CN204669714U - High frequency performance double-sided ceramic circuit board - Google Patents
High frequency performance double-sided ceramic circuit board Download PDFInfo
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- CN204669714U CN204669714U CN201520285919.XU CN201520285919U CN204669714U CN 204669714 U CN204669714 U CN 204669714U CN 201520285919 U CN201520285919 U CN 201520285919U CN 204669714 U CN204669714 U CN 204669714U
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- circuit board
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Abstract
The utility model discloses a kind of high frequency performance double-sided ceramic circuit board, the electronic component comprising wiring board body and be arranged on wiring board body; Described wiring board body comprises ceramic substrate, circuit layer, insulating barrier and electrode welding dish; Described ceramic substrate has the first surface and second surface that be arranged in parallel, and this first surface and second surface are coated with at least one deck circuit layer respectively; Described ceramic substrate offers some perforation; Each perforation runs through first surface and the second surface of ceramic substrate respectively; Insulating barrier described in one is respectively arranged with in each perforation; Each perforation is divided into the first welding hole and the second welding hole respectively by insulating barrier; An electrode welding dish is fixed with respectively separately in each first welding hole and each second welding hole; Each electrode welding dish is welded and fixed with corresponding electronic element respectively.The two-sided of the ceramic substrate of high frequency performance double-sided ceramic circuit board of the present utility model can installing electronic elements, and its production cost is lower, and fail safe is high.
Description
Technical field
The utility model relates to wiring board techniques field, is specifically related to a kind of high frequency performance double-sided ceramic circuit board.
Background technology
Wiring board has been widely used in various electronic installation, and multiple electronic component can be electrically connected by wiring board mutually, and is derived by the partial heat of these electronic components by the metallic member of wiring board.Current metal circuit board on the market has excellent thermal diffusivity and electromagnetic wave shielding, but its high frequency performance is poor, and loss of signal is comparatively large, affects the service precision of wiring board.When the one-sided circuit board occurred on the market uses on the curtain wall of double-side, all adopt the wiring board of two pieces of one sides to use, as this increased use cost, and fail safe is lower.
Utility model content
For the deficiencies in the prior art, the purpose of this utility model is to provide a kind of rational in infrastructure, high frequency performance double-sided ceramic circuit board that use cost is low.
For achieving the above object, the utility model adopts following technical scheme:
A kind of high frequency performance double-sided ceramic circuit board, the electronic component comprising wiring board body and be arranged on wiring board body; Described wiring board body comprises ceramic substrate, circuit layer, insulating barrier and electrode welding dish; Described ceramic substrate has the first surface and second surface that be arranged in parallel, and this first surface and second surface are coated with at least one deck circuit layer respectively; Described ceramic substrate offers some perforation; Each perforation runs through first surface and the second surface of ceramic substrate respectively; Insulating barrier described in one is respectively arranged with in each perforation; Each perforation is divided into the first welding hole and the second welding hole respectively by insulating barrier; An electrode welding dish is fixed with respectively separately in each first welding hole and each second welding hole; Each electrode welding dish is welded and fixed with corresponding electronic element respectively.
Preferably, described ceramic substrate is porous ceramic.
Preferably, the axis of each perforation is vertical with first surface and second surface respectively.
Preferably, each insulating barrier is all parallel with first surface and second surface, and it is positioned at the centre position of perforation, for perforation being divided into the first welding hole and second welding hole of two mutually insulateds.
Preferably, described electrode welding dish comprises electroless plating layers of copper, electrolytic copper plated layer and welded post; Described electroless plating layers of copper covers on electrolytic copper plated layer, and described welded post is fixed in electroless plating layers of copper, and interts in described perforation.
Preferably, described insulating barrier is that rubber or plastic material are made.
Preferably, described circuit layer is nickel-gold layer.
Preferably, described wiring board body also offers some through holes and installing hole; Equal and the described installing hole of each through hole and be formed with gap between boring a hole; Each installing hole and through hole are all through ceramic substrate and circuit layer.
Preferably, described installing hole is opened in the edge of wiring board body.
Preferably, described installing hole is semicircle bayonet socket, U-shaped bayonet socket or 3/4ths circular bayonet sockets do not closed.
