CN106061095B - Printed circuit board and preparation method thereof - Google Patents
Printed circuit board and preparation method thereof Download PDFInfo
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- CN106061095B CN106061095B CN201610474404.3A CN201610474404A CN106061095B CN 106061095 B CN106061095 B CN 106061095B CN 201610474404 A CN201610474404 A CN 201610474404A CN 106061095 B CN106061095 B CN 106061095B
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- heat conduction
- cover board
- conduction slot
- printed circuit
- slot
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Present invention is disclosed a kind of printed circuit boards and preparation method thereof, and wherein printed circuit board includes plate ontology, the first cover board, the second cover board and heat carrier；High and low temperature distribution when being worked according to electronic device on plate ontology opens up at least one to low-temperature space from high-temperature region and runs through plate ontology, and the heat conduction slot extended along plane where plate ontology along plate body thickness direction, separation layer is provided on the madial wall of heat conduction slot；First cover board and the second cover board are hermetically covered on both-side opening of the heat conduction slot along plate body thickness direction respectively, and are individually fixed on the plate ontology, and accommodation space is formed with heat conduction slot；The setting heat carrier in accommodation space.The first cover board and the second cover board of the present invention improve the intensity at heat conduction slot, prevent printed circuit board warpage or fracture along heat conduction slot, the use reliability for improving printed circuit board, be also prevented from heat carrier in printed circuit board the disengaging heat conduction slot in the case where shaking or fall equal application scenarios.
Description
Technical field
The present invention relates to printed circuit field of radiating, a kind of printed circuit board and preparation method thereof is especially related to.
Background technology
Moore's Law is put forward by one of Intel (Intel) founder Gordon mole (Gordon Moore),
When price is constant, the number of open ended component on integrated circuit will about be doubled every 18-24 months, performance
Also one times will be promoted.With the development of Moore's Law, the integrated circuit of chip interior is on the increase；Electronic manufacturing technology into
Step, but also the circuit integrated on unit area printed circuit board is on the increase, and the heat dissipation of printed circuit board sets as electronics
The big obstacle that standby integrated level improves.As electronic product is to lightening development, the thickness of complete machine constantly reduces, existing pressure
The radiating modes such as air-cooled, liquid cooling and cooling fin become increasingly difficult to realize.Using electronic device carrier printed circuit board into
Row heat dissipation becomes another radiating mode.
The existing heat-conducting mode of circuit galley is groove milling on a printed circuit, using special installation by Heat Conduction Material system
At heat carrier corresponding with groove milling shape, heat carrier is embedded in groove milling with external force, it is then with green oil that heat carrier is electric with printing
Road plate adhesion is fixed, and when circuit operating temperature increases, by the phase transformation of packing material, realization leads heat from the high place of temperature
The place low to temperature.
Existing heat dissipating method has the following disadvantages：1, phase-change material can not melt with printed circuit board material in heat conduction slot
It closes, printed circuit board intensity at the axis of heat conduction slot is caused to be lower, be easy warpage or fracture.2, Heat Conduction Material needs are special
Different equipment is processed into shape corresponding with heat conduction slot, increases processing step, and need special Heat Conduction Material former.
3, there is stringent limitation to the material type selecting of Heat Conduction Material and groove milling shape, cause application scenarios limited.4, phase-change material itself
In heated phase transformation, deformation and volume change are will produce, leads to Heat Conduction Material overflow printing circuit plate face, reduces product
Reliability.5, heat carrier can not only be fixed by green oil adhesion with printed circuit board in heat conduction slot, after printed circuit board forming,
Green oil is dried, and caking property disappears, and printed circuit board is in the case where the application scenarios such as shaking, falling, and heat carrier is easy to and printed circuit
Plate is detached from.
Invention content
The main object of the present invention is to provide a kind of printed circuit board improving intensity at printed circuit board heat conduction slot.
In order to achieve the above-mentioned object of the invention, the present invention proposes a kind of printed circuit board, including plate ontology, the first cover board, the
Two cover boards and heat carrier；
High and low temperature distribution when being worked according to electronic device on the plate ontology, opens up at least from high-temperature region to low-temperature space
One runs through plate ontology, and the heat conduction slot extended along plane where plate ontology along plate body thickness direction, heat conduction slot it is interior
Separation layer is provided on side wall；
First cover board and the second cover board are hermetically covered on the heat conduction slot along plate body thickness direction respectively
Both-side opening, and be individually fixed on the plate ontology, form accommodation space with the heat conduction slot；It is set in the accommodation space
Set the heat carrier.
Further, it was provided with vent hole on first cover board and/or the second cover board.
Further, the heat carrier is heat conduction with phase change body.
Further, the heat carrier is paste.
Further, the heat carrier includes heat conductive silica gel.
Further, the one side of the first cover board towards the heat conduction slot is provided with the first recess of corresponding heat conduction slot
Portion；And/or
The one side of second cover board towards the heat conduction slot is provided with the second recessed portion of corresponding heat conduction slot.
Further, the open outer side of first recessed portion is extended with along plane where the first cover board and protrudes from the first lid
First chimb of plate；And/or
The open outer side of second recessed portion is extended with along plane where the second cover board and protrudes from the second of the second cover board
Chimb.
Further, when the plate ontology is horizontal positioned, what the upper surface of the heat carrier was located above with heat conduction slot
Opening is generally aligned in the same plane.
Further, the edge of the both-side opening of the heat conduction slot is both provided with the pad around heat conduction slot；
First cover board and the second cover board are respectively by pad solder in plate ontology.
Further, the welding resistance ring around heat conduction slot is provided between the pad and heat conduction slot of the plate ontology.
Further, the cover board is metal cover board.
Further, the separation layer is copper electroplating layer.
The present invention also provides a kind of production methods of printed circuit board, including：
High and low temperature distribution when being worked according to electronic device on plate ontology, at least one is opened up from high-temperature region to low-temperature space
Run through plate ontology, and the heat conduction slot extended along plane where plate ontology along plate body thickness direction；
By via electroplating technology, separation layer is electroplated on the madial wall of the heat conduction slot；
Heat carrier is filled in the heat conduction slot, and the first cover board and the second cover board is hermetically covered on respectively described
Both-side opening of the heat conduction slot along plate body thickness direction, wherein the first cover board and the second cover board are fixedly installed on the plate sheet
On body.
