CN219718568U

CN219718568U - Multi-layer circuit board

Info

Publication number: CN219718568U
Application number: CN202320161064.4U
Authority: CN
Inventors: 邵伟; 刘彩霞; 谢剑云
Original assignee: Huizhou TCL Mobile Communication Co Ltd
Current assignee: Huizhou TCL Mobile Communication Co Ltd
Priority date: 2023-01-16
Filing date: 2023-01-16
Publication date: 2023-09-19
Anticipated expiration: 2033-01-16

Abstract

The embodiment of the utility model provides a multilayer circuit board, which comprises a circuit board body, wherein the circuit board body comprises a plurality of working layers which are sequentially arranged at intervals, and copper-clad connecting holes which sequentially penetrate through and connect the working layers are formed in the circuit board body; the copper-clad connecting holes are respectively connected with stratum and main signal layers in the plurality of working layers in a conductive mode, and are respectively connected with other working layers in the plurality of working layers in an insulating mode, and the stratum is formed on the outer surface of the circuit board body.

Description

Multi-layer circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board.

Background

A printed circuit board (Printed circuit boards, abbreviated as PCB), also known as a printed circuit board, is a provider of electrical connections for electronic components. In the related art, when the printed circuit board adopts a single-point grounding mode, jumper pads are required to be arranged for jumper short circuit, so that the wiring structure of the printed circuit board is complex, and the design and manufacturing difficulty is increased. This is particularly true when the printed circuit board is a multi-layer board structure.

Disclosure of Invention

The embodiment of the utility model provides a multilayer circuit board, which can simplify the wiring structure in the board and reduce the design and manufacturing difficulty.

In some embodiments, the wall of the copper-clad connection hole is provided with a copper-clad layer, and the copper-clad layer is respectively connected with the stratum and the main signal layer, and is spaced from the rest of the working layers.

In some embodiments, the circuit board body further includes a formation pad, the formation pad and the formation are arranged in the same layer and are mutually communicated, and the copper-clad connection hole penetrates through the formation pad.

In some embodiments, the circuit board body further includes a main layer pad, the main layer pad and the main signal layer are arranged in a same layer and are mutually conducted, and the copper-clad connection hole penetrates through the main layer pad.

In some embodiments, the circuit board body further includes a suspension pad, the suspension pad and the rest of the plurality of working layers have equal numbers of layers and are arranged in one-to-one correspondence, the suspension pad and the corresponding working layer are arranged at the same layer interval, and the copper-clad connection hole penetrates through the suspension pad.

In some embodiments, an insulating dielectric layer is disposed between two adjacent working layers.

In some embodiments, the circuit board body includes four working layers, the four working layers being a ground layer, a power layer, and two signal layers, respectively, wherein one signal layer is a main signal layer.

In some embodiments, the circuit board body includes four working layers, the four working layers are two strata and two signal layers respectively, the two strata are respectively formed on outer surfaces of two opposite sides of the circuit board body along a thickness direction, one stratum is a main horizon layer, and one signal layer is a main signal layer; the signal layer comprises a signal area and a power supply area, and the copper-clad connecting holes are respectively connected with the signal area of the main signal layer and the main ground plane layer in a conductive mode and respectively connected with another stratum and another signal layer in an insulating mode.

In some embodiments, the main ground plane layer and the main signal layer are adjacently spaced apart in the four working layers.

In some embodiments, the formation and the primary signal layer are adjacently spaced apart in the plurality of working layers.

According to the embodiment of the utility model, the copper-clad connecting holes are arranged, the stratum and the main signal layer are connected through the copper-clad connecting holes in a conductive manner, the purpose of grounding connection between the main signal layer and the stratum is realized, the copper-clad connecting holes are respectively used for insulating and connecting other working layers except the stratum and the main signal layer, so that the grounding structure between the main signal layer and the stratum is not communicated with the other working layers, the purpose of single-point grounding is realized, a jumper wire bonding pad is not required, the wiring structure in a board is simplified, and the design and manufacturing difficulty is reduced; meanwhile, the stratum is adopted as the outer layer of the circuit board body, and electromagnetic interference from the outside is shielded by the stratum, so that the working performance of each inner layer in the circuit board body is improved, and the working performance of the multilayer circuit board is further improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a cross-sectional block diagram of a multilayer circuit board provided in some embodiments of the utility model;

fig. 2 is another cross-sectional block diagram of a multi-layer circuit board provided in some embodiments of the utility model.

