heat radiation structure of the present invention. A chip-shaped heat generating component 32 is soldered and fixed on a land 33 formed on a printed circuit board. An earth pattern 35 connected to a metal housing (not shown) is connected to the land 33, and a square land 34 is formed in the middle of the land 33. Soldered and fixed. The chip-shaped heat-generating component 32 and the chip-type heat radiating plate 31 are vacuum-sucked by a chip mounter and mounted on the printed circuit board 26 in the same mounting process as in the embodiment of FIG.
【００１６】従って、発熱部品３２で発せられる熱はア
ースパターン３５を介してチップ型放熱板３１より放熱
されると共に、金属筐体からも放熱され、一層放熱効果
が増す。また発熱部品３２で発せられる熱はアースパタ
ーンを伝わるため、他の電子部品に与える熱影響が小さ
くなる。Accordingly, the heat generated by the heat-generating component 32 is radiated from the chip-type heat radiating plate 31 via the ground pattern 35 and also from the metal housing, thereby further increasing the heat radiating effect. Further, since the heat generated by the heat generating component 32 is transmitted through the ground pattern, the heat effect on other electronic components is reduced.
【００１７】次に、チップ型放熱板の実装工程について
説明する。チップ型放熱板およびチップ部品をリフロー
加熱によりハンダ付けする場合は、クリームハンダをラ
ンド上に塗布し、チップ実装機により真空吸着してチッ
プ型放熱板およびチップ部品をランド上に搭載する。そ
の後、リフロー炉に通して加熱することで、ハンダ付け
が終了する。Next, a mounting process of the chip type heat sink will be described. When soldering the chip-type heat sink and the chip components by reflow heating, cream solder is applied on the lands, and the chip-type heat sink and the chip components are mounted on the lands by vacuum suction using a chip mounter. After that, by passing through a reflow furnace and heating, the soldering is completed.
【００１８】また、ディップによりハンダ付けする場合
は、チップ型放熱板およびチップ部品の搭載位置に接着
剤を塗布し、チップ型放熱板およびチップ部品をチップ
実装機により真空吸着してその接着剤上に搭載し仮固定
する。その後、ハンダ層に通すことで、ハンダ付けが終
了する。In the case of soldering with a dip, an adhesive is applied to the mounting position of the chip-type heat radiating plate and the chip component, and the chip-type heat radiating plate and the chip component are vacuum-adsorbed by a chip mounter and the adhesive is applied on the adhesive. And temporarily fix it. Thereafter, by passing the solder through the solder layer, the soldering is completed.
【００１９】尚、以上の実施例では発熱部品としてチッ
プ部品を例にとり説明したが、本発明はこれに限定され
るものではない。In the above embodiment, a chip component has been described as an example of a heat generating component, but the present invention is not limited to this.
【００２０】[0020]
【発明の効果】以上説明したように、本発明によれば、
チップ部品の実装と同時に放熱板を実装することができ
るため、従来の放熱板の実装専用の工程がなくなり、コ
ストダウンをはかることができる。また、放熱板がチッ
プ状のため、放熱板を比較的小型化することができると
ともに、任意のスペースに放熱板を実装できる。更に放
熱板の数を増やせば、小さなスペースで大きな放熱が可
能となる。As described above, according to the present invention,
Since the heat radiator can be mounted simultaneously with the mounting of the chip components, the conventional process for mounting the heat radiator is eliminated, and the cost can be reduced. Further, since the heat radiating plate is chip-shaped, the heat radiating plate can be made relatively small, and the heat radiating plate can be mounted in an arbitrary space. If the number of heat radiating plates is further increased, large heat radiating becomes possible in a small space.
【図１】本発明に係るチップ型放熱板の一例を示す図で
ある。FIG. 1 is a diagram showing an example of a chip-type heat sink according to the present invention.
【図２】本発明に係るチップ型放熱板の他の例を示す図
である。FIG. 2 is a view showing another example of a chip-type heat sink according to the present invention.
【図３】本発明の一実施例を示す図である。FIG. 3 is a diagram showing one embodiment of the present invention.
【図４】本発明の他の実施例を示す図である。FIG. 4 is a diagram showing another embodiment of the present invention.
１、１１、２１、３１ チップ型放熱板 ２２、２３、２４、２５、３２ チップ部品 1, 11, 21, 31 Chip-type heat sink 22, 23, 24, 25, 32 Chip components
Claims (2)
品の放熱を行う放熱板を設ける放熱構造において、チッ
プ部品と同じ寸法規格に形成されたチップ型放熱板を発
熱部品の近傍に配置したことを特徴とする放熱構造。In a heat radiation structure in which a heat radiating plate for radiating heat of a chip component is provided on a substrate on which the chip component is mounted, a chip type heat radiating plate formed to the same dimensional standard as the chip component is arranged near the heat generating component. Heat dissipation structure characterized by the following.
する放熱板とを実装する実装方法において、放熱板をチ
ップ部品と同一の寸法規格に形成し、該放熱板をチップ
部品と同じ実装工程で発熱部品の近傍に配置することを
特徴とする放熱板の実装方法。2. A mounting method for mounting a chip component and a heat radiating plate for radiating the chip component on a substrate, wherein the heat radiating plate is formed to the same dimensional standard as the chip component, and the heat radiating plate is mounted in the same mounting process as the chip component. A method for mounting a heat sink, wherein the heat sink is disposed near a heat-generating component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3673191A JP2905299B2 (en) | 1991-02-06 | 1991-02-06 | Heat dissipation structure and heat sink mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3673191A JP2905299B2 (en) | 1991-02-06 | 1991-02-06 | Heat dissipation structure and heat sink mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04255294A JPH04255294A (en) | 1992-09-10 |
| JP2905299B2 true JP2905299B2 (en) | 1999-06-14 |
Family
ID=12477881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3673191A Expired - Lifetime JP2905299B2 (en) | 1991-02-06 | 1991-02-06 | Heat dissipation structure and heat sink mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2905299B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5786745A (en) * | 1996-02-06 | 1998-07-28 | Motorola, Inc. | Electronic package and method |
| JP4549265B2 (en) * | 2005-09-06 | 2010-09-22 | 三菱瓦斯化学株式会社 | Radio wave absorber |
| CN109156081A (en) * | 2016-05-30 | 2019-01-04 | 三菱电机株式会社 | The manufacturing method of electronic module and electronic module |
| WO2018109919A1 (en) * | 2016-12-16 | 2018-06-21 | 三菱電機株式会社 | Printed wiring board, air conditioner and a method for manufacturing printed wiring board |
-
1991
- 1991-02-06 JP JP3673191A patent/JP2905299B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04255294A (en) | 1992-09-10 |
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