Further, the production method of the heat conduction slot, including：
According to the shape for the heat conduction slot that will be opened up on plate ontology, the mobile route of milling cutter is preset；
According to the thickness of plate ontology, the depth that cuts of milling cutter is controlled, and groove milling is carried out according to preset mobile route.
Further, high and low temperature when being worked according to electronic device on plate ontology is distributed, from high-temperature region to low-temperature space
It opens up at least one and runs through plate ontology, and the step of along the heat conduction slot that plane where plate ontology extends along plate body thickness direction
Later, including：
Using standard printed circuit board welding resistance moulding process, it is respectively arranged with and encloses at the edge of the both-side opening of heat conduction slot
Around the pad of heat conduction slot；Wherein, welding resistance ring is set between pad and heat conduction slot；
It is described that first cover board and the second cover board are hermetically covered on the heat conduction slot along plate body thickness direction respectively
Both-side opening the step of, including：
First cover board and the second cover board are respectively correspondingly covered on the heat conduction slot along the two of plate body thickness direction
Side opening；
By SMT reflow soldering processes, the first cover board and the second cover board are hermetically welded to the corresponding pad respectively
On.
Further, it was provided with vent hole on first cover board and/or the second cover board.
Further, the side of first cover board towards the heat conduction slot is stamped with the first recessed of corresponding heat conduction slot
Concave portion；And/or
The side of second cover board towards the heat conduction slot is stamped with the second recessed portion of corresponding heat conduction slot.
Further, the open outer side of first recessed portion protrudes from the first lid along flat die where the first cover board
First chimb of plate；And/or
The open outer side of second recessed portion has protrude from the second cover board second along flat die where the second cover board
Chimb.
Further, described that heat carrier is filled in the heat conduction slot when heat carrier is pasta heat carrier, and
First cover board and the second cover board are hermetically covered on both-side opening of the heat conduction slot along plate body thickness direction respectively
Step, including：
By the second cover board closed cover together in a side opening of the heat conduction slot, and other side open horizontal is set upward
It sets；
Pasta heat carrier is filled in by the horizontal opening upward of heat conduction slot in heat conduction slot；
By the first cover board closed cover together in another side opening of the heat conduction slot.
Further, described that pasta heat carrier is filled in heat conduction slot by the horizontal opening upward of heat conduction slot
After interior step, including：
The heat carrier that horizontal opening upward is protruded from heat conduction slot is struck off.
The printed circuit board and preparation method thereof of the present invention, in the both sides of heat conduction slot difference closed cover close the first cover board and
Second cover board, the first cover board and the second cover board improve the intensity at heat conduction slot, prevent printed circuit board from being stuck up along heat conduction slot
Bent or fracture；When the phase transformation of being heated of heat conduction with phase change body generates deformation and when volume change, the first cover board and the second cover board can be with
It prevents Heat Conduction Material from overflowing on printed circuit board, improves the use reliability of printed circuit board；First cover board and the second cover board
It is also prevented from heat conduction with phase change body and is detached from heat conduction slot in the case where the application scenarios such as shaking or fall in printed circuit board；First cover board
And/or second be provided with air passing hole on cover board, and the air pressure in above-mentioned accommodation space can be kept consistent with external pressure, improve print
The safety in utilization and service life of printed circuit board.
Description of the drawings
Fig. 1 is the cross-sectional view of the printed circuit board of one embodiment of the invention；
Fig. 2 is that the printed circuit board of one embodiment of the invention does not install the first cover board and the second cover board and heat conduction with phase change body
When structural schematic diagram；
Fig. 3 is the structural schematic diagram of the printed circuit board of a specific embodiment of the invention；
Fig. 4 is the flow diagram of the production method of the printed circuit board of one embodiment of the invention；
The flow diagram of the production method of the heat conduction slot of my one embodiment of the invention of Fig. 5.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific implementation mode
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
Those skilled in the art of the present technique are appreciated that unless expressly stated, singulative " one " used herein, " one
It is a ", " described " and "the" may also comprise plural form.It is to be further understood that is used in the specification of the present invention arranges
It refers to there are the feature, integer, step, operation, element and/or component, but it is not excluded that presence or addition to take leave " comprising "
Other one or more features, integer, step, operation, element, component and/or their group.Wording used herein " and/
Or " include that the whole of one or more associated list items or any cell are combined with whole.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, all terms used herein (including technology art
Language and scientific terminology), there is meaning identical with the general understanding of the those of ordinary skill in fields of the present invention.Should also
Understand, those terms such as defined in the general dictionary, it should be understood that have in the context of the prior art
The consistent meaning of meaning, and unless by specific definitions as here, the meaning of idealization or too formal otherwise will not be used
To explain.
Referring to Figures 1 and 2, the embodiment of the present invention provides a kind of printed circuit board, including plate ontology 100, the first cover board
120, the second cover board 130 and heat carrier 116；High and low temperature distribution when being worked according to electronic device 115 on the plate ontology 100,
It is opened up from high-temperature region to low-temperature space and runs through plate ontology 100 along 100 thickness direction of plate ontology, and prolonged along 100 place plane of plate ontology
The heat conduction slot 111 stretched is provided with separation layer 112 on the madial wall of heat conduction slot 111；First cover board 120 and second covers
Plate 130 is hermetically covered on both-side opening of the heat conduction slot 111 along 100 thickness direction of plate ontology respectively, and fixes respectively
In on the plate ontology 100, accommodation space is formed with the heat conduction slot 111；The setting heat carrier in the accommodation space
116。
Above-mentioned plate ontology 100 is the main supporting body of printed circuit board, and the electronic device of various needs is arranged above
115 etc..The centre position of 100 through-thickness of plate ontology is prepreg 101, and layers of copper is arranged in the both sides of prepreg 101
102, solder mask 103 is arranged in the both sides of layers of copper 102.