Description of main reference numerals:

10-working layer, 10 a-stratum, 10a '-main ground layer, 10 b-power layer, 10 c-signal layer, 10c' -main signal layer, 101-signal region, 102-power region, 20-copper-clad connection hole, 21-copper-clad layer, 31-stratum pad, 32-main layer pad, 33-suspension pad, 40-insulating medium layer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

The use of "adapted" or "configured" in this disclosure is meant to be an open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps. In addition, the use of "based on" is intended to be open and inclusive in that a process, step, calculation, or other action "based on" one or more of the stated conditions or values may be based on additional conditions or beyond the stated values in practice.

In the present utility model, the term "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described as "exemplary" in this disclosure is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the utility model. In the following description, details are set forth for purposes of explanation. It will be apparent to one of ordinary skill in the art that the present utility model may be practiced without these specific details. In other instances, well-known structures and processes have not been described in detail so as not to obscure the description of the utility model with unnecessary detail. Thus, the present utility model is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.

The embodiment of the utility model provides a multilayer circuit board, which comprises a circuit board body, wherein the purpose of single-point grounding can be realized without arranging jumper wire bonding pads, the wiring structure in the board can be simplified, and the design and manufacturing difficulty can be reduced.

As shown in fig. 1, the circuit board body includes a plurality of working layers 10, and the plurality of working layers 10 are sequentially arranged at intervals along the thickness direction of the circuit board body. Here, the number of the working layers 10 is identical to the number of layers of the multi-layered circuit board to satisfy the working structure requirement of the multi-layered circuit board. For example, when the multi-layered circuit board is a four-layer board, the circuit board body may include four working layers 10; as another example, where the multi-layer circuit board is a six-layer board, the circuit board body may include six working layers 10; for another example, where the multi-layer circuit board is an eight-layer board, the circuit board body may include eight working layers 10.

Among the plurality of working layers 10 described above, a formation 10a and a primary signal layer 10c' may be included. The ground layer 10a is a ground layer 10a, and is provided with at least one wire grounding end (Ground (voltage level), GND for short); the main signal layer 10c' assumes the main signal routing task and provides the main electrical connection function.

The circuit board body is provided with copper-clad connection holes 20, and the copper-clad connection holes 20 sequentially penetrate through and connect the plurality of working layers 10. Here, the copper clad connection hole 20 has a conductive connection characteristic. The copper-clad connection holes 20 are respectively and conductively connected with the stratum 10a and the main signal layer 10c ' in the plurality of working layers 10, so that the main signal layer 10c ' can be communicated with the stratum 10a through the copper-clad connection holes 20, and the grounding purpose of the main signal layer 10c ' is realized; meanwhile, the copper-clad connection holes 20 are respectively and insulatively connected with the rest of the working layers 10 except the stratum 10a and the main signal layer 10c 'in the plurality of working layers 10, so that the copper-clad connection holes 20 are not connected with the rest of the working layers 10, and further, the grounding structure between the main signal layer 10c' and the stratum 10a is not connected with the rest of the working layers 10, thereby realizing the purpose of single-point grounding and correspondingly avoiding signal interference.

The stratum 10a is formed on the outer surface of the circuit board body and belongs to the outer layer of the circuit board body. When the stratum 10a is used as the outer layer of the circuit board body, the stratum 10a can shield electromagnetic interference from the outside, and the working performance of each inner layer in the circuit board body is improved. Here, the inner layer is the working layer 10 located inside the circuit board body, and may be any one of the plurality of working layers 10 except the working layer 10 located on the outer surface of the circuit board body.

Compared with the related art, the multilayer circuit board provided by the embodiment of the utility model is provided with the copper-clad connection holes 20, the copper-clad connection holes 20 are used for conducting connection between the stratum 10a and the main signal layer 10c ', the purpose of grounding connection between the main signal layer 10c' and the stratum 10a is realized, the copper-clad connection holes 20 are used for respectively insulating connection with other working layers 10 except the stratum 10a and the main signal layer 10c ', so that the grounding structure between the main signal layer 10c' and the stratum 10a is not communicated with the other working layers 10, the purpose of single-point grounding is realized, a jumper wire bonding pad is not required to be arranged, the wiring structure in the board is simplified, and the design and manufacturing difficulty is reduced; meanwhile, the stratum 10a is adopted as the outer layer of the circuit board body, and electromagnetic interference from the outside is shielded by the stratum 10a, so that the working performance of each inner layer in the circuit board body is improved, and the working performance of the multilayer circuit board is further improved.

