CN202362724U

CN202362724U - Embedded radiator

Info

Publication number: CN202362724U
Application number: CN2011204807308U
Authority: CN
Inventors: 吴安智; 陈志伟; 蔡铭昇
Original assignee: SHUANGHONG SCIENCE AND TECHNOLOGY Co Ltd
Current assignee: SHUANGHONG SCIENCE AND TECHNOLOGY Co Ltd; Auras Technology Co Ltd
Priority date: 2011-11-28
Filing date: 2011-11-28
Publication date: 2012-08-01
Anticipated expiration: 2021-11-28

Abstract

The utility model discloses an embedded radiator. The embedded radiator comprises a base, a heat conducting pipe, and a cooling fin group, wherein the base has two opposite surfaces; a fixing long groove is concavely formed on one surface, and a chip accommodating groove is concavely formed on the other surface; the width of the chip accommodating groove is larger than that of the fixing long groove; the bottom of the chip accommodating groove is communicated with the fixing long groove; one end of the heat conducting pipe is fixed in the fixing long groove of the base and cross the bottom of the chip accommodating groove; the outer surface of the heat conducting pipe corresponding to the bottom of the chip accommodating groove is flushed to the bottom of the chip accommodating groove; and the other end of the heat conducting pipe extends out of the fixing long groove and is fixed with cooling fin group. Accordingly, a chip can be embedded into the chip accommodating groove to reduce the total thickness of the radiator after placing the chip, and the chip surface can keep direct contact with the heat conducting pipe to improve the heat dissipation effect.

Description

Panel radiator

Technical field

The utility model is about a kind of heating radiator, especially in regard to a kind of panel radiator.

Background technology

Existing computing machine Related product all can include many chips; Because chip can produce used heat when computing; So the computing machine Related product must be provided with a heating radiator by chip; Thereby the used heat that chip is produced can be transmitted to dissipation heat extraction on this heating radiator, and heating radiator is one of considerable assembly for the computing machine related industry.

See also Fig. 4, the heating radiator for a kind of tool heat pipe includes:

One pedestal 60 has two apparent surfaces, and wherein a surface is the plane, and another apparent surface then is arranged with and is formed with a fixing elongated slot 61, and outside chip is then established in order to folded in this plane;

One radiating subassembly 70 includes a plurality of heat radiator side by side 71 and a heat pipe 72, and wherein these heat pipe 72 1 ends pass a plurality of heat radiator side by side, and the other end then is sticked in the fixedly elongated slot 61 of this pedestal.

Above-mentioned heat pipe is hollow form, and in wherein, promoting the heat pipe radiating rate and to have the radiating rate better than this pedestal, and speed-up chip used heat conducts on the groups of fins, reaches the heat radiation purpose with the perfusion heat-conducting liquid; Yet above-mentioned heating radiator still has following two defectives:

Volume big, take up space: please further consult Fig. 5; Above-mentioned heating radiator is folded establish to the chip 100 after; Integral thickness is that a pedestal 60 thickness add chip 100 thickness, quite occupies the content space like electronic products such as notebook computers, and can't satisfy lightening designer trends.

2. radiating effect is limited: though used the heat pipe with preferable radiating effect; But the used heat that chip produces still need conduct on this pedestal, conducts on the heat pipe from pedestal again, and the heat conduction velocity of pedestal own is slower; The speed that heat pipe is promoted is limited, and radiating effect is still not good.

In sum, because the lightening designer trends of electronic product, arrange in pairs or groups for the heating radiator that makes for the electronic product inside chip, must improve to some extent, reducing the content space of its occupied electronic product, but the while also will have the effect of good heat radiating concurrently.

The utility model content

Because the technological deficiency that above-mentioned heating radiator takes up room and radiating effect is not good, the fundamental purpose of the utility model is to propose a kind of panel radiator.

Desiring to reach the employed major technique means of above-mentioned purpose is that this panel radiator is included:

One pedestal; Have two apparent surfaces, wherein a surface is arranged with and is formed with a fixing elongated slot, and another apparent surface then is arranged with and is formed with a chip containing groove; The groove width of this chip containing groove is greater than this fixing groove width of elongated slot, and the bottom land of chip containing groove is communicated with fixing elongated slot;

One heat pipe, an end are fixedly arranged in the fixedly elongated slot of this pedestal, and stride across the bottom land of this chip containing groove, and the heat pipe outside surface of the bottom land of corresponding chip containing groove flushes with the bottom land of chip containing groove, and this heat pipe other end protrudes in this fixedly outside the elongated slot;

One groups of fins, be fixedly arranged on outstanding this fixedly on the end of the heat pipe of elongated slot.

Preferably, this pedestal is a rectangle plate body, has a length and a width, and should be fixedly the length of elongated slot equal the length of this pedestal, the width of this chip containing groove then equals the width of this pedestal.

Preferably, this pedestal periphery is formed with a plurality of fixed orifices.

Preferably, this heat pipe is a pancake heat pipe, and its inside is formed with a cavity, and forms a sinter layer along the heat pipe major axis in this cavity.

Preferably, this groups of fins comprises two opposing substrates and a plurality of fin, and these a plurality of fins directly are fixedly arranged between this two substrates to being spaced, and is welded on this heat pipe with a substrate wherein.

The utility model is formed with this chip containing groove and supplies ccontaining chip, and when being embedded in chip in the chip containing groove, the part outside wall surface of the corresponding chip containing groove bottom land of chip promptly can directly contact with heat pipe; So, remove the thickness that can reduce after the utility model radiating seat embeds chip, outside minimizing took up space, the used heat that chip is produced directly conducted to the groups of fins heat radiation by the fast heat pipe of heat-transfer rate, promotes radiating effect.