Above-mentioned high-temperature region and low-temperature space are in contrast, multiple electricity to be welded with according to circuit requirement on above-mentioned plate ontology 100
Sub- device 115, such as various chips, due to the power of electronic device 115, distribution and heat of generation etc., on plate ontology 100
The different region of temperature is will produce, such as electronic device more than 115, it is high-temperature region to generate the high position of heat, and electronic device 115 is few,
It is low-temperature space etc. to generate the few position of heat.
Above-mentioned heat conduction slot 111 is to be put down where plate ontology 100 through what its thickness direction opened up on plate ontology 100
The slot that face extends, generally strip slot, the strip slot can be linear type, can also be shaped form or other such as " T "
Font, I-shaped etc..Heat conduction slot 111 can both be arranged one, can also design a plurality of, specifically be designed according to service condition
.Above-mentioned heat conduction slot 111 is generally upper and lower both-side opening, and surrounding has the slot on boundary, naturally it is also possible to be upper and lower two
Side opening, surrounding boundary slot jaggy.If the surrounding boundary of heat conduction slot 111 is jagged, if heat carrier
116 be paste, then needs sealing gap, if heat carrier 116 is solid, can be chosen whether to block according to actual conditions scarce
Mouthful.
Above-mentioned heat carrier 116 is a kind of object that can be absorbed heat and will transmit heat, is typically chosen aneroid object
Matter, such as the heat conduction with phase change body or pasta heat carrier 116 of hard structure, such as heat conductive silica gel.It is above-mentioned to lead in the present embodiment
Hot body 116 can be heat conduction with phase change body, and heat conduction with phase change body is to vary with temperature and change form and can provide the material of latent heat.
The process that heat conduction with phase change body is become another shape body from a kind of state is known as phase transition process, as solid-state becomes liquid, or by liquid
Become solid-state etc., at this moment heat conduction with phase change body will absorb or discharge a large amount of latent heat.In the present embodiment, heat conduction with phase change body is located at high temperature
Part in heat conduction slot 111 when temperature is increased to assigned temperature, undergoes phase transition and absorbs heat, and heat can be led along phase transformation
Hot body conducts to low-temperature space and is diffused into the external world.
The main function of 120 and second cover board 130 of above-mentioned first cover board is that heat carrier 116 is defined in heat conduction slot 111
It is interior, it prevents heat carrier 116 from generating deformation and volume change and overflow printing circuit plate face, improves the reliable of printed circuit board
Property, and improve the structural strength at heat conduction slot 111.120 and second cover board 130 of above-mentioned first cover board is generally made from a metal,
As the alloys such as iron, copper or iron nickel plating, the tin plating, foreign white copper of iron are made.Above-mentioned first cover board 120, second cover board 130 or both
Group, which is closed, was arranged vent hole 122, consistent with ambient pressure in heat conduction slot 111 when making 116 volume change of heat carrier, prevented
Only printed circuit board plate bursting due to air pressure becomes larger, or the first cover board 120 or the second cover board 130 are jacked up.
Above-mentioned separation layer 112 can prevent the gas or extraneous by crossing the entrance of vent hole 122 that 116 phase transformation of heat carrier generates
Gas enter between prepreg 101 and layers of copper 102, influence the use of printed circuit board.Generally copper electroplating layer both may be used
It, can be with good transmission heat closely to be connect with the layers of copper 102 of plate ontology 100.Above-mentioned separation layer 112 generally passes through via
Electroplating technology is made, and via electroplating technology is that layer of metal film is electroplated on the madial wall of via, generally passes through dedicated mistake
Hole electroplating machine is electroplated.The thickness of separation layer 112 can be controlled using electroplating time.
In the present embodiment, above-mentioned heat carrier 116 is pasta heat carrier 116.Pasta heat carrier 116 can correspond to any
The heat conduction slot 111 of shape uses, and is processed into shape corresponding with heat conduction slot 111 without passing through special installation, reduces and lead
The moulding process step of hot body 116 and the former of heat carrier 116 improve production efficiency and save production cost；Printing electricity
In the case where the application scenarios such as shaking, falling, heat carrier 116 will not be detached from road plate with printed circuit board.It is pasta to lead in the present embodiment
The mode that hot body 116 is filled can be filled by dispenser into thermal trough hole 111.
In the present embodiment, the edge of the both-side opening of above-mentioned heat conduction slot 111 is both provided with the weldering around heat conduction slot 111
Disk 113；First cover board, 120 and second cover board 130 is welded in plate ontology 100 by pad 113 respectively.Above-mentioned pad 113
The welding resistance ring 114 around heat conduction slot 111 is provided between heat conduction slot 111, welding resistance ring 114 prevents in welding process, melts
Tin of change etc. flows into heat conduction slot 111, and the material of welding resistance ring 114 and the material of the solder mask 103 of above-mentioned plate ontology 100 are general
It is identical.
In the present embodiment, the one side of above-mentioned first cover board 120 towards heat conduction slot 111 is provided with corresponding heat conduction slot
111 the first recessed portion；First recessed portion can accommodate more heat carriers 116, also facilitate using standard electronic circuitry surface
First cover board 120 is welded to plate ontology 100 by package technique (Surface Mount Technology, SMT) reflow soldering process
On.In another embodiment, the one side of above-mentioned second cover board 130 towards heat conduction slot 111 is provided with corresponding heat conduction slot 111
The second recessed portion, the second recessed portion can equally accommodate more heat carriers 116, also facilitate and flowed back welder using standard SMT
Second cover board 130 is welded on plate ontology 100 by skill.In the present embodiment, 120 and second cover board 130 of above-mentioned first cover board is general
Using metal stamping process, sheet metal is processed into the cover board of shape corresponding with 111 hole shape of heat conduction slot.And in the first lid
The first recessed portion of punching press and the second recessed portion are distinguished on plate 120 and the second cover board 130.