The structure of the copper-clad connection hole 20 may be determined according to actual needs, and may be of a type such as a via hole, a buried hole, etc., which is not limited in the embodiment of the present utility model. In some embodiments, the walls of the copper-clad connection holes 20 may be provided with copper-clad layers 21, the copper-clad layers 21 being respectively connected to the ground layer 10a and the main signal layer 10c', and the copper-clad layers 21 being spaced apart from the remaining working layers 10. A conductive connection layer is formed on the wall of the copper-clad connection hole 20 by using the copper-clad layer 21, so that single-point grounding between the stratum 10a and the main signal layer 10c' can be realized; since the copper-clad layer 21 and the rest of the working layers 10 are arranged at intervals, the copper-clad layer 21 and the rest of the working layers 10 are not connected with each other, and the grounding structure between the main signal layer 10c' and the stratum 10a is not connected with the rest of the working layers 10, so that the purpose of single-point grounding is realized.

In some embodiments, the circuit board body may also include formation 10a pads. The formation 10a pads and the formation 10a are arranged in the same layer and are in communication with each other, and the copper-clad connection holes 20 penetrate the formation 10a pads. Thus, the copper-clad connection hole 20 can be electrically connected to the land 10a, and thus electrically connected to the land 10a through the land 10 a. In some examples, formation 10a may be provided with a ground trace, and formation 10a pads may be in communication with the ground trace.

In some embodiments, the circuit board body further includes a main layer pad 32, and the main layer pad 32 and the main signal layer 10c' are disposed in the same layer and are electrically connected to each other, and the copper-clad connection hole 20 penetrates the main layer pad 32. Thus, the copper-clad connection hole 20 can be electrically connected to the main layer pad 32, and thus electrically connected to the main signal layer 10c' through the main layer pad 32. In some examples, the primary signal layer 10c' may include a primary signal region 101 provided with a primary signal trace, and the formation 10a pad may be in communication with the primary signal trace.

In some embodiments, the circuit board body further includes a suspension pad 33. The suspended pads 33 are arranged in equal number and one-to-one correspondence with the rest of the plurality of working layers 10, the suspended pads 33 are arranged at the same layer interval as the corresponding working layers 10, and the copper-clad connection holes 20 penetrate through the suspended pads 33. In this way, each flying pad 33 and its corresponding active layer 10 are not connected to each other in a spaced apart insulating relationship so that copper-clad connection holes 20 connected to the flying pads 33 are not connected to the active side. Illustratively, when the number of the remaining working layers 10 in the plurality of working layers 10 is two, the number of the suspension pads 33 is also two, and each suspension pad 33 and one working layer 10 in the two remaining working layers 10 are arranged in the same layer and are spaced apart from each other without being connected; also, by way of example, when the number of the remaining operation layers 10 in the plurality of operation layers 10 is four, the number of the suspension pads 33 is also four, and each suspension pad 33 and one operation layer 10 in the two remaining operation layers 10 are arranged in the same layer and are spaced apart from each other without being connected; and so on, they are not described in detail herein.

In some embodiments, an insulating dielectric layer 40 may be disposed between two adjacent working layers 10. By using the insulating dielectric layer 40, insulation between two adjacent working layers 10 can be maintained without short circuit, thereby ensuring independent working performance of each working layer 10.

In some embodiments, the multi-layer circuit board may be a four-layer board and the circuit board body may include four working layers 10. Here, the four working layers 10 may be a ground layer 10a, a power layer 10b, and two signal layers 10c, respectively, wherein one signal layer 10c is a main signal layer 10c', and the power layer 10b may be used to arrange power traces and correspondingly provide driving voltages required by the signal layer 10c.

As shown in fig. 2, in some embodiments, the multi-layer circuit board may be a four-layer board, and the circuit board body may include four working layers 10; here, the four working layers 10 may be two strata 10a and two signal layers 10c, respectively. Two strata 10a are respectively formed on the outer surfaces of the opposite sides of the circuit board body in the thickness direction thereof; of the two strata 10a, one stratum 10a is the main ground plane layer 10a', which serves as a common ground, while the other stratum 10a mainly serves as a protection for electromagnetic shielding of the inner layers of the circuit board body. Of the two signal layers 10c, one signal layer 10c is the main signal layer 10c'; each signal layer 10c includes a signal region 101 and a power region 102, respectively, and the power region 102 may be used to arrange power traces and correspondingly provide driving voltages required by the signal region 101, so as to achieve an independent working effect of each signal layer 10c. Here, the copper-clad connection holes 20 are conductively connected to the signal region 101 of the main signal layer 10c 'and the main ground layer 10a', respectively, and are insulated from and connected to the other ground layer 10a and the other signal layer 10c, respectively.