Description of drawings

Fig. 1 is the three-dimensional combination figure of the utility model.

Fig. 2 is the exploded view of Fig. 1.

Fig. 3 is the sectional view of face line behind Fig. 1 the embeds outside chip.

Fig. 4 is the combination stereogram of existing heating radiator.

Fig. 5 is the sectional view of Fig. 4.

The primary clustering symbol description

10 pedestals 11 are elongated slot fixedly

12 chip containing groove, 13 fixed orifices

20 heat pipes, 21 cavitys

22 sinter layers

30 groups of fins, 31 substrates

32 fins

60 pedestals 61 are elongated slot fixedly

70 radiating subassemblies, 71 heat radiator

72 heat pipes

100 chips

Embodiment

The preferred embodiment of following conjunction with figs. and the utility model, further setting forth the utility model is to reach the technological means that predetermined utility model purpose is taked.

See also Fig. 1 and Fig. 2, the utility model panel radiator includes:

One pedestal 10 has two apparent surfaces, and wherein a surface is arranged with and is formed with a fixing elongated slot 11; Another apparent surface then is arranged with and is formed with a chip containing groove 12, and the groove width of this chip containing groove 12 is greater than this fixing groove width of elongated slot, and the bottom land of chip containing groove 12 is communicated with fixing elongated slot 11; In the present embodiment, this pedestal 10 is a rectangle plate body, has a length and a width; And fixedly the length of elongated slot 11 equals the length of this pedestal 10; The width of this chip containing groove 12 then equals the width of this pedestal 10, and these pedestal 10 peripheries are formed with a plurality of fixed orifices 13, is fixed in the electronic product to supply a plurality of bolts to pass respectively;

One heat pipe, 20, one ends are fixedly arranged in the fixedly elongated slot 11 of this pedestal 10, and stride across the bottom land of this chip containing groove; And the heat conduction shop outside surface of the cell body of corresponding chip containing groove flushes with the bottom land of chip containing groove 12, and the other end of this heat pipe 20 protrudes in this fixedly outside the elongated slot 11, please further consults Fig. 3; In the present embodiment; This heat pipe 20 is a pancake heat pipe, and its inside is formed with a cavity 21, and forms a sinter layer 22 along heat pipe 20 major axis in this cavity 21;

One groups of fins 30; Be fixedly arranged on outstanding this fixedly on heat pipe 20 1 ends of elongated slot 11; In the present embodiment; This groups of fins 30 comprises two opposing substrates 31 and a plurality of fin 32, and these a plurality of fins 32 directly are fixedly arranged between this two substrates 31 to being spaced, and is welded on this heat pipe 20 with a substrate 31 wherein.

As shown in Figure 3, owing to the utlity model has chip containing groove 12, so in use; Can make outside chip 100 be embedded in the chip containing groove 12 of this pedestal, at this moment, the outside surface of the bottom land of these chip 100 corresponding chip containing groove 12; Meeting directly contacts with the outside surface that this heat pipe 20 exposes to chip containing groove 12 bottom lands; So, except can letting chip 100 hold, and reduce outside the gross thickness after heating radiator is provided with chip 100 as in the chip containing groove 12; This chip 100 also can directly contact with the fast heat pipe 20 of heat-transfer rate; See through heat-transfer rate heat pipe 20 conduct waste heat faster, the used heat that chip is produced can conduct to groups of fins 30 dissipations more quickly, promotes radiating effect.

In sum, because the utility model is provided with occupied space behind the chip with reducing heating radiator, and promotes the effect of heating radiator to chip cooling, to meet the lightening demand of electronic product.

The above only is the preferred embodiment of the utility model; Be not that the utility model is done any pro forma restriction; Though the utility model discloses as above with preferred embodiment; Yet be not that any those skilled in the art is in the scope that does not break away from the utility model technical scheme in order to qualification the utility model; Should utilize the technology contents of above-mentioned announcement to make a little change or be modified to the equivalent embodiment of equivalent variations; In every case be the content that does not break away from the utility model technical scheme, to any simple modification, equivalent variations and modification that above embodiment did, all still belong in the scope of the utility model technical scheme according to the technical spirit of the utility model.

Claims

1. a panel radiator is characterized in that, includes:

2. panel radiator as claimed in claim 1 is characterized in that, this pedestal is a rectangle plate body, has a length and a width, and should be fixedly the length of elongated slot equal the length of this pedestal, the width of this chip containing groove then equals the width of this pedestal.

3. according to claim 1 or claim 2 panel radiator is characterized in that this pedestal periphery is formed with a plurality of fixed orifices.

4. according to claim 1 or claim 2 panel radiator is characterized in that this heat pipe is a pancake heat pipe, and its inside is formed with a cavity, and forms a sinter layer along the heat pipe major axis in this cavity.

5. panel radiator as claimed in claim 3 is characterized in that, this heat pipe is a pancake heat pipe, and its inside is formed with a cavity, and forms a sinter layer along the heat pipe major axis in this cavity.

6. according to claim 1 or claim 2 panel radiator is characterized in that this groups of fins comprises two opposing substrates and a plurality of fin, and these a plurality of fins directly are fixedly arranged between this two substrates to being spaced, and is welded on this heat pipe with a substrate wherein.

7. panel radiator as claimed in claim 5 is characterized in that, this groups of fins comprises two opposing substrates and a plurality of fin, and these a plurality of fins directly are fixedly arranged between this two substrates to being spaced, and is welded on this heat pipe with a substrate wherein.