In the present embodiment, the open outer side of above-mentioned first recessed portion is extended with along 120 place plane of the first cover board to be protruded from
First chimb 121 of the first cover board 120；The open outer side of above-mentioned second recessed portion is extended with along 130 place plane of the second cover board
Protrude from the second chimb 131 of the second cover board 130.Pass through the first chimb 121 respectively on first cover board 120 and the second cover board 130
It is welded with the plate ontology 100 with the second chimb 131, the setting of the first chimb 121 and the second chimb 131 can be further
Facilitate and the first cover board 120 and the second cover board 130 are welded on plate ontology 100 using standard SMT reflow soldering processes.Above-mentioned first
The formation of chimb 121 and the second chimb 131 is usually formed simultaneously with the first recessed portion of sheet metal punching press and the second recessed portion
, i.e., after fixing sheet metal, it is stamped to form recessed portion on the inside of edge, and edge portions form chimb.
In the present embodiment, above-mentioned heat carrier 116 be paste, when plate ontology 100 is horizontally arranged, the heat carrier 116 it is upper
The opening that surface is located above with heat conduction slot 111 is generally aligned in the same plane.I.e. heat carrier 116 is not filled up completely in the first lid
In the accommodation space surrounded between plate 120, the second cover board 130 and heat conduction slot 111, increase to the heated rear volume of heat carrier 116
Space is provided, the first cover board 120, the second cover board 130 and 111 side wall of heat conduction slot are squeezed when preventing heat carrier 116 from expanding
Pressure, improves the safe to use of printed circuit board.
Multiple electronic devices 115 are provided on plate ontology 100 in one embodiment with reference to Fig. 3, when work is,
The both sides of the first half and its lower half will produce high temperature, i.e., the first high-temperature region 201 as shown in Figure 3, the second high-temperature region 202
With third high temperature area 203, middle section is low-temperature space 204.In order to improve radiating efficiency, the first heat conduction slot 1111 is opened up, is somebody's turn to do
First heat conduction slot 1111 is in " fourth " font, and low-temperature space 204 is extended to from the first high-temperature region 201；It is further opened on plate ontology 100
Second heat conduction slot 1112, the second heat conduction slot 1112 is in the shape of an " I ", respectively from the second high-temperature region 202 and third high temperature area
203 extend to low-temperature space 204.Pad is respectively set around the first heat conduction slot 1111 and 1112 both-side opening of the second heat conduction slot
113, welding resistance ring 114 is set between pad 113 and heat conduction slot 111.By metal stamping process, punching press correspondence first is led respectively
The first cover board 120 and the second cover board 130 of 1111 shape of heat channel hole and punching press correspond to the of 1112 shape of the second heat conduction slot
One cover board 120 and the second cover board 130, and can vent hole 122 be set on the first cover board 120.Two second are covered first
Plate 130 corresponds to the first heat conduction slot 1111 respectively and the second heat conduction slot 1112 is welded in by pad 113 on plate ontology 100,
Then pasta heat conduction with phase change body is filled into the first heat conduction slot 1111 and the second heat conduction slot 1112, protrudes from the first heat conduction
The heat conduction with phase change body of slot 1111 and the second heat conduction slot 1112 is removed by scraper, keeps it concordant with plate ontology 100, finally will
Two the second cover boards 130 correspond to the first heat conduction slot 1111 respectively and the second heat conduction slot 1112 is welded in plate by pad 113
On ontology 100, by the receiving sky that heat conduction with phase change body is limited to the first cover board 120, the second cover board 130 and heat conduction slot 111 surround
In.Since the heat conduction slot 111 opened up is more, the weakened of plate ontology 100, but pass through the first cover board in welding
120 and second cover board 130 then the strength enhancing of plate ontology 100 can be ensured the safe handling of printed circuit.
The printed circuit board of the present embodiment, in the both sides of heat conduction slot 111, difference closed cover closes the first cover board 120 and second
Cover board 130, the first cover board 120 and the second cover board 130 improve the intensity at heat conduction slot 111, prevent printed circuit board along heat conduction
Warpage or fracture at slot 111；When heat carrier 116 is heated generates deformation and volume change, the first cover board 120 and second lid
Plate 130 is also prevented from heat carrier 116 and overflows on printed circuit board, improves the use reliability of printed circuit board；First lid
Plate 120 and the second cover board 130 are also prevented from heat carrier 116 and are detached from printed circuit board in the case where the application scenarios such as shaking or fall
Heat conduction slot 111；It is provided with air passing hole on first cover board 120 and/or the second cover board 130, can be kept in above-mentioned accommodation space
Air pressure it is consistent with external pressure, improve the safety in utilization and service life of printed circuit board.
With reference to Fig. 4, the embodiment of the present invention also provides a kind of production method of above-mentioned printed circuit board, including step：
S10, it is distributed according to the high and low temperature on plate ontology 100 when the work of electronic device 115, is opened from high-temperature region to low-temperature space
If at least one runs through plate ontology 100, and the thermal trough extended along 100 place plane of plate ontology along 100 thickness direction of plate ontology
Hole 111；
S20, by via electroplating technology, separation layer 112 is electroplated on the madial wall of the heat conduction slot 111；
S30, heat carrier 116 is filled in the heat conduction slot 111, and the first cover board 120 and the second cover board 130 is distinguished
Hermetically it is covered on both-side opening of the heat conduction slot 111 along 100 thickness direction of plate ontology, wherein the first cover board 120 and
Two cover boards 130 are fixedly installed on the plate ontology 100.
As described in above-mentioned steps S10, above-mentioned plate ontology 100 is the main supporting body of printed circuit board, is arranged above
Electronic device 115 of various needs etc..The centre position of 100 through-thickness of plate ontology is prepreg 101, prepreg
Layers of copper 102 is arranged in 101 both sides, and solder mask 103 is arranged in the both sides of layers of copper 102.Above-mentioned high-temperature region and low-temperature space be in contrast,
It is welded with multiple electronic devices 115, such as various chips according to circuit requirement on above-mentioned plate ontology 100, due to electronic device 115
Power, distribution and the heat of generation etc., the different region of temperature is will produce on plate ontology 100, such as electronic device more than 115,
It is high-temperature region to generate the high position of heat, and electronic device 115 is few, and it is low-temperature space etc. to generate the few position of heat.Above-mentioned thermal trough
Hole 111 is the slot extended along 100 place plane of plate ontology opened up through its thickness direction on plate ontology 100, generally
For strip slot, which can be linear type, can also be shaped form or other such as T-shaped, I-shapeds.It leads
Heat channel hole 111 can both be arranged one, can also design a plurality of, specifically be designed according to service condition.Above-mentioned heat conduction slot
111 generally upper and lower both-side opening, surroundings have the slot on boundary, naturally it is also possible to be upper and lower both-side openings, surrounding boundary has
The slot of notch.If the surrounding boundary of heat conduction slot 111 is jagged, if heat carrier 116 is paste, need to seal
Stifled notch can choose whether sealing gap if heat carrier 116 is solid according to actual conditions.Above-mentioned heat carrier 116 is
A kind of object that can be absorbed heat and will transmit heat, is typically chosen aneroid substance, such as the heat conduction with phase change of hard structure
Body or pasta heat carrier 116, such as heat conductive silica gel.In the present embodiment, above-mentioned heat carrier 116 can be heat conduction with phase change body,
Heat conduction with phase change body is to vary with temperature and change form and can provide the material of latent heat.Heat conduction with phase change body is become from a kind of state
The process of another shape body is known as phase transition process, as solid-state becomes liquid, or becomes solid-state etc. from liquid, at this moment heat conduction with phase change body
It will absorb or discharge a large amount of latent heat.In the present embodiment, heat conduction with phase change body is located at the part in high-temperature heat-conductive slot 111, temperature
When being increased to assigned temperature, heat is undergone phase transition and absorbs, heat can conduct and be diffused into low-temperature space along heat conduction with phase change body
It is extraneous.
As described in above-mentioned steps S20, above-mentioned separation layer 112 is generally copper electroplating layer, both can be with the layers of copper of plate ontology 100
102 close connections, can be with good transmission heat.Above-mentioned via electroplating technology, is as electroplated one on the madial wall of via
Layer metal film, is generally electroplated by dedicated via electroplating machine.The thickness of separation layer 112 can use electroplating time control
System.
As described in above-mentioned steps S30, the main function of 120 and second cover board 130 of above-mentioned first cover board is by heat carrier 116
It is defined in heat conduction slot 111, prevents heat carrier 116 from generating deformation and volume change and overflow printing circuit plate face, improve
The reliability of printed circuit board, and improve the structural strength at heat conduction slot 111.120 and second cover board 130 of above-mentioned first cover board
It is generally made from a metal, as the alloys such as iron, copper or iron nickel plating, the tin plating, foreign white copper of iron are made.Above-mentioned first cover board 120,
Two cover boards 130 or both group, which is closed, was arranged vent hole 122, when making 116 volume change of heat carrier, in heat conduction slot 111 with outside
Boundary's air pressure it is consistent, prevent printed circuit board plate bursting due to air pressure becomes larger, or the first cover board 120 or the second cover board 130 are jacked up.
Above-mentioned separation layer 112 is also prevented from the gas of 116 phase transformation of heat carrier generation or the extraneous gas entered by crossing vent hole 122
It enters between prepreg 101 and layers of copper 102, influences the use of printed circuit board.
In the present embodiment, the production method of above-mentioned heat conduction slot 111, including：
S11, according to the shape for the heat conduction slot 111 that will be opened up on plate ontology 100, preset the mobile route of milling cutter；
S12, according to the thickness of plate ontology 100, control the depth that cuts of milling cutter, and milling is carried out according to preset mobile route
Slot.
As described in above-mentioned steps S11, above-mentioned milling cutter is the rotating knife for Milling Process, with one or more cutters tooth
Tool.Each cutter tooth intermittently cuts the surplus of workpiece successively when work.Milling cutter is mainly used for processing plane, step, ditch on milling machine
Slot, forming surface and cut-out workpiece etc..Milling cutter is typically mounted on a mechanical arm, and mechanical arm is controlled by such as PLC controllers
Milling cutter movement is driven, the mobile route that mechanical arm drives milling cutter can be pre-entered in controller, when processing heat conduction slot 111
Consistency it is high.
As described in above-mentioned steps S12, the above-mentioned control for cutting depth is to ensure milling cutter enough through plate ontology 100 and groove milling,
Obtain the heat conduction slot 111 of 100 through-thickness both-side opening of plate ontology.It is above-mentioned to carry out groove milling according to preset mobile route
Step can control milling cutter and be moved back and forth repeatedly, to improve the smoothness of 111 side wall of heat conduction slot along preset path.
In the present embodiment, the above-mentioned high and low temperature according on plate ontology 100 when the work of electronic device 115 is distributed, from high-temperature region
At least one is opened up to low-temperature space and runs through plate ontology 100 along 100 thickness direction of plate ontology, and is prolonged along 100 place plane of plate ontology
After the step S10 for the heat conduction slot 111 stretched, including：
S13, using standard printed circuit board welding resistance moulding process, distinguish at the edge of the both-side opening of heat conduction slot 111
It is provided with the pad 113 around heat conduction slot 111；Wherein, welding resistance ring 114 is set between pad 113 and heat conduction slot 111.
As described in above-mentioned steps S13, above-mentioned pad 113 is the basic Component units of surface mount assembly, for constituting
The welding disk pattern (land pattern) of circuit board, i.e., the various pad combinations for the design of particular components type.In the present embodiment
Pad 113 be network pad.Above-mentioned printed circuit board welding resistance moulding process coats the portion of green oil as on printed circuit board
Point, actually this solder mask uses negative film to export, so after on the shape map to plank of solder mask, be not on
Green oil welding resistance, is expose copper sheet instead.
In the present embodiment, the first cover board 120 and the second cover board 130 being hermetically covered on respectively in above-mentioned steps S30
The step of heat conduction slot 111 is along the both-side opening of 100 thickness direction of plate ontology, including：
S31, the first cover board and the second cover board 130 are respectively correspondingly covered on the heat conduction slot 111 along plate ontology 100
The both-side opening of thickness direction；
S32, by SMT reflow soldering processes, the first cover board 120 and the second cover board 130 are hermetically welded to correspondence respectively
The pad 113 on.
