CN203256356U - Fixture used for electroplating ceramic printed circuit board - Google Patents
Fixture used for electroplating ceramic printed circuit board Download PDFInfo
- Publication number
- CN203256356U CN203256356U CN 201320200080 CN201320200080U CN203256356U CN 203256356 U CN203256356 U CN 203256356U CN 201320200080 CN201320200080 CN 201320200080 CN 201320200080 U CN201320200080 U CN 201320200080U CN 203256356 U CN203256356 U CN 203256356U
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- circuit board
- plating
- electroplating
- frock
- framework
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Abstract
The utility model is applicable to the field of ceramic printed circuit board manufacture procedure, and provides a fixture used for electroplating a ceramic printed circuit board. The fixture comprises a rectangular electroplating shunting plate and a hollow frame, wherein rivet holes are formed in the upper edge and lower edge of the electroplating shunting plate; rivet holes are formed in the parts, corresponding to the rivet holes in the electroplating shunting plate, of the right half part of the frame, and the rivet holes in the electroplating shunting plate are fixed together with the rivet holes in the frame through rivets; a plurality of connecting holes are formed in the upper edge and lower edge of the left half part of the frame; the connecting holes are connected through a metal wire so as to clamp a clip of a ceramic base plate. When the fixture is used, the ceramic base plate is clamped at the gap of the frame through the clip, so that the ceramic base plate can be normally electroplated by utilizing a common electroplating production flow line without causing damage to the ceramic base plate.
Description
Technical field
The utility model belongs to ceramic printed-circuit board processing procedure field, relates in particular to a kind of frock for the ceramic printed-circuit board plating.
Background technology
Ceramic substrate refers to that Copper Foil at high temperature is bonded directly to aluminum oxide or the lip-deep special process plate of aluminium nitride ceramic substrate, it has good electrical insulating property, high thermal conductivity, and can as common printed circuit board (PCB), etch various figures, have very large current capacity, have broad application prospects in the LED encapsulation field.But because the ceramic substrate size is little, frangible, common Electroplating Production streamline can not guarantee the normal plating that pottery is basic.
Summary of the invention
The purpose of this utility model is to provide a kind of frock for the ceramic printed-circuit board plating, is intended to solve the problem that common Electroplating Production streamline can not guarantee the normal plating that pottery is basic.
The utility model is achieved in that a kind of frock for the ceramic printed-circuit board plating, and described frock comprises the plating spreader plate of rectangle and the framework of rectangle and hollow;
Upper limb and the lower rim of described plating spreader plate have tack hole, described framework right half part, with described plating spreader plate on the correspondence position of described tack hole have tack hole, the tack hole on the described plating spreader plate is fixed by the tack hole on rivet and the described framework; Described framework has some connecting holes at upper limb and the lower rim of left-half, and described connecting hole connects in order to clamp the clip of ceramic substrate by wire.
Wherein, described plating spreader plate can be that thickness is 1.6mm, and copper is thick to be the printing plate of the FR-4 base material of 10z.
Wherein, described framework can be that thickness is 1.6mm, and copper is thick to be the printing plate of the FR-4 base material of 10z.
Above-mentioned frock for the ceramic printed-circuit board plating, described wire can be copper wire.
The frock that is used for the ceramic printed-circuit board plating that the utility model provides by the vacancy of clip at framework, can be utilized ceramic substrate common plating production line realization to the normal plating of ceramic substrate, and not damage ceramic substrate in use.
Description of drawings
Fig. 1 is the frock that is used for the ceramic printed-circuit board plating that the utility model embodiment provides, and electroplates the structural representation of spreader plate;
Fig. 2 is the frock that is used for the ceramic printed-circuit board plating that the utility model embodiment provides, the structural representation of framework;
Fig. 3 is among the utility model embodiment, electroplates the two dimensional structure synoptic diagram of the applied in any combination of spreader plate and framework;
Fig. 4 is among the utility model embodiment, electroplates the cross-sectional view of the applied in any combination of spreader plate and framework.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
Fig. 1 is the frock that is used for the ceramic printed-circuit board plating that the utility model embodiment provides, electroplate the structural representation of spreader plate, Fig. 2 is the frock that is used for the ceramic printed-circuit board plating that the utility model embodiment provides, the structural representation of framework, Fig. 3 is among the utility model embodiment, electroplate the two dimensional structure synoptic diagram of the applied in any combination of spreader plate and framework, Fig. 4 is among the utility model embodiment, electroplates the cross-sectional view of the applied in any combination of spreader plate and framework.
To shown in Figure 4, the frock that is used for the ceramic printed-circuit board plating that the utility model embodiment provides comprises the plating spreader plate 1 of rectangle and the framework 2 of rectangle and hollow in conjunction with Fig. 1.Upper limb and the lower rim of electroplating spreader plate 1 have tack hole 11, framework 2 is at right half part, having tack hole 21 with the correspondence position of electroplating the tack hole 11 on the spreader plate 1, and the tack hole 11 of electroplating on the spreader plate 1 is fixed by the tack hole 21 on rivet and the framework 2; Framework 2 has some connecting holes 22 at upper limb and the lower rim of left-half, the clip 24 that connecting hole 22 connects in order to clamp ceramic substrate by wire 23.
Further, electroplating spreader plate 1 is that thickness is 1.6mm, and copper is thick to be the printing plate of the FR-4 base material of 10z, and its width designs according to the width of ceramic substrate; Framework 2 is that thickness is 1.6mm, and copper is thick to be the printing plate of the FR-4 base material of 10z; The diameter of tack hole 11 and tack hole 21 is respectively 3.175mm, and the diameter of connecting hole 22 is 3.175mm; Wire 23 is copper wire preferably.
Above-mentioned frock is clipped in the vacancy of framework 2 with ceramic substrate by clip 24 in use, can utilize common plating production line to realize normal plating to ceramic substrate, and not damage ceramic substrate.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection domain of the present utility model.
Claims (4)
1. one kind is used for the frock that ceramic printed-circuit board is electroplated, and it is characterized in that described frock comprises the plating spreader plate of rectangle and the framework of rectangle and hollow;
Upper limb and the lower rim of described plating spreader plate have tack hole, described framework right half part, with described plating spreader plate on the correspondence position of described tack hole have tack hole, the tack hole on the described plating spreader plate is fixed by the tack hole on rivet and the described framework; Described framework has some connecting holes at upper limb and the lower rim of left-half, and described connecting hole connects in order to clamp the clip of ceramic substrate by wire.
2. the frock for the ceramic printed-circuit board plating as claimed in claim 1 is characterized in that described plating spreader plate is that thickness is 1.6mm, and copper is thick to be the printing plate of the FR-4 base material of 10z.
3. the frock for the ceramic printed-circuit board plating as claimed in claim 1 is characterized in that described framework is that thickness is 1.6mm, and copper is thick to be the printing plate of the FR-4 base material of 10z.
4. such as each described frock for the ceramic printed-circuit board plating of claims 1 to 3, it is characterized in that described wire is copper wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320200080 CN203256356U (en) | 2013-04-19 | 2013-04-19 | Fixture used for electroplating ceramic printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320200080 CN203256356U (en) | 2013-04-19 | 2013-04-19 | Fixture used for electroplating ceramic printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203256356U true CN203256356U (en) | 2013-10-30 |
Family
ID=49468940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320200080 Expired - Fee Related CN203256356U (en) | 2013-04-19 | 2013-04-19 | Fixture used for electroplating ceramic printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203256356U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103757685A (en) * | 2014-01-24 | 2014-04-30 | 广东达进电子科技有限公司 | Ceramic circuit board clamp used for electroplating |
-
2013
- 2013-04-19 CN CN 201320200080 patent/CN203256356U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103757685A (en) * | 2014-01-24 | 2014-04-30 | 广东达进电子科技有限公司 | Ceramic circuit board clamp used for electroplating |
| CN103757685B (en) * | 2014-01-24 | 2016-09-21 | 广东达进电子科技有限公司 | Ceramic circuit board clamp is used in a kind of plating |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131030 Termination date: 20150419 |
|
| EXPY | Termination of patent right or utility model |