CN204929393U - Compound LCD circuit board of multilayer - Google Patents
Compound LCD circuit board of multilayer Download PDFInfo
- Publication number
- CN204929393U CN204929393U CN201520722320.8U CN201520722320U CN204929393U CN 204929393 U CN204929393 U CN 204929393U CN 201520722320 U CN201520722320 U CN 201520722320U CN 204929393 U CN204929393 U CN 204929393U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- connecting rod
- copper foil
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model relates to a LCD circuit board makes technical field, specifically indicates a compound LCD circuit board of multilayer. Including the circuit board on N layer, N is for being greater than 2 integer, be equipped with a plurality of structure holes on the circuit board, the downthehole circuit board connection who wears to be equipped with connecting rod messenger N layer of structure becomes integrative flexible construction, all be equipped with printed circuit's copper foil layer on the positive and negative of circuit board, and the copper foil layer on the circuit board of N layer passes through the connecting rod and feeds through the setting each other. The utility model discloses rational in infrastructure, the flexible FPC circuit board on N layer is connected through electrically conductive connecting rod, thus the structure hole is connected with I shape annular sheath and cooperates the connection on the connecting rod, annular sheath divide into copper facing electrically conductive sheath and insulating sheath to forming circuit intercommunication or insulating connection the between the circuit board of N layer, the connecting rod can with the fixed slot be assembled between/be connected between of installation on the station, the structural feature of performance flexible line way board plays the characteristics that non - cured structural set up and practiced thrift the space, effectively improves the wiring density and the integrated level of circuit board.
Description
Technical field
The utility model relates to liquid crystal circuit board manufacturing technology field, specifically refers to a kind of MULTILAYER COMPOSITE liquid crystal circuit board.
Background technology
In recent years, resolution is high, volume is little because having for liquid crystal display, lightweight, the advantage such as Low emissivity and power saving, therefore be widely used in all types of consumption electronic products, and replace cathode ray tube (CRT) gradually, become the main flow of display.The core of liquid crystal display is display chip circuit board, in order to improve performance and the structure of circuit board, usually adopting rigidity PCB to add flexible FPC circuit board, making it have the intensity of PCB and the pliability of FPC concurrently, to improve wiring density and assembling flexibility.The circuit board of multilayer is bonded into one by for this reason current liquid crystal chip, is connected by the copper foil circuit of each aspect by Microvia copper facing technology, thus improves structural strength and the wiring density of pcb board.But there is location difficulty and bonding offset problem in the PCB of this compound in anabolic process, cause the circuit connection open circuit after piercing of the pcb board after bonding, and the board structure of circuit after bonding solidifies, and loses the change of flexible FPC and space-saving feature thereupon.Therefore, prior art needs to improve.
Summary of the invention
The purpose of this utility model is defect for prior art and deficiency, provides a kind of rational in infrastructure, easy to assembly, integrated level much higher layer compound liquid-crystal circuit board.
To achieve these goals, the utility model is by the following technical solutions:
A kind of MULTILAYER COMPOSITE liquid crystal circuit board described in the utility model, comprises the wiring board of N layer, N be greater than 2 integer; Described wiring board is provided with some structure hole, is equipped with the flexible structure that connecting rod makes the wiring board of N layer link into an integrated entity in structure hole; The positive and negative of described wiring board is equipped with the copper foil layer of printed circuit, and copper foil layer on N sandwich circuit board to be interconnected setting by connecting rod.
According to above scheme, the ring jacket of cross section in " work " word is provided with in described structure hole, annular groove in ring jacket outer rim is arranged in structure hole, and the copper foil layer on the annular groove madial wall of ring jacket and wiring board is conflicted and is arranged, in the centre bore that described connecting rod is arranged in ring jacket and with its interference fit.
According to above scheme, described ring jacket comprises copper facing sheath and insulating sleeve, and the outer rim of copper facing sheath, upper and lower end face, endoporus and annular groove madial wall are equipped with copper plate; Described some structure hole are connected by copper facing sheath or insulating sleeve and connecting rod, and then make between the copper foil layer on the wiring board of N layer in be communicated with or insulation is arranged.
According to above scheme, the lateral surface of described copper foil layer is packaged with cuticular layer, and cuticular layer be provided with some coordinate with structure hole stay white area.
The utility model beneficial effect is: the utility model is rational in infrastructure, the flexible FPC wiring board of N layer is connected by conductive link, structure hole is connected with I shape ring jacket and coordinates thus be connected on connecting rod, ring jacket is divided into copper facing conductive jacket and insulating sleeve, thus between N sandwich circuit board, form circuit communication or insulation connection; Connecting rod with the holddown groove assembly connection installed on station, can play the design feature of flexible circuit board, plays uncured vibrational power flow and space-saving feature, effectively improves wiring density and the integrated level of wiring board.
Accompanying drawing explanation
Fig. 1 is overall cross-sectional view of the present utility model.
In figure:
1, wiring board; 2, connecting rod; 11, structure hole; 12, copper foil layer; 21, copper facing sheath; 22, insulating sleeve.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the technical solution of the utility model is described.
As shown in Figure 1, a kind of MULTILAYER COMPOSITE liquid crystal circuit board described in the utility model, the wiring board 1, N comprising N layer be greater than 2 integer; Described wiring board 1 is provided with some structure hole 11, is equipped with the flexible structure that connecting rod 2 makes the wiring board 1 of N layer link into an integrated entity in structure hole 11; The positive and negative of described wiring board 1 is equipped with the copper foil layer 12 of printed circuit, and copper foil layer 12 on N sandwich circuit board 1 to be interconnected setting by connecting rod 2; Described connecting rod 2 is connected with structure hole 11 and the copper foil layer 12 on N sandwich circuit board 1 is interconnected, thus make the integrated more circuit of circuit board and components and parts, and N sandwich circuit board 1 is point to point connect with connecting rod 2, retain the deformation performance in flexible PCB, while improving integrated level, also a saving installing space.