As described in above-mentioned steps S31 and S32, i.e., the first cover board 120 and the second cover board are incited somebody to action by SMT reflow soldering processes
130 are welded on plate ontology 100, and being welded to connect, which makes the first cover board 120 and the second cover board 130 more stablize, is fixedly arranged at plate ontology
On 100, the stability of plate ontology 100 at heat conduction groove body 111 is further improved.
In the present embodiment, the side of above-mentioned first cover board 120 towards the heat conduction slot 111 is stamped with corresponding heat conduction slot
111 the first recessed portion；First recessed portion can accommodate more heat carriers 116, also facilitate using standard SMT reflow soldering processes
First cover board 120 is welded on plate ontology 100.In another embodiment, above-mentioned second cover board 130 is towards the heat conduction slot
111 side is stamped with the second recessed portion of corresponding heat conduction slot 111, and the second recessed portion can equally accommodate more heat carriers
116, also facilitate and the second cover board 130 is welded on plate ontology 100 using standard SMT reflow soldering processes.It is above-mentioned in the present embodiment
First cover board 120 and the second cover board 130 generally use metal stamping process, and sheet metal is processed into and 111 hole shape of heat conduction slot
The cover board of the corresponding shape of shape.And the first recessed portion of punching press and the second recess are distinguished on the first cover board 120 and the second cover board 130
Portion.
In the present embodiment, the open outer side of above-mentioned first recessed portion is protruded from along 120 place flat die of the first cover board
First chimb 121 of the first cover board 120；The open outer side of above-mentioned second recessed portion has along 130 place flat die of the second cover board
Protrude from the second chimb 131 of the second cover board 130.Pass through the first chimb 121 respectively on first cover board 120 and the second cover board 130
It is welded with the plate ontology 100 with the second chimb 131, the setting of the first chimb 121 and the second chimb 131 can be further
Facilitate and the first cover board 120 and the second cover board 130 are welded on plate ontology 100 using standard SMT reflow soldering processes.The shape of chimb
At, be usually formed simultaneously with the first recessed portion of sheet metal punching press and the second recessed portion, i.e., after sheet metal being fixed, lean near side (ns)
It is stamped to form recessed portion on the inside of edge, and edge portions form chimb.
It is described that heat carrier 116 is filled in described lead when above-mentioned heat carrier 116 is pasta heat carrier in the present embodiment
Heat channel hole 111, and the first cover board 120 and the second cover board 130 are hermetically covered on the heat conduction slot 111 along plate ontology respectively
The step S30 of the both-side opening of 100 thickness directions, including：
S301, by 130 closed cover of the second cover board together in a side opening of the heat conduction slot 111, and by another side opening
Level is arranged upward；
S302, pasta heat carrier 116 is filled in heat conduction slot by the horizontal opening upward of heat conduction slot 111
In 111；
S303, by 120 closed cover of the first cover board together in another side opening of the heat conduction slot 111.
As described in above-mentioned steps S301, S302, S303, because heat carrier 116 is paste, there is certain mobility, it will
The first closed cover of second cover board 130 together in heat conduction slot 111 a side opening, then upward by another side opening, in order to
Pasta heat carrier 111 is filled by the side opening, and pasta heat carrier 116 is filled uniformly.It is pasta in the present embodiment
The mode that heat carrier 116 is filled can be filled by dispenser into thermal trough hole 111.It has filled and then by the first cover board
120 lids close.
It is above-mentioned to be filled in pasta heat carrier 116 by the horizontal opening upward of heat conduction slot 111 in the present embodiment
After step S302 in heat conduction slot 111, including：
S3021, the heat carrier 116 that horizontal opening upward is protruded from heat conduction slot 111 is struck off.
As described in above-mentioned steps S3021, because heat carrier 116 is paste, it should not fill excessively, prevent expanded by heating
Damage plate ontology 100, the first cover board 120 and second cover board 130 etc. afterwards, can also be effectively prevented after expanded by heating along above-mentioned mistake
Vent hole 122 overflows.
Multiple electronic devices 115 are provided on plate ontology 100 in one embodiment with reference to Fig. 3, when work is,
The both sides of the first half and its lower half will produce high temperature, i.e., the first high-temperature region 201 as shown in Figure 3, the second high-temperature region 202
With third high temperature area 203, middle section is low-temperature space 204.In order to improve radiating efficiency, the first heat conduction slot 1111 is opened up, is somebody's turn to do
First heat conduction slot 1111 is in " fourth " font, and low-temperature space 204 is extended to from the first high-temperature region 201；It is further opened on plate ontology 100
Second heat conduction slot 1112, the second heat conduction slot 1112 is in the shape of an " I ", respectively from the second high-temperature region 202 and third high temperature area
203 extend to low-temperature space 204.Pad is respectively set around the first heat conduction slot 1111 and 1112 both-side opening of the second heat conduction slot
113, welding resistance ring 114 is set between pad 113 and heat conduction slot 111.By metal stamping process, punching press correspondence first is led respectively
The first cover board 120 and the second cover board 130 of 1111 shape of heat channel hole and punching press correspond to the of 1112 shape of the second heat conduction slot
One cover board 120 and the second cover board 130, and can vent hole 122 be set on the first cover board 120.Two second are covered first
Plate 130 corresponds to the first heat conduction slot 1111 respectively and the second heat conduction slot 1112 is welded in by pad 113 on plate ontology 100,
Then pasta heat conduction with phase change body is filled into the first heat conduction slot 1111 and the second heat conduction slot 1112, protrudes from the first heat conduction
The heat conduction with phase change body of slot 1111 and the second heat conduction slot 1112 is removed by scraper, keeps it concordant with plate ontology 100, finally will
Two the second cover boards 130 correspond to the first heat conduction slot 1111 respectively and the second heat conduction slot 1112 is welded in plate by pad 113
On ontology 100, by the receiving sky that heat conduction with phase change body is limited to the first cover board 120, the second cover board 130 and heat conduction slot 111 surround
In.Since the heat conduction slot 111 opened up is more, the weakened of plate ontology 100, but pass through the first cover board in welding
120 and second cover board 130 then the strength enhancing of plate ontology 100 can be ensured the safe handling of printed circuit.
The production method of the printed circuit board of the present embodiment, using existing printed circuit board technology and technology, without changing
The production and processing technology for becoming existing printed circuit board, without changing existing SMT techniques；First cover board 120 of welding and the
Two cover boards 130 can effectively reinforce printed circuit board and open up strength reduction caused by heat conduction slot 111.If heat carrier 116
For pasta phase-change heat conductive material, then it is not necessarily to special installation, to the shape of heat conduction slot 111 without particular/special requirement, heat conduction slot 111
Shape controlled by milling cutter, produce increasingly complex heat conduction slot 111, filling heat carrier 116 is simple；In heat conduction slot 111
Upper and lower surface soldered the first cover board 120 and the second cover board 130 limit heat carrier 116 on a printed circuit, it is ensured that printing
Circuit board is shaking, and falls the reliability under equal application scenarios.
The foregoing is merely the preferred embodiment of the present invention, are not intended to limit the scope of the invention, every utilization
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content is applied directly or indirectly in other correlations
Technical field, be included within the scope of the present invention.
A1, a kind of printed circuit board, which is characterized in that including plate ontology, the first cover board, the second cover board and heat carrier；
High and low temperature distribution when being worked according to electronic device on the plate ontology, opens up at least from high-temperature region to low-temperature space
One runs through plate ontology, and the heat conduction slot extended along plane where plate ontology along plate body thickness direction, heat conduction slot it is interior
Separation layer is provided on side wall；
First cover board and the second cover board are hermetically covered on the heat conduction slot along plate body thickness direction respectively
Both-side opening, and be individually fixed on the plate ontology, form accommodation space with the heat conduction slot；It is set in the accommodation space
Set the heat carrier.
A2, the printed circuit board according to claim A1, which is characterized in that first cover board and/or the second lid
Vent hole was provided on plate.
A3, the printed circuit board according to claim A1, which is characterized in that the heat carrier is heat conduction with phase change body.
A4, the printed circuit board according to claim A1, which is characterized in that the heat carrier is paste.
A5, the printed circuit board according to claim A4, which is characterized in that the heat carrier includes heat conductive silica gel.
A6, the printed circuit board according to claim A4, which is characterized in that first cover board is towards heat conduction slot
One side be provided with the first recessed portion of corresponding heat conduction slot；And/or
The one side of second cover board towards the heat conduction slot is provided with the second recessed portion of corresponding heat conduction slot.
A7, the printed circuit board according to claim A6, which is characterized in that the open outer side of first recessed portion
The first chimb for protruding from the first cover board is extended with along plane where the first cover board；And/or
The open outer side of second recessed portion is extended with along plane where the second cover board and protrudes from the second of the second cover board
Chimb.
A8, the printed circuit board according to claim A6, which is characterized in that when the plate ontology is horizontally arranged, institute
The opening that the upper surface of heat carrier is located above with heat conduction slot is stated to be generally aligned in the same plane.
A9, the printed circuit board according to any one of claim A1-A8, which is characterized in that the heat conduction slot
The edge of both-side opening be both provided with the pad around heat conduction slot；
First cover board and the second cover board are respectively by pad solder in plate ontology.
A10, the printed circuit board according to claim A9, which is characterized in that the pad of the plate ontology and heat conduction
The welding resistance ring around heat conduction slot is provided between slot.
A11, the printed circuit board according to any one of claim A1-A8, which is characterized in that the cover board is gold
Belong to cover board.
A12, the printed circuit board according to any one of claim A1-A8, which is characterized in that the separation layer is
Copper electroplating layer.
B1, a kind of production method of printed circuit board, which is characterized in that including：
High and low temperature distribution when being worked according to electronic device on plate ontology, at least one is opened up from high-temperature region to low-temperature space
Run through plate ontology, and the heat conduction slot extended along plane where plate ontology along plate body thickness direction；
By via electroplating technology, separation layer is electroplated on the madial wall of the heat conduction slot；
Heat carrier is filled in the heat conduction slot, and the first cover board and the second cover board is hermetically covered on respectively described
Both-side opening of the heat conduction slot along plate body thickness direction, wherein the first cover board and the second cover board are fixedly installed on the plate sheet
On body.
The production method of B2, printed circuit board according to claim B1, which is characterized in that the heat conduction slot
Production method, including：
According to the shape for the heat conduction slot that will be opened up on plate ontology, the mobile route of milling cutter is preset；
According to the thickness of plate ontology, the depth that cuts of milling cutter is controlled, and groove milling is carried out according to preset mobile route.
The production method of B3, printed circuit board according to claim B1, which is characterized in that described according to plate ontology
High and low temperature distribution when upper electronic device work, opens up at least one to low-temperature space from high-temperature region and is passed through along plate body thickness direction
Threading ontology, and after the step of along the heat conduction slot that plane where plate ontology extends, including：
Using standard printed circuit board welding resistance moulding process, it is respectively arranged with and encloses at the edge of the both-side opening of heat conduction slot
Around the pad of heat conduction slot；Wherein, welding resistance ring is set between pad and heat conduction slot；
It is described that first cover board and the second cover board are hermetically covered on the heat conduction slot along plate body thickness direction respectively
Both-side opening the step of, including：
First cover board and the second cover board are respectively correspondingly covered on the heat conduction slot along the two of plate body thickness direction
Side opening；
By SMT reflow soldering processes, the first cover board and the second cover board are hermetically welded to the corresponding pad respectively
On.
The production method of B4, printed circuit board according to claim B1, which is characterized in that first cover board
And/or second be provided with vent hole on cover board.
The production method of B5, printed circuit board according to claim B1, which is characterized in that first cover board court
The first recessed portion of corresponding heat conduction slot is stamped with to the side of the heat conduction slot；And/or
The side of second cover board towards the heat conduction slot is stamped with the second recessed portion of corresponding heat conduction slot.
The production method of B6, printed circuit board according to claim B5, which is characterized in that first recessed portion
Open outer side flat die where the first cover board have the first chimb for protruding from the first cover board；And/or
The open outer side of second recessed portion has protrude from the second cover board second along flat die where the second cover board
Chimb.