In some examples, the main horizon layer 10a 'and the main signal layer 10c' are adjacently spaced apart in the four active layers 10. On the one hand, the power supply region 102 of the main signal layer 10c 'and the main ground layer 10a' have smaller spacing distance and are closer to each other, so that the internal resistance of the power supply region 102 can be reduced to provide the driving performance of the power supply region 102; on the other hand, the signal area 101 of the main signal layer 10c ' and the main ground plane layer 10a ' have smaller spacing distance and are closer to each other, so that the main ground plane layer 10a ' can better shield electromagnetic interference, correspondingly greatly reduce the electromagnetic interference suffered by the signal area 101 of the main signal layer 10c ', and improve the signal transmission performance of the main signal layer 10c '.

In some embodiments, as shown in FIG. 1, the formation 10a and the primary signal layer 10c' are adjacently spaced apart in a plurality of working layers 10. In this way, the main signal layer 10c ' and the main ground plane layer 10a ' have smaller spacing distance and are closer to each other, so that the main ground plane layer 10a ' can better shield electromagnetic interference, correspondingly greatly reduce electromagnetic interference suffered by the main signal layer 10c ', and improve signal transmission performance of the main signal layer 10c '.

The foregoing has described in detail the multi-layer circuit board provided by the embodiments of the present utility model, and specific examples have been provided herein to illustrate the principles and embodiments of the present utility model, the above examples being provided only to assist in understanding the methods of the present utility model and the core ideas thereof; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present utility model, the present description should not be construed as limiting the present utility model.

Claims

1. The multilayer circuit board is characterized by comprising a circuit board body, wherein the circuit board body comprises a plurality of working layers which are sequentially arranged at intervals, and copper-clad connecting holes which sequentially penetrate through the working layers are formed in the circuit board body; the copper-clad connecting holes are respectively connected with stratum and main signal layers in the plurality of working layers in a conductive mode, and are respectively connected with other working layers in the plurality of working layers in an insulating mode, and the stratum is formed on the outer surface of the circuit board body.

2. The multilayer circuit board of claim 1, wherein the walls of the copper-clad connection holes are provided with copper-clad layers, the copper-clad layers being respectively connected to the ground layer and the main signal layer, and the copper-clad layers and the remaining working layers being spaced apart.

3. The multilayer circuit board of claim 1, wherein the circuit board body further comprises a formation pad, the formation pad and the formation are co-layer disposed and in communication with each other, the copper-clad connection hole extending through the formation pad.

4. The multi-layer circuit board of claim 1, wherein the circuit board body further comprises a main layer pad, the main layer pad and the main signal layer are arranged in a same layer and are in conductive communication with each other, and the copper-clad connection hole penetrates through the main layer pad.

5. The multi-layer circuit board of claim 1, wherein the circuit board body further comprises a suspension pad, the suspension pad and the rest of the plurality of working layers are equal in number and are arranged in one-to-one correspondence, the suspension pad and the corresponding working layer are arranged at the same layer interval, and the copper-clad connection hole penetrates through the suspension pad.

6. The multilayer circuit board of claim 1, wherein an insulating dielectric layer is disposed between two adjacent working layers.

7. The multi-layer circuit board of claim 1, wherein the circuit board body comprises four working layers, the four working layers being a ground layer, a power layer, and two signal layers, respectively, wherein one signal layer is a primary signal layer.

8. The multilayer circuit board according to claim 1, wherein the circuit board body comprises four working layers, the four working layers being two strata and two signal layers respectively, the two strata being formed on outer surfaces of opposite sides of the circuit board body in a thickness direction thereof respectively, wherein one stratum is a main horizon layer and one signal layer is a main signal layer; the signal layer comprises a signal area and a power supply area, and the copper-clad connecting holes are respectively connected with the signal area of the main signal layer and the main ground plane layer in a conductive mode and respectively connected with another stratum and another signal layer in an insulating mode.

9. The multi-layer circuit board of claim 8, wherein the main ground plane layer and the main signal layer are adjacently spaced apart in the four active layers.

10. The multilayer circuit board of claim 1, wherein the ground layer and the primary signal layer are adjacently spaced apart in the plurality of operational layers.