The beneficial effects of the utility model:
Compared with prior art, high frequency performance double-sided ceramic circuit board of the present utility model by offering some perforation on ceramic substrate, and insulating barrier is set in this perforation, each perforation is divided into respectively two welding holes, and in each welding hole installing electrodes welded disc, realize, at the first surface of ceramic substrate and the equal installing electronic elements of second surface, reduce manufacturing cost, and fail safe being higher.
Accompanying drawing explanation
Fig. 1 is a kind of high frequency performance double-sided ceramic circuit board structural representation in embodiment of the present utility model;
Fig. 2 is a kind of high frequency performance double-sided ceramic circuit board phantom in embodiment of the present utility model.
In figure: 1, wiring board body; 11, ceramic substrate; 12, circuit layer; 13, insulating barrier; 14, electrode welding dish; 110, bore a hole; 101, the first welding hole; 102, the second welding hole; 111, first surface; 112, second surface; 141, electroless plating layers of copper; 142, electrolytic copper plated layer; 143, welded post; 2, electronic component; 100, through hole; 200, installing hole.
Embodiment
Below, by reference to the accompanying drawings and embodiment, the utility model is described further:
With reference to Fig. 1 and Fig. 2, a kind of high frequency performance double-sided ceramic circuit board described in the present embodiment, comprises wiring board body 1 and is arranged on the electronic component 2 on wiring board body 1.Described wiring board body 1 comprises ceramic substrate 11, circuit layer 12, insulating barrier 13 and electrode welding dish 14.Preferably, described ceramic substrate 11 is porous ceramic.Because porous ceramic has good insulating properties and thermal diffusivity, so preferably adopt porous ceramic as substrate, the useful life of wiring board effectively can be improved.Described wiring board body 1 also offers some through holes 100 and installing hole 200.Each installing hole 200 and through hole 100 are all through ceramic substrate 11 and circuit layer 12.Described installing hole 200 is opened in the edge of wiring board body 1.Described installing hole 200 is not blind bore, and such as, this installing hole 200 is the shapes such as semicircle bayonet socket, U-shaped bayonet socket or 3/4ths circular bayonet sockets.
Described ceramic substrate 11 has the first surface 111 and second surface 112 that be arranged in parallel.This first surface 111 and second surface 112 are coated with at least one deck circuit layer 12 respectively.Described ceramic substrate 11 offers some perforation 110.Gap is formed between the equal and described installing hole 200 of each perforation 110 and through hole 100.
Each perforation 110 runs through first surface 111 and the second surface 112 of ceramic substrate respectively.Insulating barrier 13 described in one is respectively arranged with in each perforation 110.Each perforation 110 is divided into the first welding hole 101 and the second welding hole 102 respectively by insulating barrier 13, to realize realizing two-sided installing electronic elements 2 on same ceramic substrate 11, such as this electronic component 2 can be LED.An electrode welding dish 14 is fixed with respectively separately in each first welding hole 101 and each second welding hole 102.Each electrode welding dish 14 is welded and fixed with corresponding electronic element 2 respectively.
Preferably, in order to better installing insulating dividing plate 13 and electrode welding dish 14; The axis of each perforation 110 is vertical with first surface 111 and second surface 112 respectively.Each insulating barrier 13 is all parallel with first surface 111 and second surface 112, and it is positioned at the centre position of perforation 110, for perforation 110 being divided into the first welding hole 101 and the second welding hole 102 of two mutually insulateds, the electronic component 2 on ceramic substrate 11 two sides all can be energized work separately, avoid that electric leakage occurs and cause short circuit etc., make its fail safe higher.It should be noted that, described insulating barrier 13 can be the dividing plate with ceramic substrate 11 one, the such as perforate respectively on the two sides of ceramic substrate 11, and the perforate on ceramic substrate 11 two sides is not all communicated, thus make insulating barrier 13 become a part for substrate body 11.
Described electrode welding dish 14 comprises electroless plating layers of copper 141, electrolytic copper plated layer 142 and welded post 143.Described electroless plating layers of copper 141 covers on electrolytic copper plated layer 142.Described welded post 143 is fixed in electroless plating layers of copper 141, and interts in described perforation 110.Described insulating barrier 13 is made for rubber or plastic material.Described circuit layer 12 is nickel-gold layer.
In sum, high frequency performance double-sided ceramic circuit board of the present utility model by offering some perforation 110 on ceramic substrate 11, and insulating barrier 13 is set in this perforation 110, each perforation 110 is divided into two welding holes respectively, and in each welding hole installing electrodes welded disc 14, realize, at the first surface 111 of ceramic substrate 11 and second surface 112 all installing electronic elements 2, reduce manufacturing cost, and fail safe being higher.
to one skilled in the art, according to technical scheme described above and design, other various corresponding change and deformation can be made, and all these change and deformation all should belong within the protection range of the utility model claim.
Claims (10)
1. high frequency performance double-sided ceramic circuit board, the electronic component comprising wiring board body and be arranged on wiring board body; It is characterized in that: described wiring board body comprises ceramic substrate, circuit layer, insulating barrier and electrode welding dish; Described ceramic substrate has the first surface and second surface that be arranged in parallel, and this first surface and second surface are coated with at least one deck circuit layer respectively; Described ceramic substrate offers some perforation; Each perforation runs through first surface and the second surface of ceramic substrate respectively; Insulating barrier described in one is respectively arranged with in each perforation; Each perforation is divided into the first welding hole and the second welding hole respectively by insulating barrier; An electrode welding dish is fixed with respectively separately in each first welding hole and each second welding hole; Each electrode welding dish is welded and fixed with corresponding electronic element respectively.
2. high frequency performance double-sided ceramic circuit board according to claim 1, is characterized in that: described ceramic substrate is porous ceramic.
3. high frequency performance double-sided ceramic circuit board according to claim 1, is characterized in that: the axis of each perforation is vertical with first surface and second surface respectively.
4. high frequency performance double-sided ceramic circuit board according to claim 1, it is characterized in that: each insulating barrier is all parallel with first surface and second surface, and it is positioned at the centre position of perforation, for perforation being divided into the first welding hole and second welding hole of two mutually insulateds.
5. the high frequency performance double-sided ceramic circuit board according to any one of claim 1-4, is characterized in that: described electrode welding dish comprises electroless plating layers of copper, electrolytic copper plated layer and welded post; Described electroless plating layers of copper covers on electrolytic copper plated layer, and described welded post is fixed in electroless plating layers of copper, and interts in described perforation.
6. the high frequency performance double-sided ceramic circuit board according to any one of claim 1-4, is characterized in that: described insulating barrier is that rubber or plastic material are made.
7. the high frequency performance double-sided ceramic circuit board according to any one of claim 1-4, is characterized in that: described circuit layer is nickel-gold layer.
8. the high frequency performance double-sided ceramic circuit board according to any one of claim 1-4, is characterized in that: described wiring board body also offers some through holes and installing hole; Equal and the described installing hole of each through hole and be formed with gap between boring a hole; Each installing hole and through hole are all through ceramic substrate and circuit layer.
9. high frequency performance double-sided ceramic circuit board according to claim 8, is characterized in that: described installing hole is opened in the edge of wiring board body.
10. high frequency performance double-sided ceramic circuit board according to claim 8, is characterized in that: described installing hole is semicircle bayonet socket, U-shaped bayonet socket or 3/4ths circular bayonet sockets do not closed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520285919.XU CN204669714U (en) | 2015-05-06 | 2015-05-06 | High frequency performance double-sided ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520285919.XU CN204669714U (en) | 2015-05-06 | 2015-05-06 | High frequency performance double-sided ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204669714U true CN204669714U (en) | 2015-09-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520285919.XU Expired - Fee Related CN204669714U (en) | 2015-05-06 | 2015-05-06 | High frequency performance double-sided ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204669714U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492744A (en) * | 2020-11-20 | 2021-03-12 | 深圳市金晟达电子技术有限公司 | Adjustable 5G of structure strenghthened type circuit board for communication |
-
2015
- 2015-05-06 CN CN201520285919.XU patent/CN204669714U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492744A (en) * | 2020-11-20 | 2021-03-12 | 深圳市金晟达电子技术有限公司 | Adjustable 5G of structure strenghthened type circuit board for communication |
| CN112492744B (en) * | 2020-11-20 | 2022-02-11 | 深圳市金晟达电子技术有限公司 | Adjustable 5G of structure strenghthened type circuit board for communication |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150923 Termination date: 20190506 |