The production method of B7, printed circuit board according to claim B1, which is characterized in that the heat carrier is cream
It is described that heat carrier is filled in the heat conduction slot when heat carrier of shape, and hermetically by the first cover board and the second cover board difference
The step of being covered on both-side opening of the heat conduction slot along plate body thickness direction, including：
By the second cover board closed cover together in a side opening of the heat conduction slot, and other side open horizontal is set upward
It sets；
Pasta heat carrier is filled in by the horizontal opening upward of heat conduction slot in heat conduction slot；
By the first cover board closed cover together in another side opening of the heat conduction slot.
The production method of B8, printed circuit board according to claim B7, which is characterized in that described to be led pasta
After the step that hot body is filled in heat conduction slot by the horizontal opening upward of heat conduction slot, including：
The heat carrier that horizontal opening upward is protruded from heat conduction slot is struck off.
Claims (7)
1. a kind of production method of printed circuit board, which is characterized in that including：
High and low temperature distribution when being worked according to electronic device on plate ontology, at least one is opened up along plate from high-temperature region to low-temperature space
Plate ontology, and the heat conduction slot extended along plane where plate ontology are run through in body thickness direction；
By via electroplating technology, separation layer is electroplated on the madial wall of the heat conduction slot；
Heat carrier is filled in the heat conduction slot, and the first cover board and the second cover board are hermetically covered on the heat conduction respectively
Both-side opening of the slot along plate body thickness direction, wherein the first cover board and the second cover board are fixedly installed on the plate ontology；
Wherein, described that heat carrier is filled in the heat conduction slot when heat carrier is pasta heat carrier, and first is covered
Plate and the second cover board are hermetically covered on the step of both-side opening of the heat conduction slot along plate body thickness direction respectively, packet
It includes：
By the second cover board closed cover together in a side opening of the heat conduction slot, and other side open horizontal is arranged upward；
Pasta heat carrier is filled in by the horizontal opening upward of heat conduction slot in heat conduction slot；
By the first cover board closed cover together in another side opening of the heat conduction slot.
2. the production method of printed circuit board according to claim 1, which is characterized in that the making side of the heat conduction slot
Method, including：
According to the shape for the heat conduction slot that will be opened up on plate ontology, the mobile route of milling cutter is preset；
According to the thickness of plate ontology, the depth that cuts of milling cutter is controlled, and groove milling is carried out according to preset mobile route.
3. the production method of printed circuit board according to claim 1, which is characterized in that described according to electronics on plate ontology
High and low temperature distribution when device works opens up at least one to low-temperature space from high-temperature region and runs through plate sheet along plate body thickness direction
Body, and after the step of along the heat conduction slot that plane where plate ontology extends, including：
Using standard printed circuit board welding resistance moulding process, it is respectively arranged with to surround at the edge of the both-side opening of heat conduction slot and leads
The pad in heat channel hole；Wherein, welding resistance ring is set between pad and heat conduction slot；
It is described that first cover board and the second cover board are hermetically covered on the heat conduction slot along the two of plate body thickness direction respectively
The step of side opening, including：
First cover board and the second cover board are respectively correspondingly covered on the heat conduction slot to open along the both sides in plate body thickness direction
Mouthful；
By SMT reflow soldering processes, the first cover board and the second cover board are hermetically welded on the corresponding pad respectively.
4. the production method of printed circuit board according to claim 1, which is characterized in that first cover board and/or
It was provided with vent hole on two cover boards.
5. the production method of printed circuit board according to claim 1, which is characterized in that first cover board is described in
The side of heat conduction slot is stamped with the first recessed portion of corresponding heat conduction slot；And/or
The side of second cover board towards the heat conduction slot is stamped with the second recessed portion of corresponding heat conduction slot.
6. the production method of printed circuit board according to claim 5, which is characterized in that the opening of first recessed portion
There is the first chimb for protruding from the first cover board in outside along flat die where the first cover board；And/or
The open outer side of second recessed portion has the second chimb for protruding from the second cover board along flat die where the second cover board.
7. the production method of printed circuit board according to claim 1, which is characterized in that described to lead to pasta heat carrier
The horizontal opening upward for crossing heat conduction slot is filled in after the step in heat conduction slot, including：
The heat carrier that horizontal opening upward is protruded from heat conduction slot is struck off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610474404.3A CN106061095B (en) | 2016-06-24 | 2016-06-24 | Printed circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610474404.3A CN106061095B (en) | 2016-06-24 | 2016-06-24 | Printed circuit board and preparation method thereof |
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| CN106061095B true CN106061095B (en) | 2018-09-18 |
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| CN201610474404.3A Expired - Fee Related CN106061095B (en) | 2016-06-24 | 2016-06-24 | Printed circuit board and preparation method thereof |
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| CN112133682B (en) * | 2020-09-07 | 2022-11-25 | 浙江集迈科微电子有限公司 | Chip assembly, heat dissipation circuit device and mobile terminal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594739A (en) * | 2008-05-27 | 2009-12-02 | 华为技术有限公司 | Device embedded circuit board heat abstractor and processing method |
| CN105188260A (en) * | 2015-11-02 | 2015-12-23 | 中国电子科技集团公司第二十六研究所 | Printed circuit board embedded runner liquid cooling heat exchange device |
| CN105491785A (en) * | 2014-10-10 | 2016-04-13 | 先丰通讯股份有限公司 | Phase-change heat conduction circuit board module and circuit board structure thereof |
-
2016
- 2016-06-24 CN CN201610474404.3A patent/CN106061095B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594739A (en) * | 2008-05-27 | 2009-12-02 | 华为技术有限公司 | Device embedded circuit board heat abstractor and processing method |
| CN105491785A (en) * | 2014-10-10 | 2016-04-13 | 先丰通讯股份有限公司 | Phase-change heat conduction circuit board module and circuit board structure thereof |
| CN105188260A (en) * | 2015-11-02 | 2015-12-23 | 中国电子科技集团公司第二十六研究所 | Printed circuit board embedded runner liquid cooling heat exchange device |
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