The ring jacket of cross section in " work " word is provided with in described structure hole 11, annular groove in ring jacket outer rim is arranged in structure hole 11, and the copper foil layer 12 on the annular groove madial wall of ring jacket and wiring board 1 is conflicted and is arranged, in the centre bore that described connecting rod 2 is arranged in ring jacket and with its interference fit, wiring board 1 is connected with ring jacket by structure hole 11, and the annular groove side of ring jacket and wiring board 1 collision piece, therefore connecting rod 2 forms anatomical connectivity and circuit communication by ring jacket and wiring board 1.
Described ring jacket comprises copper facing sheath 21 and insulating sleeve 22, and the outer rim of copper facing sheath 21, upper and lower end face, endoporus and annular groove madial wall are equipped with copper plate; Described some structure hole 11 are connected with connecting rod 2 by copper facing sheath 21 or insulating sleeve 22, and then make between the copper foil layer 12 on the wiring board 1 of N layer in being communicated with or insulation setting, connecting rod 2 is by the electrical connectivity of copper facing sheath 21, thus make to be formed between copper foil layer 12 circuit on N sandwich circuit board 1 to be communicated with, the node that wiring board 1 residing for insulating sleeve 22 is connected with connecting rod 2 is then off state, thus the connected sum open circuit realized between N sandwich circuit board 1 coordinates, improve wiring space and the integrated level of circuit board.
The lateral surface of described copper foil layer 12 is packaged with cuticular layer, and cuticular layer be provided with some coordinate with structure hole 11 stay white area.
The above is only better embodiment of the present utility model, therefore all equivalences done according to structure, feature and the principle described in the utility model patent claim change or modify, and are included in the utility model patent claim.
Claims (4)
1. a MULTILAYER COMPOSITE liquid crystal circuit board, comprises the wiring board (1) of N layer, N be greater than 2 integer; It is characterized in that: described wiring board (1) is provided with some structure hole (11), in structure hole (11), be equipped with the flexible structure that connecting rod (2) makes the wiring board of N layer (1) link into an integrated entity; The positive and negative of described wiring board (1) is equipped with the copper foil layer (12) of printed circuit, and copper foil layer (12) on N sandwich circuit board (1) to be interconnected setting by connecting rod (2).
2. MULTILAYER COMPOSITE liquid crystal circuit board according to claim 1, it is characterized in that: in described structure hole (11), be provided with the ring jacket of cross section in " work " word, annular groove in ring jacket outer rim is arranged in structure hole (11), and the copper foil layer (12) on the annular groove madial wall of ring jacket and wiring board (1) is conflicted and is arranged, in the centre bore that described connecting rod (2) is arranged in ring jacket and with its interference fit.
3. MULTILAYER COMPOSITE liquid crystal circuit board according to claim 2, it is characterized in that: described ring jacket comprises copper facing sheath (21) and insulating sleeve (22), the outer rim of copper facing sheath (21), upper and lower end face, endoporus and annular groove madial wall are equipped with copper plate; Described some structure hole (11) are connected with connecting rod (2) by copper facing sheath (21) or insulating sleeve (22), and then make between the copper foil layer (12) on the wiring board (1) of N layer in being communicated with or insulation setting.
4. MULTILAYER COMPOSITE liquid crystal circuit board according to claim 1, is characterized in that: the lateral surface of described copper foil layer (12) is packaged with cuticular layer, and cuticular layer be provided with some coordinate with structure hole (11) stay white area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520722320.8U CN204929393U (en) | 2015-09-17 | 2015-09-17 | Compound LCD circuit board of multilayer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520722320.8U CN204929393U (en) | 2015-09-17 | 2015-09-17 | Compound LCD circuit board of multilayer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204929393U true CN204929393U (en) | 2015-12-30 |
Family
ID=54978485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520722320.8U Expired - Fee Related CN204929393U (en) | 2015-09-17 | 2015-09-17 | Compound LCD circuit board of multilayer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204929393U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106376176A (en) * | 2016-09-14 | 2017-02-01 | 广东达进电子科技有限公司 | Printed circuit board and fabrication method thereof |
| CN106526926A (en) * | 2016-12-20 | 2017-03-22 | 深圳市华星光电技术有限公司 | Multilayer circuit structure |
| CN107889413A (en) * | 2017-09-29 | 2018-04-06 | 艾威尔电路（深圳）有限公司 | The multi-functional rigid-flex combined board of hollow out of ectonexine plug-in unit |
-
2015
- 2015-09-17 CN CN201520722320.8U patent/CN204929393U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106376176A (en) * | 2016-09-14 | 2017-02-01 | 广东达进电子科技有限公司 | Printed circuit board and fabrication method thereof |
| CN106526926A (en) * | 2016-12-20 | 2017-03-22 | 深圳市华星光电技术有限公司 | Multilayer circuit structure |
| CN106526926B (en) * | 2016-12-20 | 2019-05-31 | 深圳市华星光电技术有限公司 | Multilayer circuit structure |
| CN107889413A (en) * | 2017-09-29 | 2018-04-06 | 艾威尔电路（深圳）有限公司 | The multi-functional rigid-flex combined board of hollow out of ectonexine plug-in unit |
| CN107889413B (en) * | 2017-09-29 | 2020-10-13 | 艾威尔电路（深圳）有限公司 | Hollow multifunctional rigid-flex board with inner and outer layer plug-in components |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151230 Termination date: 20190917 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |